Coating apparatus

Abstract

The application relates to the technical field of battery preparation, in particular to a coating equipment. The coating equipment comprises a coating main body, the coating main body is provided with a plurality of cavities, and the plurality of cavities can be communicated with each other; the plurality of cavities comprises a feeding cavity, a discharging cavity and a central loading cavity arranged between the feeding cavity and the discharging cavity; a plurality of deposition cavities and a plurality of annealing cavities are arranged on the circumferential side of the central loading cavity. The application can realize the growth of a high-performance transparent conductive oxide film layer through deposition of the plurality of deposition cavities on the circumferential side of the central loading cavity and then PECVD method dissociation and annealing operation in the plurality of annealing cavities, separates the film forming process and the oxidation process of the transparent conductive oxide film layer, improves the technical problem that the oxygen partial pressure balance in the transparent conductive oxide film layer preparation process is difficult to control, and can accurately control the conductivity and transmittance performance of the transparent conductive oxide film layer.

Description

Technical Field

[0001] This application relates to the field of battery manufacturing technology, and in particular to a coating device. Background Technology

[0002] In the magnetron sputtering deposition process of heterojunction solar cells, PVD deposition of transparent conductive oxide films often employs in-situ oxidation, simultaneously introducing an appropriate amount of oxygen to control the oxygen concentration during deposition. The partial pressure of oxygen during deposition influences the film formation mechanism to some extent. Oxygen vacancy defects in the transparent conductive oxide film largely determine the carrier concentration. Each oxygen vacancy provides two free carriers, and the carrier concentration affects the film's optical and electrical properties. Higher carrier concentrations significantly reduce transmittance, while lower carrier concentrations increase resistivity.

[0003] For transparent conductive oxide films used in solar cells, selecting an appropriate carrier concentration is crucial. How to select the appropriate oxygen partial pressure during the process to adjust the carrier concentration is a technical problem that urgently needs to be solved.

[0004] It should be noted that the above content is not necessarily prior art, nor is it intended to limit the scope of patent protection of this application. Utility Model Content

[0005] This application provides a coating apparatus to solve or alleviate one or more of the technical problems mentioned above.

[0006] This application provides a coating apparatus, including:

[0007] The coating body has multiple cavities that are interconnected; the multiple cavities include a feeding cavity, a discharging cavity, and a central loading cavity disposed between the feeding cavity and the discharging cavity; multiple deposition cavities and multiple annealing cavities are disposed around the periphery of the central loading cavity.

[0008] Optionally, the plurality of deposition chambers include a first deposition chamber, the plurality of annealing chambers include a first annealing chamber, and the first deposition chamber and the first annealing chamber are centrally symmetrically arranged with the central loading chamber as the center; and / or

[0009] The plurality of deposition chambers include a second deposition chamber, the plurality of annealing chambers include a second annealing chamber, and the second deposition chamber and the second annealing chamber are centrally symmetrically arranged with the central loading chamber as the center; and / or

[0010] The plurality of deposition chambers include a third deposition chamber, the plurality of annealing chambers include a third annealing chamber, and the third deposition chamber and the third annealing chamber are arranged in a centrally symmetrical manner with the central loading chamber as the center.

[0011] Optionally, the temperature range of the first annealing chamber is 200~250℃; and / or

[0012] The temperature range of the second annealing chamber is 150~200℃; and / or

[0013] The temperature range of the third annealing chamber is 100~150℃.

[0014] Optionally, it also includes:

[0015] Multiple valves are provided, wherein the valves are disposed between two adjacent cavities;

[0016] An installation plate is provided between two adjacent cavities, and an inlet and outlet are provided on the installation plate; a valve is rotatably mounted on the installation plate for opening or closing the inlet and outlet; a telescopic structure is provided on the installation plate for driving the valve to rotate to open or close the inlet and outlet.

[0017] Optionally, the telescopic structure includes a telescopic member and a first telescopic rod. One end of the telescopic member is disposed on the mounting plate, and the other end is telescopically movable. One end of the first telescopic rod is fixedly disposed on the valve, and the other end is rotatably connected to the telescopically movable end of the telescopic member.

[0018] Optionally, the telescopic structure further includes a second telescopic rod, and one end of the telescopic member is movably disposed on the mounting plate; one end of the second telescopic rod is rotatably disposed on the mounting plate, and the other end is rotatably connected to the retractable end of the telescopic member;

[0019] Wherein, along the direction in which the telescopic member extends, the angle between the second telescopic rod and the telescopic member is an acute angle.

