A circuit board processing device with a rapid zinc spraying function

Through optimized design of lifting and adjusting components, reciprocating moving mechanism and nozzle structure, the fully automated control of the zinc spraying process of circuit boards was achieved, solving the problems of uneven spraying and local damage, and improving spraying efficiency and quality.

CN224530990UActive Publication Date: 2026-07-21SHENZHEN WEIDEXIN ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN WEIDEXIN ELECTRONICS CO LTD
Filing Date
2025-08-28
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

In existing circuit board zinc spraying equipment, the nozzle and the circuit board are in a fixed relative position, which leads to uneven spraying and local damage, and lacks flexibility and adaptability.

Method used

By employing lifting and adjusting components and reciprocating movement mechanisms, combined with optimized nozzle structure design and multiple nozzle collaborative working modes, the nozzle can move flexibly in three-dimensional space, and achieve fully automated control through flow regulation and temperature monitoring.

Benefits of technology

It significantly improves coating uniformity, reduces the risk of localized overheating, and enhances coating efficiency and quality, adapting to the processing needs of circuit boards of various specifications.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to the technical field of circuit board processing, in particular to a circuit board processing device with a rapid zinc spraying function, which comprises a base, a driving mechanism, a spraying module, a lifting adjusting assembly, a reciprocating moving mechanism, a dynamic balance assembly and an optimally designed nozzle structure. The nozzle is flexibly adjusted in the vertical and horizontal directions through a screw rod and a servo motor, the atomization effect is improved by combining a conical diffuser and a spiral groove design, and the uniformity of the zinc layer and the spraying adaptability are ensured by using a flow regulating valve and a multiple nozzle cooperative working mode. The application can significantly improve the spraying quality, reduce the risk of local overheating, meet the complex circuit board processing requirements, and improve the efficiency and reliability.
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Description

Technical Field

[0001] This utility model belongs to the field of circuit board processing technology, specifically a circuit board processing device with rapid zinc spraying function. Background Technology

[0002] To improve the corrosion resistance and conductivity of circuit boards, zinc spraying is typically performed on their surface. This involves spraying zinc at high speed onto the circuit board surface, forming a uniform protective film that enhances corrosion resistance and improves electrical properties. The zinc spraying process mainly consists of two stages: First, the circuit board is fixed on the processing device, and molten zinc is atomized and sprayed onto the board surface through a nozzle. Second, a moving mechanism drives the nozzle to reciprocate along the circuit board surface, ensuring a uniform zinc layer distribution. However, in the first stage, the relative position between the nozzle and the circuit board is fixed. Existing zinc spraying devices have a relatively conventional structure, and the mechanism controlling the nozzle movement is generally a fixed design. This leads to uneven deposition on the zinc layer surface when the distance between the nozzle and the circuit board changes, affecting the spraying effect and potentially causing localized overheating or damage to the circuit board. Therefore, a solution is urgently needed. Utility Model Content

[0003] This utility model proposes a circuit board processing device with rapid zinc spraying function, which has the advantages of improving spraying uniformity and reducing the risk of local overheating, thereby solving the problems of uneven spraying and local damage caused by the fixed relative position of the nozzle and the circuit board in the prior art. To achieve the above objectives, this utility model adopts the following technical solution:

[0004] A circuit board processing device with rapid zinc spraying function includes a base, a drive mechanism, and a spraying module, and further includes:

[0005] The lifting and adjusting assembly includes a support frame and a screw. The support frame is fixedly installed on the top of the base. The screw is installed on the inner side wall of the support frame through a bearing. A sliding block is threadedly connected to the outer surface of the screw. A nozzle bracket is fixedly connected to the bottom of the sliding block.

[0006] A reciprocating moving mechanism includes a guide rail and a rack. The guide rail is fixedly installed on the top of the support frame. The rack is arranged parallel to one side of the guide rail. A gear meshes on the outer surface of the rack. The output shaft of a servo motor is fixedly connected to the central shaft of the gear. The servo motor is installed on the top of the nozzle bracket through a fixing bracket.

