A spot plating die with positioning and guiding functions

Abstract

The utility model discloses a kind of point plating mould with positioning and guiding function, comprising: the V-shaped frame, two groups of guiding conveying mechanisms are drivenly installed in V-shaped frame in upper and lower opposite formula, two groups of butt joint disc are fixedly installed on V-shaped frame upper surface, two groups of butt joint disc are rotatably installed with point plating disc between, point plating disc outer surface is connected and is installed with point plating needle, point plating needle is press pump type structure, so that point plating disc can drive point plating needle to rotate and press on the surface of strip-shaped chip conveyed between two groups of guiding conveying mechanisms to carry out press point plating.The design of the guiding conveying mechanism of the present application, through first conveying belt and second conveying belt, forms stable bite clamp structure, in combination with the support of backing plate, it can be ensured that strip-shaped chip does not deviate, does not run off in conveying process, this accurate guiding conveying makes chip can enter point plating area with fixed path, stable posture, guarantee that point plating needle and chip to be plated point accurate alignment.

Description

Technical Field

[0001] This utility model relates to the field of spot plating mold technology, specifically a spot plating mold with positioning and guiding function. Background Technology

[0002] In the field of modern precision manufacturing, from microelectronic chips to complex precision instrument components, the accuracy and reliability of surface treatment directly determine product performance and lifespan. Spot plating, as a refined branch of electroplating technology, meets diverse needs such as localized functional enhancement and aesthetic modification with its unique advantage of "targeted plating." Among these, the spot plating process based on the collaborative operation of a disc-shaped spot plating mold and a strip-shaped chip achieves millimeter-level or even micrometer-level positioning of the plating points through precise mold rotation and chip directional movement. In this process, the spot plating mold is not only a positioning carrier, but its internal design for storing and transporting the plating solution is also the core of the process.

[0003] For example, the national authorized patent announcement number CN218115624U discloses a 500 mm diameter electroplating line nano-ceramic dot plating mold, which effectively solves the problem that the continuous movement of the strip chip may cause poor contact between the strip chip and the dot plating mold, thus affecting the dot plating efficiency. The mold includes a dot plating mold body, a base at the bottom of the dot plating mold body, a rotating component installed between the dot plating mold body and the base, and a limiting component installed on one side of the dot plating mold body. The rotating component includes a rotating shaft symmetrically installed at the top and bottom of the dot plating mold body, and a gear installed on the outside of the rotating shaft. In this utility model, a screw is threadedly connected to a connecting plate, and the screw is rotatably engaged with a support plate. After the screw rotates, it pushes the rotating roller to move towards one side of the dot plating mold body, thereby limiting the strip chip and facilitating the tight contact between the strip chip and the dot plating mold body, thus improving the dot plating effect.

[0004] However, the aforementioned 500 mm diameter electroplating line nano-ceramic spot plating mold does not have the function of limiting the workpiece during the workpiece transmission and spot plating process. This will cause the workpiece to deviate in position during transmission, resulting in a deviation in the spot plating position. Utility Model Content

[0005] The purpose of this utility model is to provide a spot plating mold with positioning and guiding function to solve the problem mentioned in the background art that the lack of a function to limit the workpiece during the workpiece transmission spot plating process leads to the workpiece being misaligned during transmission.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A spot plating mold with positioning and guiding function includes: a U-shaped frame, in which two sets of guiding and conveying mechanisms are installed in a vertically opposite manner; two sets of docking plates are fixedly installed on the upper surface of the U-shaped frame; a spot plating plate is rotatably installed between the two sets of docking plates; and a spot plating needle is connected to the outer surface of the spot plating plate. The spot plating needle has a press pump structure, so that when the spot plating plate drives the spot plating needle to rotate, it presses against the surface of the strip chip being conveyed between the two sets of guiding and conveying mechanisms to perform spot plating.

[0008] Preferably, one end of one of the docking discs is fixedly mounted with a connecting cylinder, and one end of the connecting cylinder is fixedly mounted with a motor. The output shaft of the motor passes through the connecting cylinder and is fixedly connected to the first transmission disc. The first transmission disc is fixedly mounted at one end of the plating disc and passes through the docking disc and is covered by the connecting cylinder.

[0009] Preferably, the guiding and conveying mechanism includes four sets of first transmission columns and two sets of second transmission columns, and the outer surfaces of each pair of horizontally opposite first transmission columns and second transmission columns are respectively fitted with a first conveyor belt and a second conveyor belt, and the two sets of first conveyor belts are driven by the two ends of the upper surface of the second conveyor belt.

