A plating rack assembly for chip processing

Abstract

The utility model discloses a kind of chip processing is electrically plated hanger assembly, and it is related to chip hanger technical field.A kind of chip processing is electrically plated hanger assembly, including crossbeam, the top of crossbeam is provided with handle, further include: insulating plate, connect the lower end of the crossbeam, wherein, slot is opened in the insulating plate, the side of the insulating plate is connected with limit plate frame, and first opening with smaller caliber than slot is opened in the limit plate frame;Movable plate, by buckle component connection in the other side of insulating plate, and the movable plate is opened with second opening with smaller caliber than slot, and the first opening and second opening are mutually aligned arrangement;The utility model can realize the quick fixing work of movable plate, to make the fixing efficiency of chip higher, indirectly can promote the electroplating efficiency of subsequent chip.

Description

Technical Field

[0001] This utility model belongs to the field of chip mounting technology, specifically, it relates to an electroplating mounting assembly for chip processing. Background Technology

[0002] Chip plating racks are essential in the manufacturing of thin-film circuit components, microwave module components, and microwave coated circuit products. These racks are specialized tools used in semiconductor manufacturing to support and fix chip substrates (such as silicon wafers and microwave coated circuit components). Their core function is to act as a cathode conductor during electroplating, ensuring that current flows uniformly and stably across the chip surface, thereby depositing a uniform and dense metal film. They are typically composed of corrosion-resistant metal materials and insulating shielding components, and their design directly affects the plating quality, consistency, and reliability of the chip.

[0003] Many existing electroplating fixtures use bolt pressing or complex mechanical clamping methods to fix chips. The operation process is cumbersome and laborious, which not only increases the installation and disassembly time, but also easily causes chip damage or poor contact due to uneven human force. This inefficient fixing method prolongs the production preparation time, reduces the equipment utilization rate, becomes a bottleneck restricting the improvement of the overall efficiency of electroplating, and also brings potential quality risks. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide an electroplating fixture assembly for chip processing that can overcome or at least partially solve the above problems.

[0005] To solve the above-mentioned technical problems, the basic concept of the technical solution adopted by this utility model is as follows:

[0006] An electroplating fixture assembly for chip processing includes a crossbeam with a handle at its top, and further includes: an insulating plate connected to the lower end of the crossbeam, wherein the insulating plate has a slot, a limiting plate frame is connected to one side of the insulating plate, and the limiting plate frame has a first opening with a diameter smaller than the slot; and a movable plate connected to the other side of the insulating plate by a snap-fit ​​component, wherein the movable plate has a second opening with a diameter smaller than the slot, and the first opening and the second opening are aligned with each other.

[0007] Preferably, the buckle component includes a short shaft connected to the outer wall of the insulating plate, a horizontally arranged pressure rod rotatably connected to the short shaft, a longitudinally arranged strip groove on the movable plate, and the pressure rod passing through the strip groove and pressing against the outer wall of the movable plate.

[0008] Furthermore, the insulating plate is provided with a socket, one end of the short shaft is inserted into the socket, and a corrosion-resistant rubber band is installed between the short shaft and the inner wall of the socket.

[0009] Preferably, the lower end of the crossbeam is connected to two symmetrically arranged strip plates, and the two ends of the strip plates are connected to hanging clips. The lower side of the hanging clip has a hanging groove, and the outer side of the hanging clip is equipped with an adjustable screw. The top of the insulating plate is engaged in the groove formed by the two strip plates.

[0010] Preferably, the movable plate is connected to a boss that surrounds the second opening, and the boss is fitted inside the slotted port.

[0011] Furthermore, flexible rings are respectively provided on the opposite surfaces of the limiting plate frame and the boss.

[0012] Furthermore, a metal component is connected to the strip plate, and a conductive wire is connected to the metal component. The end of the conductive wire passes through the limiting plate frame and extends into the edge of the slot. A metal spring is connected to the end of the conductive wire, and the limiting plate frame is provided with a through hole that cooperates with the conductive wire.

[0013] Furthermore, both sides of the strip groove are provided with arc-shaped protrusions.

