Semiconductor parts drying oven

Abstract

The utility model provides a kind of semiconductor parts drying oven, it is related to semiconductor processing technical field, device main part bottom is equipped with air inlet mechanism, and air inlet mechanism is equipped with resistance wire plate with top, and resistance wire plate is located device main part inside bottom, device main part top is equipped with air outlet mechanism;Driving motor left end is connected with air inlet mechanism, and driving motor top is connected with air outlet mechanism, and driving motor can drive air inlet mechanism and air outlet mechanism synchronous operation, device main part top left end is connected with air outlet.The air inlet mechanism is synchronously operated by driving motor and air outlet mechanism, air inlet mechanism can be transmitted to the hot air inside device main part, air outlet mechanism can also be transmitted to the airflow of device main part top inside device main part, so that the airflow in device main part is always kept in flowing state, and the humidity of device main part top is discharged by air outlet mechanism, so as to increase the efficiency of the equipment when drying semiconductor parts.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, specifically to a semiconductor parts drying oven. Background Technology

[0002] Semiconductor components are made of materials with electrical conductivity between that of conductors and insulators; their conductivity can be adjusted by controlling external conditions, making them ideal for manufacturing various electronic components and integrated circuits. However, during semiconductor processing, the processed components often need to be cleaned and dried. But existing semiconductor component drying equipment has some shortcomings, such as:

[0003] Application No.: CN202320175815.8 discloses a drying device for semiconductor parts after cleaning. This device can improve drying efficiency and reduce drying dead spots, minimizing the need for workers to repeatedly turn the parts over. The device itself can achieve the drying effect that workers can only achieve by repeatedly turning the parts over, thus reducing labor costs. However, the device is difficult to adjust the inlet and outlet air speeds synchronously, which may lead to excessive internal airflow or low air pressure during actual use, thereby reducing the adjustability of the device when drying semiconductor parts.

[0004] Therefore, we propose a semiconductor component drying oven to address the problems mentioned above. Utility Model Content

[0005] The purpose of this utility model is to provide a semiconductor component drying oven to solve the problem mentioned in the background art that most semiconductor component drying equipment on the market is difficult to adjust the inlet and outlet air speeds synchronously, which may lead to excessive internal airflow or low air pressure during actual use, thereby reducing the adjustability of the equipment when drying semiconductor components.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor component drying oven, comprising a device body, a drive motor disposed inside the device body, an air inlet mechanism at the bottom of the device body, and a resistance wire plate at the top of the air inlet mechanism and the resistance wire plate being located at the bottom inner side of the device body, and an air outlet mechanism at the top of the device body.

[0007] The left end of the drive motor is connected to the air inlet mechanism, and the top of the drive motor is connected to the air outlet mechanism. The drive motor can drive the air inlet mechanism and the air outlet mechanism to run synchronously. The top left end of the main body of the device is connected to the air outlet, and the air outlet is connected to the air outlet mechanism.

[0008] By driving the air intake and exhaust mechanisms synchronously with the motor, the air intake mechanism can transmit hot air into the main body of the device while the exhaust mechanism can also transmit the airflow from the top of the main body out of the main body. This keeps the airflow inside the main body constantly flowing, and the exhaust mechanism removes moisture from the top of the main body, thereby increasing the efficiency of the equipment in drying semiconductor parts.

[0009] As a preferred embodiment of this utility model, a first sprocket is connected to the left end of the drive motor, and a chain is engaged on the outer side of the first sprocket, and a second sprocket is engaged on the top of the chain. The left end of the first sprocket is connected to the air intake mechanism.

[0010] The above technical solution enables the drive motor to operate more stably when driving the air intake and air outlet mechanisms synchronously, thereby increasing the stability of the equipment during operation.

[0011] As a preferred technical solution of this utility model, the top of the second sprocket is connected to the main body of the device, and the air intake mechanism includes a first drive shaft, and a first bevel gear is connected to the outside of the first drive shaft. The front end of the first bevel gear meshes with a second bevel gear, and the front end of the second bevel gear is connected to a turbine fan blade. A turbine housing is provided on the outside of the turbine fan blade, and an air inlet is connected to the front end of the turbine housing.

[0012] The above technical solution enables the turbine blades to transmit the airflow to the bottom of the resistance wire plate, thereby heating the airflow and making the equipment more stable when drying semiconductor parts.

[0013] As a preferred technical solution of this utility model, the top of the turbine housing is connected to the resistance wire plate, and the bottom of the resistance wire plate is connected to a heating box, which is located inside the main body of the device.

[0014] The above technical solution makes it easier for the main body of the device to start the resistance wire plate, so that when the airflow passes through the resistance wire plate, the heat of the resistance wire plate can be transferred to the inside of the main body of the device, thereby increasing the efficiency of the device during heating.

[0015] As a preferred technical solution of this utility model, the heating box can transmit current to the resistance wire plate, so that the resistance wire plate heats up, and the left end of the second sprocket is connected to the air outlet mechanism, and the air outlet mechanism includes a drive gear, and driven gears mesh on both the front and rear sides of the drive gear, and the left ends of the drive gear and the driven gear are connected to a second drive shaft, and a fan blade assembly is provided on the outer side of the second drive shaft.

