Electroplating device
By designing a conductive shaft and a conductive ring, the problem of conductive wire entanglement was solved, thereby improving the reliability and efficiency of the electroplating equipment and reducing maintenance costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- YIHONG ENVIRONMENTAL PROTECTION MACHINERY SUZHOU
- Filing Date
- 2025-05-07
- Publication Date
- 2026-07-21
AI Technical Summary
The conductive wires of traditional electroplating rollers are prone to tangling with the workpiece during rotation, leading to decreased conductivity stability and short circuit risk. In addition, maintenance costs are high, affecting the reliability and efficiency of the electroplating equipment.
The conductive shaft and conductive ring replace the conductive wire. The conductive ring is designed with its center of gravity lower than the center to avoid tangling, and a sealing component prevents corrosion, thereby improving conductivity and device lifespan.
This effectively prevents the conductive ring from tangling with the workpiece, improving the reliability and service life of the electroplating equipment, reducing maintenance costs, and increasing processing efficiency.
Smart Images
Figure CN224531107U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of electroplating technology, specifically relating to an electroplating apparatus. Background Technology
[0002] Electroplating rollers, as core equipment in the electroplating process, have important applications in the field of metal surface treatment, especially suitable for batch electroplating of small workpieces such as screws and miniature hardware parts. Traditional electroplating rollers achieve uniform coating by rotating the roller and tumbling the workpiece in the electroplating solution. However, in terms of conductivity, existing electroplating rollers generally establish a current path by directly inserting conductive wires inside the roller. This contact-based conductivity structure has significant drawbacks: when the roller rotates continuously, the unsecured conductive wires are prone to mechanical interference with the workpiece to be electroplated. This is particularly true for threaded or irregularly shaped screws, where sharp parts can easily become entangled with the wires, leading to wear of the wire insulation and even breakage of the metal core. This not only causes decreased conductivity stability and abnormal local current density but also potentially triggers short circuits. Furthermore, frequent wire replacements significantly increase equipment maintenance costs and limit the reliability and processing efficiency of the electroplating roller.
[0003] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content
[0004] The purpose of this invention is to provide an electroplating device that uses a conductive shaft and a conductive ring instead of a conductive wire, thereby improving the reliability of the electroplating device.
[0005] To achieve the above objectives, a specific embodiment of this utility model provides the following technical solution: an electroplating apparatus, comprising a hollow electroplating drum, a conductive shaft, multiple conductive rings, and a driving assembly. The hollow electroplating drum has an electroplating cavity inside and is provided with an openable and closable cover plate to place a workpiece to be electroplated into the electroplating cavity; the conductive shaft is axially inserted into the electroplating drum, with both ends extending out of the electroplating drum; multiple conductive rings are sleeved on the conductive shaft; the driving assembly is connected to the electroplating drum to drive the electroplating drum to rotate around the conductive shaft; wherein the mass distribution of each conductive ring is uneven, such that the center of gravity of each conductive ring is lower than the center of the ring itself.
[0006] In one or more embodiments of this utility model, a counterweight structure is provided at the lower part of the conductive ring.
[0007] In one or more embodiments of this utility model, the two ends of the conductive ring have overlapping portions, which constitute the counterweight structure.
[0008] In one or more embodiments of this utility model, a sealing assembly is provided between the conductive shaft and the electroplating roller.
[0009] In one or more embodiments of this utility model, the sealing assembly includes a bushing, a first sealing ring, a protective cover, a cap, and a second sealing ring. The bushing is sleeved on the conductive shaft; the first sealing ring is sleeved on the bushing and located between the bushing and the electroplating roller; the protective cover is disposed at both ends of the conductive shaft and abuts against the drive assembly; the cap abuts against the protective cover and is located on the side of the protective cover away from the conductive shaft; the second sealing ring is disposed between the protective cover and the cap.
[0010] In one or more embodiments of this utility model, the driving assembly includes: a connecting frame, a driving rod, a driving wheel, and a transmission wheel. The connecting frame is connected to both ends of the conductive rod; the driving rod is inserted into the connecting frame; the driving wheel is disposed at one end of the driving rod and meshes with an external power device; the transmission wheel is disposed on the driving rod and connected to the electroplating drum to drive the electroplating drum to rotate.
