Automatic temperature measuring and cooling placement device for passive devices
By introducing a heat sink and a cold source system into the passive component temperature measurement device, the problem of tooling temperature rise during passive component temperature measurement is solved, and more accurate temperature measurement is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SICHUAN STRONGEST LASER TECH CO LTD
- Filing Date
- 2025-06-25
- Publication Date
- 2026-07-21
AI Technical Summary
During temperature measurement, the heat generated by passive devices can easily cause the tooling temperature to rise, affecting the accuracy of temperature measurement.
Design an automatic temperature measurement and cooling placement device for passive components, including a base, a support, a heat sink, and a temperature measuring device. The heat sink is connected to a cold source, which removes heat and reduces the accumulation of heat on the heat sink and support, thereby reducing the impact on the temperature measurement of passive components.
This effectively reduces the impact of temperature rise in heat pipes and support components on the temperature measurement of passive devices, improving temperature measurement accuracy and stability.
Smart Images
Figure CN224535238U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of passive device testing technology, and specifically relates to an automatic temperature measurement, cooling and placement device for passive devices. Background Technology
[0002] During the automatic temperature measurement of passive devices, tooling is required to position and support the passive devices. The tooling can stably support the passive devices for a long time to reduce the influence of temperature measuring instruments (such as thermal imagers) on the temperature measurement of passive devices. However, during the testing of passive devices, the passive devices heat the tooling through both photothermal radiation and thermal conduction. After prolonged heating, the temperature of the tooling is higher than that of a normally qualified device, which affects the subsequent temperature measurement of the passive devices. Utility Model Content
[0003] This utility model provides an automatic temperature measurement and cooling placement device for passive components, which solves the technical problem that the heat from passive components can easily cause the tooling temperature to rise during current temperature measurement of passive components, thus affecting the temperature measurement of passive components.
[0004] This utility model is achieved through the following technical solution: an automatic temperature measurement and cooling placement device for passive components, comprising a base, a support, a heat dissipation pipe, and a temperature measuring device. The base has an installation space; the support is installed on the base and located within the installation space; the heat dissipation pipe is installed on the support and connected to a cold source; the passive component is placed on the heat dissipation pipe; and the temperature measuring device is installed above the passive component.
[0005] Optionally, a positioning groove is provided on the heat dissipation pipe, and the passive device is placed in the positioning groove.
[0006] Optionally, multiple positioning slots are provided, and the multiple positioning slots are distributed along the axial direction of the heat dissipation pipe. Optionally, it also includes a cold source input pipe and a cold source output pipe. The base has a cavity. Both the cold source input pipe and the cold source output pipe are connected to the installation space. The cold source input pipe is connected to the cold source to deliver the cold source into the installation space, and the cold source output pipe is used to discharge the cold source from the installation space.
[0007] Optionally, two support members are provided, one end of each of the two support members is mounted on the base and located within the installation space, the two support members are arranged opposite to each other, the heat dissipation pipe corresponds to each support member, the two ends of the passive device are respectively placed on the two heat dissipation pipes, and the two support members are respectively used to support the two ends of the passive device.
[0008] Optionally, the support member has a mounting surface at one end away from the base, the mounting surface extending along the extension direction of the passive device, the heat dissipation pipe is mounted on the mounting surface, and the position of the heat dissipation pipe on the mounting surface is adjusted to adjust the distance between the two heat dissipation pipes.
[0009] Optionally, the extension direction of the heat pipe is at an angle to the extension direction of the passive device.
[0010] Optionally, the inner wall of the base is made of a light-absorbing material.
[0011] Optionally, the temperature measuring device is an infrared thermal imager.
[0012] Compared with the prior art, this utility model has the following advantages: The present invention provides an automatic temperature measurement and cooling placement device for passive components, comprising a base, a support, a heat dissipation pipe, and a temperature measuring device. The base has an installation space; the support is installed on the base and located within the installation space; the heat dissipation pipe is installed on the support and connected to a cold source; the passive component is placed on the heat dissipation pipe; and the temperature measuring device is installed above the passive component.
[0013] With the above structure, the automatic temperature measurement and cooling placement device for passive components provided by this utility model places the passive component on a heat sink when measuring the temperature of the passive component. The support member supports the heat sink and the passive component on the heat sink. The temperature measurement device obtains the temperature of the passive component, the support member, and the base from above. A cold source is introduced into the heat sink. The passive component generates heat and moves to the heat sink through heat conduction and transfer. The cold source flows inside the heat sink and carries away the heat from the contact part between the heat sink and the passive component, thereby reducing the temperature rise of the heat sink. The heat is also conducted to the support member through the heat sink, thereby reducing the impact of the temperature rise of the heat sink and the support member on the passive component. The line contact between the heat sink and the passive component reduces the contact area between the heat sink and the passive component, reducing the heat conducted by the passive component to the heat sink and carried away by the heat sink through the heat sink, thus reducing the impact on the true temperature of the passive component. Therefore, when the passive device is measuring the temperature, the automatic temperature measurement and cooling placement device removes the temperature of the part in contact with the heat sink by using a cold source, thereby reducing the impact of the heat sink temperature rise and the temperature of the passive device being conducted to the support on the passive device during temperature measurement. Attached Figure Description
[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0015] Figure 1 This is a schematic diagram of the structure of an automatic temperature measurement, cooling and placement device for passive components provided by this utility model; Figure 2 This is a schematic diagram of the mounting structure of the passive device in an embodiment of this utility model.
