Chemical copper anti-copper slag and copper deposition improvement system

Abstract

The utility model discloses a kind of chemical copper anti-copper slag and copper deposition improvement system, belong to chemical copper technical field.Its technical scheme is: chemical copper anti-copper slag and copper deposition improvement system, including copper deposition tank and controller;Copper deposition tank includes copper deposition inner tank and copper deposition outer tank, copper deposition inner tank is set in the inside of copper deposition outer tank, L-shaped baffle is provided between the two end side walls of copper deposition inner tank and copper deposition outer tank, backflow opening is provided in the bottom of copper deposition inner tank, the side wall of copper deposition inner tank is provided with drilling, the inner wall of copper deposition outer tank is provided with slow flow distribution plate, control valve is provided in the bottom of backflow opening, control valve is electrically connected with controller;Copper deposition inner tank is provided with pH sensor and concentration sensor, pH sensor and concentration sensor are electrically connected with controller.The utility model can reduce the copper deposition condition of copper deposition condition in the periphery due to concentration gradient difference stationary area, through real-time online analysis, copper slag analysis result anomaly caused by detection not in time can be eliminated in time.

Description

Technical Field

[0001] This utility model belongs to the field of chemical copper technology, specifically relating to a chemical copper anti-copper slag and copper deposition improvement system. Background Technology

[0002] Chemical copper plating is a process that deposits a copper layer on a non-conductive substrate through a chemical reduction reaction. It is widely used in printed circuit board (PCB) manufacturing and metallization of electronic components. This process requires no external current; instead, it relies on the reaction between chemical agents to form a uniform and dense copper plating layer on a catalytically active substrate surface, providing a good conductive foundation for subsequent electroplating and other processes. Its core principle involves using a reducing agent to reduce copper ions from solution to metallic copper, which is then deposited on the substrate surface. This involves complex chemical reactions and solution equilibrium systems.

[0003] Existing automated analysis devices for chemical copper plating tanks require the addition of alkali, stabilizers, and reducing agents based on the ratio of copper ion concentration determined by photoelectric colorimetry analysis. In actual production, the height of the rollers on horizontal equipment results in low water flow rates, high chemical activity, and reduced chelation capacity due to tank walls hindering backflow, leading to analytical failures. Concentration differences at the tank bottom cause copper deposition, forming copper slag that blocks pipes. In severe cases, rapid copper buildup on the tank walls and bottom necessitates immediate tank replacement and removal of the deposits, impacting uptime and product quality. Automated analysis requires real-time tank cooling to 18-20 degrees Celsius to ensure accuracy, significantly increasing production complexity and time costs. Given these problems with existing automated chemical copper plating tank analysis devices, improvements to the chemical copper plating process and related equipment are urgently needed. Utility Model Content

[0004] This invention provides a chemical copper anti-copper slag and copper precipitation improvement system. This system can reduce the copper deposition caused by the surrounding static zone due to concentration gradient difference. Through real-time online analysis, it can promptly eliminate abnormal copper slag analysis results caused by untimely detection.

[0005] The technical solution of this utility model is as follows:

[0006] Chemical copper anti-copper slag and copper precipitation improvement system, including copper precipitation tank and controller;

[0007] The copper plating tank includes an inner copper plating tank and an outer copper plating tank. The inner copper plating tank is located inside the outer copper plating tank. An L-shaped baffle plate is installed between the two end side walls of the inner and outer copper plating tanks. A reflux opening is installed at the bottom of the inner copper plating tank. Drill holes are installed on the side walls of the inner copper plating tank. A slow flow distribution plate is installed on the inner wall of the outer copper plating tank. A control valve is installed at the bottom of the reflux opening. The control valve is electrically connected to the controller.

[0008] A pH sensor and a concentration sensor are installed inside the copper plating tank, and both the pH sensor and the concentration sensor are electrically connected to the controller.

[0009] Above the L-shaped baffle plate, on one side wall of the outer copper plating tank, is a pipeline for overflowing the chemical solution to the waste liquid area. To maintain a stable liquid level, a portion of the chemical solution is discharged into the waste liquid area pipeline. Above the L-shaped baffle plate, on the other side wall of the outer copper plating tank, is a pipeline for discharging the chemical solution to be analyzed. This pipeline is connected in sequence to a filter, a first chemical solution box, a second chemical solution box, and an automatic analysis system. Both the first and second chemical solution boxes are equipped with cooling coils, which have cooling water inlet and outlet pipelines. The outlet of the automatic analysis system is connected to the inner copper plating tank via a pipeline. The second chemical solution box is connected to a pipeline for returning the chemical solution to the outer copper plating tank. A circulation pump and a flow meter are installed on the pipeline connecting the automatic analysis system to the inner copper plating tank, and the flow meter is electrically connected to a controller. The outer copper plating tank is also connected to the filter via a copper plating liquid outflow pipeline. A copper plating liquid replenishment pipeline is located on one side of the bottom of the outer copper plating tank.

