A high-precision tin paste thickness detection device

Abstract

The utility model discloses a kind of tin paste thickness detection equipment of high precision, it includes conveying device, positioning unit and detection device;Conveying device includes conveying line and the lifting drive mechanism of driving the lifting motion of conveying line, the input end of conveying line is provided with first blocking mechanism, output end is provided with second blocking mechanism;Positioning unit is arranged between the first blocking mechanism and the second blocking mechanism, and the positioning unit includes bearing station and the positioning module and alignment optical fiber being set on the bearing station;The detection device includes XYZ drive module, the first mounting plate of being driven to move in XYZ direction by the XYZ drive module and the detection unit being set on the first mounting plate.The utility model can be integrated in high-precision positioning, intelligent automatic control, stable and reliable operation and efficient flexible detection, significantly improve the accuracy, efficiency and automation level of tin paste printing quality detection.

Description

Technical Field

[0001] This utility model belongs to the field of thickness detection technology, and in particular relates to a high-precision solder paste thickness detection device. Background Technology

[0002] During the manufacturing process of circuit boards (PCBs), solder paste is usually printed and then various components are mounted. The thickness of the solder paste has a critical impact on the performance of the components. Therefore, the thickness of the solder paste needs to be inspected after printing. Moreover, with the development of surface mount technology (SMT), the components assembled on circuit boards (PCBs) are getting smaller and smaller, the component assembly density is getting larger and larger, and the solder joints are getting smaller and smaller. Traditional low-precision inspection methods can no longer meet the requirements.

[0003] In the prior art, Chinese Utility Model Patent Publication CN205991789U discloses a detection device for accurately detecting solder paste thickness. This device uses a displacement sensor, a pressure sensor, and an ultrasonic sensor on a mounting plate to detect the solder paste thickness. However, during actual testing, the mounting plate may be subject to vibration or other factors that cause positional shifts, leading to positional shifts in the ultrasonic sensor. This results in the ultrasonic sensor probe not being perpendicular to the surface being measured, i.e., there is a tilt angle. When the probe is tilted at a certain angle, the ultrasonic wave propagation path is no longer a vertical straight line but a slanted path. The actual sound wave path will be greater than the true thickness of the workpiece, thus generating measurement errors and reducing measurement accuracy.

[0004] Therefore, it is necessary to provide a high-precision solder paste thickness detection device to solve the above-mentioned technical problems. Utility Model Content

[0005] The main purpose of this invention is to provide a high-precision solder paste thickness detection device that integrates high-precision positioning, intelligent automatic control, stable and reliable operation, and efficient and flexible detection, significantly improving the accuracy, efficiency, and automation level of solder paste printing quality detection.

[0006] This utility model achieves the above objective through the following technical solution: a high-precision solder paste thickness detection device, comprising:

[0007] A conveying device includes a conveyor line and a lifting drive mechanism for driving the conveyor line to move up and down. The input end of the conveyor line is provided with a first blocking mechanism and the output end is provided with a second blocking mechanism.

[0008] A positioning unit is disposed between the first blocking mechanism and the second blocking mechanism. The positioning unit includes a support platform and a positioning module and an alignment optical fiber disposed on the support platform.

[0009] A detection device is disposed above the positioning unit. The detection device includes an XYZ drive module, a first mounting plate that is driven by the XYZ drive module to move in the XYZ direction, and a detection unit disposed on the first mounting plate.

[0010] Furthermore, the detection unit includes a first camera, a second camera, and a detection mechanism. The detection mechanism includes a first driving component, a lifting bracket driven by the first driving component to perform lifting and lowering movements, and a probe disposed on the lifting bracket. A displacement sensor is connected to the probe.

[0011] Furthermore, the conveyor line includes a pair of parallel conveyor frames, a second drive member disposed on the conveyor frames, a rotating shaft driven by the second drive member to rotate about a horizontal axis, and a pair of transmission belts wound around both ends of the rotating shaft.

[0012] Furthermore, the lifting drive mechanism includes a lifting plate and a third drive component for driving the lifting plate to move up and down, with both ends of the lifting plate connected to the conveyor frame.

[0013] Furthermore, the first blocking mechanism includes a first sensor disposed in front of the conveyor, a second sensor disposed behind the conveyor, a first baffle plate disposed between the first sensor and the second sensor, and a fourth driving member for driving the first baffle plate to move up and down.

[0014] Furthermore, the second blocking mechanism includes a third sensor, a second baffle plate, and a fifth driving component for driving the second baffle plate to move up and down.

[0015] Furthermore, a fourth sensor is also provided at the output end of the conveyor line.