[0016] In the picture: 1-Base, 2-Support component, 3-Heat pipe, 31-Positioning slot, 4-Temperature measuring device, 5-Cold source input pipe, 6-Cold source output pipe, 7-Passive component. Detailed Implementation
[0017] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0018] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.
[0019] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0020] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be described in detail below. Obviously, the described embodiments are merely some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this invention.
[0021] This utility model provides an automatic temperature measurement, cooling, and placement device for passive components, solving the technical problem that the heat from passive components easily leads to an increase in the temperature of the tooling during temperature measurement, thus affecting the measurement of passive components. The automatic temperature measurement, cooling, and placement device for passive components includes a base 1, a support 2, a heat dissipation pipe 3, and a temperature measuring device 4, wherein: Base 1 has installation space and serves as a platform for mounting other components, such as... Figure 1 As shown, in one embodiment of this invention, the base 1 is box-shaped.
[0022] The support 2 is installed on the base 1 and is located in the installation space. The end of the support 2 away from the base 1 is used to support the passive device 7. The support 2 increases the distance between the passive device 7 and the base 1. When the passive device 7 is being measured, the support 2 increases the distance between the passive device 7 and the bottom of the base 1, thereby reducing the heat radiation to the base 1 and the reflection towards the passive device 7, thus reducing the impact of the heat reflected by the base 1 on the temperature measurement of the passive device 7.
[0023] The heat sink 3 is mounted on the support 2 and is connected to a cold source. The cold source moves along the axial direction of the heat sink 3, thereby transferring heat from the heat sink 3 to the cold source. As the cold source moves, the heat moves with it, reducing heat accumulation on the heat sink 3 and its impact on the temperature measurement of the passive device 7. The passive device 7 is placed on the heat sink 3, and the heat generated by the passive device 7 is carried away by the cold source inside the heat sink 3, thus reducing the heat conduction through the heat sink 3 to the support 2, which would cause the support 2 to heat up and consequently affect the temperature of the passive device 7. The heat sink 3 is tubular, thus... When the passive device 7 contacts the heat sink 3, the surfaces of the passive device 7 and the heat sink 3 are in line contact, thereby reducing the heat transfer from the passive device 7 to the heat sink 3 and carried away by the heat sink 4. The heat sink 3 can be a structural component made of copper or other materials. Using materials with good thermal conductivity, such as copper, can quickly absorb and transfer the heat generated by the passive device 7 to the cold source, reducing the heat accumulation at the contact point between the copper tube and the passive device 7. The passive device 7 can be a cladding stripper (CPS), a mode adapter (MFA), a bundler without a metal housing, etc. The cold source can be a gas or a liquid.
[0024] Temperature measuring device 4 is installed above passive device 7 to measure the temperature of base 1, support 2, heat pipe 3, and obtain temperature information of base 1, support 2, heat pipe 3 and passive device 7, so as to determine the influence of the temperature of base 1, support 2, heat pipe 3 on passive device 7 based on the obtained temperature information.
[0025] With the above structure, the automatic temperature measurement and cooling placement device for passive devices provided by this utility model, when measuring the temperature of the passive device 7, places the passive device 7 on the heat sink 3. The support member 2 supports the heat sink 3 and the passive device 7 on the heat sink 3. The temperature measuring device 4 obtains the temperature of the passive device 7, the support member 2 and the base 1 above the passive device 7. A cold source is introduced into the heat sink 3. The passive device 7 generates heat and moves to the heat sink 3 through heat conduction and heat transfer. The cold source flows in the heat sink 3 and carries away the heat from the contact part between the heat sink 3 and the passive device 7, thereby reducing the temperature rise of the heat sink 3. The heat is also conducted to the support member 2 through the heat sink 3, thereby reducing the impact of the temperature rise of the heat sink 3 and the support member 2 on the passive device 7. The line contact between the heat sink 3 and the passive device 7 reduces the contact area between the heat sink 3 and the passive device 7, reducing the heat conducted by the passive device 7 to the heat sink 3 and carried away by the heat sink 3, thus reducing the impact on the true temperature of the passive device 7. Therefore, when the passive device automatic temperature measurement and cooling placement device measures the temperature of the passive device 7, it uses a cold source to remove the temperature of the part of the passive device 7 in contact with the heat sink 3, thereby reducing the impact of the heat sink temperature rise and the temperature of the passive device 7 being conducted to the support member 2 on the temperature measurement of the passive device 7.