[0020] Optionally, the central loading cavity includes a loading plate, and a transition cavity is provided on the loading plate. The transition cavity includes a base, a bottom plate, and a rotation drive component. The base is rotatably mounted on the loading plate via a bearing, and the bottom plate is fixedly mounted on the side of the base away from the loading plate. The rotation drive component is used to drive the base to rotate on the loading plate.

[0021] Optionally, a plurality of support wheels are rotatably provided on the loading plate, and the support wheels are in rolling contact with the side of the base plate facing the loading plate.

[0022] Optionally, each of the plurality of cavities is provided with a transport assembly for transporting a carrier plate. The transport assembly includes a transport drive and a plurality of transport wheels symmetrically arranged, the transport wheels being rotatably disposed in the cavity; the transport drive is disposed on the cavity and is used to drive each transport wheel to rotate.

[0023] Optionally, it also includes:

[0024] A vacuum system is used to extract air from the plurality of cavities to create a vacuum environment.

[0025] The embodiments of this application employing the above-described technical solution may have the following advantages:

[0026] By arranging multiple deposition chambers and multiple annealing chambers around the central loading cavity, a transparent conductive oxide film can be deposited in the deposition chamber, and then dissociated using the PECVD method in the annealing chamber. Simultaneously, the transparent conductive oxide film is preliminarily annealed at a set temperature in the annealing chamber, and then a high-performance transparent conductive oxide film is grown by subsequent annealing steps. This separates the film formation process and the oxidation process of preparing the transparent conductive oxide film, thereby improving the technical problem of the difficulty in controlling the oxygen partial pressure balance during the preparation of the transparent conductive oxide film, and enabling precise control of the conductivity and transmittance performance of the transparent conductive oxide film. Attached Figure Description

[0027] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0028] Figure 1 This is a schematic diagram of the coating equipment provided in the embodiments of this application.

[0029] Figure 2 This is a cross-sectional view of the coating apparatus provided in the embodiments of this application, showing the connection relationship between the transition cavity and the central loading cavity.

[0030] Figure 3 This is a top view of the base plate of the coating apparatus provided in the embodiments of this application, showing the transition cavity.

[0031] Figure 4 This is a cross-sectional view of the coating equipment provided in the embodiments of this application, showing the connection relationship between the valve and the mounting plate.

[0032] Figure 5 This is a cross-sectional view of the coating apparatus provided in an embodiment of this application, showing the transport components.

[0033] Explanation of reference numerals in the attached figures:

[0034] 1. Feeding chamber; 2. Discharging chamber; 3. Central loading chamber; 31. Loading plate; 311. Support wheel; 312. Support block; 32. Transition chamber; 321. Base; 322. Base plate; 323. Fixing block; 324. Transmission wheel; 325. Transmission rod; 326. Transmission belt; 327. Bearing; 41. First deposition chamber; 42. Second deposition chamber; 43. Third deposition chamber; 51. First annealing chamber; 52. Second annealing chamber; 53. Third annealing chamber; 4. Valve; 5. Mounting plate; 51. Inlet / outlet; 61. Telescopic component; 62. First telescopic rod; 63. Second telescopic rod; 71. Transport wheel; 72. Transport belt. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other. The application will now be described in detail with reference to the accompanying drawings and embodiments.

[0036] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0037] Exemplary embodiments according to this application will now be described in more detail with reference to the accompanying drawings. It should be understood that these exemplary embodiments may be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein.

[0038] like Figures 1-5 As shown, embodiments of this application can provide a coating apparatus, which may include:

