Electroplating apparatus

Abstract

The present disclosure relates to an electroplating device. The electroplating device comprises at least one adsorption structure for adsorbing a substrate; a driving structure for driving the adsorption structure to move the substrate, the adsorption structure being fixedly connected to the driving structure in an extendable manner, the adsorption structure being located on a side of the driving structure facing the substrate; and a support structure located on a side of the driving structure close to the ground, the support structure comprising a support plate for supporting the substrate, and a homing element located between the driving structure and the support plate and fixedly connected to the driving structure and the support plate respectively, a surface of the homing element facing the substrate comprising a first surface and a second surface arranged in sequence in a direction close to the driving structure, in a direction parallel to the horizontal plane, the minimum distance from the second surface to the substrate being greater than the maximum distance from the first surface to the substrate.

Description

Technical Field

[0001] This disclosure relates to the field of display product manufacturing technology, specifically to an electroplating device. Background Technology

[0002] Display products require metal traces for signal transmission, and electroplating is a common technique for fabricating these traces. For example, electroplating involves placing the substrate to be plated into an electroplating tank using electroplating equipment. The equipment can perform actions such as adsorption, movement, and support on the substrate, thereby controlling its position. Therefore, the electroplating equipment significantly impacts the final electroplating effect on the substrate. Summary of the Invention

[0003] This disclosure aims to solve at least one of the technical problems existing in the prior art, and proposes an electroplating device.

[0004] To achieve the above objectives, this disclosure provides an electroplating apparatus, comprising:

[0005] A carrier for supporting the substrate;

[0006] A cover plate is used to cover the edge of the substrate. When the cover plate covers the edge of the substrate, the substrate is fixed between the cover plate and the carrier. The cover plate is provided with a plurality of alignment marks.

[0007] A cover plate alignment mechanism is used to adjust the position of the cover plate in a plane parallel to the substrate so that the cover plate is aligned with the edge of the substrate;

[0008] A cover plate picking and placing mechanism is used to drive the cover plate to move in a direction perpendicular to the substrate.

[0009] In some embodiments, the cover plate alignment mechanism includes:

[0010] Multiple connecting components, the connecting components being used for fixed connection with the cover plate;

[0011] A drive frame, fixedly connected to the connecting component, is used to drive the connecting component to move the cover plate.

[0012] The camera component is fixedly connected to the drive frame and is used to take pictures of the alignment marks on the cover plate.

[0013] In some embodiments, the alignment mark is a different color from the cover plate.

[0014] In some embodiments, the alignment mark has a through hole, and the cover plate has a groove communicating with the through hole.

[0015] In some embodiments, the electroplating equipment further includes:

[0016] At least one adsorption structure for adsorbing the substrate;

[0017] A driving structure is used to drive the adsorption structure to move the substrate. The adsorption structure is telescopically and fixedly connected to the driving structure, and the adsorption structure is located on the side of the driving structure facing the substrate.

[0018] A support structure, located on the side of the drive structure closest to the ground, the support structure comprising:

[0019] A support plate is used to support the substrate;

[0020] A calibrator is located between the drive structure and the support plate, and is fixedly connected to both the drive structure and the support plate. The surface of the calibrator facing the substrate includes a first surface and a second surface arranged sequentially along the direction close to the drive structure. In a direction parallel to the horizontal plane, the minimum distance from the second surface to the substrate is greater than the maximum distance from the first surface to the substrate.

[0021] In some embodiments, the substrate includes a seed region and at least a non-seed region located on the side of the seed region closer to the ground, wherein the seed region is provided with electroplated seeds;

[0022] The first surface is disposed opposite to the non-seed region, and at least a portion of the second surface is disposed opposite to the seed region.

[0023] In some embodiments, the substrate includes a display area and a non-display area located on at least one side of the display area, wherein the seed area is located in the display area and the non-seed area is located in the non-display area.

[0024] In some embodiments, in a direction perpendicular to the horizontal plane, the maximum distance from the first surface to the support plate is not greater than the width of the non-display area.

[0025] In some embodiments, the corrector further includes a first step surface and a second step surface facing away from the ground. The first step surface is connected to the edge of the second surface facing away from the ground. The second step surface includes a first edge and a second edge disposed opposite to each other along the drive structure and the substrate arrangement direction. The first edge is connected to the edge of the first surface near the ground, and the second edge is connected to the edge of the first surface facing away from the ground.

[0026] In some embodiments, the electroplating equipment further includes a telescopic component, the telescopic component including a connector and a plurality of telescopic rods fixedly connected to the connector, the connector being fixedly connected to the drive structure, and the telescopic rods being fixedly connected to the adsorption structure.

