Single-atom high-temperature flat panel deposition apparatus

Abstract

The utility model discloses a kind of single-atom high-temperature flat plate deposition devices.The single-atom high-temperature flat plate deposition device includes the deposition tank with deposition cavity, the sample deposition platform for placing sample, the heating device for heating sample, the cooling device for insulating heating device and deposition tank and the injection pipe for injecting single atom or cluster particle, the deposition tank is provided with the gas inlet for introducing non-reaction gas and the gas outlet for discharging non-reaction gas, the sample deposition platform and heating device are all installed on the cooling device, the heating device is located below the sample deposition platform, and the cooling device is in the deposition tank.The single-atom high-temperature flat plate deposition device of the utility model sets cooling device between heater and deposition tank, ensures that the temperature of the outer surface of deposition tank is in safe range, and can also maintain the working temperature of electromagnetic coil, so that electromagnetic coil works stably.

Description

Technical Field

[0001] This utility model relates to the field of powder heat treatment technology, and in particular to a single-atom high-temperature plate deposition device. Background Technology

[0002] Atomic layer deposition (ALD) is an important technique for improving the physicochemical properties of samples. Samples coated using ALD exhibit good resistance to erosion, moisture resistance, and flowability. However, in existing techniques, when heating plate-shaped samples, the heating device is usually located at the bottom of the sample and in direct contact with the deposition chamber. This direct transfer of high temperature to the deposition chamber causes the surface of the chamber to become very hot, potentially leading to burns. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a single-atom high-temperature flat plate deposition device that prevents the surface of the deposition tank from overheating.

[0004] To address the aforementioned problems, this invention provides a single-atom high-temperature plate deposition apparatus. The apparatus includes a deposition chamber with a deposition cavity, a sample deposition stage for placing a sample, a heating device for heating the sample, a cooling device for isolating the heating device and the deposition chamber, and a jetting pipe for ejecting single-atom or cluster particles. The deposition chamber is equipped with an inlet for introducing non-reactive gas and an outlet for discharging non-reactive gas. The sample deposition stage and the heating device are both mounted on the cooling device, which is located below the sample deposition stage and inside the deposition chamber.

[0005] Furthermore, the cooling device includes a cooling seat with a cooling cavity, an inlet for introducing cooling water, and an outlet for discharging cooling water. The inlet and outlet are mounted on the cooling seat, and the cooling seat has a cooling cavity. The inlet and outlet are connected to the cooling cavity of the cooling seat.

[0006] Furthermore, the cooling device has a first mounting groove for mounting a heating device and a second mounting groove for mounting a sample deposition stage. The first mounting groove is formed by a downward indentation at the bottom of the second mounting groove, and the diameter of the first mounting groove is smaller than the diameter of the second mounting groove.

[0007] Furthermore, the heating device includes an electromagnetic coil that generates heat when energized and a heating base for mounting the electromagnetic coil. The heating base is provided with a mounting groove, and the electromagnetic coil is disposed in the mounting groove.

[0008] Furthermore, the mounting groove is composed of a continuous S-shaped groove, which is formed by the downward recess of the top surface of the heating seat.

[0009] Furthermore, the sample deposition stage is provided with a placement slot for placing the sample.

[0010] Furthermore, the sample deposition stage is also provided with a sample retrieval slot, which is connected to the placement slot.

[0011] Furthermore, the deposition box includes a box body with a deposition chamber, a box cover for sealing the deposition chamber, and height-adjustable support feet. The box cover is detachably fixed to the box body, a sealing ring is provided between the box cover and the box body, and the support feet are provided on the box body.

[0012] Furthermore, the housing includes a cylinder, a bottom plate, and a top plate for enclosing and forming a deposition chamber. The lower end of the cylinder is connected to the bottom plate, the upper end of the cylinder is connected to the top plate, and the housing cover is detachably installed on the top plate.

[0013] Furthermore, the bottom plate is provided with a lower positioning groove for installing and positioning the cylinder, the top plate is provided with an upper positioning groove for installing and positioning the cylinder, the top plate is provided with a sealing groove, the sealing groove is located on the top surface of the top plate, the sealing ring is located in the sealing groove, and the box cover is pressed on the sealing ring.

[0014] This invention relates to a single-atom high-temperature flat plate deposition apparatus that uses a cooling device to separate the heating device from the deposition chamber. The cooling device can isolate the heat generated by the heating device from being transferred to the deposition chamber, keeping the temperature of the outer surface of the deposition chamber within a safe range. At the same time, it can also maintain the working temperature of the electromagnetic coil, enabling the electromagnetic coil to work stably. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a preferred embodiment of the single-atom high-temperature plate deposition apparatus of this utility model.