[0039] The coating body has multiple cavities that are interconnected. It should be noted that, in this embodiment, based on actual production needs, the coating body is made of metal material, forming multiple rectangular metal structures. Each metal structure contains a sealable cavity, and the cavities in the multiple metal structures are interconnected. The multiple cavities include a feeding cavity 1, a discharging cavity 2, and a central loading cavity 3 disposed between the feeding cavity 1 and the discharging cavity 2. Multiple deposition cavities and multiple annealing cavities are arranged around the central loading cavity 3. Before preparing the transparent conductive oxide film, a carrier plate is required. Then, transparent conductive oxide films are prepared on both sides of the carrier plate. First, a transparent conductive oxide film is prepared on one side of the carrier plate. The carrier plate is first placed in the feeding chamber 1 and transported to the central loading chamber 3. Then, it is transported to the deposition chamber to complete one deposition. Then, it is transported to the annealing chamber to complete one hydrogen / oxygen plasma treatment and annealing. Then, it is transported to the next deposition chamber through the central loading chamber 3. This cycle is repeated several times. Then, it is transported out through the discharge chamber 2 and put back into the feeding chamber 1 to prepare a transparent conductive oxide film on the other side of the carrier plate. In this embodiment, the feeding chamber 1, the central loading chamber 3, and the discharging chamber 2 are arranged on the same straight line, which means that the feeding chamber 1, the discharging chamber 2, the multiple deposition chambers, and the multiple annealing chambers are all arranged around the central loading chamber 3. The spatial structure of the entire coating equipment is relatively compact, which effectively improves the space utilization rate and greatly shortens the transportation distance in the process of preparing the transparent conductive oxide film layer, thereby effectively saving the preparation time of the transparent conductive oxide film layer, that is, improving the production efficiency of the transparent conductive oxide film layer.

[0040] In this embodiment, multiple deposition chambers and multiple annealing chambers are arranged around the central loading cavity 3. The deposition chambers can deposit a transparent conductive oxide film, and then the annealing chambers can be used to dissociate the oxide film using the PECVD method. At the same time, the transparent conductive oxide film is initially annealed at a set temperature in the annealing chambers. Subsequent annealing steps are then used to grow a high-performance transparent conductive oxide film. This separates the film formation process and the oxidation process of the transparent conductive oxide film, thereby improving the technical problem of the difficulty in controlling the oxygen partial pressure balance during the preparation of the transparent conductive oxide film. This allows for precise control of the conductivity and transmittance properties of the transparent conductive oxide film.

[0041] It should be noted that the coating equipment, by setting up multiple deposition chambers and multiple annealing chambers, not only separates the film formation process and oxidation process of the transparent conductive oxide film, enabling the preparation of the transparent conductive oxide film using an ex-situ oxidation method, that is, the combination of multiple deposition chambers and multiple annealing chambers can split the transparent conductive oxide film into a stacked transparent conductive oxide film consisting of n layers; it can also simultaneously use hydrogen / oxygen plasma to treat the deposited transparent conductive oxide film during the annealing process in the annealing chamber, thereby controlling the grain size of the transparent conductive oxide film and balancing the conductivity and light transmittance of the transparent conductive oxide film.

[0042] In optional embodiments, the plurality of deposition chambers include a first deposition chamber 41, and the plurality of annealing chambers include a first annealing chamber 51, wherein the first deposition chamber 41 and the first annealing chamber 51 are centrally symmetrically arranged with respect to the central loading chamber 3; and / or the plurality of deposition chambers include a second deposition chamber 42, and the plurality of annealing chambers include a second annealing chamber 52, wherein the second deposition chamber 42 and the second annealing chamber 52 are centrally symmetrically arranged with respect to the central loading chamber 3; and / or the plurality of deposition chambers include a third deposition chamber 43, and the plurality of annealing chambers include a third annealing chamber 53, wherein the third deposition chamber 43 and the third annealing chamber 53 are centrally symmetrically arranged with respect to the central loading chamber 3. In the embodiments of this application, the central loading chamber 3 has a regular octagonal structure, with one chamber adjacent to each side, which effectively improves the utilization of space and shortens the transport distance of the carrier plate, further improving the production efficiency of the transparent conductive oxide film layer.

[0043] In this embodiment, theoretically, the number of deposition chambers and annealing chambers is not limited; it is only required that the number of deposition chambers and annealing chambers be the same. Furthermore, the first deposition chamber 41 and the first annealing chamber 51 are centrally symmetrically arranged with the central loading chamber 3 as the center; and / or the second deposition chamber 42 and the second annealing chamber 52 are centrally symmetrically arranged with the central loading chamber 3 as the center; and / or the third deposition chamber 43 and the third annealing chamber 53 are centrally symmetrically arranged with the central loading chamber 3 as the center. The deposition chambers and annealing chambers centrally symmetrically arranged with the central loading chamber 3 as the center are on the same straight line, allowing the carrier plate in the first deposition chamber 41 to be directly transported to the first annealing chamber 51. This improves the transport efficiency of the carrier plate, facilitating rapid transport during the production of the transparent conductive oxide film layer, thereby reducing the transport distance and further improving the production efficiency of the transparent conductive oxide film layer.