[0027] In some embodiments, the plurality of telescopic rods includes a main telescopic rod and a plurality of auxiliary telescopic rods, the main telescopic rod being fixedly connected to the center of the adsorption structure, and the plurality of auxiliary telescopic rods surrounding the main telescopic rod.

[0028] In some embodiments, the adsorption structure has an initial position and a final position when adsorbing the substrate;

[0029] The support plate includes a first support portion disposed opposite to the straightening component and a second support portion connected to the first support portion;

[0030] In the arrangement direction of the driving structure and the substrate, the size of the second support portion is greater than the distance between the initial position and the final position.

[0031] In some embodiments, the driving structure includes a driving plate and a plurality of guide rods. The adsorption structure is fixedly connected to the driving plate, and the guide rods are fixedly connected to the straightening member and the driving plate respectively. The guide rods are capable of driving the straightening member to move relative to the driving plate in a direction perpendicular to the horizontal plane. Attached Figure Description

[0032] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings:

[0033] Figure 1 These are schematic diagrams illustrating the structural composition of the electroplating equipment in some embodiments;

[0034] Figure 2 These are schematic diagrams of the support structure and the substrate in some embodiments;

[0035] Figure 3 This is a schematic diagram of the cover plate structure in some embodiments of this disclosure;

[0036] Figure 4 This is a schematic diagram of the cover plate alignment mechanism in some embodiments of this disclosure;

[0037] Figure 5 This is a schematic diagram of the structure of the electroplating equipment in some embodiments of this disclosure;

[0038] Figure 6 This is a schematic diagram of the structure of the corrector and the substrate in some embodiments of this disclosure;

[0039] Figure 7 These are schematic diagrams of the adsorption structure and the stretchable component in some embodiments of this disclosure;

[0040] Figure 8This is a schematic diagram of the driving structure in some embodiments of this disclosure;

[0041] Figure 9 This is a schematic diagram of the electroplating equipment in some other embodiments of this disclosure;

[0042] Figure 10 This is a schematic diagram of the structure of the electroplating equipment in some other embodiments of this disclosure. Detailed Implementation

[0043] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0044] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0045] Unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0046] As used herein, “parallel” and “perpendicular” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°.

[0047] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0048] This document describes exemplary embodiments with reference to sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Therefore, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0049] Figure 1 This is a schematic diagram of the structural composition of the electroplating equipment in some embodiments.

[0050] like Figure 1 As shown, the electroplating equipment includes a carrier 1, a cover plate 3, a substrate picking and placing mechanism, and a cover plate driving mechanism. The substrate picking and placing mechanism includes an adsorption structure 5, a driving structure 4, and a supporting structure 6.

[0051] Electroplating equipment can be divided into two sides, A and B, which are electroplated simultaneously. The structures of sides A and B are symmetrical about carrier 1. Figure 1 The supporting structure 6 on side A is not shown.

[0052] Before the electroplating process begins, a robotic arm transfers the substrate 2, plated with seed copper, into the electroplating equipment. The substrate pick-and-place mechanism holds the substrate 2 via the suction structure 5. After the robotic arm retracts, the substrate pick-and-place mechanism, via the drive structure 4, propels the substrate 2 onto the surface of the carrier 1. The carrier 1 can be equipped with suction cups, which vacuum-adhere the substrate 2. The substrate pick-and-place mechanism then returns to its initial position. Next, the cover plate pick-and-place mechanism 7 adsorbs the cover plate 3 and pushes it onto the surface of the substrate 2. After the cover plate 3 is vacuum-attached to the surface of the substrate 2, it covers the edge of the substrate 2. The cover plate pick-and-place mechanism 7 then returns to its initial position. At this point, the substrate 2 is successfully loaded onto the carrier 1. Figure 1 This is also a schematic diagram of the device status after substrate 2 is loaded.

[0053] Then the gantry crane lifts out the carrier 1 loaded with substrate 2 and transfers it to the electroplating tank for electroplating.

[0054] During this process, the cover plate 3 cannot automatically align with the substrate 2, requiring manual positioning. This results in prolonged alignment time, impacting equipment capacity. Furthermore, positioning is typically performed once per shift, allowing multiple substrates 2 to be electroplated per shift. This means multiple substrates 2 and the cover plate 3 are aligned manually in the same single operation, preventing consistent positioning of the cover plate 3 and substrate 2 each time. The set position of the cover plate 3 may shift during movement and repositioning, and similarly, the set position of the substrate 2 may shift during movement and repositioning. Therefore, the positioning accuracy between the cover plate 3 and substrate 2 may fluctuate within the same shift, and the coverage edge of the cover plate 3 on substrate 2 may shift. For example, if a seed area with electroplating seeds is provided on substrate 2, the cover plate 3's coverage position needs to match this seed area. Therefore, misalignment between the cover plate 3 and substrate 2 may lead to electroplating misalignment, extending beyond the seed area and causing peeling. Manual alignment is achieved using positioning pins, which can wear and expand over time, potentially causing electroplating misalignment. The electroplating defect rate of substrate 2 can reach 13.33%.