[0010] Preferably, a first gear and a second gear are fixedly installed at both ends of one of the first and second transmission columns, and the first gear and the second gear mesh with each other, so that the first transmission column and the second transmission column can be driven to rotate relative to each other through the meshing of the first gear and the second gear. In turn, the first transmission column and the second transmission column drive the first conveyor belt and the second conveyor belt fitted on the outer surface to rotate relative to each other, so that the gap between the first conveyor belt and the second conveyor belt can bite the strip chip into the conveyor.

[0011] Preferably, each of the two sets of first conveyor belts and one set of second conveyor belts is provided with a support plate. The upper and lower surfaces of the support plate can respectively abut against the upper and lower surfaces of the first and second conveyor belts, and the support plate is fixedly installed at both ends inside the U-shaped frame.

[0012] Preferably, one end of the first gear is fixedly mounted with a second transmission disk, the outer surface of the second transmission disk is fitted with a transmission belt, and the other end of the transmission belt is fitted onto the outer surface of the first transmission disk.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] 1. Through the design of the plating disc, plating needle, motor, and guiding conveyor mechanism, during use, the plating disc is rotated within two sets of mating discs by starting the motor, while the guiding conveyor mechanism is driven to move within the U-shaped frame. Then, the operator can feed the strip chip into the guiding conveyor mechanism and have it bitten into the guide. During this process, the plating disc continues to rotate under the drive of the motor. Because the plating needle has a press-pump structure, it is pre-stored with electroplating solution. When the strip chip is precisely delivered to the plating area between the two sets of guiding conveyors, the rotating plating needle rotates to the position of contact with the chip surface and presses against it. On the chip to be plated, the moment the plating needle presses against the chip, its pump-like structure is squeezed, the internal pressure changes, triggering the electroplating solution extrusion mechanism. This allows the stored electroplating solution to be precisely applied to the chip surface to the plating location through the outlet of the plating needle under pressure. As the plating disk continues to rotate, the plating needle will continuously contact each plating point on the chip, repeating the pressing and extrusion of the electroplating solution, thus achieving continuous plating of the chip surface to the plating area. Throughout the plating process, the guiding and conveying mechanism maintains a stable biting drive, and the workpiece deviation is prevented by the limiting of the U-shaped frame.

[0015] 2. Through the design of the first transmission column, first conveyor belt, second conveyor belt, second transmission disc, second gear, first gear, transmission belt, and support plate, in use, the first transmission disc can be rotated by starting the motor. Since the first transmission disc is fixedly connected to the plating disc, its rotation directly drives the plating disc to rotate synchronously. Simultaneously, the transmission belt fitted on the outer surface of the first transmission disc drives the second transmission disc to rotate as well. The second transmission disc is fixedly installed at one end of one set of first gears, thus driving the first gear to rotate as well. The meshing second gear also rotates accordingly. This transmission process... Power is transmitted to the first and second drive columns. Since the first and second drive columns are fixedly connected to the first and second gears respectively, they begin to rotate relative to each other. The rotation of the first and second drive columns directly drives the first and second conveyor belts, which are mounted on their outer surfaces, to rotate synchronously. Each pair of laterally opposite first and second drive columns, in conjunction with the first and second conveyor belts, forms a stable clamping structure. Two sets of the first conveyor belts drive the upper surfaces of the second conveyor belts at both ends, ensuring that the gap between the first and second conveyor belts stably grips and conveys the strip-shaped chip, allowing it to be conveyed... During the process, the chip is firmly clamped between two sets of conveyor belts and moves smoothly along the bite path, effectively avoiding deviation or off-tracking. Simultaneously, the support plates installed inside the first and second conveyor belts provide stable support, ensuring the flatness and stability of the conveyor belts during transmission, further guaranteeing the smoothness and accuracy of chip transport. After the chip is stably transported to the plating area between the U-shaped frames, one set of plating needles mounted on the outer surface of the plating tray rotates to a vertical position and presses against the chip surface. Because the plating needles have a pump-like structure, their internal components... When the structure is compressed, the stored electroplating solution is squeezed out and precisely coated onto the chip surface at the plating location, completing the spot plating operation. A stable clamping structure is formed by four sets of first drive columns and two sets of second drive columns working in conjunction with the first and second conveyor belts. Combined with the support of the support plate, this ensures that the strip chip does not shift or deviate during transport. This precise guiding transport allows the chip to enter the spot plating area along a fixed path and in a stable posture, ensuring precise alignment between the plating needle and the chip's plating point. This effectively avoids problems such as missed plating or off-center plating caused by chip position deviation, significantly improving the accuracy of the plating position and the consistency of the plating quality. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the structure of the dot-plating disk of this utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the docking plate and connecting cylinder of this utility model;

[0019] Figure 4 This is a schematic diagram of the structure of the first and second conveyor belts of this utility model.

