A kind of for adapting mountain landslide displacement monitoring circuit

By employing LoRa adaptive frequency hopping technology and ultra-low power design, combined with IMU frequency-time domain fusion algorithm, the problems of high power consumption and signal blind spots in landslide monitoring equipment in remote mountainous areas have been solved, achieving low-cost and high-precision landslide monitoring.

CN224534998UActive Publication Date: 2026-07-21HANGZHOU WEILIKE COMM SYST CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HANGZHOU WEILIKE COMM SYST CO LTD
Filing Date
2025-10-13
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

Existing landslide monitoring technologies face challenges in remote mountainous areas, including difficulties in laying power lines, power supply, weak communication coverage, and high monitoring accuracy requirements. This results in high power consumption, high cost, and the inability to meet the needs in areas with no signal coverage.

Method used

By employing LoRa adaptive frequency hopping technology, ultra-low power design, IMU frequency-time domain fusion algorithm and magnetic start-stop, combined with LDO power conversion and MCU intelligent management, the device achieves low-power operation and high-precision monitoring.

Benefits of technology

In mountainous areas with no signal coverage, the packet loss rate is less than 5%, the transmission delay is less than 500ms, the power consumption is less than 3 years, the monitoring accuracy reaches the sub-centimeter level, and the maintenance cost is reduced.

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Abstract

The utility model discloses a kind of for adapting mountain landslide displacement monitoring circuit, include MCU, LoRa transceiver, IMU sensor temperature and humidity sensor, SPI flash memory and lithium sub battery power supply system;Adaptive frequency hopping wide-area ad hoc network is constructed using LoRa technology, support 470-510MHz frequency band communication, realize the communication distance of more than 1.5km between nodes in monitoring area, the packet loss rate in 5km square range is less than 5%, time delay is less than 500ms.By IMU sensor frequency domain time domain fusion algorithm realizes sub-centimeter level displacement perception, combined with magnetic sensitive switch control ultra-low power start-stop;LDO power conversion circuit provides 0.45 μA static current, support equipment more than 3 years endurance.This scheme solves the landslide real-time monitoring problem under the signal blind area of mountainous area, power supply difficulty.
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Description

Technical Field

[0001] This utility model relates to the technical field, specifically to a circuit for adapting to landslide displacement monitoring. Background Technology

[0002] Precise landslide monitoring technology has become a rigid requirement in the engineering field. Monitoring methods are mainly divided into external deformation monitoring (surface displacement, cracks) and underground soil deformation monitoring (deep displacement, pore water pressure). Only by combining the two can the landslide formation characteristics be fully captured.

[0003] The core challenges currently facing landslide monitoring are concentrated in "three difficulties and one high":

[0004] Complex geographical environment: Monitoring points are mostly located in remote mountainous areas with steep terrain, making it difficult to lay lines. Traditional wired solutions are costly and risky to implement.

[0005] Difficulty in power supply: Long-term stable power supply in the field is a huge challenge, requiring equipment to have ultra-low power consumption operation capability to extend independent working time.

[0006] Weak communication coverage: The lack of base stations or weak signals is the norm, and there is an urgent need for reliable, low-power wireless communication solutions that can adapt to weak / no signal environments.

[0007] High monitoring accuracy is required: In order to capture the small deformations in the early stage of landslides, the displacement sensing accuracy needs to reach the sub-centimeter level, which places extremely high demands on sensing technology and data analysis.

[0008] like Figure 1 As shown, a typical modern displacement monitoring system is usually built on 4G technology and consists of multi-functional displacement monitoring equipment deployed in the field and a remote cloud platform. The equipment is highly integrated and can simultaneously collect:

[0009] Motion parameters: tilt angle, three-dimensional acceleration, gyroscope change, azimuth angle.

[0010] Environmental parameters: temperature and humidity, crack width.

[0011] Device status: battery level / voltage, firmware / hardware version, device identifier (model number, serial number).