[0044] In optional embodiments, the temperature range of the first annealing chamber 51 is 200~250℃, for example, the temperature of the first annealing chamber 51 can be 200℃, 225℃, or 250℃; and / or the temperature range of the second annealing chamber 52 is 150~200℃, for example, the temperature of the second annealing chamber 52 can be 150℃, 175℃, or 200℃; and / or the temperature range of the third annealing chamber 53 is 100~150℃, for example, the temperature of the third annealing chamber 53 can be 100℃, 125℃, or 150℃.

[0045] In some embodiments, the carrier plate has an N-side, and when a transparent conductive oxide film layer is deposited on the N-side of the carrier plate, the oxygen concentration in the first annealing chamber 51 is in the range of 1% to 2%; and / or the oxygen concentration in the second annealing chamber 52 is in the range of 2% to 3%; and / or the oxygen concentration in the third annealing chamber 53 is in the range of 3% to 4%.

[0046] In some embodiments, the carrier plate has a P-side opposite to the N-side. When a transparent conductive oxide film layer is deposited on the P-side of the carrier plate, the oxygen concentration in the first annealing chamber 51 is in the range of 3% to 4%; and / or the oxygen concentration in the second annealing chamber 52 is in the range of 2% to 3%; and / or the oxygen concentration in the third annealing chamber 53 is in the range of 1% to 2%.

[0047] In this embodiment, the different temperature ranges set in the first annealing chamber 51, the second annealing chamber 52, and the third annealing chamber 53 allow for gradient annealing during the formation of the transparent conductive oxide film layer. This effectively reduces the residual stress in the formed transparent conductive oxide film layer, improves its long-term stability, and also allows for segmented control of the crystallization process, reducing interface defects. Similarly, when depositing the transparent conductive oxide film layer on the N-side or the P-side of the carrier plate, the first annealing chamber 51, the second annealing chamber 52, and the third annealing chamber 53 are set with different oxygen concentration ranges. This allows the final multilayer transparent conductive oxide film layer to form an oxygen concentration gradient, which is beneficial for achieving the matching of the optical and electrical performance of the transparent conductive oxide film layer in heterojunction solar cell devices.

[0048] In an optional embodiment, the system further includes: multiple valves 4, each valve 4 positioned between two adjacent cavities; the valves 4 isolate the two communicating cavities, preventing interference between different process parameters within the cavities. A mounting plate 5 is provided between two adjacent cavities; the mounting plate 5 can be integrally formed or fixed between the two cavities using screws, bolts, or other means. The mounting plate 5 has inlet and outlet 51; the valves 4 are rotatably mounted on the mounting plate 5, and rotating the valves 4 opens or closes the inlet and outlet 51; the mounting plate 5 has a telescopic structure for driving the valves 4 to rotate and open or close the inlet and outlet 51.

[0049] In this embodiment, the valve 4 is configured to separate the cavities, preventing the process parameters in different cavities from interfering with each other during operation. When the carrier plate needs to be transported to other cavities, the valve 4 can be rotated by the telescopic structure to open the inlet / outlet 51 to allow the carrier plate to pass through. Then, the telescopic structure resets, thereby causing the valve 4 to reset and close the inlet / outlet 51.

[0050] In an optional embodiment, the telescopic structure includes a telescopic member 61 and a first telescopic rod 62. One end of the telescopic member 61 is disposed on the mounting plate 5, and the other end is telescopically movable. One end of the telescopic member 61 can be movably disposed on the mounting plate 5 or fixedly disposed on the mounting plate 5. In this embodiment, one end of the telescopic member 61 is fixedly disposed on the mounting plate 5 by screws or bolts. The telescopic member 61 can be one of a pneumatic cylinder, a hydraulic cylinder, or an electric cylinder. One end of the first telescopic rod 62 is fixedly disposed on the valve 4 by screws or bolts, and the other end is rotatably connected to the telescopically movable end of the telescopic member 61. The telescopic member 61 and the first telescopic rod 62 can be arranged perpendicularly to form a right angle; alternatively, they can be fixed to the mounting plate 5 along the direction of the telescopic member 61, with the telescopic member 61 and the first telescopic rod 62 forming an acute or obtuse angle. When the telescopic member 61 and the first telescopic rod 62 form an acute angle, one end of the first telescopic rod 62 is fixedly installed in the lower half of the valve 4; when the telescopic member 61 and the first telescopic rod 62 form a right angle or an obtuse angle, one end of the first telescopic rod 62 is fixedly installed in the upper half of the valve 4. In this embodiment, the telescopic member 61 and the first telescopic rod 62 are set at an acute angle. Since one end of the telescopic member 61 is fixedly installed on the mounting plate 5, the other end of the telescopic member 61 can only reciprocate along a straight line. Therefore, when the extendable end of the telescopic member 61 extends, the acute angle formed by the telescopic member 61 and the first telescopic rod 62 gradually increases. When the acute angle increases to a right angle, the valve 4 is opened to its maximum extent, thereby realizing the transport of the carrier plate through the inlet and outlet 51 to the next cavity. Then the telescopic member 61 resets, and the angle formed by the telescopic member 61 and the first telescopic rod 62 re-forms an acute angle, driving the valve 4 to reset, thereby closing the inlet and outlet 51.