[0007] A dynamic balancing assembly includes an elastic link and a limiting ring. One end of the elastic link is hinged to the side of the sliding block, and the other end is hinged to the inside of the limiting ring. The limiting ring is fixedly installed on the top of the support frame, and an adjusting spring is provided in the middle of the elastic link.

[0008] The nozzle structure is optimized. Multiple sets of nozzles are fixedly installed at the bottom of the nozzle support. Each set of nozzles is connected to the molten zinc supply unit through a hose. A conical diffuser is provided at the outlet end of the nozzle. The inner wall of the conical diffuser is engraved with spiral grooves. The spiral grooves are distributed in an involute pattern along the axial direction of the conical diffuser.

[0009] This invention redesigns the relative movement between the nozzle and the circuit board. By incorporating a lifting adjustment component and a reciprocating movement mechanism, the nozzle can be flexibly adjusted in both the vertical and horizontal directions. Specifically, the screw rotates, causing the sliding block to move up and down along the support frame, thereby changing the vertical distance between the nozzle and the circuit board to accommodate circuit boards of varying thicknesses. Simultaneously, a servo motor drives a gear along a rack, causing the nozzle support to reciprocate horizontally, ensuring that molten zinc is evenly applied to the circuit board surface. Furthermore, the design of the elastic connecting rod and the limiting ring provides dynamic balance compensation for the movement of the sliding block, preventing nozzle position deviation due to mechanical vibration and further improving coating accuracy.

[0010] This invention also features a novel nozzle structure. By adding a conical diffuser at the nozzle outlet and engraving spiral grooves on its inner wall, the molten zinc is guided by the spiral grooves to create a vortex effect during spraying. This design not only improves the atomization of the molten zinc but also effectively reduces particle deposition during the spraying process, thus significantly improving the uniformity of the zinc layer. Simultaneously, the involute spiral groove design of the conical diffuser allows the molten zinc to automatically adjust the spray angle during spraying, reducing spraying defects caused by changes in the distance between the nozzle and the circuit board.

[0011] This invention further optimizes the control method of the molten zinc supply unit by adding a flow regulating valve at the inlet end of the hose. The supply of molten zinc is adjusted in real time by detecting the pressure feedback signal at the nozzle outlet. When the distance between the nozzle and the circuit board shortens, the flow regulating valve automatically reduces the supply of molten zinc to prevent local overheating or excessive zinc layer thickness. Conversely, when the distance between the nozzle and the circuit board increases, the flow regulating valve appropriately increases the supply of molten zinc to ensure that the zinc layer thickness is maintained within a reasonable range.

[0012] This invention also incorporates a multi-nozzle collaborative working mode. Four independent nozzles are mounted on a nozzle holder and connected to different molten zinc supply units, enabling zoned spraying operations. Each nozzle group can be independently adjusted according to the specific shape and size of the circuit board. For example, the spraying intensity can be appropriately increased for the edge areas of the circuit board, while a lower spraying frequency is maintained for the central areas, thus avoiding zinc layer accumulation or gaps. Furthermore, a temperature sensor is installed at the bottom of the nozzle holder to monitor the temperature changes on the circuit board surface in real time and transmit the data to the control system for timely adjustment of spraying parameters, reducing the risk of localized overheating.

[0013] This invention achieves fully automated control of the zinc spraying process through the aforementioned technical means, significantly improving spraying efficiency and quality. Firstly, the combined use of the lifting and adjusting components and the reciprocating movement mechanism allows the nozzles to move flexibly in three-dimensional space, meeting the processing requirements of complex circuit boards. Secondly, the optimized nozzle structure design and intelligent control of the molten zinc supply unit effectively solve the problems of uneven zinc layer and localized overheating. Finally, the collaborative working mode of multiple nozzles further enhances the adaptability and practicality of the device, enabling its widespread application in various circuit board processing scenarios.

[0014] In summary, this utility model, through its innovative structural design and intelligent control strategy, successfully overcomes the problems of uneven coating, localized overheating, and poor adaptability in existing technologies, providing a more efficient and reliable solution for the zinc spraying process of circuit boards. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of the present invention, showing the main components of the device and their layout.