[0055] Optionally, the adsorption structure 5 can be a Bernoulli suction cup. The surface of the Bernoulli suction cup has a porous design. When gas flows out, a pressure difference is generated between the substrate 2 and the Bernoulli suction cup, adsorbing the substrate 2 onto the surface of the Bernoulli suction cup according to the Bernoulli principle. The back of the Bernoulli suction cup is fixed to the driving structure 4 only by a telescopic rod 432. This makes the Bernoulli suction cup prone to tilting, which in turn causes insufficient negative pressure, causing the substrate 2 to fall off and break, affecting the yield of the substrate 2, with a defect rate of 9.63%. Even if the suction cup does not fall off, the tilting of the suction cup will cause the substrate 2 to tilt, which will also cause electroplating misalignment.

[0056] Figure 2 These are schematic diagrams of the support structure 6 and the substrate 2 in some embodiments.

[0057] like Figure 2 As shown, the support structure 6 includes a support plate 62 and a straightening component 61. The support plate 62 supports the substrate 2 and alleviates the adsorption pressure on the adsorption structure 5. The straightening component 61 is fixedly connected to both the driving structure 4 and the support plate 62. Figure 1 and Figure 2 It is known that after the adsorption structure 5 adsorbs the substrate 2, the side of the straightening component 61 below the adsorption structure 5 will contact the surface of the substrate 2, and the side height is relatively high, for example, reaching 47mm. This will cause the side of the straightening component 61 to contact the seed area of ​​the substrate 2, causing the electroplating seed surface of the seed area to be scratched, resulting in electroplating metal bumps after electroplating, which in turn leads to subsequent process defects. For example, the metal bumps may short-circuit with the subsequent metal, with a defect rate of 4.17%.

[0058] In order to at least alleviate or solve one of the aforementioned technical problems, this disclosure provides an electroplating apparatus.

[0059] Figure 3 This is a schematic diagram of the cover plate in some embodiments of this disclosure. Figure 4 This is a schematic diagram of the cover plate alignment mechanism in some embodiments of this disclosure. Figure 5 This is a schematic diagram of the structure of the electroplating equipment in some embodiments of this disclosure.

[0060] In some embodiments, such as Figure 5 As shown, an electroplating apparatus disclosed herein includes: a carrier 1 and a cover plate 3.

[0061] The carrier 1 is used to support the substrate 2.

[0062] The cover plate 3 is used to cover the edge of the substrate 2. When the cover plate 3 covers the edge of the substrate 2, the substrate 2 is fixed between the cover plate 3 and the carrier 1.

[0063] like Figure 3 As shown, the cover plate 3 is provided with multiple alignment marks 31.

[0064] The electroplating equipment also includes a cover plate alignment mechanism 8 and a cover plate 3 pick-and-place mechanism.

[0065] The cover plate alignment mechanism 8 is used to adjust the position of the cover plate 3 in a plane parallel to the substrate 2 so that the cover plate 3 is aligned with the edge of the substrate 2.

[0066] The cover plate 3 pick-up and drop mechanism is used to drive the cover plate 3 to move in a direction perpendicular to the substrate 2.

[0067] Figure 1 In the electroplating equipment shown, the cover plate 3 pick-up and drop mechanism can only move in a direction perpendicular to the substrate 2 to bring it closer to or away from the substrate 2. Based on this, the present disclosure adds a cover plate alignment mechanism 8, which can carry the cover plate 3 and move it in a plane parallel to the substrate 2. For example, it can move horizontally, or it can move at a certain angle to the horizontal or vertically, or it can rotate the substrate 2 to adjust the position of the cover plate 3 and achieve the alignment of the substrate 2 and the cover plate 3.

[0068] Furthermore, in this embodiment of the present disclosure, an alignment mark 31 is provided on the cover plate 3. During the process of the cover plate alignment mechanism 8 moving the cover plate 3, the alignment mark 31 can be used to determine whether the cover plate is aligned.

[0069] In some embodiments, such as Figure 4 As shown, the cover plate alignment mechanism 8 includes: multiple connecting components 82, a drive frame 81, and a photographing component.

[0070] The connecting component 82 is used for detachable and fixed connection with the cover plate 3. Optionally, the connecting component 82 can be magnetically connected to the cover plate 3, or a gripping structure can be provided to pick up and put down the cover plate 3.