[0011] In one or more embodiments of the present invention, a plurality of radially extending teeth are provided at the end of the electroplating drum along the circumference of the electroplating drum, the teeth meshing with the transmission wheel to be driven by the transmission wheel.
[0012] In one or more embodiments of this utility model, conductive copper busbars extending upward are provided at both ends of the conductive shaft. One end of the conductive copper busbar is connected to the conductive shaft, and the other end is connected to an external power source to supply power to the conductive shaft.
[0013] In one or more embodiments of this utility model, a copper busbar protective cover is provided around the conductive copper busbar.
[0014] In one or more embodiments of this utility model, a reinforcing rod is provided on the connecting frame, and the conductive copper busbar is fixedly connected to the end of the reinforcing rod.
[0015] Compared with existing technologies, the electroplating device of this invention uses a conductive shaft and a conductive ring to replace the existing conductive wire. The conductive ring is sleeved on the conductive shaft and will not entangle with the workpiece, thus avoiding wear. The center of gravity of the conductive ring is lower than its center, allowing the conductive ring to abut against the conductive shaft and return to its original position in a timely manner to effectively transmit current. In addition, a sealing component is provided to prevent corrosion at the connection points between the conductive shaft, electroplating roller, and conductive copper busbar, thereby improving the service life of the electroplating device. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a first perspective view of the electroplating apparatus in one embodiment of the present invention;
[0018] Figure 2 This is a second perspective view of the electroplating apparatus in one embodiment of the present invention;
[0019] Figure 3 This is a schematic diagram of a conductive ring in one embodiment of the present invention;
[0020] Figure 4 This is a partial cross-sectional view of the sealing component in one embodiment of the present invention.
[0021] Explanation of key figure labels:
[0022] 1-Electroplating roller, 11-Electroplating chamber, 12-Cover plate, 13-Toothed part, 2-Conductive shaft, 3-Conductive ring, 31-Counterweight structure, 4-Drive assembly, 41-Connecting frame, 42-Drive rod, 43-Drive wheel, 44-Transmission wheel, 45-Reinforcing rod, 46-Connector, 5-Sealing assembly, 51-Shaft sleeve, 52-First sealing ring, 53-Protective cover, 54-Sealing cap, 55-Second sealing ring, 6-Conductive copper busbar, 61-Copper busbar cover. Detailed Implementation
[0023] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.
[0024] like Figure 1-4As shown, an electroplating apparatus according to one embodiment of the present invention includes a hollow electroplating roller 1, a conductive shaft 2, multiple conductive rings 3, and a drive assembly 4. The hollow electroplating roller 1 has an electroplating cavity 11 inside and is equipped with an openable and closable cover plate 12 to place the workpiece to be electroplated into the electroplating cavity 11. The conductive shaft 2 is inserted into the electroplating roller 1 along its axial direction, with both ends extending out of the electroplating roller 1. Multiple conductive rings 3 are sleeved on the conductive shaft 2. The drive assembly 4 is connected to the electroplating roller 1 to drive the electroplating roller 1 to rotate around the conductive shaft 2. The mass distribution of each conductive ring 3 is uneven, such that the center of gravity of each conductive ring 3 is lower than the center of the ring itself.
[0025] The working principle of this electroplating device is as follows: The cover plate 12 on the electroplating drum 1 is opened, and the workpiece to be electroplated (e.g., a screw) is placed inside, occupying approximately one-third of the space in the electroplating chamber 11. Then, the cover plate 12 is closed. Two-thirds of the electroplating drum 1 is immersed in the electroplating solution. The conductive shaft 2 is energized, and the electroplating drum 1 is driven by the drive assembly 4 to rotate relative to the conductive shaft 2. During the rotation of the electroplating drum 1, the workpiece to be electroplated comes into contact with the conductive ring 3, thereby achieving current transmission and electroplating.