[0051] In an optional embodiment, the telescopic structure further includes a second telescopic rod 63, and one end of the telescopic member 61 is movably disposed on the mounting plate 5. One end of the second telescopic rod 63 is rotatably disposed on the mounting plate 5, and the other end is rotatably connected to the retractable end of the telescopic member 61; wherein, along the direction of extension of the telescopic member 61, the included angle between the second telescopic rod 63 and the telescopic member 61 is an acute angle. In this embodiment, along the direction of extension of the telescopic member 61, the included angle between the telescopic member 61 and the first telescopic rod 62 is also an acute angle, and the length of the first telescopic rod 62 is greater than the length of the second telescopic rod 63. Therefore, the installation position of the first telescopic rod 62 on the valve 4 is below the installation position of the second telescopic rod 63 on the mounting plate 5, and the installation position of the second telescopic rod 63 on the mounting plate 5 is below the installation position of the telescopic member 61 on the mounting plate 5.

[0052] In this embodiment, since one end of the telescopic member 61 is movably mounted on the mounting plate 5, when the telescopic member 61 extends, the acute angle between the second telescopic rod 63 and the telescopic member 61 gradually increases, which then pushes the telescopic member 61 toward the position of the valve 4. At the same time, during this process, the acute angle between the first telescopic rod 62 and the telescopic member 61 also gradually increases, which allows the first telescopic rod 62 to stably open the valve 4 so that the carrier plate can enter the next chamber through the inlet and outlet 51.

[0053] In an optional embodiment, the central loading cavity 3 includes a loading plate 31, and a transition cavity 32 is provided on the loading plate 31. The transition cavity 32 includes a base 321, a bottom plate 322 and a rotation drive component. The base 321 is rotatably mounted on the loading plate 31 via a bearing 327. The bottom plate 322 can be fixedly mounted on the side of the base 321 away from the loading plate 31 by screws or bolts. The rotation drive component is used to drive the base 321 to rotate on the loading plate 31.

[0054] In some embodiments, four fixing blocks 323 are provided on the side of the base plate 322 away from the base 321, and a transmission wheel 324 is rotatably mounted on each fixing block 323. Every two transmission wheels 324 are connected by a transmission rod 325, and the transmission rod 325 is perpendicular to the transport direction of the carrier plate. The two transmissions are connected by a transmission belt 326. A drive motor is also provided in the base 321, which can drive the transmission belt 326 to drive the four transmission wheels 324 to rotate synchronously, thereby realizing the transport of the carrier plate.

[0055] In this embodiment, a rotation drive is disposed within the base 321. The rotation drive can rotate via the drive bearing 327, thereby driving the base 321 to rotate on the loading plate 31, causing the base 321 to drive the bottom plate 322 to rotate on the loading plate 31. When the carrier plate is transported to the transition cavity 32, the carrier plate is located on the four drive wheels 324. When it is necessary to transport the carrier plate to the first deposition cavity 41, the rotation drive drives the base 321 to rotate, causing the bottom plate 322 to rotate. That is, the transition cavity 32 corresponds to the valve 4 of the first deposition cavity 41, and then the valve 4 of the first deposition cavity 41 is opened. The drive motor drives the drive wheels 324 to rotate synchronously, thereby transporting the carrier plate into the first deposition cavity 41.