[0012] Spatial information: GPS time, positioning status, and precise coordinates.

[0013] The above data is reported to the cloud platform in real time through the built-in 4G module, enabling centralized management, data storage and analysis, remote inspection, status monitoring and real-time alarms.

[0014] However, existing technical solutions still have the following bottlenecks.

[0015] Existing 4G solutions have significant limitations:

[0016] Power consumption bottleneck: The integration of multiple sensors (tilt, accelerometer, crack gauge, temperature and humidity meter) and a continuously operating 4G communication module results in high overall power consumption. Although a dual-battery system (lithium battery + lithium-ion battery) is adopted to maintain a battery life of more than 3 years, cost and maintenance pressures still exist.

[0017] High dependence on communication: In areas with weak or no 4G coverage, the system functions are disabled or greatly reduced, and cannot meet the needs of signal blind spots that are common in mountainous areas.

[0018] Cost and complexity: High power consumption requires more complex power systems and larger capacity batteries, which increases the cost, size and deployment difficulty of the device.

[0019] Therefore, in view of the above problems, this technical solution designs a circuit adapted for monitoring the displacement of landslides. Utility Model Content

[0020] The purpose of this invention is to provide a circuit for adapting to landslide displacement monitoring, so as to solve the problems mentioned in the background art.

[0021] To achieve the above objectives, this utility model provides the following technical solution:

[0022] A circuit for adapting to landslide displacement monitoring includes a battery-powered circuit powered by an LDO power converter, which supplies power to various functional circuits, including an MCU, a LoRa transceiver, an IMU sensor, a temperature and humidity sensor, a magnetic switch, and LED lights.

[0023] The battery voltage is detected via the MCU's ADC port, providing the MCU with information on battery voltage changes. Power on / off is controlled by a power magnetic switch, and LEDs indicate the device's on / off status and displacement alarm status. The MCU is the control center of the monitoring circuit. The software communicates with the displacement monitoring IMU sensor via SPI bus and with the temperature and humidity sensor via I2C bus. UART is used for device debugging, SPI flash memory is used for backup storage of monitoring data, the JTAG port is used for in-circuit emulation programming, GPIO ports are used for LED status indication, and an RTC crystal oscillator serves as the device's calendar clock.

[0024] The main control MCU (Microcontroller Unit) communicates with the LoRa transceiver via an SPI bus interface. The MCU, through register configuration, handles various command responses and interactions with the LoRa transceiver, such as wireless transmission and reception of IMU monitoring data, LoRa carrier transmit power, receive and transmit frequencies, frequency hopping mode, spreading factor, carrier rate, operating status, and fault alarms. The software implements half-duplex transmit / receive mode selection, network configuration, timing strategies, and real-time strong control settings, achieving intelligent management. The main control MCU program is time-synchronized by the RTC clock and sets energy-saving operating modes according to the working mode. Without affecting normal equipment monitoring and operation, it achieves automatic energy-saving control, real-time monitoring of operating status, firmware upgrades, and fault alarm reporting, effectively saving equipment energy consumption and extending battery life.

[0025] Compared with the existing technology, the beneficial effects of this utility model are: it solves the signal blind zone problem in mountainous areas by using LoRa adaptive frequency hopping technology, with a packet loss rate of <5% and a transmission delay of <500ms within 5km², thereby improving communication reliability.

[0026] With an LDO quiescent current of 0.45μA, a magnetic switch of 0.92μA, and a flash memory sleep current of 0.007μA, it supports more than 3 years of battery life and achieves ultra-low power consumption.

[0027] Sub-centimeter-level displacement sensing is achieved through IMU frequency-time domain fusion algorithm, with acceleration / gyroscope synchronization error <100μs.

[0028] Reduce maintenance costs through magnetic start / stop and wireless parameter configuration (Bluetooth / UART). Attached Figure Description

[0029] picture Figure 1 Schematic diagram of a traditional landslide monitoring system;

[0030] Figure 2 This is a block diagram of the landslide monitoring system for this patent.