[0014] By adopting the above technical solution, this utility model has the following beneficial effects compared with the prior art:

[0015] 1. This utility model allows for the disassembly of the movable plate by rotating the pressure rod to align it parallel to the slot, and then removing the movable plate away from the insulating plate. The pressure rod will pass through the slot, thus enabling the movable plate to be disassembled. When it is necessary to fix the chip in the slot, the movable plate is reset, and then the pressure rod is rotated to dealign it from the slot, thus enabling the movable plate to be quickly fixed. This improves the chip fixing efficiency and indirectly enhances the subsequent chip electroplating efficiency.

[0016] 2. This utility model improves the stability of the movable plate by increasing the frictional resistance between the pressure rod and the outer wall of the movable plate when the pressure rod is rotated, making the pressure rod less likely to rotate due to external force.

[0017] 3. By using corrosion-resistant rubber bands or adjustable bolts, this utility model allows the short shaft to pull the pressure rod against the surface of the movable plate, making the movable plate more firmly pressed against the surface of the insulating plate, thereby improving the stability of chip fixation.

[0018] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings. Attached Figure Description

[0019] In the attached diagram:

[0020] Figure 1 This is a three-dimensional structural diagram of an electroplating fixture assembly for chip processing proposed in this utility model. Figure One ;

[0021] Figure 2 This is a three-dimensional structural diagram of an electroplating fixture assembly for chip processing proposed in this utility model. Figure Two ;

[0022] Figure 3 This is a partial structural schematic diagram of an electroplating fixture assembly for chip processing proposed in this utility model;

[0023] Figure 4 This invention relates to a localized explosion of an electroplating fixture assembly for chip processing. Figure One ;

[0024] Figure 5 This invention relates to a localized explosion of an electroplating fixture assembly for chip processing. Figure Two .

[0025] In the diagram: 1. Crossbeam; 2. Insulating plate; 3. Handle; 4. Slot; 5. Limiting plate frame; 6. First opening; 7. Movable plate; 8. Second opening; 9. Boss; 10. Insertion hole; 11. Short shaft; 12. Pressure rod; 13. Strip groove; 14. Metal part; 15. Conductive wire; 16. Perforation; 17. Metal spring; 18. Corrosion-resistant rubber band; 19. Protrusion; 20. Flexible ring; 21. Strip plate; 22. Adjustable screw. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings. The following embodiments are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0027] Example: Refer to Figures 1-5 An electroplating rack assembly for chip processing includes a metal beam 1, with a handle 3 fixedly connected to the top of the beam 1 by locking screws. The handle 3 makes it easier to pick up and hang the entire electroplating rack assembly. Both the beam 1 and the handle 3 are made of insulated phenolic resin board.

[0028] It also includes: an insulating plate 2 capable of insulation, connected to the lower end of the crossbeam 1. The insulating plate 2 is made of nylon material with good insulation and strong corrosion resistance. The insulating plate 2 has a slot 4 for placing the chip. The shape of the slot 4 is the same as that of the chip, which can be rectangular or circular. A limiting plate frame 5 is connected to one side of the insulating plate 2. The limiting plate frame 5 has a first opening 6 with a diameter smaller than that of the slot 4. A movable plate 7 is connected to the other side of the insulating plate 2 by a snap-fit ​​component. The movable plate 7 has a second opening 8 with a diameter smaller than that of the slot 4. The first opening 6 and the second opening 8 are aligned with each other.

[0029] The limiting plate frame 5 is made of insulating material, and the movable plate 7 is made of conductive metal material;

[0030] Specifically, when fixing the chip in the slot 4, the movable plate 7 is first removed from one side of the insulating plate 2 by the snap-fit ​​component, and then the chip is placed in the slot 4. At this time, since the diameter of the first opening 6 is smaller than that of the slot 4, the chip will not fall out of the first opening 6. Then the movable plate 7 is reset and fixed to the insulating plate 2 by the snap-fit ​​component. Since the diameter of the second opening 8 is the same as that of the slot 4, the chip will also not fall out of the second opening 8. The chip can be restricted in the slot 4 by the limiting plate frame 5 and the movable plate 7. Then the insulating plate 2 is placed in the electroplating tank. The electroplating solution in the electroplating tank can pass through the first opening 6 and the second opening 8 and contact the surface of the chip, thereby enabling the electroplating process of the chip.

