Power module temperature monitoring system, uninterruptible power supply (UPS) diagnostic device

Abstract

The application provides a power module temperature monitoring system and an uninterrupted power supply (UPS) diagnosis device, wherein the power module temperature monitoring system comprises a master control module and at least one miniature infrared image camera; the miniature infrared image camera comprises an insulating base, an infrared image sensor, an infrared image data acquisition board and an insulating colloid; the insulating base has a stepped hole; the infrared image sensor is accommodated in the stepped hole of the insulating base; the infrared image data acquisition board is located above the infrared image sensor and is electrically connected with the infrared image sensor; the insulating colloid is buckled above the infrared image data acquisition board and is sealingly connected with the insulating base; and the master control module is electrically connected with each miniature infrared image camera. The power module temperature monitoring system provided by the application has a compact structure, can be installed in a narrow space with a complex structure and near a high-voltage conductor, can realize real-time, online and automatic monitoring of temperature changes of the power module, and can realize timely early warning.

Description

Technical Field

[0001] This application relates to the technical field of power module temperature monitoring systems, and in particular to a power module temperature monitoring system and an uninterruptible power supply (UPS) diagnostic device. Background Technology

[0002] The core components of an Uninterruptible Power Supply (UPS) include a rectifier power module and an inverter power module, each containing power components and a heat sink. The power components are the primary heat source, while the heat sink is the primary heat dissipation component. Heat generated inside the power components is transferred to their surface, and then dissipated through the heat sink's surface, which is in close contact with the components, thus preventing the internal temperature of the power components from becoming too high and burning them out.

[0003] Current technology typically involves mounting temperature sensors on the surface of a heat sink, such as at one or several different locations. By measuring the surface temperature of the heat sink, the surface temperature of the power component is estimated, and consequently, the internal temperature of the power component. However, heat conduction takes time, and temperature changes within the power component take time to manifest on the heat sink surface. Therefore, the disadvantages of current technology are: First, it is difficult to promptly detect changes in the internal temperature of the power component or to understand the temperature distribution, making timely alarms and response strategies difficult. For example, abnormal changes in UPS operating conditions or deterioration in power component performance can cause a sudden increase in heat within the power component. This sudden increase in heat cannot be promptly conducted to the heat sink, causing the internal temperature of the power component to become excessively high in a short period, potentially burning out the power component. Second, power components operate under high voltage, making traditional temperature sensors such as resistance temperature detectors (RTDs) unsuitable for direct mounting on the surface of the power component. Mounting them through an insulating layer further hinders heat conduction. Third, the compact internal structure and limited space of UPS systems make traditional non-contact temperature sensors unsuitable for installation due to their large size.

[0004] Therefore, how to detect the temperature changes and temperature distribution of power components in real time is an urgent problem to be solved. Summary of the Invention

[0005] To address one of the aforementioned technical deficiencies, this application provides a power module temperature monitoring system and an uninterruptible power supply (UPS) diagnostic device.

[0006] According to a first aspect of the embodiments of this application, a power module temperature monitoring system is provided, the power module temperature monitoring system comprising: a main control module and at least one miniature infrared image camera; The miniature infrared image camera includes an insulating base, an infrared image sensor, an infrared image data acquisition board, and an insulating colloid. The insulating base has an insulating base body and a stepped hole; the insulating base body includes a fixing part and a miniature infrared camera mounting part; the miniature infrared camera mounting part is arranged perpendicularly to the fixing part; the stepped hole is disposed through the miniature infrared camera mounting part and has a large hole section and a small hole section. The infrared image sensor is housed within the large aperture section and abuts against the top surface of the small aperture section; the lens aperture of the infrared image sensor is smaller than the aperture of the large aperture section but larger than the aperture of the small aperture section. The infrared image data acquisition board is located above the infrared image sensor and is electrically connected to the infrared image sensor; The insulating colloid is fastened to the top of the infrared image data acquisition board and is sealed to the insulating base; The main control module is electrically connected to the infrared image data acquisition board of each of the miniature infrared image cameras.

[0007] Preferably, the fixing part has two fixing holes for fixing the miniature infrared image camera and the temperature component.

[0008] Preferably, the top surface of the miniature infrared camera mounting part is an arc surface.

[0009] Preferably, the insulating base is made of polytetrafluoroethylene.

[0010] Preferably, the infrared image data acquisition board integrates an RS-485 bus communication interface for the miniature infrared image camera to transmit data externally.

[0011] More preferably, the main control module is connected to the miniature infrared image camera via an RS-485 bus communication interface.

[0012] Preferably, the infrared image data acquisition board sends an infrared image acquisition command to the infrared image sensor and receives the infrared image data acquired by the infrared image sensor.

[0013] Preferably, the infrared image sensor has a data acquisition rate of 10 frames per second and a resolution of 3 mm.

[0014] Preferably, the infrared image sensor has a viewing angle of 90°, a sampling distance of 50mm, and a sampling range of 100mm×75mm.