[0031] Figure 3 This is a block diagram of the landslide monitoring circuit for this patent.

[0032] Figure 4 Schematic diagram of power supply and power conversion for lithium-ion batteries;

[0033] Figure 5 This is the schematic diagram of the MCU main control circuit.

[0034] Figure 6 This is a schematic diagram of a LoRa transceiver circuit.

[0035] Figure 7 This is a circuit diagram of a power magnetic switch and an LED light.

[0036] Figure 8 This is the schematic diagram of the IMU sensor circuit.

[0037] Figure 9 This is a circuit diagram of a temperature and humidity sensor.

[0038] Figure 10 This is a schematic diagram of an SPI flash memory circuit.

[0039] Figure 11 IMU sensor displacement monitoring algorithm flowchart. Detailed Implementation

[0040] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0041] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0042] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0043] like Figures 2-3 The circuit block diagram shown is for a landslide displacement monitoring circuit, which includes a battery-powered circuit powered by an LDO power converter to power various functional circuits, including an MCU, a LoRa transceiver, an IMU sensor, a temperature and humidity sensor, a magnetic switch, and LEDs.

[0044] The battery voltage is detected via the MCU's ADC port, providing the MCU with information on battery voltage changes. Power on / off is controlled by a power magnetic switch, and LEDs indicate the device's on / off status and displacement alarm status. The MCU is the control center of the monitoring circuit. The software communicates with the displacement monitoring IMU sensor via SPI bus and with the temperature and humidity sensor via I2C bus. UART is used for device debugging, SPI flash memory is used for backup storage of monitoring data, the JTAG port is used for in-circuit emulation programming, GPIO ports are used for LED status indication, and an RTC crystal oscillator serves as the device's calendar clock.

[0045] The main control MCU (Microcontroller Unit) communicates with the LoRa transceiver via an SPI bus interface. The MCU, through register configuration, handles various command responses and interactions with the LoRa transceiver, such as wireless transmission and reception of IMU monitoring data, LoRa carrier transmit power, receive and transmit frequencies, frequency hopping mode, spreading factor, carrier rate, operating status, and fault alarms. The software implements half-duplex transmit / receive mode selection, network configuration, timing strategies, and real-time strong control settings, achieving intelligent management. The main control MCU program is time-synchronized by the RTC clock and sets energy-saving operating modes according to the working mode. Without affecting normal equipment monitoring and operation, it achieves automatic energy-saving control, real-time monitoring of operating status, firmware upgrades, and fault alarm reporting, effectively saving equipment energy consumption and extending battery life.

[0046] like Figure 4 The diagram shows the power supply interface of the battery and the 3.3V power conversion schematic of the LDO:

[0047] The 3.6V lithium-ion battery power supply is connected to the device via a 2-pin interface. Overcurrent and overvoltage protection is provided by a 0.5A fuse and a TVS diode; further protection includes reverse connection protection and low leakage current limiting by two PMOS transistors. A resistor divider network generates a voltage sample, and the battery voltage is fed to the MCU's ADC port for voltage detection. This detects changes in battery voltage parameters and generates a low battery alarm through self-testing, providing early warning and notification that the battery is depleted and needs replacement. The lithium-ion battery power supply is converted to 3.3V via an LDO (SSP7615-33M5R) converter circuit to power the system.

[0048] The LDO chip features a wide input voltage range of 1.5V to 8V. It has a low dropout voltage of 200mV @ 100mA (VOUT=3.3V), supporting battery-powered devices with minimal input / output voltage differences. Its maximum output current capability is 400mA (VOUT=3.3V), meeting the current requirements for wireless transmission.

[0049] It also features output short-circuit protection: short-circuit current drops to 35mA to prevent device damage. Additionally, it boasts ultra-low quiescent current (typical value 0.45μA, VOUT=3.3V, no load) and sleep current <1μA, significantly extending battery life. High-precision, low-noise voltage output accuracy: ±2% (IOUT=1mA), power supply meets and is suitable for the wireless applications of this device.