[0071] The drive frame 81 is fixedly connected to the connecting component 82 and is used to drive the connecting component 82 to move the cover plate 3.

[0072] The camera assembly is fixedly connected to the drive frame 81 and is used to photograph the alignment mark 31 on the cover plate 3. The camera assembly is not in... Figure 4 As shown, optionally, the position of the imaging component on the drive frame 81 can be set accordingly to the position of the alignment mark 31 on the cover plate 3, so as to facilitate the imaging component to take pictures of the alignment mark 31.

[0073] It is understandable that the cover plate 3 is annular in shape, and the annulus can be square, circular, etc., depending on the shape of the substrate 2. For example, if the substrate 2 is square, then the cover plate 3 is annular in shape.

[0074] Alternatively, the camera component may include a miniature camera.

[0075] It is understandable that the cover plate 3 covering the edge of the substrate 2 means that part of the cover plate 3 covers the substrate 2 and the other part covers the carrier 1, thereby fixing the substrate 2 between the carrier 1 and the cover plate 3. It can also be understood that the substrate 2 is clamped between the cover plate 3 and the carrier 1.

[0076] The cover plate 3 has multiple alignment marks 31. The alignment marks 31 are used to align the cover plate 3 and the substrate 2. The camera is used to take pictures of the alignment marks 31.

[0077] During the specific alignment process, the camera sends the captured photos to the control module. The control module is configured to calculate the position information of the alignment mark 31 and compare the position of the alignment mark 31 with the preset position. If the position of the alignment mark 31 is different from the preset position, the cover plate alignment mechanism 8 is controlled to adjust the position of the cover plate 3 so that the cover plate 3 is in the preset position, thus completing the alignment of the cover plate 3 and the substrate 2.

[0078] Optionally, the location can be a coordinate location.

[0079] The embodiments disclosed herein can compare the coordinate position of the cover plate 3 with that of the standard cover plate 3 using software, and then adjust the position of the cover plate 3 specifically through the cover plate alignment mechanism 8.

[0080] This embodiment of the present disclosure achieves the alignment of the substrate 2 with the cover plate 3 as shown in the figure by setting alignment marks 31 on the cover plate 3, through the control module and the cover plate alignment mechanism 8. Compared with manual alignment, this improves accuracy and time. Furthermore, this embodiment of the present disclosure can achieve the positioning of the substrate 2 and the cover plate 3 each time by taking pictures, thereby ensuring the electroplating effect each time and avoiding phenomena such as electroplating offset caused by misalignment of the substrate 2 and the cover plate 3.

[0081] The cover plate alignment mechanism 8 disclosed herein can achieve automatic positioning of the cover plate 3. For example, in one example, the cycle time for aligning the cover plate 3 can be increased from 10 minutes to 30 seconds, and the cycle time per process can be increased by 20 times. At the same time, the alignment accuracy of the cover plate 3 is improved from ±5 mm to ±1 mm, improving electroplating misalignment and peeling defects, and increasing the yield by 13.33%.

[0082] Optionally, the cover plate alignment mechanism 8 can be specifically a UVW automatic alignment (high-precision vision automatic alignment) platform.

[0083] Optionally, when the substrate 2 is square and the cover plate 3 is annular, the alignment mark 31 can be set at the corner of the cover plate 3. For example, an alignment mark 31 can be set at each of the two opposite corners. Or, for example, an alignment mark 31 can be set at each of the four corners.

[0084] In some embodiments, the alignment mark 31 is a different color from the cover plate 3.

[0085] Optionally, the alignment mark 31 is black.

[0086] This embodiment of the disclosure improves the recognizability of the alignment mark 31 by designing it to be a different color from the cover plate 3, which is beneficial for the control module to obtain the position information of the alignment mark 31.

[0087] In some embodiments, the alignment mark 31 has a through hole, and the cover plate 3 has a groove communicating with the through hole.

[0088] Optionally, the cover plate 3 can be made of metal. After the metal is grooved, the groove exposes the metal. The metal is relatively light in color, generally white, yellow, silver, etc., which can form a sharp contrast with the black alignment mark 31, thereby facilitating the determination of the position of the alignment mark 31.

[0089] Optionally, the through-hole and the groove can have the same shape, for example, both can be a cross or an X. In this case, the alignment mark 31 can serve as the background for the cross-shaped groove, and the color can be black to improve the recognizability of the cross shape. Furthermore, since the cross shape is formed on the cover plate 3, the position of the cover plate 3 can be adjusted by determining the coordinates of the cross-shaped groove.

[0090] Optionally, the alignment mark 31 is set against a black background and has a size of 40*40mm.