[0016] Figure 2 This is a schematic diagram of the lifting and adjusting assembly of this utility model, which focuses on showing the connection relationship between the screw, the sliding block and the nozzle bracket.

[0017] Figure 3 This is a schematic diagram of the reciprocating motion mechanism of this utility model, which shows in detail the cooperation between the guide rail, rack, gear and servo motor.

[0018] Figure 4 This is a schematic diagram of the dynamic balancing component of this utility model, showing the installation position and function of the elastic connecting rod, the limiting ring, and the adjusting spring.

[0019] Figure 5 This is a schematic diagram of the optimized nozzle structure design of this utility model, highlighting the design features of the conical diffuser and its inner wall spiral groove.

[0020] Figure 6This is a schematic diagram of the multi-nozzle collaborative working mode of this utility model, showing the distribution and independent adjustment function of the four nozzles on the nozzle support.

[0021] The attached figures are labeled as follows:

[0022] 1. Base; 2. Support frame; 3. Screw; 4. Sliding block; 5. Nozzle bracket; 6. Guide rail; 7. Rack; 8. Gear; 9. Servo motor; 10. Elastic connecting rod; 11. Limiting ring; 12. Adjusting spring; 13. Nozzle; 14. Conical diffuser; 15. Spiral groove; 16. Hose; 17. Flow regulating valve; 18. Temperature sensor. Detailed Implementation

[0023] This utility model provides a circuit board processing device with rapid zinc spraying function, such as Figures 1 to 6 As shown, it mainly consists of a base 1, a support frame 2, a lifting and adjusting assembly, a reciprocating moving mechanism, a dynamic balancing assembly, an optimized nozzle structure design, and multiple sets of nozzles working in a coordinated manner. The specific embodiments of this utility model are described in detail below with reference to the accompanying drawings.

[0024] In this embodiment, the base 1 serves as the foundation of the entire device, supporting and securing other components. A support frame 2 is vertically fixed to the top of the base 1. A screw 3 is mounted on its inner wall via bearings. A sliding block 4 is threaded onto the outer surface of the screw 3, and the bottom of the sliding block 4 is fixedly connected to the nozzle bracket 5. A drive motor (not labeled) is located at the upper end of the screw 3, connected to it via a coupling. When the drive motor starts, the screw 3 rotates, causing the sliding block 4 to move up and down along the inner wall of the support frame 2, thereby adjusting the vertical position of the nozzle bracket 5. A guide groove is provided on the side of the sliding block 4, engaging with a guide rail on the inner wall of the support frame 2 to ensure stability during movement and prevent displacement.

[0025] like Figure 3 As shown, the reciprocating mechanism includes a guide rail 6, a rack 7, a gear 8, and a servo motor 9. The guide rail 6 is fixedly mounted on the top of the support frame 2. The rack 7 is parallel to one side of the guide rail 6, and the outer surface of the rack 7 meshes with the gear 8. The central shaft of the gear 8 is fixedly connected to the output shaft of the servo motor 9 via a coupling. The servo motor 9 is mounted on the top of the nozzle bracket 5 via a mounting bracket. When the servo motor 9 starts, its output shaft drives the gear 8 to rotate, and the gear 8 moves along the rack 7, thereby pushing the nozzle bracket 5 to reciprocate in the horizontal direction. A slider (unlabeled) is provided between the guide rail 6 and the nozzle bracket 5. The slider is nested on the guide rail 6 to reduce friction and improve the smoothness of movement.

[0026] like Figure 4As shown, the dynamic balancing assembly includes an elastic link 10, a limiting ring 11, and an adjusting spring 12. One end of the elastic link 10 is hinged to the side of the sliding block 4, and the other end is hinged to the inner side of the limiting ring 11. The limiting ring 11 is fixedly installed on the top of the support frame 2. An adjusting spring 12 is provided in the middle of the elastic link 10, and both ends of the adjusting spring 12 are fixedly connected to the two hinge points of the elastic link 10, respectively. When the sliding block 4 moves up and down along the screw 3, the elastic link 10 extends and retracts accordingly. The adjusting spring 12 dynamically compensates for the movement of the sliding block 4 through its own elastic force, thereby counteracting the positional displacement of the nozzle support 5 caused by mechanical vibration or external interference, ensuring that the nozzle support 5 always remains stable.

