A sensor SMD package housing

Abstract

The utility model relates to sensor packaging technical field, and disclose a kind of sensor SMD packaging shell, including pedestal mechanism, and the top end of pedestal mechanism is connected with protection mechanism, and protection mechanism includes first protective cover and second protective cover, and second protective cover is connected in the first protective cover one side surface with clamping, and the bottom of pedestal mechanism inboard is fixedly connected with heat dissipation mechanism.The sensor SMD packaging shell, through the protection mechanism and heat dissipation mechanism of setting, solve the existing sensor SMD packaging shell, usually inadequate protective performance, in the transportation or installation process, easy to cause internal sensor damage due to collision;Or poor heat dissipation effect, the heat generated when sensor works cannot be promptly dissipated, affect the measurement accuracy and service life of sensor.

Description

Technical Field

[0001] This utility model relates to the field of sensor packaging technology, specifically to a sensor SMD packaging shell. Background Technology

[0002] A sensor is a detection device that senses the measured information and transforms it into an electrical signal or other required form of information output according to a certain rule, in order to meet the requirements of information transmission, processing, storage, display, recording, and control. SMD (Surface Mount Device) packaged sensors are widely used in various electronic devices due to their small size and easy installation.

[0003] As a crucial component of sensors, the SMD (Surface Mount Device) package directly impacts sensor performance. Currently, existing SMD packages have several drawbacks: in terms of protection, they are typically insufficient, and their simple structure makes them susceptible to damage during transportation or installation from impacts or pressure, affecting normal sensor operation; in terms of heat dissipation, they are ineffective. Sensors generate heat during operation, and existing packages cannot effectively dissipate this heat, potentially affecting measurement accuracy and even shortening the sensor's lifespan. Therefore, an improved SMD package is needed to address these issues. Utility Model Content

[0004] The purpose of this invention is to provide a sensor SMD packaging shell to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a sensor SMD packaging shell, including a base mechanism, a protective mechanism being snapped onto the top of the base mechanism, and the protective mechanism including a first protective cover and a second protective cover, the second protective cover being snapped onto one side surface of the first protective cover, and a heat dissipation mechanism being fixedly connected to the bottom inner side of the base mechanism.

[0006] Furthermore, the heat dissipation mechanism includes a heat dissipation plate and heat dissipation fins, with the heat dissipation fins evenly and fixedly connected to the bottom surface of the heat dissipation plate, and positioning posts fixedly connected to the four corners of the upper surface of the heat dissipation plate; the positioning posts facilitate the precise positioning and installation of the sensor.

[0007] Furthermore, a rotating shaft is fixedly connected to the middle of one side of both ends of the first protective cover, and a buckle is movably connected to the circumferential surface of the rotating shaft. A locking block is fixedly connected to the middle of one side of both ends of the second protective cover, and the buckle is snapped onto the circumferential surface of the locking block. The cooperation of the buckle and the locking block facilitates the secure connection of the first and second protective covers.

[0008] Furthermore, the base mechanism includes a base and pins, with the pins evenly and fixedly connected to the lower part of one side surface of the base, and fixing ears fixedly connected to the upper part of both sides surface of the base; the fixing ears facilitate fixing the package shell onto the circuit board.

[0009] Furthermore, a placement groove is provided in the middle of the upper surface of the base, and a thermally conductive silicone layer is provided on the inner side wall of the placement groove. A slot is provided at the top edge of the base. The thermally conductive silicone layer can improve the heat transfer efficiency and facilitate heat dissipation of the sensor.

[0010] Furthermore, a buffer pad is fixedly connected to the inner surface of the protective mechanism, and the buffer pad is made of silicone material; the buffer pad can play a buffering role when it is hit, protecting the internal sensor.

[0011] Furthermore, the bottom surface of the base is provided with heat dissipation holes, and the positions of the heat dissipation holes correspond to those of the heat dissipation fins; the heat dissipation holes facilitate heat exchange between the heat dissipation fins and the outside air, thereby improving the heat dissipation effect.