[0010] Preferably, the drill hole is located at 2 / 3 of the height of the inner wall of the copper plating tank, and the angle between the drill hole and the inner wall of the copper plating tank is 75°.

[0011] Preferably, the surface of the flow distribution plate is provided with flow guide grooves, which are distributed in a spiral shape on the surface of the flow distribution plate.

[0012] Preferably, the concentration sensor is a spectral sensor or a copper ion concentration detection sensor.

[0013] Preferably, a temperature sensor is installed in the copper plating tank, and several heaters are installed on the tank wall. Both the heaters and the temperature sensor are electrically connected to the controller. The heaters, temperature sensor, and controller are linked to maintain the constant temperature environment required for the copper plating reaction and prevent abnormal copper deposition caused by temperature fluctuations.

[0014] Compared with the prior art, this utility model has the following advantages:

[0015] 1. This utility model increases the fluid exchange rate and reduces the copper deposition caused by the surrounding static area due to the concentration gradient difference by setting up a double-groove structure, side wall drilling and L-shaped baffle plate.

[0016] 2. The sidewall drilling (75° angle) and the spiral guide channel slow flow distribution plate optimize the fluid path and improve the mixing uniformity of the outflowing liquid in the channel.

[0017] 3. An online dual-stage cooling system (first and second drug tanks + cooling coils) rapidly cools the drug solution to 18-20°C, avoiding the time loss associated with traditional shutdown cooling methods. An automatic analysis system monitors parameters such as copper ion concentration and pH in real time, and dynamically replenishes the drug via a controller to maintain the stability and chelation capacity of the drug solution.

[0018] 4. The filter intercepts copper slag particles to prevent pipe blockage; the chemical solution circulation and return design reduces waste liquid discharge and lowers the frequency of tank replacement. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of this utility model.

[0020] In the diagram, 1. Inner copper plating tank; 2. Outer copper plating tank; 3. L-shaped baffle plate; 4. Drill hole; 5. Slow flow distribution plate; 6. Pipeline for overflowing chemical solution to waste liquid area; 7. Outlet pipeline for chemical solution to be analyzed; 8. Filter; 9. First chemical solution box; 10. Second chemical solution box; 11. Automatic analysis system; 12. Pipeline for chemical solution to flow back to outer copper plating tank; 13. Circulation pump; 14. Return opening; 15. Outlet pipeline for copper plating solution; 16. Replenishment pipeline for copper plating solution. Detailed Implementation

[0021] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of this utility model.

[0022] Example 1

[0023] like Figure 1 As shown, this embodiment provides a technical solution of the present invention as follows:

[0024] Chemical copper anti-copper slag and copper precipitation improvement system, including copper precipitation tank and controller;

[0025] The copper plating tank includes an inner copper plating tank 1 and an outer copper plating tank 2. The inner copper plating tank 1 is located inside the outer copper plating tank 2. An L-shaped baffle plate 3 is provided between the two end side walls of the inner copper plating tank 1 and the outer copper plating tank 2. A reflux opening 14 is provided at the bottom of the inner copper plating tank 1. A drill hole 4 is provided on the side wall of the inner copper plating tank 1. A slow flow distribution plate 5 is provided on the inner wall of the outer copper plating tank 2. A control valve is provided at the bottom of the reflux opening 14. The control valve is electrically connected to a controller. The drill hole 4 is located at 2 / 3 of the height of the side wall of the inner copper plating tank 1. The angle between the drill hole 4 and the side wall of the inner copper plating tank 1 is 75°. A flow guide groove is provided on the surface of the slow flow distribution plate 5. The flow guide groove is distributed in a spiral shape on the surface of the slow flow distribution plate 5.

[0026] A pH sensor and a copper ion concentration detection sensor are installed inside the copper plating tank 1. Both the pH sensor and the concentration sensor are electrically connected to the controller.

[0027] Above the L-shaped baffle plate 3, on one side wall of the copper plating tank 2, is a pipe 6 for overflowing the chemical solution to the waste liquid area. Above the L-shaped baffle plate 3, on the other side wall of the copper plating tank 2, is a pipe 7 for discharging the chemical solution to be analyzed. The discharging pipe 7 is connected in sequence to a filter 8, a first chemical solution box 9, a second chemical solution box 10, and an automatic analysis system 11. Both the first chemical solution box 9 and the second chemical solution box 10 are equipped with cooling coils, which are equipped with cooling water inlet pipes and cooling water outlet pipes. The outlet of the automatic analysis system 11 is connected to the inner copper plating tank 1 via a pipeline; the second reagent box 10 is connected to a pipeline 12 for the return of reagent to the outer copper plating tank; the automatic analysis system 11 uses an OCA online analyzer manufactured by Shanghai Puwei Automation Technology Co., Ltd.; a circulation pump 13 and a flow meter are installed on the pipeline connected to the inner copper plating tank 1, and the flow meter is electrically connected to the controller; the outer copper plating tank 2 is also connected to the filter 8 via a copper plating liquid outflow pipeline 15; a copper plating liquid replenishment pipeline 16 is installed on one side of the bottom of the outer copper plating tank 2. A temperature sensor is installed in the inner copper plating tank 1, and several heaters are installed on the tank wall of the inner copper plating tank 1. Both the heaters and the temperature sensor are electrically connected to the controller. The heaters, temperature sensor, and controller are linked to maintain the constant temperature environment required for the copper plating reaction and avoid abnormal copper precipitation caused by temperature fluctuations.