[0016] Furthermore, the positioning module includes a fixing block disposed on the side of the support platform and a positioning pin disposed on the fixing block.

[0017] Furthermore, the conveyor line is equipped with a clamping assembly at the bearing platform, the clamping assembly including a clamping plate and a sixth driving component for driving the clamping plate to perform lifting and lowering actions.

[0018] Furthermore, the first camera is set vertically, while the second camera is set at an angle and facing the bottom of the probe.

[0019] Compared with the prior art, the advantages of this utility model's high-precision solder paste thickness detection device are as follows:

[0020] (1) High detection accuracy: The detection equipment detects the actual position of the probe in real time by setting the alignment fiber and comparing it with the preset position in the PLC control unit. Once a deviation is found, the PLC can immediately control the XYZ drive module to adjust the probe to the precise preset position directly above the solder paste, which can ensure the accuracy of detection. The tilted second camera, together with the light sources on both sides, can acquire high-definition images of the relative position of the probe and the solder paste while the probe is in contact with the solder paste for measurement. This double verification ensures that the probe is always directly above the solder paste to be measured, which fundamentally guarantees the extremely high accuracy of thickness detection.

[0021] (2) High degree of automation and intelligence: The entire inspection process (including PCB board conveying, positioning, clamping, probe position calibration, thickness measurement, and image acquisition) is automatically coordinated by the PLC control unit, realizing fully automated operation and reducing errors caused by human intervention; it integrates multiple sensors (first, second, third, and fourth sensors) and blocking mechanisms, realizing precise control of PCB board conveying and real-time monitoring and feedback of process status (such as board arrival and abnormal board jamming), with a high level of intelligence;

[0022] (3) Precise positioning and strong versatility: The independent and replaceable positioning modules (fixed blocks + positioning pins) set at the four corners can be flexibly replaced according to the position of the positioning holes on different PCB boards, so that the equipment can adapt to a variety of PCB boards and has excellent versatility; the clamping components are added at the four corners of the bearing platform. The clamping plates and positioning pins work together to firmly fix the PCB board, effectively avoiding small displacements during the detection process, and further ensuring the repeatability of positioning and detection.

[0023] (4) Stable and reliable operation: The lifting drive mechanism of the conveying device is symmetrically arranged on the left and right sides of the bearing platform, which ensures the smoothness of the lifting movement of the conveying line and enables the PCB board to be placed accurately and smoothly on the bearing platform; the fourth sensor monitoring output terminal is set up to detect abnormal situations such as PCB board stagnation in time and alarm, which improves the reliability and safety of equipment operation.

[0024] (5) High detection efficiency and good flexibility: The three-axis (XYZ) drive module can move the detection device quickly and accurately within the entire PCB board plane, and can efficiently complete the detection of solder paste thickness at multiple different positions on the board without multiple clamping, which greatly improves the detection efficiency; the detection points are programmable and can flexibly adapt to the detection needs of different products, with strong process adaptability.

[0025] Therefore, this solder paste thickness detection equipment integrates high-precision positioning, intelligent automatic control, stable and reliable operation, and efficient and flexible detection, significantly improving the accuracy, efficiency, and automation level of solder paste printing quality detection. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a high-precision solder paste thickness detection device according to an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of the detection device according to an embodiment of the present invention;

[0028] Figure 3 This is a schematic diagram of the detection device of this utility model after the XYZ drive module has been removed;

[0029] Figure 4 This is a schematic diagram of the structure of the detection mechanism in an embodiment of the present utility model;

[0030] Figure 5 This is a schematic diagram of the conveying device and positioning unit according to an embodiment of the present invention;

[0031] Figure 6 This is a schematic diagram of the positioning unit and the second blocking mechanism in an embodiment of the present invention;

[0032] The numbers in the image represent:

[0033] 100-High precision solder paste thickness inspection equipment;

[0034] 1-Conveying device, 11-Conveying line, 111-Conveying frame, 112-Second driving component, 113-Rotating shaft, 114-Transmission belt, 12-Lifting drive mechanism, 121-Lifting plate, 122-Third driving component, 13-First blocking mechanism, 131-First sensor, 132-Second sensor, 133-First baffle plate, 134-Fourth driving component, 14-Second blocking mechanism, 141-Third sensor, 142-Second baffle plate, 143-Fifth driving component, 15-Fourth sensor;

[0035] 2-Positioning unit, 21-Bearing platform, 22-Positioning module, 221-Fixing block, 222-Positioning pin, 23-Alignment fiber, 24-Pressure assembly, 241-Pressure plate, 242-Sixth driving component;