[0016] Figure 2 This is an exploded view of the single-atom high-temperature plate deposition apparatus of this utility model.

[0017] Figure 3 This is a cross-sectional view of the single-atom high-temperature plate deposition apparatus of this utility model.

[0018] Figure 4 This is a structural schematic diagram of the top slab.

[0019] Figure 5 This is a schematic diagram of the cooling base.

[0020] Figure 6 This is a schematic diagram of the heating base.

[0021] Figure 7 This is a schematic diagram of the sample deposition stage.

[0022] The meanings of the labels in the attached diagram are as follows:

[0023] Deposition box 1, deposition chamber 101, air inlet 102, air outlet 103, box body 11, cylinder 111, bottom plate 112, lower positioning groove 1121, top plate 113, upper positioning groove 1131, sealing groove 1132, sealing groove 113, box cover 12, support foot 13, sample deposition stage 2, placement groove 21, retrieval groove 22, heating device 3, electromagnetic coil 31, coil mounting groove 311, heating seat 32, cooling device 4, cooling seat 41, cooling chamber 410, first mounting groove 411, second mounting groove 412, water inlet interface 42, water outlet interface 43, spray pipe 5, sealing ring 6, sample 7. Detailed Implementation

[0024] The present invention will be further described below with reference to the accompanying drawings.

[0025] like Figures 1 to 3As shown, a preferred embodiment of the single-atom high-temperature plate deposition apparatus of this invention includes a deposition chamber 1, a sample deposition stage 2, a heating device 3, a cooling device 4, and a jet pipe 5. The deposition chamber 1 has an environmentally controlled deposition chamber 101. The deposition chamber 1 is provided with an inlet 102 and an outlet 103. The inlet 102 is used to introduce non-reactive gas, and the outlet 103 is used to discharge non-reactive gas. The non-reactive gas is usually an inert gas. The non-reactive gas can prevent the sample 7 from oxidizing and deteriorating when it comes into contact with air at high temperature. After the non-reactive gas fills the entire deposition chamber 101, it can be discharged through natural diffusion or negative pressure. Its flow design helps to form a continuous gas protective atmosphere on the surface of the sample 7. This design helps to replace the air in the deposition chamber 101 as much as possible and improve the protective effect. The inlet 102 is located higher than the outlet 103, which ensures that the non-reactive gas will only be discharged from the outlet 103 when the entire deposition chamber 101 is filled. The cooling device 4 is installed inside the deposition chamber 101 of the deposition chamber 1. The heating device 3 is mounted on the cooling device 4. The sample deposition stage 2 is mounted on the cooling device 4 and is in contact with the heating device 3. The sample deposition stage 2 is used to place the sample 7. The heating device 3 is used to heat the sample deposition stage 2, thereby indirectly heating the sample 7 on the sample deposition stage 2. The cooling device 4 is used to isolate the heating device 3 from the deposition chamber 1, preventing the heat generated by the heating device 3 from being directly transferred to the deposition chamber 1, ensuring that the surface temperature of the deposition chamber 1 is within a safe range, avoiding burns, and maintaining a stable coil operating temperature. The injection pipe 5 is mounted on the deposition chamber 1. The injection pipe 5 is used to inject single-atom or cluster particles, so that the sample 7 in the sample deposition stage 2 forms a coating. The end of the injection pipe 5 faces the sample deposition stage 2 to ensure that the reactive gas can be injected onto the sample 7 in the sample deposition stage 2. Typically, the injection pipe 5 is positioned directly above the sample deposition stage 2, with the injection pipe 5 pointing vertically downwards towards the sample deposition stage 2.

[0026] The deposition chamber 1 includes a chamber body 11, a cover 12, and support feet 13. The cover 12 is detachably fixed to the chamber body 11, facilitating the removal of the sample 7 and the cleaning or maintenance of the deposition chamber 101. The chamber body 11 has a deposition chamber 101, and the cover 12 seals the deposition chamber 101. A sealing ring 6 is provided between the cover 12 and the chamber body 11 to increase the sealing between the end cap and the assembly ring, thereby ensuring the sealing of the deposition chamber 101. The air inlet 102 and the air outlet 103 are both located on the chamber body 11, and the spray pipe 5 is located on the cover 12. Of course, in other embodiments, the spray pipe 5 can also be located on the cover 12, with the end of the spray pipe 5 bent towards the sample deposition stage 2. The support feet 13 are installed at the bottom of the chamber body 11, and the height of the support feet 13 is adjustable so that the chamber body 11 can be kept level even on uneven ground.