[0056] In an optional embodiment, a plurality of support wheels 311 are rotatably mounted on the loading plate 31 via support blocks 312, and the support wheels 311 roll in contact with the side of the base plate 322 facing the loading plate 31. In this embodiment, there are four support wheels 311, and the four support wheels 311 are distributed in a matrix on the loading plate 31, thereby achieving stable support for the base plate 322 and also providing stable support for the rotating base plate 322.

[0057] In an optional embodiment, each of the plurality of cavities is provided with a transport assembly for transporting a carrier plate. The transport assembly includes a transport drive and a plurality of symmetrically arranged transport wheels 71, which are rotatably disposed within the cavity. The transport drive is disposed on the cavity and is used to drive each transport wheel 71 to rotate. The transport drive can be a motor. There are a total of six transport wheels 71, arranged in groups of three. Two groups of transport wheels 71 are symmetrically and rotatably disposed on the side walls of the cavity. Each group of transport wheels 71 is connected by a transport belt 72. The transport drive is mounted in the cavity by screws or bolts and can drive the transport belt 72 to drive the two groups of transport wheels 71 to rotate synchronously, thereby realizing the transport of the carrier plate.

[0058] In an optional embodiment, a vacuum system is also included, which is used to extract air from the multiple cavities to create a vacuum environment.

[0059] In this embodiment, the deposition process of the transparent conductive oxide film is completed in multiple chambers. Therefore, different processes can be switched within the same coating equipment (system), reducing the risk of contamination during carrier transport and improving the production efficiency of the transparent conductive oxide film. The vacuum system ensures that the entire deposition process is completed in a vacuum environment, preventing dust contamination from contact with the atmosphere and avoiding corrosion from oxygen, water vapor, and other impurities, thus improving the quality of the transparent conductive oxide film.

[0060] In summary, the working process of the coating equipment is as follows: The carrier plate is placed in the feeding chamber 1, then the feeding chamber 1 is closed. The vacuum system is turned on, ensuring that all chambers are under vacuum. Then, the valve 4 between the feeding chamber 1 and the central loading chamber 3 is opened. The carrier plate is transported to the transition chamber 32 within the central loading chamber 3 by the transport components within the feeding chamber 1. Then, the valve 4 is closed. The carrier plate is positioned on the drive wheel 324 in the transition chamber 32. The drive component rotates the base plate 322 to align with the first deposition chamber 41. Then, the valve 4 between the first deposition chamber 41 and the transition chamber 32 is opened. The carrier plate is then transported to the first deposition chamber 41 by the drive wheel 324, and then the valve 4 is closed. After the carrier plate completes its first deposition in the first deposition chamber 41, the valve 4 between the first deposition chamber 41 and the transition chamber 32 is opened again. The transport assembly in the first deposition chamber 41 transports the carrier plate back to the transition chamber 32. Then, the valve 4 between the first annealing chamber 51 and the transition chamber 32 is opened, transporting the carrier plate to the first annealing chamber 51, and then the valve 4 is closed. After the carrier plate completes its first annealing in the first annealing chamber 51, the valve 4 between the first annealing chamber 51 and the transition chamber 32 is opened, and the transport assembly in the first annealing chamber 51 transports the carrier plate to the transition chamber 32. Then, the transition chamber 32 rotates to the position corresponding to the second deposition chamber 42 to facilitate a second deposition and annealing of the carrier plate. This cycle continues until the carrier plate completes three depositions and three annealings, at which point the transition chamber 32 rotates again to the position corresponding to the discharge chamber 2. Open the valve 4 between the discharge chamber 2 and the central loading chamber 3 to transport the carrier plate into the discharge chamber 2, and then close the valve 4 to complete the preparation of the transparent conductive oxide film layer on the carrier plate.

[0061] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0062] For ease of description, directional terms such as "front, back, up, down, left, right," "horizontal, vertical, horizontal," and "top, bottom" generally indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. These terms are used solely for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the scope of protection of this application. The directional terms "inner" and "outer" refer to the inner or outer contours relative to the components themselves. For example, if a device in the drawings is inverted, a device described as "above" or "on top of" other devices or structures will subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein are interpreted accordingly.

[0063] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0064] Unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0065] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0066] It should also be noted that the terms "one embodiment," "another embodiment," or "embodiment" used in this specification refer to specific features, structures, or characteristics described in connection with that embodiment, which are included in at least one embodiment described in the general description of this application. The appearance of the same expression in multiple places in the specification does not necessarily refer to the same embodiment. Furthermore, when a specific feature, structure, or characteristic is described in connection with any embodiment, the intention is to suggest that implementing such a feature, structure, or characteristic in conjunction with other embodiments also falls within the scope of this application.