[0036] 3-Detection device, 31-XYZ drive module, 311-Mounting bracket, 312-Y-axis drive component, 313-First support plate, 314-X-axis drive component, 315-Second support plate, 316-Z-axis drive component, 32-First mounting plate, 33-First camera, 34-Second camera, 35-Detection mechanism, 351-First drive component, 352-Probe, 353-Displacement sensor, 354-Lifting bracket, 36-Light source. Detailed Implementation

[0037] Please refer to Figures 1-6 This embodiment is a high-precision solder paste thickness detection device 100, which includes:

[0038] The conveying device 1 includes a conveying line 11 and a lifting drive mechanism 12 for driving the conveying line 11 to move up and down. The input end of the conveying line 11 is provided with a first blocking mechanism 13 and the output end is provided with a second blocking mechanism 14.

[0039] Positioning unit 2 is disposed between the first blocking mechanism 13 and the second blocking mechanism 14. Positioning unit 2 includes a support platform 21 and a positioning module 22 and an alignment fiber 23 disposed on the support platform 21.

[0040] The detection device 3 is located above the positioning unit 2. The detection device 3 includes an XYZ drive module 31, a first mounting plate 32 driven by the XYZ drive module 31 to move in the XYZ direction, and a detection unit mounted on the first mounting plate 32. The detection unit includes a first camera 33, a second camera 34, and a detection mechanism 35. The detection mechanism 35 includes a first drive member 351, a lifting bracket 354 driven by the first drive member 351 to move up and down, and a probe 352 mounted on the lifting bracket 354. A displacement sensor 353 is connected to the probe 352.

[0041] If the position of probe 352 is off, the accuracy of solder paste thickness detection will deteriorate. Therefore, an alignment fiber optic cable 23 is provided to detect the actual position of probe 352. Both the alignment fiber optic cable 23 and the detection device 3 are electrically connected to the PLC control unit. If the alignment fiber optic cable 23 detects a deviation between the actual position of probe 352 and the preset position in the PLC control unit, the PLC control unit sends a signal to control the detection device 3. The XYZ drive module 31 controls probe 352 to move to the preset position, which is directly above the solder paste. This ensures that probe 352 is always directly above the solder paste, thereby ensuring the accuracy of solder paste thickness detection. In this embodiment, probe 352 is vertically positioned, which ensures the accuracy of solder paste thickness detection. The PLC control unit is existing technology, and its design can be adopted.

[0042] The conveyor line 11 includes a pair of parallel conveyor frames 111, a second drive member 112 mounted on the conveyor frames 111, a rotating shaft 113 driven by the second drive member 112 to rotate about a horizontal axis, and a pair of transmission belts 114 wound around both ends of the rotating shaft 113. The two ends of the rotating shaft 113 are rotatably mounted on the conveyor frames 111, and the two conveyor frames 111 are located on the front and rear sides of the support platform 21, respectively. In this embodiment, PCB boards are being conveyed, and the transmission belts 114 are belts.

[0043] The lifting drive mechanism 12 drives the conveyor line 11 to descend and place the PCB board onto the support platform 21. The lifting drive mechanism 12 includes a lifting plate 121 and a third drive component 122 that drives the lifting plate 121 to move up and down. The two ends of the lifting plate 121 are respectively connected to the conveyor frame 111. In this embodiment, two lifting drive mechanisms 12 are provided, located at the left and right ends of the support platform 21, respectively, which can ensure the stability of the up and down movement of the conveyor line 11, thereby accurately positioning the PCB board onto the support platform 21. In other embodiments, the number and position of the lifting drive mechanisms 12 can be set according to the actual situation, and the number and position of the lifting drive mechanisms 12 are not limited here.

[0044] The first blocking mechanism 13 includes a first sensor 131 disposed in front of the conveyor, a second sensor 132 disposed behind the conveyor, a first baffle plate 133 disposed between the first sensor 131 and the second sensor 132, and a fourth drive unit 134 for driving the first baffle plate 133 to move up and down. When both the first sensor 131 and the second sensor 132 detect the signal of the PCB board, the fourth drive unit 134 drives the first baffle plate 133 to extend and block the PCB board behind the conveyor, so as to ensure that only one PCB board enters the carrier platform 21 at a time.

[0045] The second blocking mechanism 14 includes a third sensor 141, a second baffle plate 142, and a fifth drive unit 143 that drives the second baffle plate 142 to move up and down. When the third sensor 141 senses a PCB board signal, the fifth drive unit 143 drives the second baffle plate 142 to extend and block the PCB board. Then, the lifting drive mechanism 12 drives the conveyor line 11 to descend and place the PCB board onto the support platform 21.