[0020] In the diagram: 1. U-shaped frame; 101. Connecting plate; 102. Spot plating plate; 103. Spot plating needle; 104. Connecting cylinder; 105. Motor; 106. First transmission plate; 2. Guide conveying mechanism; 201. First transmission column; 202. First conveyor belt; 203. Second conveyor belt; 204. Second transmission plate; 205. Second gear; 206. First gear; 207. Transmission belt; 208. Liner plate; 209. Second transmission column. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] like Figures 1-2 As shown, this embodiment provides a spot plating mold with positioning and guiding function, including: a U-shaped frame 1, two sets of guiding and conveying mechanisms 2 are installed in the U-shaped frame 1 in an up-down relative transmission manner, two sets of docking plates 101 are fixedly installed on the upper surface of the U-shaped frame 1, a spot plating plate 102 is rotatably installed between the two sets of docking plates 101, and a spot plating needle 103 is connected to the outer surface of the spot plating plate 102. The spot plating needle 103 has a press pump structure, so that when the spot plating plate 102 drives the spot plating needle 103 to rotate, it can press and spot plating on the surface of the strip chip being conveyed between the two sets of guiding and conveying mechanisms 2.

[0023] One of the docking discs 101 has a connecting cylinder 104 fixedly installed at one end, and a motor 105 is fixedly installed at one end of the connecting cylinder 104. The output shaft of the motor 105 passes through the connecting cylinder 104 and is fixedly connected to the first transmission disc 106. The first transmission disc 106 is fixedly installed at one end of the plating disc 102 and passes through the docking disc 101 and is covered by the connecting cylinder 104.

[0024] Through the design of the plating disc 102, plating needle 103, motor 105, and guide conveyor 2, during use, the plating disc 102 can be rotated within the two sets of mating discs 101 by starting the motor 105, while the guide conveyor 2 is simultaneously driven to move within the U-shaped frame 1. Then, the operator can feed the strip chip into the guide conveyor 2 and have it bitten into the guide. During this process, the plating disc 102 continues to rotate under the drive of the motor 105. Furthermore, because the plating needle 103 has a press-pump structure and pre-stores electroplating solution inside, when the strip chip is precisely delivered to the plating area between the two sets of guide conveyors 2, the rotating plating needle 103 rotates precisely to contact the chip surface. The plating needle 103 presses against the chip at the contact point and presses against the chip to be plated. At the moment the plating needle 103 presses against the chip, its pump-like structure is squeezed, and the internal pressure changes, triggering the electroplating liquid extrusion mechanism. Under pressure, the stored electroplating liquid is accurately coated onto the chip surface to be plated through the outlet of the plating needle 103. As the plating disk 102 continues to rotate, the plating needle 103 will continuously contact each point to be plated on the chip, repeating the above pressing and extrusion of electroplating liquid, so as to achieve continuous plating of the chip surface to be plated. During the entire plating process, the guide conveyor 2 always maintains a stable biting drive, and the workpiece can also be prevented from deviating by the limiting of the U-shaped frame 1.

[0025] like Figures 3-4 As shown, the guiding and conveying mechanism 2 includes four sets of first transmission columns 201 and two sets of second transmission columns 209. The outer surfaces of each pair of horizontally opposite first transmission columns 201 and second transmission columns 209 are respectively fitted with a first conveyor belt 202 and a second conveyor belt 203, and the two sets of first conveyor belts 202 are driven by the two ends of the upper surface of the second conveyor belt 203.

[0026] Furthermore, a first gear 206 and a second gear 205 are fixedly installed at both ends of one set of first transmission columns 201 and second transmission columns 209, respectively, and the first gear 206 and the second gear 205 mesh with each other, so that the first transmission column 201 and the second transmission column 209 can be driven to rotate relative to each other through the meshing of the first gear 206 and the second gear 205. In turn, the first transmission column 201 and the second transmission column 209 drive the first conveyor belt 202 and the second conveyor belt 203 fitted on the outer surface to rotate relative to each other, so that the gap between the first conveyor belt 202 and the second conveyor belt 203 can bite the strip chip into the conveyor.