[0027] Combination Figure 4 Referring to the reference, the housing 11 includes a cylindrical body 111, a bottom plate 112, and a top plate 113. The lower end of the cylindrical body 111 is connected to the bottom plate 112, and the upper end of the cylindrical body 111 is connected to the top plate 113. The cylindrical body 111, the bottom plate 112, and the top plate 113 enclose a deposition chamber 101. The housing cover 12 is detachably installed on the top plate 113 to seal the deposition chamber 101. A lower positioning groove 1121 is provided on the bottom plate 112. The lower positioning groove 1121 is formed by a downward indentation of the bottom plate 112. The lower end of the cylindrical body 111 is located in the lower positioning groove 1121. The lower positioning groove 1121 facilitates the quick determination of the positional relationship between the cylindrical body 111 and the bottom plate 112 during assembly. The top plate 113 is provided with an upper positioning groove 1131, which is formed by the bottom surface of the top plate 113 being recessed upwards. The upper end of the cylinder 111 is located in the upper positioning groove 1131. The upper positioning groove 1131 facilitates the quick determination of the positional relationship between the cylinder 111 and the top plate 113 during assembly. The top plate 113 is provided with a sealing groove 1132, which is located on the top surface of the top plate 113. The sealing ring 6 is located in the sealing groove 1132, and the box cover 12 is pressed on the sealing ring 6 to achieve a seal between the box cover 12 and the box body 11.

[0028] Combination Figure 5Referring to the above, the cooling device 4 includes a cooling base 41, a water inlet 42, and a water outlet 43. The water inlet 42 and the water outlet 43 are mounted on the cooling base 41. The cooling base 41 has a cooling cavity 410. The water inlet 42 and the water outlet 43 are connected to the cooling cavity 410 of the cooling base 411. The lower ends of the water inlet 42 and the water outlet 43 extend through the bottom plate 112 of the deposition tank 1 for easy communication with the outside. Cooling water enters the cooling cavity 410 through the water inlet 42, and after fully absorbing heat around the electromagnetic coil 31, it is discharged from the cooling base 41 through the water cooling outlet. This continuously and effectively removes the heat generated by the electromagnetic coil 31, ensuring that the heat is not transferred to the deposition tank 1, thereby ensuring that the outer surface temperature of the deposition tank 1 is within a safe range, while also maintaining the operating temperature of the electromagnetic coil 31, allowing the electromagnetic coil 31 to operate stably.

[0029] The cooling device 4 has a first mounting groove 411 and a second mounting groove 412, which are located on the cooling base 41. The heating device 3 is disposed in the first mounting groove 411, and the sample deposition stage 2 is disposed in the second mounting groove 412. The first mounting groove 411 and the second mounting groove 412 are concentrically arranged, with the first mounting groove 411 located below the second mounting groove 412. The second mounting groove 412 is formed by a downward indentation from the top surface of the cooling base 41, and the first mounting groove 411 is formed by a downward indentation from the bottom of the second mounting groove 412. The diameter of the first mounting groove 411 is smaller than the diameter of the second mounting groove 412. This design allows the heating device 3 to fit snugly against the sample deposition stage 2, enabling the heating device 3 to quickly transfer heat to the sample deposition stage 2.

[0030] like Figure 6 As shown, the heating device 3 includes an electromagnetic coil 31 and a heating base 32. The electromagnetic coil 31 is mounted on the heating base 32. The electromagnetic coil 31 generates heat when energized, and its heating range covers the entire sample deposition stage 2. The heating base 32 has a coil mounting groove 311, within which the electromagnetic coil 31 is mounted. The coil mounting groove 311 is formed by a continuous S-shaped recess, recessed downwards from the top surface of the heating base 32. This facilitates the placement of the electromagnetic coil 31 into the groove, and both ends of the groove extend to the sidewalls of the heating base 32, allowing the groove to communicate with the outside of the heating base 32, thus facilitating the connection between the control wire harness and the electromagnetic coil 31. The height of the heating base 32 is the same as the height of the second mounting groove 412, ensuring that the bottom of the heating base 32 and the second mounting groove 412 are at the same height. This allows the sample deposition stage 2 to be stably positioned within the second mounting groove 412, ensuring the stability of the sample deposition stage 2.

[0031] like Figure 7 As shown, the sample deposition stage 2 is provided with a placement groove 21, which is located at the center of the sample deposition stage 2. The placement groove 21 is used to place a flat sample 7. The placement groove 21 is formed by a downward-facing indentation of the top surface of the sample deposition stage 2, which facilitates the placement of the sample 7. The placement groove 21 can confine the sample 7 and ensure that the sample 7 does not move. The sample deposition stage 2 is also provided with a retrieval groove 22, which is formed by a downward-facing indentation of the top surface of the sample deposition stage 2. Part of the retrieval groove 22 overlaps with the placement groove 21, so that the retrieval groove 22 and the placement groove 21 are connected. In this way, the sample 7 can be removed from the placement groove 21 by going deep into the placement groove 21 and fitting against the side wall of the sample 7. There are four retrieval grooves 22, which are evenly distributed around the placement groove 21.