[0091] Optionally, the "+" shaped groove is a thin, hollowed-out design with a total length of 30mm and a width of 5mm.

[0092] In some embodiments, such as Figure 5 As shown, this disclosure provides an electroplating apparatus, including: at least one adsorption structure 5, a driving structure 4, and a supporting structure 6.

[0093] Among them, the adsorption structure 5 is used to adsorb the substrate 2.

[0094] The driving structure 4 is used to drive the adsorption structure 5 to move the substrate 2. The adsorption structure 5 is telescopically and fixedly connected to the driving structure 4. The adsorption structure 5 is located on the side of the driving structure 4 facing the substrate 2.

[0095] The support structure 6 is located on the side of the drive structure 4 closest to the ground.

[0096] The support structure 6 includes: a support plate 62 and a straightening component 61.

[0097] Among them, the support plate 62 is used to support the base plate 2.

[0098] The aligning component 61 is located between the drive structure 4 and the support plate 62, and is fixedly connected to both the drive structure 4 and the support plate 62.

[0099] Figure 6 This is a schematic diagram of the structure of the corrector 61 and the substrate 2 in some embodiments of this disclosure, specifically a schematic diagram of the structure of the corrector 61 and the substrate 2 after the adsorption structure 5 adsorbs the substrate 2.

[0100] like Figure 6 As shown, the surface of the corrector 61 facing the substrate 2, i.e. the side surface of the corrector 61, includes a first surface 612 and a second surface 611 arranged sequentially along the direction close to the drive structure 4. In the direction parallel to the horizontal plane, the minimum distance d2 from the second surface 611 to the substrate 2 is greater than the maximum distance d1 from the first surface 612 to the substrate 2.

[0101] It should be noted that the minimum distance d2 between the second surface 611 and the substrate 2 refers to the distance between the second surface 611 and the surface of the substrate 2 facing the driving structure 4. The maximum distance d1 between the first surface 612 and the substrate 2 refers to the distance between the first surface 612 and the surface of the substrate 2 facing the driving structure 4.

[0102] In this embodiment of the present disclosure, by setting the distance d2 from the second surface 611 to the substrate 2 to be greater than the distance d1 from the first surface 612 to the substrate 2, the contact area between the side of the straightening member 61 and the substrate 2 can be reduced, thereby reducing the degree of scratching of the side of the straightening member 61 on the surface of the substrate 2 by the electroplating seeds, or directly avoiding contact between the second surface 611 and the substrate 2, thereby preventing the second surface 611 from scratching the surface of the substrate 2 by the electroplating seeds, and thus preventing the subsequent electroplating effect from being affected.

[0103] In some embodiments, the substrate 2 includes a seed region and a non-seed region located at least on the side of the seed region closer to the ground. The seed region is provided with electroplating seeds. The non-seed region is not provided with electroplating seeds.

[0104] The first surface 612 is disposed opposite to the non-seed region, and at least a portion of the second surface 611 is disposed opposite to the seed region. For example, optionally, the second surface 611 is disposed opposite to the seed region. Alternatively, a portion of the second surface 611 is disposed opposite to the seed region, and another portion is disposed opposite to the non-seed region.

[0105] In this embodiment, the first surface 612 is disposed opposite to the non-seed region, and the non-seed region does not have any electroplating seeds. Therefore, even if the first surface 612 comes into contact with the substrate 2 surface in the non-seed region, it will not affect the electroplating seeds in the seed region. The second surface 611 cannot come into contact with the substrate 2 surface in the seed region, therefore, the second surface 611 will not affect the electroplating seeds in the seed region.

[0106] Therefore, the embodiments disclosed herein can prevent the second surface 611 from scratching the electroplating seeds on the surface of the substrate 2, thereby preventing the electroplating effect in the seed area from being affected.

[0107] In one example, this disclosure improves the electroplating bump problem by optimizing the corrector 61, resulting in a 4.17% increase in yield.

[0108] In some embodiments, such as Figure 6 As shown, the substrate 2 includes a display area AA and a non-display area NA located on at least one side of the display area AA, wherein the seed area is located in the display area AA and the non-seed area is located in the non-display area NA.

[0109] Similarly, in this embodiment, the first surface 612 is disposed opposite to the non-display area NA, and the non-display area NA does not have any electroplating seeds. Therefore, even if the first surface 612 contacts the substrate 2 surface of the non-display area NA, it will not affect the electroplating seeds in the display area AA. The second surface 611 cannot contact the substrate 2 surface in the display area AA; therefore, the second surface 611 will not affect the electroplating seeds in the display area AA.

[0110] Therefore, the embodiments disclosed herein can prevent the second surface 611 from scratching the display area AA of the substrate 2, thereby preventing the subsequent electroplating process from affecting the electroplating effect of the display area AA.