[0012] Compared with the prior art, the present invention provides a sensor SMD packaging shell, which has the following advantages:

[0013] 1. This sensor SMD package housing, through its designed protective mechanism, provides excellent protection, solving the problem that existing sensor SMD package housings often lack sufficient protection and are prone to damage to the internal sensor due to impacts during transportation or installation. The first and second protective covers of the protective mechanism can completely enclose the internal sensor, and the cooperation of the buckles and blocks ensures a secure connection of the protective covers. The inner cushioning pads can effectively buffer impact forces and reduce the risk of sensor damage.

[0014] 2. The SMD package of this sensor features a well-designed heat dissipation mechanism, providing excellent heat dissipation performance. This solves the problem of poor heat dissipation in existing SMD package designs, which prevents the timely dissipation of heat generated during sensor operation, thus affecting measurement accuracy and lifespan. The heat sink conducts heat generated by the sensor to the heat dissipation fins, which exchange heat with the outside air through ventilation holes on the bottom of the base, quickly dissipating heat and ensuring the sensor operates at a suitable temperature. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the protective mechanism structure of this utility model;

[0018] Figure 3 This is a schematic diagram of the base mechanism structure of this utility model;

[0019] Figure 4 This is a schematic diagram of the heat dissipation mechanism of this utility model.

[0020] In the diagram: 1. Base mechanism; 11. Base; 111. Placement slot; 112. Thermally conductive silicone layer; 113. Slot; 114. Heat dissipation hole; 12. Pin; 13. Fixing ear; 2. Heat dissipation mechanism; 21. Heat dissipation plate; 22. Heat dissipation fins; 23. Positioning post; 3. Protective mechanism; 31. First protective cover; 32. Rotating shaft; 33. Buckle; 34. Second protective cover; 35. Locking block; 36. Buffer pad. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0023] Example:

[0024] Please see Figure 1-4This utility model provides a technical solution: a sensor SMD packaging shell, including a base mechanism 1, a protective mechanism 3 is snapped to the top of the base mechanism 1, and the protective mechanism 3 includes a first protective cover 31 and a second protective cover 34, the second protective cover 34 is snapped to one side surface of the first protective cover 31, and a heat dissipation mechanism 2 is fixedly connected to the bottom of the inner side of the base mechanism 1; the heat dissipation mechanism 2 includes a heat dissipation plate 21 and heat dissipation fins 22, and the heat dissipation fins 22 are evenly fixedly connected to the bottom surface of the heat dissipation plate 21, and positioning posts 23 are fixedly connected to the four corners of the upper surface of the heat dissipation plate 21; a rotating shaft 32 is fixedly connected to the middle of one side of both ends of the first protective cover 31, and a buckle 33 is movably connected to the circumferential surface of the rotating shaft 32; a locking block 35 is fixedly connected to the middle of one side of both ends of the second protective cover 34, and the buckle 33 is snapped to the circumferential surface of the locking block 35;

[0025] The base mechanism 1 includes a base 11 and pins 12, with the pins 12 evenly and fixedly connected to the lower part of one side surface of the base 11. Fixing ears 13 are fixedly connected to the upper part of both sides of the base 11. A placement groove 111 is provided in the middle of the upper surface of the base 11, and a thermally conductive silicone layer 112 is provided on the inner side wall of the placement groove 111. A slot 113 is provided on the top edge of the base 11. Specifically, the sensor is placed in the placement groove 111, the positioning post 23 positions the sensor to prevent the sensor from shifting, and the thermally conductive silicone layer 112 is tightly attached to the side of the sensor to conduct the heat from the side of the sensor to the base 11.

[0026] A buffer pad 36 is fixedly connected to the inner surface of the protective mechanism 3, and the buffer pad 36 is made of silicone. The bottom surface of the base 11 is provided with heat dissipation holes 114, and the heat dissipation holes 114 correspond to the positions of the heat dissipation fins 22. Specifically, after the sensor is installed, the first protective cover 31 and the second protective cover 34 are placed on the top of the base 11 and fixed by the snap fastener 33 and the snap block 35. The buffer pad 36 contacts the upper surface of the sensor to play a buffer protection role. When dissipating heat, the heat generated by the sensor is conducted to the heat dissipation fins 22 through the heat dissipation plate 21. The heat dissipation fins 22 exchange heat with the outside air through the heat dissipation holes 114 to achieve heat dissipation.