[0050] The MCU main control unit model is STM32L431CCT6, such as Figure 5 The diagram shows the power supply magnetic switch circuit and the LED light schematic:

[0051] Ultra-low power design, power supply range: 1.71V~3.6V, MCU 32-bit ARM Cortex M4 core, maximum internal clock 80MHz. 256K bytes of embedded Flash, 64K bytes of SRAM, accelerator to achieve zero-wait Flash execution, four UART standard communication interfaces, three I2C standard communication interfaces, three SPI standard communication interfaces, backup register: 32×32 bits (VBAT power supply retention), supports SWD serial debugging, supports RTC counting (seconds / minutes / hours) and perpetual calendar functions. ADC: 12-bit resolution, 5Msps sampling rate. Multi-speed internal RC clock (MSI, 100kHz~48MHz). The MCU power supply voltage VDD_3.3V is input through pins 1, 9, 24, and 48. Pin 7 NRST of the MCU is the power-on reset pin. Pins 34 and 37 are SWDIO and SWCLK, respectively, used as SWD serial debugging ports. Pins 30 and 31 are UART serial buses, used for data configuration and debugging between peripherals and the MCU. Pins 39, 40, and 41 are the SPI1 serial bus. Pin 22, SPI1_CS1, is connected to the external memory MX25R8035FZUIL0, used to store monitoring device address information, configuration information, clock parameters, transmit / receive strategies, logo logs, and other data. Pin 38, SPI1_CS0, is connected to the LoRa transceiver's SPI chip select, used to control the LoRa transceiver's SPI bus communication. Pins 26, 27, and 28 are the SPI2 serial bus. Pin 25, SPI2_CS0_A, is connected to the IMU sensor's accelerometer chip select, and pin 29, SPI2_CS0_G, is connected to the IMU sensor's gyroscope chip select. Pin 10, TR_INT_DIO, is used for LoRa transceiver data transmit / receive status input / output IO status detection. Pin 11, BAT_VADC, is the voltage sampling ADC detection port for the lithium-ion battery. Pin 10, HALL_VADC, is the voltage sampling ADC detection port for the magnetic switch. The MCU's I2C bus (pin 45 I2C_SCL and pin 46 I2C_SDA) communicates with the I2C interface of the external temperature and humidity sensor. The power supply to the LoRa transceiver of the external temperature and humidity sensor is controlled by the MCU's pin 17 I2C_P_EN enable switch. The MCU controls the power supply enable according to the application strategy, further reducing power consumption during device operation. Pin 16 LED_EN is the enable control pin for external indicator lights, used for device power-on / off and displacement alarm status. Pins 18 and 19 are the IMU sensor's acceleration and gyroscope interrupt inputs, used for signal detection when the device experiences acceleration or the gyroscope sensor exceeds the monitoring threshold. Pin 20 is an indicator light for the MCU software's running status. Pin 42 is the LoRa transceiver's reset control pin, active low. Pin 43 is the LoRa transceiver's busy signal output pin; only when this signal is low does it indicate that the chip is ready to accept new commands.When this signal is high, the MCU must wait until it turns off again before sending another command. Pins 3 and 4 are the input pins for the MCU's 32.76kHz RTC clock, providing a reference time for the device.

[0052] like Figure 6 The diagram shows the LoRa communication circuit schematic. The transceiver chip is model SX1262, with a frequency range of 150-960MHz continuous coverage, supporting global sub-GHz ISM bands.

[0053] LoRa modulation: Supports SF5-SF12, bandwidth 7.8-500kHz, code rate 4 / 5 to 4 / 8. SX1262 output power up to +22dBm, power programmable (32 levels, 1dB steps).

[0054] LoRa receiver sensitivity: as low as -148dBm (SF12, BW=10.4kHz).

[0055] Ultra-low power design, receiving current: 4.2mA (LoRa mode, DC-DC regulated).