[0067] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0068] It should also be noted that the above are merely preferred embodiments of this application and do not limit the scope of patent protection of this application. Any equivalent structural or procedural changes made using the content of this application’s specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A coating equipment, characterized in that, include: The coating body has multiple cavities that are interconnected; the multiple cavities include a feeding cavity (1), a discharging cavity (2), and a central loading cavity (3) located between the feeding cavity (1) and the discharging cavity (2); multiple deposition cavities and multiple annealing cavities are arranged around the central loading cavity (3).

2. The coating equipment according to claim 1, characterized in that, The plurality of deposition chambers include a first deposition chamber (41), the plurality of annealing chambers include a first annealing chamber (51), and the first deposition chamber (41) and the first annealing chamber (51) are centrally symmetrically arranged with the central loading chamber (3) as the center; and / or The plurality of deposition chambers include a second deposition chamber (42), the plurality of annealing chambers include a second annealing chamber (52), and the second deposition chamber (42) and the second annealing chamber (52) are centrally symmetrically arranged with the central loading chamber (3) as the center; and / or The plurality of deposition chambers include a third deposition chamber (43), the plurality of annealing chambers include a third annealing chamber (53), and the third deposition chamber (43) and the third annealing chamber (53) are arranged in a centrally symmetrical manner with the central loading chamber (3) as the center.

3. The coating equipment according to claim 2, characterized in that, The temperature range of the first annealing chamber (51) is 200~250℃; and / or The temperature range of the second annealing chamber (52) is 150~200℃; and / or The temperature range of the third annealing chamber (53) is 100~150℃.

4. The coating equipment according to claim 1, characterized in that, Also includes: Multiple valves (4) are provided between two adjacent cavities; An installation plate (5) is provided between two adjacent cavities, and an inlet and outlet (51) are provided on the installation plate (5); the valve (4) is rotatably mounted on the installation plate (5) and is used to open or close the inlet and outlet (51); the installation plate (5) is provided with a telescopic structure, which is used to drive the valve (4) to rotate to open or close the inlet and outlet (51).

5. The coating equipment according to claim 4, characterized in that, The telescopic structure includes a telescopic component (61) and a first telescopic rod (62). One end of the telescopic component (61) is disposed on the mounting plate (5), and the other end is telescopic. One end of the first telescopic rod (62) is fixedly disposed on the valve (4), and the other end is rotatably connected to the telescopic end of the telescopic component (61).

6. The coating equipment according to claim 5, characterized in that, The telescopic structure further includes a second telescopic rod (63), and one end of the telescopic member (61) is movably disposed on the mounting plate (5); one end of the second telescopic rod (63) is rotatably disposed on the mounting plate (5), and the other end is rotatably connected to the telescopic end of the telescopic member (61); Wherein, along the direction in which the telescopic member (61) extends, the angle between the second telescopic rod (63) and the telescopic member (61) is an acute angle.

7. The coating equipment according to claim 1, characterized in that, The central loading cavity (3) includes a loading plate (31), and a transition cavity (32) is provided on the loading plate (31). The transition cavity (32) includes a base (321), a bottom plate (322), and a rotation drive component. The base (321) is rotatably mounted on the loading plate (31) via a bearing (327). The bottom plate (322) is fixedly mounted on the side of the base (321) away from the loading plate (31). The rotation drive component is used to drive the base (321) to rotate on the loading plate (31).

8. The coating equipment according to claim 7, characterized in that, A plurality of support wheels (311) are rotatably provided on the loading plate (31), and the support wheels (311) are in rolling contact with the side of the base plate (322) facing the loading plate (31).

9. The coating apparatus according to any one of claims 1 to 8, characterized in that, Each of the plurality of cavities is provided with a transport assembly for transporting a carrier plate. The transport assembly includes a transport drive and a plurality of transport wheels (71) symmetrically arranged. The transport wheels (71) are rotatably disposed in the cavity. The transport drive is disposed on the cavity and is used to drive each transport wheel (71) to rotate.

10. The coating apparatus according to any one of claims 1 to 8, characterized in that, Also includes: A vacuum system is used to extract air from the plurality of cavities to create a vacuum environment.

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