[0026] In the above embodiment, the electroplating apparatus uses a conductive shaft 2 and a conductive ring 3 to replace the conductive wire in the prior art. The conductive ring 3 is sleeved on the conductive shaft 2. When it comes into contact with the workpiece to be electroplated, it moves on the conductive shaft 2, and its own movement amplitude changes accordingly with the degree of movement of the workpiece, preventing it from getting tangled with the workpiece, thus effectively replacing the conductive wire. In addition, the center of gravity of the conductive ring 3 is lower than its center, making it difficult for the conductive ring 3 to be lifted off the conductive shaft 2 by the workpiece, causing it to lose contact with the conductive shaft 2 and thus failing to effectively transmit current. Furthermore, even if the conductive ring 3 is lifted off the conductive shaft 2 by the workpiece and loses contact, it can quickly fall back to the state of contact with the conductive shaft 2 due to the downward shift of its center of gravity.
[0027] In one implementation, such as Figure 2-3 As shown, a counterweight structure 31 is provided at the lower part of the conductive ring 3, which causes the center of gravity of the conductive ring 3 to shift downward.
[0028] Preferred, such as Figure 3 As shown, the two ends of the conductive ring 3 are extended, resulting in overlapping portions at both ends of the guide ring. The overlapping portions at both ends of the conductive ring 3 can form the counterweight structure 31. With this configuration, utilizing the structure of the conductive ring 3 itself, there is no need to add an additional counterweight structure 31, which avoids protrusions or unevenness on the conductive ring 3, making it less likely to interfere with or be lifted by the workpiece to be electroplated.
[0029] Electroplating chemicals corrode the copper conductive shaft 2, leading to poor contact and high temperatures. These high temperatures can melt the electroplating roller 1. Furthermore, corrosion reduces the conductivity of the conductive shaft 2, increasing production costs. In one embodiment, a sealing component 5 is provided between the conductive shaft 2 and the electroplating roller 1 to prevent electroplating chemicals from entering the connection point and causing electrochemical corrosion, which would affect the service life and conductivity of the conductive shaft 2.
[0030] Specifically, such as Figure 4 As shown, the sealing assembly 5 includes a bushing 51, a first sealing ring 52, a protective cover 53, a cap 54, and a second sealing ring 55. The bushing 51 is fitted onto the conductive shaft 2, and one side of the bushing 51 has an extension whose outer diameter is larger than the diameter of the opening on the side wall of the electroplating roller 1, thereby covering the opening. The first sealing ring 52 is fitted onto the bushing 51 and located between the bushing 51 and the electroplating roller 1. For example, the first sealing ring 52 can be press-fitted with both the bushing 51 and the electroplating roller 1 to prevent plating solution from entering through gaps at the connection. The protective cover 53 is located at both ends of the conductive shaft 2 and abuts against the drive assembly 4. The cap 54 abuts against the protective cover 53 and is located on the side of the protective cover 53 away from the conductive shaft 2. The second sealing ring 55 is located between the protective cover 53 and the cap 54. The protective cover 53 and the cap 54 cover the ends of the conductive shaft 2, further preventing plating solution from seeping in from the ends of the conductive shaft 2.
[0031] like Figure 2 As shown, in one embodiment, the drive assembly 4 includes a connecting frame 41, a drive rod 42, a drive wheel 43, and a transmission wheel 44. The connecting frame 41 is connected to both ends of the conductive shaft 2, allowing the electroplating drum 1 to rotate within the connecting frame 41. The drive rod 42 is inserted into the connecting frame 41; the drive wheel 43 is disposed at one end of the drive rod 42 and meshes with an external power device. When the external power device is working, the drive wheel 43 drives the drive rod 42 to rotate together. The transmission wheel 44 is disposed on the drive rod 42 and connected to the electroplating drum 1 to drive the electroplating drum 1 to rotate.
[0032] Specifically, multiple radially extending teeth 13 are provided at the end of the electroplating drum 1 along its circumference. The teeth 13 mesh with the drive wheel 44 and are driven by the drive wheel 44. When the drive wheel 43 drives the drive rod 42 to rotate, the drive wheel 44 rotates together with the drive rod 42, thereby driving the electroplating drum 1 to rotate, so that the workpiece to be electroplated can be evenly contacted with the electroplating solution to achieve electroplating.