[0027] like Figure 5 As shown, the optimized nozzle structure design includes a nozzle 13 and a conical diffuser 14. The nozzle 13 is fixedly installed at the bottom of the nozzle bracket 5 via a threaded connection, and each set of nozzles 13 is connected to the molten zinc supply unit via a hose 16. The conical diffuser 14 is fixedly installed at the outlet end of the nozzle 13, and its inner wall is engraved with spiral grooves 15, which are involutely distributed along the axial direction of the conical diffuser 14. When molten zinc is ejected from the nozzle 13, it is guided by the spiral grooves 15 through the inner wall of the conical diffuser 14, forming a vortex effect. This design significantly improves the atomization effect of the molten zinc and reduces particle deposition during the spraying process. Furthermore, the involute spiral groove design 15 of the conical diffuser 14 allows the molten zinc to automatically adjust the spray angle during spraying, thereby adapting to changes in the distance between the nozzle 13 and the circuit board and avoiding spraying defects caused by distance variations.

[0028] like Figure 6 As shown, the multi-nozzle collaborative working mode includes four independent nozzles 13, each nozzle 13 connected to a different molten zinc supply unit via an independent hose 16. A flow regulating valve 17 is installed at the inlet end of the hose 16. The flow regulating valve 17 adjusts the molten zinc supply in real time based on the pressure feedback signal detected at the outlet end of the nozzle 13. When the distance between the nozzle 13 and the circuit board shortens, the flow regulating valve 17 automatically reduces the molten zinc supply to prevent local overheating or excessive zinc layer thickness; conversely, when the distance between the nozzle 13 and the circuit board increases, the flow regulating valve 17 appropriately increases the molten zinc supply to ensure the zinc layer thickness remains within a reasonable range. Furthermore, a temperature sensor 18 is installed at the bottom of the nozzle bracket 5. The temperature sensor 18 is connected to the control system via a data cable to monitor the temperature changes on the circuit board surface in real time and transmit the data to the control system for timely adjustment of spraying parameters, reducing the risk of local overheating.

[0029] In practical applications, the working process of this utility model is as follows: First, based on the thickness of the circuit board to be processed, the drive motor of the screw 3 is started, causing the sliding block 4 to move up and down along the support frame 2, thereby adjusting the vertical distance between the nozzle bracket 5 and the circuit board. Next, the servo motor 9 is started, and the servo motor 9 moves along the rack 7 through the gear 8, pushing the nozzle bracket 5 to reciprocate in the horizontal direction, ensuring that the molten zinc can be evenly covered on the surface of the circuit board. During the spraying process, the elastic connecting rod 10 and the adjusting spring 12 dynamically balance and compensate for the movement of the sliding block 4, avoiding the displacement of the nozzle bracket 5 due to mechanical vibration. At the same time, after the molten zinc is sprayed from the nozzle 13, it is guided by the spiral groove 15 through the inner wall of the conical diffuser 14 to form a vortex effect, thereby improving the atomization effect and reducing particle deposition. The flow regulating valve 17 adjusts the supply of molten zinc in real time according to the pressure feedback signal at the outlet of the nozzle 13 to ensure uniform zinc layer thickness. The temperature sensor 18 monitors the temperature change of the circuit board surface in real time and transmits the data to the control system so as to adjust the spraying parameters in time and avoid local overheating.

[0030] This invention achieves fully automated control of the zinc spraying process through the aforementioned structural design and operating method, significantly improving spraying efficiency and quality. The connections, positions, and coordination between all components have been carefully designed to ensure efficient operation of the device in complex circuit board processing scenarios.

[0031] To enable those skilled in the art to fully understand and implement the technical solution of this utility model, the following supplementary explanation of the operating principle and implementation steps of this utility model is provided in conjunction with specific application scenarios.