[0026] An optional implementation of this embodiment is as follows: A positioning groove 31 is provided on the heat dissipation pipe 3, and the passive device 7 is placed in the positioning groove 31. The positioning groove 31 is used to limit the passive device 7, thereby reducing the impact of the movement of the passive device 7 on the temperature measurement of the passive device 7 when the temperature of the passive device 7 is measured.
[0027] An optional implementation of this embodiment is as follows: multiple positioning slots 31 are provided, and the multiple positioning slots 31 are distributed along the axial direction of the heat sink 3. The multiple positioning slots 31 are so as to facilitate the installation of the passive device 7 at different positions of the heat sink 3 according to the usage requirements, so as to facilitate the adjustment of the position of the passive device 7. The positioning slots 31 can be evenly distributed along the axial direction of the heat sink 3, or they can be set at a specific distance along the axial direction of the heat sink 3 as needed.
[0028] An optional implementation of this embodiment is as follows: It further includes a cold source input pipe 5 and a cold source output pipe 6. The base 1 has a cavity. Both the cold source input pipe 5 and the cold source output pipe 6 are connected to the installation space. The cold source input pipe 5 is connected to the cold source to transport the liquid of the cold source to the installation space. The cold source output pipe 6 is used to discharge the liquid in the installation space. When the heat of the passive device 7 is radiated onto the base 1, the temperature of the base 1 rises. The cold source moves along the cavity of the base 1, thereby transferring the heat on the base 1 to the cold source. As the cold source moves, the heat moves with the cold source, reducing the accumulation of heat on the base 1, thereby reducing the impact of heat reflection onto the passive device 7 on the temperature measurement of the passive device 7. More preferably, a flow channel connected to the cavity is provided in the support member 2, so that the cold source can enter the flow channel and carry away the heat conduction or heat radiation temperature of the passive device 7 on the support member 2, thereby reducing the influence of the temperature of the support member 2 on the passive device 7.
[0029] An optional implementation of this embodiment is as follows: Two support members 2 are provided, one end of each support member 2 is mounted on the base 1 and located in the installation space. The two support members 2 are arranged opposite to each other. The heat dissipation pipes 3 correspond one-to-one with the support members 2. The two ends of the passive device 7 are respectively placed on the two heat dissipation pipes 3. Each heat dissipation pipe 3 is provided with a positioning groove 31. The positioning grooves 31 on the two heat dissipation pipes 3 correspond one-to-one, so as to limit the two ends of the heat dissipation pipes 3, so that the passive device 7 can be placed more stably on the heat dissipation pipes 3. The two support members 2 are respectively used to support the two ends of the passive device 7, so that the forces on the two ends of the passive device 7 are more balanced, and the passive device 7 can be supported more stably.
[0030] An optional implementation of this embodiment is as follows: The end of the support member 2 away from the base 1 has a mounting surface, which extends along the extension direction of the passive device 7. The heat dissipation pipe 3 is mounted on the mounting surface. By adjusting the position of the heat dissipation pipe 3 on the mounting surface, the distance between the two heat dissipation pipes 3 can be adjusted, so as to make adjustments according to different passive devices 7. Optionally, the distance between the two support members 2 can also be adjusted by replacing different support members 2, etc., so as to be suitable for different passive devices 7.
[0031] An optional implementation of this embodiment is as follows: the extension direction of the heat pipe is at an angle to the extension direction of the passive device 7, that is, the axial direction of the heat pipe and the passive device 7 are not parallel. This reduces the contact area between the heat pipe and the passive device 7, reduces the heat transfer efficiency, and thus makes the temperature measured by the temperature measuring device 4 more stable for the passive device 7.
[0032] An optional implementation of this embodiment is as follows: The inner wall of the base 1 is made of a light-absorbing material. Optionally, the base 1 can be made directly of a light-absorbing material, or a light-absorbing material can be coated on the inner wall of the base 1, or the inner wall of the base 1 can be made in other ways to reduce the reflected light of photothermal radiation to the passive device 7, thereby reducing the impact of reflected light on the passive device 7. At the same time, the light and heat absorbed by the light-absorbing material can be carried away by a cold source, reducing the temperature of the base 1 and reducing the impact of the temperature rise of the base 1 on the passive device 7.
[0033] An optional implementation of this embodiment is as follows: The temperature measuring device 4 is an infrared thermal imager. The infrared thermal imager can image the base 1, support 2, and passive device 7 as a whole in real time. The acquired images and related measurement data are used to determine the state of the passive device 7.