[0111] In some embodiments, such as Figure 6 As shown, in the direction perpendicular to the horizontal plane, the maximum distance H1 from the first surface 612 to the support plate 62 is not greater than the width H2 of the non-display area NA, where H2 is the distance from the display area AA to the support plate 62. That is, the height H1 of the first surface 612 is not greater than the height H2 of the non-display area NA. It can be understood that the width H2 of the non-display area NA refers to the width of the non-display area NA located on the side of the display area AA closest to the ground.

[0112] In this embodiment, the distance from the first surface 612 to the support plate 62 can be designed according to the size of the non-display area NA, so as to ensure that the first surface 612 does not exceed the non-display area NA and can contact the display area AA, thereby avoiding the first surface 612 from scratching the seed area on the surface of the substrate 2, which would affect the electroplating effect of subsequent electroplating.

[0113] In some embodiments, such as Figure 6 As shown, the corrector 61 also includes a first step surface 613 and a second step surface 614 facing away from the ground. The first step surface 613 is connected to the edge of the second surface 611 facing away from the ground. The second step surface 614 includes a first edge and a second edge that are arranged opposite to each other along the arrangement direction of the drive structure 4 and the substrate 2. The first edge is connected to the edge of the second surface 611 near the ground, and the second edge is connected to the edge of the first surface 612 facing away from the ground.

[0114] It is understandable that the end of the corrector 61 facing the substrate 2 has a stepped shape.

[0115] Optionally, the corrector 61 includes a first corrector portion and a second corrector portion. The surface of the first corrector portion facing the substrate 2 is a first surface 612, and the surface of the second corrector portion facing the substrate 2 is a second surface 611.

[0116] In this embodiment of the disclosure, by designing the shape of the straightening component 61, it is possible to avoid the side of the straightening component 61 from scratching the electroplating seeds on the surface of the substrate 2, thereby preventing electroplating bumps.

[0117] In some embodiments, the drive structure 4 includes a retractable component 43.

[0118] Figure 7 This is a schematic diagram of the adsorption structure 5 and the stretchable component 43 in some embodiments of this disclosure.

[0119] like Figure 7As shown, the retractable component 43 includes a connector 431 and a plurality of telescopic rods 432 fixedly connected to the connector 431. The connector 431 is fixedly connected to the drive structure 4, and the telescopic rods 432 are fixedly connected to the adsorption structure 5. The telescopic rods 432 extend in the same direction, thereby ensuring that the adsorption force on the drive structure 4 is in the same direction.

[0120] This embodiment of the invention controls the adsorption structure 5 by setting multiple telescopic rods 432, which can improve the support force on the adsorption structure 5 and prevent the adsorption structure 5 from tilting, which could lead to gas leakage and cause the substrate 2 to fall off.

[0121] In some embodiments, such as Figure 7 As shown, the multiple telescopic rods 432 include a main telescopic rod 4321 and multiple auxiliary telescopic rods 4322. The main telescopic rod 4321 is fixedly connected to the center of the adsorption structure 5, and the multiple auxiliary telescopic rods 4322 surround the main telescopic rod 4321.

[0122] For example, there can be two auxiliary telescopic rods 4322, located on both sides of the main telescopic rod 4321, and arranged symmetrically.

[0123] For example, there can be three auxiliary telescopic rods 4322, which are evenly arranged around the main telescopic rod 4321.

[0124] The present invention, through the combination of the main telescopic rod 4321 and the auxiliary telescopic rod 4322, can greatly enhance the supporting effect of the telescopic component 43 on the adsorption structure 5, and avoid the substrate 2 from slipping due to insufficient adsorption force of the adsorption structure 5.

[0125] This embodiment is equivalent to adding two telescopic rods 432 to the original telescopic rod 432, and forming a triangular stable structure with the original telescopic rod 432, thereby fixing the Bernoulli suction cup plane.

[0126] Optionally, the Bernoulli suction cup has a diameter of 150 mm and a thickness of 20 mm.

[0127] Optionally, the telescopic rod 432 has a length of 100mm.

[0128] When the adsorption structure 5 picks up the substrate 2, the telescopic rod 432 can extend and retract freely, with a maximum extension distance of 50mm.

[0129] In one example, this disclosure improves the fragmentation problem by adding a telescopic rod 432 that is fixedly connected to the Bernoulli suction cup, resulting in a 9.63% increase in yield.