[0027] Working principle: When the SMD packaged housing of the sensor is in use, the sensor is first placed in the placement slot 111 of the base mechanism 1. The sensor is positioned and fixed by the positioning post 23 of the heat dissipation mechanism 2. The bottom surface of the sensor contacts the heat dissipation plate 21, and the side surface contacts the thermally conductive silicone layer 112 in the placement slot 111. Then, the first protective cover 31 and the second protective cover 34 of the protective mechanism 3 are placed on the top of the base 11, so that the edge of the protective cover is inserted into the slot 113 of the base 11. The buckle 33 is rotated to engage with the locking block 35, completing the installation and fixing of the protective mechanism 3. At this time, the buffer pad 36 on the inner side of the protective mechanism 3 abuts against the upper surface of the sensor.

[0028] During sensor operation, some of the generated heat is transferred to the heat sink 21 through the bottom surface, and then from the heat sink 21 to the heat dissipation fins 22. The heat dissipation fins 22 exchange heat with the outside air through the heat dissipation holes 114 on the bottom surface of the base 11, dissipating the heat. The remaining heat is transferred to the base 11 through the thermally conductive silicone layer 112 on the side, and then dissipated by the base 11. During transportation or installation, the first protective cover 31 and the second protective cover 34 of the protective mechanism 3 encase and protect the sensor. The buffer pad 36 cushions external impact forces, preventing damage to the sensor. The mounting ears 13 can fix the package shell to the circuit board, and the pins 12 enable electrical connection between the sensor and the circuit board.

[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A sensor SMD package housing, characterized in that, The base mechanism (1) is attached to a protective mechanism (3) at its top. The protective mechanism (3) includes a first protective cover (31) and a second protective cover (34). The second protective cover (34) is attached to one side surface of the first protective cover (31). A heat dissipation mechanism (2) is fixedly connected to the bottom inside the base mechanism (1).

2. The sensor SMD packaging shell according to claim 1, characterized in that, The heat dissipation mechanism (2) includes a heat dissipation plate (21) and heat dissipation fins (22), and the heat dissipation fins (22) are uniformly fixedly connected to the bottom surface of the heat dissipation plate (21). Positioning posts (23) are fixedly connected to the four corners of the upper surface of the heat dissipation plate (21).

3. The sensor SMD packaging shell according to claim 1, characterized in that, The first protective cover (31) has a rotating shaft (32) fixedly connected to the middle of one side of both ends of the surface, and a buckle (33) is movably connected to the circumferential surface of the rotating shaft (32). The second protective cover (34) has a locking block (35) fixedly connected to the middle of one side of both ends of the surface, and the buckle (33) is snapped onto the circumferential surface of the locking block (35).

4. The sensor SMD packaging shell according to claim 1, characterized in that, The base mechanism (1) includes a base (11) and pins (12), and the pins (12) are uniformly fixedly connected to the lower part of one side surface of the base (11), and fixed ears (13) are fixedly connected to the upper part of both sides surface of the base (11).

5. A sensor SMD packaging shell according to claim 4, characterized in that, The base (11) has a placement groove (111) in the middle of its upper surface, and a thermally conductive silicone layer (112) is provided on the inner side wall of the placement groove (111). The top edge of the base (11) has a slot (113).

6. The sensor SMD packaging shell according to claim 1, characterized in that, The inner surface of the protective mechanism (3) is fixedly connected to a buffer pad (36), and the buffer pad (36) is made of silicone.

7. A sensor SMD packaging housing according to claim 4, characterized in that, The base (11) has heat dissipation holes (114) on its bottom surface, and the heat dissipation holes (114) correspond to the positions of the heat dissipation fins (22).

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