[0033] In one embodiment, conductive copper busbars 6 extending upwards are provided at both ends of the conductive shaft 2. One end of the conductive copper busbar 6 is connected to the conductive shaft 2, and the other end is connected to an external power source to supply power to the conductive shaft 2. The protective cover 53, the cap 54, and the second sealing ring 55 in the sealing assembly 5 are located at the connection between the conductive copper busbar 6 and the conductive shaft 2, thereby preventing corrosion of the conductive copper busbar 6 and the conductive shaft 2 by chemicals. Furthermore, a copper busbar protective cover 61 is provided around the conductive copper busbar 6 to protect it from corrosion.
[0034] To prevent the conductive copper busbar 6 from moving or bending during the electroplating process, a reinforcing rod 45 is provided on the connecting frame 41, and the conductive copper busbar 6 is fixedly connected to the end of the reinforcing rod 45. For example, two reinforcing rods 45 can be provided, and the ends of the two reinforcing rods 45 are connected by a connector 46. The conductive copper busbar 6 is connected to the connector 46, thereby further improving the fixing strength of the conductive copper busbar 6.
[0035] In summary, this electroplating apparatus uses a conductive shaft 2 and a conductive ring 3 to replace the existing conductive wire. The conductive ring 3 is fitted onto the conductive shaft 2, preventing it from tangling with the workpiece and avoiding wear. The center of gravity of the conductive ring 3 is lower than its center, allowing it to abut against the conductive shaft 2 and return to its original position promptly, thus effectively transmitting current. Furthermore, a sealing assembly 5 is provided to prevent corrosion at the connections between the conductive shaft 2, the electroplating roller 1, and the conductive copper busbar 6, thereby improving the service life of the electroplating apparatus.
[0036] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
[0037] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. An electroplating apparatus, characterized in that, include: A hollow electroplating drum has an electroplating chamber inside and an openable and closable cover plate on the electroplating drum to place the workpiece to be electroplated into the electroplating chamber. A conductive shaft is inserted axially into the electroplating drum, with both ends of the conductive shaft extending out of the electroplating drum. Multiple conductive rings are sleeved on the conductive shaft; and A drive assembly, connected to the electroplating roller, drives the electroplating roller to rotate about the conductive shaft; The mass distribution of each conductive ring is uneven, causing the center of gravity of the conductive ring to be lower than the center of the ring itself.
2. The electroplating apparatus according to claim 1, characterized in that, The lower part of the conductive ring is provided with a counterweight structure.
3. The electroplating apparatus according to claim 2, characterized in that, The conductive ring has overlapping portions at both ends, which constitute the counterweight structure.
4. The electroplating apparatus according to claim 1, characterized in that, A sealing assembly is provided between the conductive shaft and the electroplating drum.
5. The electroplating apparatus according to claim 4, characterized in that, The sealing assembly includes: A bushing, fitted onto the conductive shaft; The first sealing ring is sleeved on the bushing and located between the bushing and the electroplating drum; A protective cover is disposed at both ends of the conductive shaft and abuts against the drive assembly; A cap, abutting against the protective cover and located on the side of the cover away from the conductive axis; and The second sealing ring is disposed between the protective cover and the cap.
6. The electroplating apparatus according to claim 1, characterized in that, The driving component includes: The connecting frame is connected to both ends of the conductive shaft; The drive rod is inserted into the connecting frame; A drive wheel is located at one end of the drive rod and meshes with an external power device. A transmission wheel is mounted on the drive rod and connected to the electroplating drum to drive the electroplating drum to rotate.
7. The electroplating apparatus according to claim 6, characterized in that, A plurality of radially extending teeth are provided at the end of the electroplating drum along the circumference of the electroplating drum. The teeth mesh with the drive wheel to be driven by the drive wheel.
8. The electroplating apparatus according to claim 7, characterized in that, The conductive shaft has upward-extending conductive copper busbars at both ends. One end of the conductive copper busbar is connected to the conductive shaft, and the other end is connected to an external power source to supply power to the conductive shaft.
9. The electroplating apparatus according to claim 8, characterized in that, The conductive copper busbar is surrounded by a copper busbar protective cover.
10. The electroplating apparatus according to claim 8, characterized in that, A reinforcing rod is provided on the connecting frame, and the conductive copper busbar is fixedly connected to the end of the reinforcing rod.