[0031] The aforementioned buckle component includes a short shaft 11 connected to the outer wall of the insulating plate 2. A horizontally arranged pressure rod 12 is rotatably connected to the short shaft 11. A longitudinally arranged strip groove 13 is provided on the movable plate 7. The pressure rod 12 passes through the strip groove 13 and is pressed against the outer wall of the movable plate 7. Both sides of the strip groove 13 are provided with arc-shaped protrusions 19, and the protrusions 19 are hemispherical in shape.

[0032] When disassembling the movable plate 7, rotate the pressure rod 12 to make it parallel to the strip groove 13, and then control the movable plate 7 to move away from the insulating plate 2. The pressure rod 12 will pass through the strip groove 13, thus realizing the disassembly of the movable plate 7. When it is necessary to fix the chip in the slot 4, reset the movable plate 7, and the pressure rod 12 will pass through the strip groove 13 again. Then rotate the pressure rod 12 so that it is not parallel to the strip groove 13. The pressure rod 12 will then press against the outer wall of the movable plate 7, thus realizing the quick fixation of the movable plate 7, thereby making the chip fixation efficiency higher and indirectly improving the subsequent chip electroplating efficiency. When rotating the pressure rod 12, the protrusion 19 can increase the frictional resistance between the pressure rod 12 and the outer wall of the movable plate 7, making the pressure rod 12 less likely to rotate due to external force, which can improve the stability of fixing the movable plate 7.

[0033] The aforementioned insulating plate 2 is provided with a socket 10. One end of the short shaft 11 is inserted into the socket 10, and a corrosion-resistant rubber band 18 is installed between the short shaft 11 and the inner wall of the socket 10. In use, the corrosion-resistant rubber band 18 can pull the pressure rod 12 against the surface of the movable plate 7 through the short shaft 11, so that the movable plate 7 can be pressed more firmly against the surface of the insulating plate 2, thereby improving the stability of chip fixation.

[0034] The corrosion-resistant rubber band 18 here can be replaced with an adjustable bolt, which can be made of corrosion-resistant nylon material.

[0035] The lower end of the aforementioned crossbeam 1 is connected to two symmetrically arranged strip plates 21. Each strip plate 21 has a hanging bracket on both sides. The hanging bracket is made of conductive metal and has a hanging groove on its lower side. An adjustable screw 22 is mounted on the outside of the hanging bracket. When the hanging brackets on both sides of the strip plate 21 are engaged with the conductive beam of the electroplating tank, the adjustable screw 22 is screwed in to bring the strip plate 21 and the hanging bracket into close contact with the conductive beam of the electroplating tank before electroplating is performed. After electroplating is completed, the power is turned off, and the adjustable screw 22 is loosened to disconnect the hanging brackets of the strip plate 21 from the conductive beam of the electroplating tank. Then, the entire electroplating fixture assembly of this invention can be removed from the conductive beam of the electroplating tank by gripping the handle 3, making it more convenient and safer.

[0036] The top of the insulating plate 2 is snapped into the slot formed by the two strip plates 21. When fixing the insulating plate 2, the top of the insulating plate 2 is snapped between the two strip plates 21. The middle section of the strip plate 21 is connected to the insulating plate 2 by bolts, so that the insulating plate 2 can be installed between the two strip plates 21. The strip plate 21 is made of conductive metal material.

[0037] The aforementioned movable plate 7 is connected to a boss 9 that surrounds the second opening 8. The boss 9 is fitted inside the port of the slot 4. Flexible rings 20 are respectively provided on the opposite surfaces of the limiting plate frame 5 and the boss 9. The flexible rings 20 can be made of corrosion-resistant rubber. In use, the boss 9 needs to be inserted into the slot 4, so that the limiting work of the movable plate 7 can be completed efficiently. The flexible rings 20 can prevent the edges of the chip from being damaged due to compression, reducing the probability of damage to the edges of the chip due to pressure.