[0046] The output end of the conveyor line 11 is also equipped with a fourth sensor 15. The fourth sensor 15 is set up to detect whether there is any abnormality at the output end of the conveyor line 11. Under normal circumstances, after the solder paste thickness on the PCB is detected, the PCB will flow to the next station normally, and the fourth sensor 15 will not detect the signal of the PCB. If the fourth sensor 15 detects the signal of the PCB, it is considered that a PCB is stuck at the output end of the conveyor line 11, and the output is abnormal. An alarm will be set to prompt the staff to confirm.

[0047] The positioning module 22 includes a fixing block 221 disposed on the side of the support platform 21 and a positioning pin 222 disposed on the fixing block 221. The positioning pin 222 protrudes above the support surface of the support platform 21, and a positioning hole corresponding to the positioning pin 222 is provided on the PCB board. The positioning module 22 is disposed separately from the support platform 21, allowing for the replacement of positioning modules 22 with different structures according to different positioning holes on the PCB board, thereby improving the versatility of the positioning unit 2. In this embodiment, four positioning modules 22 are provided, respectively disposed at the four corners of the support platform 21, ensuring the positioning accuracy of the PCB board. In other embodiments, the number and position of the positioning modules 22 can be set according to the actual situation, and the number and position of the positioning modules 22 are not limited here. In other embodiments, the positioning pin 222 can be directly disposed on the support platform 21, which simplifies the structure of the positioning unit 2.

[0048] To ensure the positioning accuracy of the PCB board, the conveyor line 11 is equipped with a clamping assembly 24 at the support platform 21 to press the PCB board onto the support platform 21. The clamping assembly 24 includes a clamping plate 241 and a sixth driving component 242 that drives the clamping plate 241 to move up and down. In this embodiment, four clamping assemblies 24 are provided, respectively located at the four corners of the support platform 21. The four-corner positioning ensures the positioning accuracy of the PCB board. Specifically, the clamping plate 241 presses against the PCB board and is located on the outer periphery of the positioning pin 222. The clamping plate 241 is provided with a clearance notch that cooperates with the positioning pin 222. The dual positioning of the clamping plate 241 and the positioning pin 222 ensures the positioning accuracy of the PCB board. In other embodiments, the number and position of the clamping assemblies 24 can be set according to the actual situation, and the number and position of the clamping assemblies 24 are not limited here.

[0049] The first camera 33 is vertically positioned with a light source 36 below it. The first camera 33 takes pictures of the PCB board to determine whether the PCB board positioning is accurate. The second camera 34 is tilted and faces the bottom of the probe 352. Light sources 36 are placed on both sides of the second camera 34. When the probe 352 contacts the solder paste for height measurement, the second camera 34 simultaneously takes pictures, acquiring high-definition images of the relative position of the probe 352 and the solder paste to determine that the probe 352 is directly above the solder paste, thereby ensuring the accuracy of the detection.

[0050] The XYZ drive module 31 includes a pair of mounting brackets 311, a Y-axis drive component 312 mounted on the mounting brackets 311, a first support plate 313 driven by the Y-axis drive component 312 to move in the Y direction, an X-axis drive component 314 mounted on the first support plate 313, a second support plate 315 driven by the X-axis drive component 314 to move in the X direction, and a Z-axis drive component 316 mounted on the second support plate 315. The first mounting plate 32 is connected to the Z-axis drive component 316. The pair of mounting brackets 311 extend along the Y direction and span over the conveying device 1, which conveys the PCB board along the X direction. The Y-axis drive component 312 is mounted on one of the mounting brackets 311, and a slide rail is provided on the other mounting bracket 311. One end of the first support plate 313 is mounted on the Y-axis drive component 312, and the other end is slidably mounted on the slide rail via a slider. The first support plate 313 extends along the X direction. The XYZ drive module 31 can drive the mounting plate 32 to move along the XYZ direction, thereby enabling thickness detection of solder paste at multiple locations on the PCB board. This improves detection efficiency and allows the module to be moved freely to the desired detection location, offering greater flexibility and versatility.