[0130] In some embodiments, during the adsorption process of substrate 2, the substrate 2 driving mechanism adsorbs substrate 2 at an initial position, and then moves substrate 2 a certain distance along the direction close to the driving structure 4 after adsorption, thereby ensuring the supporting effect of the support sheet in the support structure 6 on substrate 2. Therefore, the adsorption structure 5 has an initial position and a final position when adsorbing substrate 2.

[0131] The support plate 62 includes a first support portion disposed opposite to the straightening member 61 and a second support portion connected to the first support portion. The first and second support portions are not located at... Figure 6 The bid was successful.

[0132] In the arrangement direction of the driving structure 4 and the substrate 2, such as Figure 6 As shown, the dimension d3 of the second support is greater than the distance between the initial position and the final position.

[0133] The dimensions of the second support portion in this embodiment are designed to ensure that even when the substrate 2 is moved from the initial position to the final position, there is still a distance between the substrate 2 and the first surface 612. This further prevents the entire straightening component 61 from contacting the surface of the substrate 2, thus preventing the side of the straightening component 61 from scratching the electroplating seeds on the surface of the substrate 2.

[0134] Figure 8 This is a schematic diagram of the driving structure 4 in some embodiments of this disclosure. It should be noted that... Figure 8 The diagram shows the structure of the drive structure 4 on the side opposite to the substrate 2. Figure 8 The support structure 6 shown in the figure is a schematic diagram of the side of the support structure 6 away from the substrate 2.

[0135] In some embodiments, such as Figure 8 As shown, the driving structure 4 includes a driving plate 41 and multiple guide rods 42. The adsorption structure 5 is fixedly connected to the driving plate 41. The guide rods 42 are fixedly connected to the straightening component 61 and the driving plate 41 respectively. The guide rods 42 can drive the straightening component 61 to move relative to the driving plate 41 in a direction perpendicular to the horizontal plane, thereby adjusting the horizontal height of the straightening component 61.

[0136] Optionally, such as Figure 8 As shown, the multiple guide rods 42 include a main guide rod 421 and multiple auxiliary guide rods 422 located on both sides of the main guide rod 421, thereby ensuring the position control of the guide rods 42 on the overall support structure 6, and thus ensuring the accurate position of the substrate 2.

[0137] Specifically, in this embodiment of the present disclosure, by providing auxiliary guide rods 422 on both sides of the column guide rod 42, the horizontal height of the aligning member 61 can be further stabilized.

[0138] Meanwhile, the side of the straightening component 61 is designed as a double-step structure with a first straightening part and a second straightening part. Optionally, the height of the first straightening part (lower step) is 20mm, and the height of the second straightening part (upper step) is 25mm. The upper step is set back 5mm from the lower step, and the upper step does not contact the surface of the substrate 2 to avoid scratching the surface film layer of the substrate 2.

[0139] Furthermore, the size of the support strip is increased from 8mm to 18mm, so that the gap between the lower step of the straightening component 61 and the substrate 2 is at least 10mm, so as to avoid the lower step of the straightening component 61 from contacting the surface of the substrate 2 and avoid scratching the surface film layer of the substrate 2.

[0140] Figure 9 This is a schematic diagram of the structure of the electroplating equipment in some other embodiments of this disclosure. Figure 10 This is a schematic diagram of the structure of the electroplating equipment in some other embodiments of this disclosure.

[0141] The schematic diagram of the electroplating equipment disclosed herein is as follows: Figure 9 As shown, Figure 9 The initial position of substrate 2 before it begins to transfer is shown.

[0142] based on Figure 9 The electroplating equipment shown in this disclosure, and the process of using the electroplating equipment include:

[0143] Before the electroplating process begins, the robotic arm transfers the substrate 2 plated with seed copper into the electroplating equipment. The substrate pick-and-place mechanism holds the substrate 2 through the adsorption structure 5, and the robotic arm exits.

[0144] After the robotic arm exits, the substrate picking and placing mechanism drives the substrate 2 to the surface of the carrier 1. After the carrier 1 vacuum adsorbs the substrate 2, the substrate picking and placing mechanism returns to the initial position. At this time, the cover plate alignment mechanism 8 and the cover plate picking and placing mechanism 7 together correct the position of the cover plate 3. Then, the cover plate picking and placing mechanism 7 adsorbs the cover plate 3 and pushes it to the surface of the substrate 2. After the cover plate 3 is vacuum attached to the surface of the substrate 2, the control module drives the cover plate picking and placing mechanism 7 to return to the initial position.

[0145] At this point, substrate 2 has been successfully loaded onto carrier 1. A schematic diagram of the device status after loading is shown below. Figure 10 As shown. Then the gantry crane lifts the carrier 1 loaded with substrate 2 from the rotating platform and transfers it to the electroplating tank for electroplating.