[0028] Work process:

[0029] The copper plating solution in the inner tank 1 flows into the outer tank 2 through the bottom reflux opening 14, and then enters the filter 8 through the copper plating solution outlet pipe 15. The copper plating solution flowing out at a 75° angle through the side wall drill hole 4 is slowed and evenly distributed by the spiral guide groove of the slow flow distribution plate 5 to reduce copper precipitation caused by turbulence. It then enters the filter 8 through the solution outlet pipe 7 to remove impurities and enters the first solution box 9 and the second solution box 10 for cooling. After cooling, the solution enters the automatic analysis system 11 to detect parameters such as copper content and pH value. The remaining solution flows back to the inner tank 1 through the solution outlet pipe 12 for recycling. Based on the feedback results from the automatic analysis system, the controller replenishes the solution to the outer tank as needed. When the liquid level exceeds the height of the L-shaped baffle plate 3, the solution overflows to the waste liquid area through the solution outlet pipe 6 to maintain a stable liquid level. The temperature sensor monitors the temperature of the inner tank, and the controller adjusts the heater power to ensure a constant reaction temperature.

[0030] Although the present invention has been described in detail with reference to the accompanying drawings and preferred embodiments, it is not limited thereto. Various equivalent modifications or substitutions can be made to the embodiments of the present invention by those skilled in the art without departing from the spirit and essence of the present invention, and all such modifications or substitutions should be within the scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A chemical copper anti-copper slag and copper deposition improvement system, characterized in that, Includes copper plating tank and controller; The copper plating tank includes an inner copper plating tank (1) and an outer copper plating tank (2). The inner copper plating tank (1) is located inside the outer copper plating tank (2). An L-shaped baffle plate (3) is provided between the two end side walls of the inner copper plating tank (1) and the outer copper plating tank (2). A reflux opening (14) is provided at the bottom of the inner copper plating tank (1). A control valve is provided at the bottom of the reflux opening (14). The control valve is electrically connected to the controller. A drill hole (4) is provided on the side wall of the inner copper plating tank (1). A slow flow distribution plate (5) is provided on the inner wall of the outer copper plating tank (2). A pH sensor and a concentration sensor are installed in the copper plating tank (1), and both the pH sensor and the concentration sensor are electrically connected to the controller; Above the L-shaped baffle plate (3), on one side wall of the copper plating tank (2), is a pipeline (6) for overflowing the chemical solution to the waste liquid area. Above the L-shaped baffle plate (3), on the other side wall of the copper plating tank (2), is a pipeline (7) for the chemical solution to be analyzed. The pipeline (7) for the chemical solution to be analyzed is connected in sequence to a filter (8), a first chemical solution box (9), a second chemical solution box (10), and an automatic analysis system (11). Cooling coils are installed on the outside of both the first chemical solution box (9) and the second chemical solution box (10). The cooling coils are equipped with cooling... The water inlet pipe and cooling water outlet pipe are connected to the copper plating inner tank (1) through the outlet of the automatic analysis system (11); the second chemical box (10) is connected to the chemical liquid return pipe (12) to the copper plating outer tank; a circulation pump (13) and a flow meter are installed on the pipe connecting the automatic analysis system (11) and the copper plating inner tank (1), and the flow meter is electrically connected to the controller; the copper plating outer tank (2) is also connected to the filter (8) through the copper plating liquid outflow pipe (15); a copper plating liquid replenishment pipe (16) is installed on one side of the bottom of the copper plating outer tank (2).

2. The chemical copper anti-copper slag and copper precipitation improvement system as described in claim 1, characterized in that, The drill hole (4) is located at 2 / 3 of the height of the side wall of the copper plating tank (1), and the angle between the drill hole (4) and the side wall of the copper plating tank (1) is 75°.

3. The chemical copper anti-copper slag and copper precipitation improvement system as described in claim 1, characterized in that, The surface of the slow flow distribution plate (5) is provided with flow guide grooves, which are distributed in a spiral shape on the surface of the slow flow distribution plate (5).

4. The chemical copper anti-copper slag and copper precipitation improvement system as described in claim 1, characterized in that, The concentration sensor is either a spectral sensor or a copper ion concentration detection sensor.

5. The chemical copper anti-copper slag and copper precipitation improvement system as described in claim 1, characterized in that, A temperature sensor is provided in the copper plating tank (1), and several heaters are provided on the tank wall of the copper plating tank (1). Both the heaters and the temperature sensor are electrically connected to the controller.

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