[0027] Each of the two sets of first conveyor belts 202 and one set of second conveyor belts 203 is provided with a support plate 208. The upper and lower surfaces of the support plate 208 can respectively abut against the upper and lower surfaces of the first conveyor belt 202 and the second conveyor belt 203, and the support plate 208 is fixedly installed at both ends inside the U-shaped frame 1.

[0028] One end of the first gear 206 is fixedly mounted with the second transmission disc 204, and the outer surface of the second transmission disc 204 is fitted with a transmission belt 207. The other end of the transmission belt 207 is fitted onto the outer surface of the first transmission disc 106.

[0029] Through the design of the first transmission column 201, the first conveyor belt 202, the second conveyor belt 203, the second transmission disc 204, the second gear 205, the first gear 206, the transmission belt 207, and the support plate 208, in use, the first transmission disc 106 can be rotated by starting the motor 105. Since the first transmission disc 106 is fixedly connected to the plating disc 102, the rotation of the first transmission disc 106 directly drives the plating disc 102 to rotate synchronously. Simultaneously, the transmission belt 207 fitted on the outer surface of the first transmission disc 106 can also drive the second transmission disc 204 to rotate. The second transmission disc 204 is fixedly installed at one end of one set of first gears 206, thus driving the first gear 206 to rotate as well. The second gear 205, which meshes with the first gear, also rotates. This transmission process transmits power to the first transmission column 201 and the second transmission column 209. Since the first transmission column 201 and the second transmission column 209 are fixedly connected to the first gear 206 and the second gear 205 respectively, they begin to rotate relative to each other. The rotation of the first transmission column 201 and the second transmission column 209 directly drives the first conveyor belt 202 and the second conveyor belt 203, which are mounted on their outer surfaces, to rotate synchronously. Each pair of transversely opposite first transmission columns 201 and second transmission columns 209, in conjunction with the first conveyor belt 202 and the second conveyor belt 203, forms a stable clamping structure. Furthermore, two sets of first conveyor belts 202 are driven by the upper surfaces of the second conveyor belt 203 at both ends, enabling the first conveyor belt to rotate synchronously. The gap between conveyor belt 202 and the second conveyor belt 203 stably grips and transports the strip chip, ensuring that the chip is firmly held between the two conveyor belts and moves smoothly along the gripping path during transport, effectively preventing deviation or misalignment. Simultaneously, the support plates 208 installed inside the first and second conveyor belts 202 and 203 provide stable support for the conveyor belts, ensuring their flatness and stability during transmission, further guaranteeing the smoothness and accuracy of chip transport. After the chip is stably transported to the plating area between the U-shaped frames 1, one set of plating needles 103 mounted on the outer surface of the plating tray 102 rotates to a vertical position and presses against the chip surface. Furthermore, because the plating needles 103 are... The press-pump structure triggers the internal structure when the chip is pressed against it, squeezing out the stored electroplating solution and precisely coating it onto the chip surface at the plating location, completing the spot plating operation. Four sets of first drive columns 201 and two sets of second drive columns 209, in conjunction with the first conveyor belt 202 and the second conveyor belt 203, form a stable clamping structure. Combined with the support of the support plate 208, this ensures that the strip chip does not shift or deviate during transport. This precise guiding transport allows the chip to enter the spot plating area along a fixed path and in a stable posture, ensuring precise alignment between the plating needle 103 and the chip's plating point. This effectively avoids problems such as missed plating or off-center plating caused by chip position deviation, significantly improving the accuracy of the spot plating location and the consistency of the plating quality.

