Furnace tube apparatus
By setting a movable second temperature sensing element in the furnace tube equipment and utilizing a driving mechanism, the problem of temperature measurement error in the furnace tube equipment was solved, enabling accurate measurement of wafer temperature and ensuring the quality of wafer fabrication.
CN224534813UActive Publication Date: 2026-07-21CHENGDU ZIGUANG SEMICON TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHENGDU ZIGUANG SEMICON TECH CO LTD
- Filing Date
- 2025-08-29
- Publication Date
- 2026-07-21
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Figure CN224534813U_ABST
Abstract
The present disclosure relates to a furnace tube device, which comprises a furnace tube body, a first temperature measuring element, a second temperature measuring element and a driving mechanism; wherein the first temperature measuring element can be arranged in the furnace tube body; the second temperature measuring element can be used to measure the temperature of a wafer; the driving mechanism is arranged outside the furnace tube body, used to clamp the second temperature measuring element and can drive the second temperature measuring element to move in the height direction in the furnace tube body. The second temperature measuring element of the present disclosure can be stably moved in the height direction in the furnace tube body through the driving mechanism, thereby providing accurate reference temperature for the first temperature measuring element, and further ensuring that the first temperature measuring element arranged in the furnace tube body can accurately deduce the actual temperature of the wafer according to the temperature data provided by the second temperature measuring element, and ensuring the preparation efficiency and quality of the wafer.
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