[0015] According to a second aspect of the embodiments of this application, an uninterruptible power supply (UPS) diagnostic device is provided. The UPS diagnostic device includes a power module temperature monitoring system as described in any of the first aspects above. The miniature infrared image camera of the power module temperature monitoring system is mounted on the heat sink of the power component of the UPS. The main control module is electrically connected to the communication port of the UPS via an RS-485 bus.

[0016] The power module temperature monitoring system provided in this embodiment features a miniature infrared camera fixed to the power module via an insulating base. An infrared image sensor and an infrared image data acquisition board are housed in stepped holes in the insulating base and sealed to it with insulating adhesive. This provides insulation and shock resistance for the infrared image sensor and data acquisition board. The miniature infrared camera has a compact structure, making it suitable for installation in complex, confined spaces and near high-voltage conductors without altering the power module's structure. Upon receiving an infrared image acquisition command, the infrared image sensor can automatically and in real-time acquire infrared image data from the power module and transmit it to the main control module. The main control module can then promptly identify the temperature distribution of the power module, enabling more reliable and safer operation, thereby extending the power module's lifespan and reducing the risk of unexpected shutdown. Attached Figure Description

[0017] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a schematic diagram of the power module temperature monitoring system provided in an embodiment of this application; Figure 2 This is a schematic diagram of the structure of the miniature infrared imaging camera provided in the embodiments of this application; Figure 3 This is a schematic diagram of the structure of the insulating base provided in the embodiments of this application; Figure 4 This is a schematic diagram of the structure of the infrared image sensor provided in the embodiments of this application; Figure 5 This is a schematic diagram of the structure of the infrared image data acquisition board provided in the embodiments of this application; Figure 6 This is a schematic diagram of the structure of the insulating colloid provided in the embodiments of this application; Figure 7 This is a schematic diagram illustrating an application scenario of the miniature infrared image camera provided in the embodiments of this application.

[0018] Figure label: 1-Main control module; 2-Miniature infrared image camera; 21-Insulating base; 211-Insulating base body; 2111-Fixing part; 2112-Miniature infrared camera mounting part; 21111-Fixing hole; 212-Stepped hole; 22-Infrared image sensor; 220-Lens; 221-First power supply terminal; 222-Signal terminal; 23-Infrared image data acquisition board; 230-Processing module; 231-Second power supply terminal; 232-Through hole for first power supply terminal; 233-Through hole for signal terminal; 24-Insulating colloid. Detailed Implementation To make the technical solutions and advantages of the embodiments of this application clearer, the exemplary embodiments of this application will be described in further detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not an exhaustive list of all embodiments. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0019] To address the above problems, this application provides a method such as... Figure 1 The power module temperature monitoring system shown may specifically include: a main control module 1 and at least one miniature infrared image camera 2.

[0020] Combination Figures 2-6 As shown, the structure of the miniature infrared image camera 2 specifically includes: an insulating base 21, an infrared image sensor 22, an infrared image data acquisition board 23, and an insulating colloid 24.

[0021] The insulating base 21 serves as the mounting mechanism for the miniature infrared image camera 2, and includes an insulating base body 211 and stepped holes 212. The insulating base body 211 specifically includes a fixing part 2111 and a miniature infrared camera mounting part 2112. The fixing part 2111 has two fixing holes 21111, which facilitate a detachable connection between the miniature infrared image camera 2 and the power module (not shown in the figure) via bolts.

[0022] The top surface of the miniature infrared camera mounting part 2112 is curved. The miniature infrared camera mounting part 2112 is set perpendicular to the fixing part 2111.

[0023] The stepped hole 212 is set through the miniature infrared camera mounting part 2112, and has a large hole section and a small hole section. The setting of the stepped hole 212 facilitates the installation of the infrared image sensor 22 and the infrared image data acquisition board 23.

[0024] The insulating base 21 can be made of polytetrafluoroethylene (PTFE), giving it excellent insulation properties and protecting the electronic components inside the stepped hole 212. The insulating base 21 can be 28.0 mm long, 14.0 mm wide, and 18.5 mm high, making the miniature infrared image camera 2 suitable for installation in confined spaces with complex structures.

[0025] The infrared image sensor 22 includes a lens 220, a pair of first power terminals 221, a pair of signal terminals 222, and a signal acquisition circuit (not shown in the figure). The lens aperture of the infrared image sensor 22 is smaller than the aperture of the large aperture section but larger than the aperture of the small aperture section, so that the lens 220 is housed within the large aperture section and abuts against the top surface of the small aperture section, which acts as a limiting force. The signal acquisition circuit is housed within the lens 220, while the pair of first power terminals 221 and the pair of signal terminals 222 protrude from the lens 220 and are electrically connected to the signal acquisition circuit. Specifically, the infrared image sensor 22 has an acquisition rate of 10 frames per second, a resolution of 3 mm, a viewing angle of 90°, an acquisition distance of 50 mm, and an acquisition range of 100 mm × 75 mm. The infrared image sensor 22 can acquire infrared image data from the power module. The infrared image acquired by the infrared image sensor 22 is a grayscale image, where each pixel corresponds to a grayscale value, i.e., infrared image data.