[0032] First, before starting the device, the circuit board to be processed must be fixed in the designated position on the base 1. Bolts or other fixing methods are used to ensure the circuit board remains stable during spraying, preventing displacement due to external forces. Then, the operator sets the initial distance between the nozzle 13 and the circuit board according to the thickness of the circuit board. This process is achieved through a lifting adjustment assembly: after the drive motor starts, it rotates the screw 3, causing the sliding block 4 to move up and down along the inner wall of the support frame 2, thereby adjusting the height of the nozzle bracket 5. The guide groove of the sliding block 4 cooperates with the guide rail on the inner wall of the support frame 2, ensuring that the sliding block 4 maintains a straight trajectory during movement and avoids deviation. This design achieves precise adjustment of the vertical distance between the nozzle 13 and the circuit board, providing a fundamental guarantee for the uniformity of subsequent spraying.

[0033] After vertical positioning is completed, the device enters the horizontal reciprocating spraying stage. Once the servo motor 9 is started, its output shaft drives the gear 8 to rotate. The gear 8 moves along the rack 7, causing the nozzle support 5 to reciprocate horizontally. Multiple sets of nozzles 13 are mounted at the bottom of the nozzle support 5, each set connected to an independent molten zinc supply unit via a hose 16. During the reciprocating motion, the nozzles 13 evenly cover the circuit board surface, ensuring no areas of zinc layer are missed. To ensure smooth movement, a slider is provided between the guide rail 6 and the nozzle support 5. The slider is nested on the guide rail 6 to reduce friction and improve movement accuracy. Simultaneously, the elastic connecting rod 10 and adjusting spring 12 in the dynamic balancing assembly dynamically compensate for the movement of the sliding block 4, counteracting the effects of mechanical vibration or external interference on the nozzle support 5 and ensuring that the nozzles 13 remain stable.

[0034] During the spraying process, molten zinc, after being ejected from nozzle 13, is guided by spiral grooves 15 as it passes through the inner wall of the conical diffuser 14, creating a vortex effect. This design, through the involute distribution structure of the spiral grooves 15, allows the molten zinc to automatically adjust its spray angle during spraying, adapting to changes in the distance between nozzle 13 and the circuit board. When nozzle 13 is close to the circuit board, spiral grooves 15 guide the molten zinc towards the center, preventing localized over-thickness; when nozzle 13 is away from the circuit board, spiral grooves 15 guide the molten zinc outwards, ensuring the zinc layer coverage remains unaffected. This design significantly improves the atomization effect of molten zinc, reduces particle deposition, and thus improves the uniformity of the zinc layer.

[0035] To further optimize coating quality, the flow regulating valve 17 monitors the pressure feedback signal at the nozzle 13 outlet in real time and adjusts the supply of molten zinc accordingly. When the distance between the nozzle 13 and the circuit board shortens, the flow regulating valve 17 automatically reduces the supply of molten zinc to prevent local overheating or zinc layer buildup; when the distance between the nozzle 13 and the circuit board increases, the flow regulating valve 17 appropriately increases the supply of molten zinc to ensure that the zinc layer thickness remains within a reasonable range. In addition, the temperature sensor 18 at the bottom of the nozzle holder 5 monitors the temperature changes on the circuit board surface in real time and transmits the data to the control system. The control system adjusts the coating parameters promptly based on the temperature data, such as reducing the coating speed or decreasing the supply of molten zinc, to avoid localized overheating or damage to the circuit board.

[0036] In the multi-nozzle collaborative operation mode, four independent nozzles 13 are connected to different molten zinc supply units, allowing for zoned spraying operations based on the specific shape and size of the circuit board. For example, the spraying intensity can be appropriately increased for the edge areas of the circuit board to ensure complete coverage, while a lower spraying frequency is maintained for the central area to avoid zinc layer buildup. The flow regulating valve 17 of each nozzle group independently controls the molten zinc supply, ensuring flexible adjustment of spraying parameters for each area. Furthermore, the reciprocating motion of the nozzle support 5 combined with the collaborative operation of multiple nozzles further improves spraying efficiency and uniformity.