[0056] Sleep current: Cold start (no data retention): 160nA. Standby current: 0.6mA. Voltage range: 1.8-3.7V.

[0057] Channel activity detection: Configurable detection duration (1-16 symbols), supports LoRa preamble / data symbol detection, for low-power monitoring.

[0058] Data buffer: 256 bytes of RAM, supporting independent TX / RX base address configuration. Flexible packet format: LoRa®: explicit / implicit header, programmable preamble length (10-65535 symbols), CRC optional.

[0059] Fast switching time: STDBY_RC→RX only 83μs, STDBY_XOSC→TX only 105μs.

[0060] The BUSY pin indicates the chip status (high level = busy).

[0061] PA matching: SX1262 requires a battery voltage ≥2.7V to maintain +20dBm.

[0062] Clocking option: Internal programmable XTAL load capacitor (11.3-33.4pF). SX1262 pins (1, 10, 11) are powered by the VDDS power supply.

[0063] Pins 7 and 9 are the adjustable output voltage ports for the chip's internal LDO / DC-DC regulator. Pin 15 is the chip's low-level active reset pin, enabled by the MCU. Pin 13, TR_INT_DIO, serves as the LoRa transceiver's data transmission / reception status output, connected to the MCU for chip status detection. Pin 14, BUSY_SX1262, serves as the LoRa transceiver's busy status output, connected to the MCU for chip read / write capability detection. Pins 16, 17, 18, and 19 are the chip's SPI bus, used for slave-level communication with the MCU. Pins 3 and 4 are the chip's 32MHz clock input / output, with a clock chip selection of ±10PPM to meet the strict frequency offset requirements of LoRa communication. Pins 21 and 22 are the chip's RF receive signal input pins, pin 23 is the RF output signal pin, and pin 24 is the power supply pin for the PA terminal of the output pin.

[0064] In the schematic, the receiver (RFI) and transmitter (RFO) ports are connected at the intersection of C30, C39, and C35. The receiver matching network is a lumped element balancing converter composed of C39, C40, and L8 (L9 is not installed).

[0065] For the transmitting circuit, the matching network is a π-type low-pass filter topology, and it forms a transmit / receive LC low-pass filter with L5, L6, C35, and C36.

[0066] To match the TX impedance, a cascaded low-pass filter consisting of L7, C37, and C33 is designed for load impedance matching from the 50-ohm antenna port to the RFO port. Simultaneously, C44 is connected in parallel with L7 to achieve TX harmonic suppression and an input / output VSWR < 1.5. The MCU, through configuring chip register data, enables software operations such as selecting transmit / receive modes (LoRa carrier transmit power, transmit / receive frequency, frequency hopping mode, spreading factor, carrier rate, operating status, etc.) and querying and configuring parameters.

[0067] Meanwhile, in order to comply with the domestic ISM band requirements, the wireless transceiver frequency range of this monitoring circuit is configured to be 470-510MHz.

[0068] like Figure 7 The schematic diagram of the power supply magnetic switch circuit is shown below:

[0069] The chip model is HAL250, featuring ultra-low power consumption. Operating voltage range: 1.8V–5.5V, average current: 0.92μA@3.3V. Sleep clock system: sleep cycle 280ms, wake-up time 60μs, significantly reducing power consumption. All-polarity triggering supports both south (S) and north (N) magnetic field triggering, eliminating the need to distinguish magnetic field direction. Pin 2 HALL_VADC high-level trigger, connected to the MCU for status input detection.

[0070] The red LED, model 3528, is driven by an NPN transistor MMBT3904. LED_EN is enabled by the MCU; a high level indicates it is emitting light.

[0071] This high-brightness red surface-mount LED is used for equipment installation with a wide viewing angle (120°) and high brightness (22lm@150mA). The high-brightness red light flashing status of the equipment, such as power on / off and displacement alarm, is clearly identifiable under sunlight.