[0038] The strip plate 21 is connected to a metal part 14 for conducting electricity. A conductive wire 15 for conducting electricity is connected to the metal part 14. The end of the conductive wire 15 passes through the limiting plate frame 5 and extends into the edge of the slot 4. The end of the conductive wire 15 is connected to a metal spring 17 for conducting electricity and has elasticity. The limiting plate frame 5 is provided with a through hole 16 that cooperates with the conductive wire 15. So when the chip is fixed in the slot 4, the limiting plate frame 5 is made of insulating material, the movable plate 7 is made of conductive metal material, and the conductive wire 15 and the metal spring 17 are connected to the movable plate 7. The metal spring 17 can make the contact area between the conductive wire 15 and the movable plate 7 large, so that the conductivity is stable.

[0039] The limiting plate frame 5 is installed on the outer surface of the conductive wire 15, the metal spring 17, and the movable plate 7 by bolts or pins, and an insulating cover kit is fitted on the bolts or pins.

[0040] The upper end of the metal part 14 is connected to the strip plate 21 by bolts, and the lower part of the metal part 14 is connected to the conductive wire 15, the metal spring 17, and the movable plate 7.

[0041] The outer side of the metal part 14 is equipped with an insulating sheet or a hollow insulating sleeve.

[0042] During electroplating, the current can pass through the metal part 14, the conductive wire 15 and the metal spring 17 in sequence to contact the chip, so as to complete the electroplating of the chip.

[0043] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-described technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A chip processing electroplating fixture assembly, comprising a crossbeam (1), wherein a handle (3) is provided on the top of the crossbeam (1), characterized in that, Also includes: An insulating plate (2) is connected to the lower end of the crossbeam (1). The insulating plate (2) has a slot (4) and a limiting plate frame (5) is connected to one side of the insulating plate (2). The limiting plate frame (5) has a first opening (6) with a diameter smaller than that of the slot (4). The movable plate (7) is connected to the other side of the insulating plate (2) by a snap-fit ​​component, and the movable plate (7) has a second opening (8) with a diameter smaller than that of the slot (4), and the first opening (6) and the second opening (8) are aligned with each other.

2. The electroplating fixture assembly for chip processing according to claim 1, characterized in that, The buckle component includes a short shaft (11) connected to the outer wall of the insulating plate (2), a horizontally arranged pressure rod (12) is rotatably connected to the short shaft (11), and a longitudinally arranged strip groove (13) is opened on the movable plate (7). The pressure rod (12) passes through the strip groove (13) and presses against the outer wall of the movable plate (7).

3. The electroplating fixture assembly for chip processing according to claim 2, characterized in that, The insulating plate (2) is provided with a socket (10), one end of the short shaft (11) is inserted into the socket (10), and a corrosion-resistant rubber band (18) is installed between the short shaft (11) and the inner wall of the socket (10).

4. The electroplating fixture assembly for chip processing according to claim 1, characterized in that, The lower end of the crossbeam (1) is connected to two symmetrically arranged strip plates (21). The two sides of the strip plates (21) are connected to the hanging brackets. The lower side of the hanging brackets has a hanging groove. The outer side of the hanging brackets is equipped with adjustable screws (22). The top of the insulating plate (2) is engaged in the slot formed by the two strip plates (21).

5. The electroplating fixture assembly for chip processing according to claim 1, characterized in that, The movable plate (7) is connected to a boss (9) that surrounds the second opening (8), and the boss (9) is fitted inside the port of the slot (4).

6. The electroplating fixture assembly for chip processing according to claim 5, characterized in that, Flexible rings (20) are respectively provided on the opposite surfaces of the limiting plate frame (5) and the boss (9).

7. The electroplating fixture assembly for chip processing according to claim 4, characterized in that, A metal part (14) is connected to the strip plate (21), and a conductive wire (15) is connected to the metal part (14). The end of the conductive wire (15) passes through the limiting plate frame (5) and extends to the edge of the slot (4). A metal spring (17) is connected to the end of the conductive wire (15). The limiting plate frame (5) is provided with a through hole (16) that cooperates with the conductive wire (15). The conductive wire (15) and the metal spring (17) are connected to the movable plate (7).

8. The electroplating fixture assembly for chip processing according to claim 2, characterized in that, Both sides of the strip groove (13) are provided with arc-shaped protrusions (19).

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