[0016] The above technical solution enables the drive motor to operate more stably when driving multiple sets of fan blades, thereby increasing the efficiency of the equipment during ventilation.

[0017] As a preferred technical solution of this utility model, the fan blade assembly is located at the top of the device body, and the top of the device body is provided with a water-absorbing sponge plate, and the device body is provided with an array of perforated plates.

[0018] The above technical solution enables the main body of the device to be more stable when placing semiconductor components, thereby increasing the stability of the device during use.

[0019] As a preferred technical solution of this utility model, a closed door is connected to the front end of the main body of the device, and the closed door is rotatably connected to the main body of the device through a hinge.

[0020] The above technical solution enables the closing door to be more stable when connected to the main body of the device, thereby increasing the stability of the device during operation.

[0021] Compared with the prior art, the beneficial effects of this utility model are: by driving the air inlet mechanism and the air outlet mechanism to operate synchronously by the drive motor, the air inlet mechanism can transmit hot air into the device body, while the air outlet mechanism can also transmit the airflow from the top of the device body out of the device body, so that the airflow inside the device body is always in a flowing state, and the moisture from the top of the device body is discharged through the air outlet mechanism, thereby increasing the efficiency of the equipment in drying semiconductor parts.

[0022] Furthermore, the heating box design makes it easier to start the resistance wire plate in the main body of the device, allowing the heat from the resistance wire plate to be transferred to the inside of the main body of the device as the airflow passes through it, thereby increasing the efficiency of the device during heating.

[0023] Furthermore, the vent plate design allows for greater stability when placing semiconductor components in the main body of the device, thereby increasing the stability of the equipment during use. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the elevation structure of this utility model;

[0025] Figure 2 This is a three-dimensional structural schematic diagram of the front cross-section of this utility model;

[0026] Figure 3 This is a three-dimensional structural diagram of the drive motor of this utility model;

[0027] Figure 4 This is a three-dimensional structural diagram of the turbine fan blade of this utility model;

[0028] Figure 5 This is a three-dimensional structural diagram of the second drive shaft of this utility model.

[0029] In the diagram: 1. Main body of the device; 2. Drive motor; 3. First sprocket; 4. Chain; 5. Second sprocket; 6. First drive shaft; 7. First bevel gear; 8. Second bevel gear; 9. Turbine fan blades; 10. Turbine housing; 11. Air inlet; 12. Heating box; 13. Resistance wire plate; 14. Perforated plate; 15. Drive gear; 16. Driven gear; 17. Second drive shaft; 18. Fan blade assembly; 19. Air outlet; 20. Closing door. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0031] To address the difficulty in synchronously controlling the intake and exhaust speeds in existing technologies, the following solution is disclosed. Please refer to [link / reference]. Figures 1-5 This utility model provides a technical solution: a semiconductor component drying oven, including a device body 1 and an air inlet mechanism at the bottom of the device body 1 and an air outlet mechanism at the top; a resistance wire plate 13 is provided at the top of the air inlet mechanism, and the resistance wire plate 13 is located at the bottom of the device body 1.

[0032] The main body 1 of the device is equipped with a drive motor 2. The left end of the drive motor 2 is connected to the air inlet mechanism, and the top of the drive motor 2 is connected to the air outlet mechanism. The drive motor 2 can drive the air inlet mechanism and the air outlet mechanism to operate synchronously.

[0033] The air intake mechanism includes a first drive shaft 6, which is connected to the output shaft of the drive motor 2. A first bevel gear 7 is connected to the outside of the first drive shaft 6. A second bevel gear 8 meshes with the front end of the first bevel gear 7, and the front end of the second bevel gear 8 is connected to the shaft of the turbine blade 9. A turbine housing 10 is provided on the outside of the turbine blade 9. An air inlet 11 is connected to the front end of the turbine housing 10 and is located outside the main body 1 of the device. The top of the turbine housing 10 is connected to the resistance wire plate 13, and a heating box 12 is connected to the bottom of the resistance wire plate 13. The heating box 12 is located inside the main body 1 of the device. The heating box 12 can transmit current to the resistance wire plate 13, causing the resistance wire plate 13 to heat up.

[0034] A first sprocket 3 is connected to the output shaft at the left end of the drive motor 2, and a chain 4 is engaged on the outside of the first sprocket 3. A second sprocket 5 is engaged on the top of the chain 4. The top of the second sprocket 5 is mounted on the main body 1 of the device, and the left end of the second sprocket 5 is connected to the air outlet mechanism.

[0035] The air outlet mechanism includes a drive gear 15, which is mounted on a drive shaft. The drive shaft passes through the main body 1 of the device and is rotatably mounted thereon, with its end connected to a second sprocket 5. Driven gears 16 mesh with both the front and rear sides of the drive gear 15. The left ends of both the drive gear 15 and the driven gears 16 are connected to a second drive shaft 17. The second drive shaft 17 passes through the main body 1 of the device and is rotatably mounted thereon. A fan blade assembly 18 is provided on the outside of the second drive shaft 17, and the fan blade assembly 18 is located at the top of the main body 1 of the device.