[0072] like Figure 8 The schematic diagram of the IMU sensor circuit is shown below:

[0073] The chip model is BMI088, a high-performance 6-axis inertial measurement unit (IMU) that includes a 3-axis accelerometer and a 3-axis gyroscope.

[0074] Supports low-power mode and multiple motion detection functions. Pins 3 and 11 (VDD_IMU) are the chip power supply pins. Pin 5 (SPI2_CS0_G) is the gyroscope SPI bus chip select pin, and pin 14 (SPI2_CS0_A) is the accelerometer SPI bus chip select pin. Pins 8, 9, and 10 are the SPI2 bus, used for slave communication with the MCU. Pins 16 (INT1) and 12 (INT2) are the interrupt output pins for the accelerometer and gyroscope, respectively, connected to the MCU for IMU monitoring status determination.

[0075] The motion detection function of this IMU sensor has axis weight mapping, which can freely map each axis to adapt to different coordinate systems.

[0076] Supports arbitrary motion detection: detects the slope change between the current acceleration and a reference value; configurable threshold (0-1.5g) and duration (0-163 seconds). Individual axis detection can be enabled. No-motion detection: detects stationary device states; configurable threshold and duration. High-g detection: detects high acceleration events (0-24g range); configurable threshold, hysteresis, and duration (0-20 seconds); detects each axis and direction (positive / negative). Low-g detection: detects low acceleration states (0-1.5g range).

[0077] Based on the acceleration vector length sqrt(accx² + accy² + accz²). Direction detection: Detects the device's position relative to the gravitational field in six directions (up, down, left, right, forward, backward).

[0078] Supports three detection modes: symmetrical, high asymmetry, and low asymmetry. Hysteresis and blocking modes are configurable. Data synchronization function synchronizes the data acquisition time of the accelerometer and gyroscope, with a typical synchronization accuracy of <100μs. Power mode allows independent control of the power supply status of the accelerometer and gyroscope.

[0079] Low-power mode: Periodically switches between performance and suspend modes. Configurable output data rate (0.78Hz-400Hz) and average sample count. Register writes require a minimum 450μs interval. Interrupt system with rich configurable interrupt sources: Motion detection (arbitrary motion / no motion). Acceleration detection (high g / low g). Direction change, data synchronization ready, FIFO status, data ready, error interrupt, can be mapped to INT1 and INT2 pins, supporting latched and non-latched modes. The accelerometer and gyroscope have independent register mappings, and function configuration is completed through register groups, providing rich status output registers. As a high-performance IMU chip, the BMI088 cannot directly achieve continuous, absolute displacement monitoring based solely on its IMU data; this is determined by its physical principles (inertial navigation has accumulated errors).

[0080] However, it can provide high-precision raw acceleration and angular velocity data, which are the foundation for realizing displacement motion sensing.

[0081] By combining specific algorithms (such as sensor fusion and zero-rate updates) with system design, sub-centimeter-level relative displacement or vibration monitoring can be achieved. The core objective of algorithm calibration is to accurately measure and compensate for the systematic errors of the sensors, mainly zero bias and scaling factors, including inter-axis non-orthogonality.

[0082] Among them, an integrated geomagnetic sensor provides absolute azimuth correction and compensates for gyroscope drift;

[0083] Periodically Triggered Zero-Rate Update (ZUPT) algorithm: The velocity error is reset when the IMU detects a stationary state (by acceleration variance < threshold).

[0084] Based on the raw, high-quality data from the IMU, after zero-drift calibration, it is input into a coordinate system with an attitude algorithm and Euler angle reference motion constraints. This ultimately yields high-precision attitude, velocity, or relative displacement information, which serves as monitoring data for landslide displacement. Figure 11 The diagram shows the flow of the IMU sensor displacement monitoring algorithm.

[0085] like Figure 9 The circuit diagram of the temperature and humidity sensor shown is as follows:

[0086] A 4-pin I2C interface is provided for connecting an external chip, model SHT40. The power supply to this temperature and humidity sensor is controlled by the MCU. The control pin I2C_P_EN enables the MMBT3904 transistor, which in turn drives the PMOS transistor IRLML6402. The control pin I2C_P_EN is active high.