[0034] In summary, the automatic temperature measurement and cooling placement device for passive components provided by this utility model places the passive component 7 in the positioning groove 31 of the heat sink 3 when measuring the temperature of the passive component 7. The positioning groove 31 limits the passive component 7, thereby reducing the impact of shaking of the passive component 7 on the temperature measurement device 4. The two support members 2 are used to support the two heat sinks 3 respectively, thereby supporting both ends of the passive component 7 and making the force on both ends of the passive component 7 more balanced. The temperature measurement device 4 obtains the temperature of the passive component 7, the support members 2 and the base 1 above the passive component 7. By adjusting the position of the heat sink 3 on the mounting surface, the distance between the two heat sinks 3 can be adjusted to accommodate different passive components 7. A cold source is introduced into the heat sink 3. The passive component 7 generates heat and moves to the heat sink 3 through heat conduction and heat transfer. The cold source flows within the heat sink 3. The cooling source removes heat from the contact area between the heat sink 3 and the passive device 7, thereby reducing the temperature rise of the heat sink 3 and conducting heat to the support 2 through the heat sink 3, thus reducing the impact of the temperature rise of the heat sink 3 and the support 2 on the passive device 7. The line contact between the heat sink 3 and the passive device 7 reduces the contact area between the heat sink 3 and the passive device 7, reducing the heat transfer from the passive device 7 to the heat sink 3 and carried away by the heat sink 3, thus reducing the impact on the actual temperature of the passive device 7. The light-absorbing material of the base 1 can reduce the reflected light of photothermal radiation to the passive device 7, thereby reducing the impact of reflected light on the passive device 7. At the same time, the light and heat absorbed by the light-absorbing material can be carried away by the cold source flowing in the cold source input pipe 5 and the cold source output pipe 6, reducing the temperature of the base 1 and reducing the impact of the temperature rise of the base 1 on the passive device 7. Therefore, when the passive device automatic temperature measurement and cooling placement device measures the temperature of the passive device 7, it uses a cold source to remove the temperature of the part of the passive device 7 in contact with the heat sink 3, reducing the impact of the heat sink temperature rise and the temperature of the passive device 7 being conducted to the support 2 on the temperature measurement of the passive device 7. The photothermal radiation of the passive device 7 is absorbed by the light-absorbing material of the base 1 and carried away by the cold source flowing in the cold source input pipe 5 and the cold source output pipe 6, reducing the impact of the reflected light of the light and heat radiation from the base 1 on the passive device 7.
[0035] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope described in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.
Claims
1. An automatic temperature measurement, cooling, and placement device for passive components, characterized in that, include: The base provides installation space; A support member is mounted on the base and located within the mounting space; A heat sink is mounted on the support and connected to a cold source, and the passive device is placed on the heat sink. A temperature measuring device is installed above the passive device.
2. The passive device automatic temperature measurement, cooling, and placement device according to claim 1, characterized in that, The heat dissipation pipe has a positioning groove, and the passive device is placed in the positioning groove.
3. The automatic temperature measurement, cooling, and placement device for passive components according to claim 2, characterized in that, The positioning slots are provided in multiple ways, and the multiple positioning slots are distributed along the axial direction of the heat dissipation pipe.
4. The automatic temperature measurement, cooling, and placement device for passive components according to claim 1, characterized in that, Also includes: The base has a cavity and includes a cold source input pipe and a cold source output pipe. Both the cold source input pipe and the cold source output pipe are connected to the installation space. The cold source input pipe is connected to the cold source to deliver the cold source into the installation space, and the cold source output pipe is used to discharge the cold source from the installation space.
5. The automatic temperature measurement, cooling, and placement device for passive components according to claim 1, characterized in that, Two support members are provided, one end of each of the two support members is mounted on the base and located in the installation space. The two support members are arranged opposite to each other. The heat dissipation pipes correspond one-to-one with the support members. The two ends of the passive device are respectively placed on the two heat dissipation pipes. The two support members are used to support the two ends of the passive device.
6. The automatic temperature measurement, cooling, and placement device for passive components according to claim 5, characterized in that, The support member has a mounting surface at one end away from the base. The mounting surface extends along the extension direction of the passive device. The heat sink is mounted on the mounting surface. The position of the heat sink on the mounting surface is adjusted to adjust the distance between the two heat sinks.
7. The automatic temperature measurement, cooling, and placement device for passive components according to claim 1, characterized in that, The extension direction of the heat pipe forms an angle with the extension direction of the passive device.
8. The automatic temperature measurement, cooling, and placement device for passive components according to claim 1, characterized in that, The inner wall of the base is made of light-absorbing material.
9. The automatic temperature measurement, cooling, and placement device for passive components according to claim 1, characterized in that, The temperature measuring device is an infrared thermal imager.