[0032] In use, sample 7 is placed in sample deposition stage 2, and then the entire deposition chamber 101 is filled with non-reactive gas. The electromagnetic coil 31 is energized to heat the sample deposition stage 2, while the jet tube 5 sprays single-atom or cluster particles, allowing the particles to uniformly coat the sample 7. Using the electromagnetic coil 31 for heating enables precise temperature control and avoids the temperature lag inherent in traditional heating methods. Furthermore, the electromagnetic coil 31 is evenly distributed around the sample deposition stage 2, ensuring uniform heating. A cooling device 4 is installed between the heating base 32 and the bottom plate 112 of the deposition chamber 1. This cooling device 4 continuously and effectively removes the heat generated by the electromagnetic coil 31, ensuring that heat is not transferred to the deposition chamber 1, thus maintaining the outer surface temperature of the deposition chamber 1 within a safe range. It also maintains the operating temperature of the electromagnetic coil 31, ensuring stable operation.

[0033] The above are merely embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structure made using the contents of this utility model specification and drawings, whether directly or indirectly applied to other related technical fields, shall also be within the patent protection scope of this utility model.

Claims

1. A single-atom high-temperature flat plate deposition apparatus, characterized in that: The device includes a deposition chamber with a deposition cavity, a sample deposition stage for placing a sample, a heating device for heating the sample, a cooling device for isolating the heating device and the deposition chamber, and a jetting pipe for ejecting single-atom or cluster particles. The deposition chamber is provided with an inlet for introducing non-reactive gas and an outlet for discharging non-reactive gas. The sample deposition stage and the heating device are both mounted on the cooling device, which is located below the sample deposition stage and inside the deposition chamber.

2. The single-atom high-temperature flat plate deposition apparatus as described in claim 1, characterized in that: The cooling device includes a cooling seat with a cooling cavity, an inlet for introducing cooling water, and an outlet for discharging cooling water. The inlet and outlet are installed on the cooling seat, and the cooling seat has a cooling cavity. The inlet and outlet are connected to the cooling cavity of the cooling seat.

3. The single-atom high-temperature flat plate deposition apparatus as described in claim 1, characterized in that: The cooling device has a first mounting groove for mounting a heating device and a second mounting groove for mounting a sample deposition stage. The first mounting groove is formed by the bottom of the second mounting groove being recessed downwards, and the diameter of the first mounting groove is smaller than the diameter of the second mounting groove.

4. The single-atom high-temperature flat plate deposition apparatus as described in claim 1, characterized in that: The heating device includes an electromagnetic coil that generates heat when energized and a heating base for mounting the electromagnetic coil. The heating base is provided with a mounting groove, and the electromagnetic coil is located in the mounting groove.

5. The single-atom high-temperature flat plate deposition apparatus as described in claim 4, characterized in that: The mounting groove is composed of a continuous S-shaped groove, which is formed by the downward indentation of the top surface of the heating base.

6. The single-atom high-temperature flat plate deposition apparatus as described in claim 1, characterized in that: The sample deposition stage is provided with a placement slot for placing the sample.

7. The single-atom high-temperature flat plate deposition apparatus as described in claim 6, characterized in that: The sample deposition stage is also provided with a retrieval slot for retrieving samples, and the retrieval slot is connected to the placement slot.

8. The single-atom high-temperature flat plate deposition apparatus as described in claim 1, characterized in that: The deposition box includes a box body with a deposition chamber, a box cover for sealing the deposition chamber, and height-adjustable support feet. The box cover is detachably fixed to the box body, and a sealing ring is provided between the box cover and the box body. The support feet are provided on the box body.

9. The single-atom high-temperature flat plate deposition apparatus as described in claim 8, characterized in that: The enclosure includes a cylinder, a bottom plate, and a top plate for enclosing and forming a deposition chamber. The lower end of the cylinder is connected to the bottom plate, and the upper end of the cylinder is connected to the top plate. The enclosure cover is detachably installed on the top plate.

10. The single-atom high-temperature flat plate deposition apparatus as described in claim 9, characterized in that: The base plate is provided with a lower positioning groove for installing and positioning the cylinder, the top plate is provided with an upper positioning groove for installing and positioning the cylinder, the top plate is provided with a sealing groove, the sealing groove is located on the top surface of the top plate, the sealing ring is located in the sealing groove, and the box cover is pressed on the sealing ring.

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