[0087] like Figure 10 The schematic diagram of the SPI flash memory circuit is shown below:

[0088] The chip model is MX25R8035F. Pin 1, SPI1_CS1, is the chip select pin for the flash chip's SPI bus. Pins 8, 9, and 10 are the SPI2 bus, used for slave communication with the MCU. Voltage range: 1.65V–3.6V. Ultra-low power mode: standby current: 5μA (typical), deep sleep current: 0.007μA (typical). Flash data storage is used for device information, parameter saving, software backup, and monitoring data storage, increasing data security.

[0089] The operation process of this technical solution is as follows: the magnetic switch (HAL250) senses the magnetic field and triggers the MCU to power on and initialize;

[0090] Data acquisition: The IMU sensor acquires acceleration / gyroscope data in real time;

[0091] The temperature and humidity sensor (SHT40) starts environmental monitoring at a fixed interval of 1 hour. After each sampling, it keeps the power supply on for 2 seconds to complete the measurement and then cuts off the power.

[0092] Data processing: The MCU executes a frequency-domain and time-domain fusion algorithm to process IMU data;

[0093] Data is stored in SPI flash memory (MX25R8035F);

[0094] Communication transmission: Configure the LoRa module (SX1262) carrier parameters (power / frequency / SF factor) on the MCU.

[0095] Data is sent to the main station via an adaptive frequency hopping protocol;

[0096] Power management: The RTC clock controls the MCU's sleep / wake-up cycle;

[0097] Dynamically shut down the power supply to unused modules (such as temperature and humidity sensors);

[0098] Fault handling: An alarm is triggered when the battery voltage is below the threshold;

[0099] When the displacement exceeds the limit, an alarm will be triggered by flashing an LED light (3528).

[0100] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A circuit for adapting to landslide displacement monitoring, characterized in that, Includes a control center MCU with monitoring circuitry; The LoRa transceiver connects to the MCU via the SPI bus. The IMU sensor is connected to the MCU via the SPI bus; The temperature and humidity sensor is connected to the MCU via the I²C bus. SPI flash memory is used for monitoring data backup storage; Lithium-ion battery power supply system and LDO power conversion circuit; A magnetic switch circuit for controlling the start and stop of equipment.

2. The landslide displacement monitoring circuit according to claim 1, characterized in that: The LoRa transceiver supports the 470-510MHz frequency band, is configured with an adaptive frequency hopping protocol, and achieves a communication distance of more than 1.5km between nodes within the monitoring area, with a packet loss rate of <5% and a transmission latency of <500ms within a 5km² range.

3. The landslide displacement monitoring circuit according to claim 1, characterized in that: The IMU sensor uses a frequency domain and time domain fusion algorithm to process data, and achieves sub-centimeter displacement sensing through accelerometer and gyroscope data synchronization and motion constraint coordinate transformation.

4. The landslide displacement monitoring circuit according to claim 1, characterized in that: The LDO power conversion circuit provides a 3.3V system voltage, a quiescent current of 0.45μA, a sleep current of <1μA, supports an input voltage of 1.5V~8V, and has short-circuit protection.

5. The landslide displacement monitoring circuit according to claim 1, characterized in that: The magnetically sensitive switch circuit operates at a current of 0.92μA@3.3V, supports triggering by all polarity magnetic fields, and controls the start and stop of the device by detecting the status through an ADC.

6. The landslide displacement monitoring circuit according to claim 1, characterized in that: The temperature and humidity sensor is powered by a PMOS transistor controlled by the MCU via the I2C_P_EN pin, enabling dynamic switching.

7. The landslide displacement monitoring circuit according to claim 1, characterized in that: The SPI flash memory has a deep sleep current of 0.007μA and is used to store device parameters, monitoring data, and fault logs.