[0030] Based on the above technical solution, the working steps of this solution are summarized as follows: In use, the first transmission disc 106 can be rotated by starting the motor 105. Since the first transmission disc 106 is fixedly connected to the plating disc 102, the rotation of the first transmission disc 106 directly drives the plating disc 102 to rotate synchronously. Simultaneously, the transmission belt 207 fitted on the outer surface of the first transmission disc 106 drives the second transmission disc 204 to rotate. The second transmission disc 204 is fixedly installed at one end of one set of first gears 206, thus driving the first gears 206 to rotate as well. The meshing second gear 205 also rotates accordingly. This transmission process transmits power to the first transmission column 201 and the second transmission column 209. Since the first transmission column 201 and the second transmission column 209 are fixedly connected to the first gear 206 and the second gear 205 respectively, they begin to rotate relative to each other. The rotation of the drive column 209 directly drives the first conveyor belt 202 and the second conveyor belt 203 mounted on its outer surface to operate synchronously. Each pair of horizontally opposite first drive columns 201 and second drive columns 209, together with the first conveyor belt 202 and the second conveyor belt 203, form a stable clamping structure. The two sets of first conveyor belts 202 are driven by the two ends of the upper surface of the second conveyor belt 203, so that the gap between the first conveyor belt 202 and the second conveyor belt 203 can stably bite and transport the strip chip. After the chip is stably transported to the spot plating area between the U-shaped frames 1, one set of spot plating needles 103 installed on the outer surface of the spot plating tray 102 also rotates to a vertical position and presses against the surface of the chip. Since the spot plating needle 103 is a press pump structure, its internal structure is squeezed and triggered at the moment of pressing the chip, squeezing out the stored electroplating liquid and accurately coating it on the position to be plated on the chip surface, thus completing the spot plating operation.

[0031] In summary, the first conveyor belt 202 and the second conveyor belt 203 form a stable clamping structure. Combined with the support of the support plate 208, this ensures that the strip chip does not deviate or run off course during the conveying process. This precise guiding conveying allows the chip to enter the spot plating area with a fixed path and stable posture, ensuring that the spot plating needle 103 is precisely aligned with the chip to be plated. This effectively avoids problems such as missed plating or off-center plating caused by chip position deviation, and greatly improves the accuracy of the spot plating position and the consistency of the plating quality.

[0032] All parts not described in this utility model are the same as or can be implemented using existing technology. Although embodiments of this utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this utility model, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A spot plating mold with positioning and guiding function, characterized in that, include: A U-shaped frame (1) is provided with two sets of guide conveying mechanisms (2) installed in a vertically opposite manner. Two sets of docking plates (101) are fixedly installed on the upper surface of the U-shaped frame (1). A spot plating plate (102) is rotatably installed between the two sets of docking plates (101). A spot plating needle (103) is connected to the outer surface of the spot plating plate (102). The spot plating needle (103) is a press pump type structure, so that when the spot plating plate (102) drives the spot plating needle (103) to rotate, it presses against the surface of the strip chip being conveyed between the two sets of guide conveying mechanisms (2) to perform spot plating. One of the docking discs (101) is fixedly mounted with a connecting cylinder (104) at one end. A motor (105) is fixedly mounted with one end of the connecting cylinder (104). The output shaft of the motor (105) passes through the connecting cylinder (104) and is fixedly connected to the first transmission disc (106). The first transmission disc (106) is fixedly mounted at one end of the spot plating disc (102) and passes through the docking disc (101) and is covered by the connecting cylinder (104). The guiding and conveying mechanism (2) includes four sets of first transmission columns (201) and two sets of second transmission columns (209). The outer surfaces of each pair of horizontally opposite first transmission columns (201) and second transmission columns (209) are respectively fitted with a first conveyor belt (202) and a second conveyor belt (203), and the two sets of first conveyor belts (202) are driven by the two ends of the upper surface of the second conveyor belt (203).

2. The dot plating mold with positioning and guiding function according to claim 1, characterized in that: One set of the first drive column (201) and the second drive column (209) are respectively fixedly mounted with a first gear (206) and a second gear (205) at both ends, and the first gear (206) and the second gear (205) mesh with each other, so that the first drive column (201) and the second drive column (209) can be driven to rotate relative to each other through the meshing of the first gear (206) and the second gear (205), thereby enabling the first drive column (201) and the second drive column (209) to drive the first conveyor belt (202) and the second conveyor belt (203) on the outer surface to rotate relative to each other, so that the gap between the first conveyor belt (202) and the second conveyor belt (203) can bite the strip chip into the conveyor.

3. A spot plating mold with positioning and guiding function according to claim 2, characterized in that: Each of the two sets of first conveyor belts (202) and one set of second conveyor belts (203) is provided with a liner plate (208). The upper and lower surfaces of the liner plate (208) can respectively abut against the upper and lower surfaces of the first conveyor belt (202) and the second conveyor belt (203), while the liner plate (208) is fixedly installed at both ends inside the U-shaped frame (1).

4. A spot plating mold with positioning and guiding function according to claim 2, characterized in that: One end of the first gear (206) is fixedly mounted with a second transmission disc (204), and a transmission belt (207) is fitted on the outer surface of the second transmission disc (204). The other end of the transmission belt (207) is fitted on the outer surface of the first transmission disc (106).

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