[0037] In summary, this invention achieves fully automated control of the zinc spraying process through the comprehensive application of a lifting and adjusting assembly, a reciprocating movement mechanism, a dynamic balancing assembly, optimized nozzle structure design, and a multi-nozzle collaborative working mode. The aforementioned structural design and operating method ensure flexible adjustment of the relative position between the nozzle 13 and the circuit board, significantly improving spraying uniformity and efficiency, while effectively reducing the risk of localized overheating and uneven zinc layer. The connections, positions, and coordination between all components have been carefully designed to ensure efficient operation of the device in complex circuit board processing scenarios.

Claims

1. A circuit board processing device with rapid zinc spraying function, comprising a base (1), a drive mechanism, and a spraying module, characterized in that, Also includes: The lifting adjustment assembly includes a support frame (2) and a screw (3). The support frame (2) is fixedly installed on the top of the base (1). The screw (3) is installed on the inner wall of the support frame (2) by a bearing. A sliding block (4) is threadedly connected to the outer surface of the screw (3). A nozzle bracket (5) is fixedly connected to the bottom of the sliding block (4). The reciprocating movement mechanism includes a guide rail (6) and a rack (7). The guide rail (6) is fixedly installed on the top of the support frame (2). The rack (7) is arranged parallel to one side of the guide rail (6). A gear (8) meshes with the outer surface of the rack (7). The output shaft of a servo motor (9) is fixedly connected to the central shaft of the gear (8). The servo motor (9) is installed on the top of the nozzle bracket (5) through a fixing frame. The dynamic balancing assembly includes an elastic link (10) and a limiting ring (11). One end of the elastic link (10) is hinged to the side of the sliding block (4), and the other end is hinged to the inside of the limiting ring (11). The limiting ring (11) is fixedly installed on the top of the support frame (2). An adjusting spring (12) is provided in the middle of the elastic link (10). The nozzle structure is optimized. Multiple sets of nozzles (13) are fixedly installed at the bottom of the nozzle support (5). Each set of nozzles (13) is connected to the molten zinc supply unit through a hose (16). The outlet end of the nozzle (13) is provided with a conical diffuser (14). The inner wall of the conical diffuser (14) is engraved with a spiral groove (15). The spiral groove (15) is distributed in an involute pattern along the axial direction of the conical diffuser (14).

2. The circuit board processing device with rapid zinc spraying function according to claim 1, characterized in that, The upper end of the screw (3) is connected to the output shaft of the drive motor through a coupling. The side of the sliding block (4) is provided with a guide groove, which cooperates with the guide rail on the inner side wall of the support frame (2).

3. The circuit board processing device with rapid zinc spraying function according to claim 1, characterized in that, A slider is provided between the guide rail (6) and the nozzle bracket (5). The slider is nested on the guide rail (6). The servo motor (9) moves along the rack (7) through the gear (8) and pushes the nozzle bracket (5) to reciprocate in the horizontal direction.

4. The circuit board processing device with rapid zinc spraying function according to claim 1, characterized in that, The two ends of the elastic link (10) are respectively hinged to the side of the sliding block (4) and the inner side of the limiting ring (11) via hinges, and the two ends of the adjusting spring (12) are respectively fixedly connected to the two hinge points of the elastic link (10).

5. A circuit board processing device with rapid zinc spraying function according to claim 1, characterized in that, The spiral grooves (15) of the conical diffuser (14) are distributed in an involute pattern along its axial direction. The conical diffuser (14) is fixedly installed at the outlet end of the nozzle (13) by a threaded connection.

6. The circuit board processing device with rapid zinc spraying function according to claim 1, characterized in that, The inlet end of the hose (16) is provided with a flow regulating valve (17), which adjusts the supply of molten zinc by detecting the pressure feedback signal at the outlet end of the nozzle (13).

7. A circuit board processing device with rapid zinc spraying function according to claim 1, characterized in that, The nozzle bracket (5) is equipped with a temperature sensor (18) at its bottom. The temperature sensor (18) is connected to the control system via a data cable and is used to monitor the temperature change on the surface of the circuit board.

8. A circuit board processing device with rapid zinc spraying function according to claim 1, characterized in that, The number of nozzles (13) is four groups, and each group of nozzles (13) is connected to a different molten zinc supply unit through an independent hose (16).