[0036] The top left end of the device body 1 is connected to an air outlet 19, and the air outlet 19 corresponds to the air blowing direction of the fan blade assembly 18; the top of the device body 1 is provided with a water-absorbing sponge plate, and the inside of the device body 1 is provided with an array of perforated plates 14; the front end of the device body 1 is connected to a closed door 20, and the closed door 20 is rotatably connected to the device body 1 by a hinge.

[0037] Working principle: When using the semiconductor component drying oven, first connect the power supply to the grid, then place the workpiece inside the main body 1, and start the drive motor 2 to drive the air inlet and air outlet mechanisms. The air inlet mechanism will transmit the airflow to the resistance wire plate 13, thereby heating the airflow. The heated airflow will then dry the workpiece inside the main body 1. After drying, the airflow will be discharged from the main body 1 by the air outlet mechanism set at the top of the main body 1, thus keeping the airflow inside the main body 1 in a constant state, which can better dry the workpiece.

[0038] When the drive motor 2 drives the air intake mechanism to run, the first sprocket 3 will drive the first drive shaft 6 to rotate, which in turn drives the first bevel gear 7 to rotate, which in turn drives the second bevel gear 8 and the turbine blade 9 to rotate, so that the turbine blade 9 runs inside the turbine housing 10, and the airflow at the air intake 11 is drawn into the turbine housing 10 and transmitted to the resistance wire plate 13 for heating. When the resistance wire plate 13 is running, it will draw electricity from the heating box 12 to generate heat.

[0039] When the drive motor 2 drives the air outlet mechanism to run, the first sprocket 3 will drive the second sprocket 5 to rotate through the chain 4, which in turn drives the drive gear 15 to rotate. This causes the drive gear 15 to drive the driven gear 16 to rotate, which in turn drives the three sets of second drive shafts 17 to rotate. This causes the second drive shafts 17 to drive the fan blade assembly 18 to run, thereby discharging the airflow from the air outlet 19.

[0040] This completes a series of tasks. The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0041] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A semiconductor component drying oven, comprising a main body (1) and a drive motor (2) disposed inside the main body (1), characterized in that, The device body (1) has an air inlet mechanism at the bottom and a resistance wire plate (13) at the top. The resistance wire plate (13) is located at the bottom inside the device body (1). The device body (1) has an air outlet mechanism at the top. The left end of the drive motor (2) is connected to the air intake mechanism, and the top of the drive motor (2) is connected to the air outlet mechanism. The drive motor (2) can drive the air intake mechanism and the air outlet mechanism to run synchronously. The top left end of the main body (1) of the device is connected to the air outlet (19), and the air outlet (19) is connected to the air outlet mechanism.

2. The semiconductor component drying oven according to claim 1, characterized in that, The drive motor (2) is connected to a first sprocket (3) on its left end, and a chain (4) is engaged on the outside of the first sprocket (3), and a second sprocket (5) is engaged on the top of the chain (4). The left end of the first sprocket (3) is connected to the air intake mechanism.

3. The semiconductor component drying oven according to claim 2, characterized in that, The top of the second sprocket (5) is connected to the main body (1) of the device, and the air intake mechanism includes a first drive shaft (6), and a first bevel gear (7) is connected to the outside of the first drive shaft (6). The front end of the first bevel gear (7) is meshed with a second bevel gear (8), and the front end of the second bevel gear (8) is connected to a turbine fan blade (9). A turbine housing (10) is provided on the outside of the turbine fan blade (9), and an air inlet (11) is connected to the front end of the turbine housing (10).

4. The semiconductor component drying oven according to claim 3, characterized in that, The top of the turbine housing (10) is connected to the resistance wire plate (13), and the bottom of the resistance wire plate (13) is connected to the heating box (12), and the heating box (12) is located inside the main body (1) of the device.

5. The semiconductor component drying oven according to claim 4, characterized in that, The heating box (12) can transmit current to the resistance wire plate (13), causing the resistance wire plate (13) to heat up. The left end of the second sprocket (5) is connected to the air outlet mechanism, and the air outlet mechanism includes a drive gear (15). The drive gear (15) is meshed with driven gears (16) on both the front and rear sides. The left ends of the drive gear (15) and the driven gears (16) are connected to a second drive shaft (17), and a fan blade assembly (18) is provided on the outside of the second drive shaft (17).

6. The semiconductor component drying oven according to claim 5, characterized in that, The fan blade assembly (18) is located at the top of the device body (1), and the top of the device body (1) is provided with a water-absorbing sponge plate, and the device body (1) is provided with an array of perforated plates (14).

7. The semiconductor component drying oven according to claim 6, characterized in that, The device body (1) is connected to a closed door (20) at the front end, and the closed door (20) is rotatably connected to the device body (1) by a hinge.

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