[0051] When using the high-precision solder paste thickness detection device 100 provided in this solution, after the solder paste is applied to the PCB board, it flows into the first conveyor line 11. When both the first sensor 131 and the second sensor 132 detect the signal from the PCB board, the fourth drive unit 134 drives the first baffle plate 133 to extend and block the PCB board behind it, ensuring that one PCB board enters the carrier platform 21. When the PCB board is directly above the carrier platform 21, the third drive unit 122 drives the lifting plate 121 to lower the conveyor line 11, and the positioning hole on the PCB board is positioned with the positioning pin 222. Inside, the sixth driving component 242 drives the clamping plate 241 to descend, pressing the clamping plate 241 onto the PCB board and positioning it around the outer periphery of the positioning pin 222. The first camera 33 takes a picture of the PCB board to determine if the PCB board positioning is accurate. Then, the detection device 3 starts working. The XYZ driving module 31 drives the first mounting plate 32 to move the detection unit, causing the probe 352 to move above the pre-set first solder paste reference area. The PLC control unit controls the first driving component 351 to descend, driving the lifting bracket 354 to move the probe 352 down to contact the first solder paste reference area. On the upper surface of the domain, displacement sensor 353 acquires the first height value of the first solder paste reference area. The PLC control unit controls the first drive component 351 to drive the lifting bracket 354, which in turn moves the probe 352 upwards. The XYZ drive module 31 drives the first mounting plate 32, which in turn moves the detection unit, causing the probe 352 to move directly above the first solder paste area. Simultaneously, the second camera 34 takes a picture, acquiring a high-definition image of the relative position of the probe 352 and the solder paste. The PLC control unit then controls the first drive component 351 to descend, driving the lifting bracket 354 to move the probe 352 downwards to contact the first solder paste area. On the upper surface of a solder paste area, displacement sensor 353 acquires the second height value of the first solder paste area. The difference between the second height value and the first height value is the thickness value of the solder paste. The PLC control unit controls the first drive component 351 to descend and drive the lifting bracket 354 to drive the probe 352 to rise. The XYZ drive module 31 drives the first mounting plate 32 to move the detection unit to the next detection point, respectively acquiring the first height value of the second solder paste-free reference area and the second height value of the second solder paste area. Then, the detection unit moves to multiple areas of the PCB board to realize continuous automatic detection of solder paste height in multiple areas of the PCB board.

[0052] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. A high-precision solder paste thickness detection device, characterized in that, It includes: A conveying device includes a conveyor line and a lifting drive mechanism for driving the conveyor line to move up and down. The input end of the conveyor line is provided with a first blocking mechanism and the output end is provided with a second blocking mechanism. A positioning unit is disposed between the first blocking mechanism and the second blocking mechanism. The positioning unit includes a support platform and a positioning module and an alignment optical fiber disposed on the support platform. A detection device is disposed above the positioning unit. The detection device includes an XYZ drive module, a first mounting plate that is driven by the XYZ drive module to move in the XYZ direction, and a detection unit disposed on the first mounting plate.

2. The high-precision solder paste thickness detection device as described in claim 1, characterized in that: The detection unit includes a first camera, a second camera, and a detection mechanism. The detection mechanism includes a first driving component, a lifting bracket that is driven to move up and down by the first driving component, and a probe disposed on the lifting bracket. A displacement sensor is connected to the probe.

3. The high-precision solder paste thickness detection device as described in claim 1, characterized in that: The conveyor line includes a pair of parallel conveyor frames, a second drive unit mounted on the conveyor frames, a rotating shaft driven by the second drive unit to rotate about a horizontal axis, and a pair of transmission belts wound around both ends of the rotating shaft.

4. The high-precision solder paste thickness detection device as described in claim 3, characterized in that: The lifting drive mechanism includes a lifting plate and a third drive component for driving the lifting plate to move up and down. The two ends of the lifting plate are respectively connected to the conveyor frame.

5. The high-precision solder paste thickness detection device as described in claim 1, characterized in that: The first blocking mechanism includes a first sensor disposed in front of the conveyor, a second sensor disposed behind the conveyor, a first baffle plate disposed between the first sensor and the second sensor, and a fourth driving component for driving the first baffle plate to move up and down.

6. The high-precision solder paste thickness detection device as described in claim 1, characterized in that: The second blocking mechanism includes a third sensor, a second baffle plate, and a fifth driving component that drives the second baffle plate to move up and down.

7. The high-precision solder paste thickness detection device as described in claim 1, characterized in that: A fourth sensor is also installed at the output end of the conveyor line.

8. The high-precision solder paste thickness detection device as described in claim 1, characterized in that: The positioning module includes a fixing block disposed on the side of the support platform and a positioning pin disposed on the fixing block.

9. The high-precision solder paste thickness detection device as described in claim 1, characterized in that: The conveyor line is equipped with a clamping assembly at the bearing platform. The clamping assembly includes a clamping plate and a sixth driving component that drives the clamping plate to perform lifting and lowering actions.

10. The high-precision solder paste thickness detection device as described in claim 2, characterized in that: The first camera is set vertically, and the second camera is set at an angle and facing the bottom of the probe.

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