[0146] After electroplating and subsequent processes are completed, the gantry transports the carrier 1, which contains the electroplated substrate 2, back into the rotating platform for the wafer removal process. The wafer removal process is the reverse of the loading process. First, the cover plate pick-up and drop mechanism 7 picks up the cover plate 3 and removes it to the initial position. Then, the substrate pick-up and drop mechanism advances to the surface of the substrate 2, picks up the substrate 2 through the adsorption structure 5, and retracts to the initial position. Finally, the robot arm removes the substrate 2 from the substrate pick-up and drop mechanism, completing the entire process.

[0147] In summary, this disclosure improves electroplating yield and mass production capability of electroplating equipment by optimizing the structure of the alignment component, adding a telescopic rod, and automatically aligning the cover plate.

[0148] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. An electroplating device, characterized in that, include: A carrier used to support a substrate; A cover plate is used to cover the edge of the substrate. When the cover plate covers the edge of the substrate, the substrate is fixed between the cover plate and the carrier. The cover plate is provided with a plurality of alignment marks. A cover plate alignment mechanism is used to adjust the position of the cover plate in a plane parallel to the substrate so that the cover plate is aligned with the edge of the substrate; A cover plate picking and placing mechanism is used to drive the cover plate to move in a direction perpendicular to the substrate.

2. The electroplating equipment according to claim 1, characterized in that, The cover plate alignment mechanism includes: Multiple connecting components, the connecting components being detachably and securely connected to the cover plate; A drive frame, fixedly connected to the connecting component, is used to drive the connecting component to move the cover plate. The camera component is fixedly connected to the drive frame and is used to take pictures of the alignment marks on the cover plate.

3. The electroplating equipment according to claim 1, characterized in that, The alignment mark is a different color from the cover plate.

4. The electroplating equipment according to claim 3, characterized in that, The alignment mark has a through hole, and the cover plate has a groove communicating with the through hole.

5. The electroplating equipment according to any one of claims 1 to 4, characterized in that, The electroplating equipment also includes: At least one adsorption structure for adsorbing the substrate; A driving structure is used to drive the adsorption structure to move the substrate. The adsorption structure is telescopically and fixedly connected to the driving structure, and the adsorption structure is located on the side of the driving structure facing the substrate. A support structure, located on the side of the drive structure closest to the ground, the support structure comprising: A support plate is used to support the substrate; A calibrator is located between the drive structure and the support plate, and is fixedly connected to both the drive structure and the support plate. The surface of the calibrator facing the substrate includes a first surface and a second surface arranged sequentially along the direction close to the drive structure. In a direction parallel to the horizontal plane, the minimum distance from the second surface to the substrate is greater than the maximum distance from the first surface to the substrate.

6. The electroplating equipment according to claim 5, characterized in that, The substrate includes a seed region and at least a non-seed region located on the side of the seed region closer to the ground, and the seed region is provided with electroplated seeds; The first surface is disposed opposite to the non-seed region, and at least a portion of the second surface is disposed opposite to the seed region.

7. The electroplating equipment according to claim 6, characterized in that, The substrate includes a display area and a non-display area located on at least one side of the display area, wherein the seed area is located in the display area and the non-seed area is located in the non-display area.

8. The electroplating equipment according to claim 7, characterized in that, In a direction perpendicular to the horizontal plane, the maximum distance from the first surface to the support plate is not greater than the width of the non-display area.

9. The electroplating equipment according to claim 5, characterized in that, The corrective component further includes a first step surface and a second step surface that are away from the ground. The first step surface is connected to the edge of the second surface that is away from the ground. The second step surface includes a first edge and a second edge that are disposed opposite to each other along the direction of the drive structure and the substrate arrangement. The first edge is connected to the edge of the first surface that is close to the ground, and the second edge is connected to the edge of the first surface that is away from the ground.

10. The electroplating equipment according to claim 5, characterized in that, The electroplating equipment also includes a telescopic component, which includes a connector and a plurality of telescopic rods fixedly connected to the connector. The connector is fixedly connected to the drive structure, and the telescopic rods are fixedly connected to the adsorption structure.

11. The electroplating equipment according to claim 10, characterized in that, The plurality of telescopic rods includes a main telescopic rod and a plurality of auxiliary telescopic rods. The main telescopic rod is fixedly connected to the center of the adsorption structure, and the plurality of auxiliary telescopic rods surround the main telescopic rod.

12. The electroplating equipment according to claim 5, characterized in that, The adsorption structure has an initial position and a final position when adsorbing the substrate; The support plate includes a first support portion disposed opposite to the straightening component and a second support portion connected to the first support portion; In the arrangement direction of the driving structure and the substrate, the size of the second support portion is greater than the distance between the initial position and the final position.

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