[0026] The infrared image data acquisition board 23 includes a processing module 230, a pair of second power terminals 231, a pair of first power terminal holes 232, and a pair of signal terminal holes 233. The pair of first power terminal holes 232 are for the insertion of a pair of first power terminals 221, and the pair of signal terminal holes 233 are for the insertion of a pair of signal terminals 222. The infrared image data acquisition board 23 is located above the infrared image sensor 22 and is electrically connected to it. The infrared image data acquisition board 23 integrates an RS-485 bus communication interface for external data transmission from the miniature infrared image camera 2. It has very strong anti-interference capabilities and can transmit data up to 1200 meters. The processing module 230 of the infrared image data acquisition board 23 sends infrared image acquisition commands to the signal acquisition circuit of the infrared image sensor 22 and receives the infrared image data acquired by the signal acquisition circuit of the infrared image sensor 22.

[0027] The insulating colloid 24 is fastened to the top of the infrared image data acquisition board 23. A pair of first power terminals 221, a pair of second power terminals 231, and a pair of signal terminals 222 are exposed on the upper surface of the insulating colloid 24. The insulating colloid 24 is sealed to the miniature infrared camera mounting part 2112 of the insulating base 21, and plays a role in insulation and shock resistance for the signal acquisition circuit board of the infrared image sensor 22 and the processing module 230 of the infrared image data acquisition board 23.

[0028] The main control module 1 is electrically connected to the processing module 230 of the infrared image data acquisition board 23 of the miniature infrared image camera 2 via an RS-485 bus communication interface. In a specific example, the main control module 1 has 16 channels and can simultaneously connect to up to 16 infrared image data acquisition boards 23 via 4-core cables. The main control module 1 provides a 3V operating voltage to each infrared image data acquisition board 23. The main control module 1 can be implemented using a controller-embedded digital signal processor, a technique known to those skilled in the art.

[0029] The grayscale value of each pixel in an infrared image is related to the intensity of infrared radiation emitted by the power module, which in turn is directly related to the temperature of the power module. According to Planck's radiation law and Stefan-Boltzmann's law, the radiation intensity of an object increases with increasing temperature. Therefore, a mapping relationship can be established between the temperature of the power module and the pixel values ​​of the infrared image. By calibrating and determining the temperature and pixel values, the temperature value corresponding to each pixel can be calculated. Since each pixel is very small, and the corresponding temperature measurement area is also small, to eliminate measurement errors caused by white noise, while ensuring the measurement area size is met, the minimum and maximum values ​​of the temperature values ​​of each pixel within that area are removed, and the average of the remaining 80% of temperature values ​​is taken as the temperature measurement value for that area. In this way, a corresponding temperature distribution matrix can be obtained for the infrared image data of each camera.

[0030] Under normal circumstances, the temperature of each power module in an electrical system should be the same or not significantly different. By identifying the temperature distribution, we can detect any abnormalities in the temperature distribution of each power module. Power modules with high temperatures have potential failure risks and accelerate aging, requiring timely replacement. Therefore, anomalies can be used to determine the potential failures and aging of power modules, thereby diagnosing the electrical condition, providing early warnings of potential faults, and enabling planned shutdowns for maintenance to avoid losses caused by unplanned shutdowns.

[0031] Therefore, the main control module 1 is connected to a pair of first power terminals 221, a pair of second power terminals 231, and a pair of signal terminals 222, respectively. By reading, processing, and identifying the infrared images collected by the infrared image sensor 22 sent by the infrared image data acquisition board 23, and combining this with the original electrical operating data of the power module, changes in the internal temperature of the power module can be detected in a timely manner, and the temperature distribution of the entire power module can be identified. In this way, sudden increases in the temperature of the power module can be detected in a timely manner, and alarms can be triggered promptly (abnormal alarms, potential abnormal alarms, prediction of the deterioration of the power module and the rate of deterioration), and timely handling can be carried out. This allows the power module to operate more reliably and safely, thereby extending the service life of the power module and reducing the risk of unexpected shutdown of the power module.

[0032] This application also provides an uninterruptible power supply (UPS) diagnostic device, characterized in that the UPS diagnostic device includes the aforementioned power module temperature monitoring system, which is implemented using the aforementioned scheme, wherein a miniature infrared image camera is mounted on the UPS heat sink and faces the UPS power components; the main control module is electrically connected to the UPS communication port via an RS-485 bus.

[0033] Combination Figure 7 As shown, three miniature infrared cameras (infrared cameras) are mounted on the front heat sink of the UPS's No. 1 rectifier module, facing the front side of the power components. Three infrared cameras are also mounted on the front heat sink of the UPS's No. 2 rectifier module, facing the front side of the power components. Three infrared cameras are further mounted on the front heat sink of the UPS's No. 1 inverter module, facing the front side of the power components. The main control module uses an STMicroelectronics STM32H7S3L8 controller with an embedded signal processor to acquire eight static infrared images in real time at a rate of 1-10 frames per second, and performs real-time image processing and recognition.

[0034] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0035] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A power module temperature monitoring system, characterized in that, The power module temperature monitoring system includes: a main control module and at least one miniature infrared image camera; The miniature infrared image camera includes an insulating base, an infrared image sensor, an infrared image data acquisition board, and an insulating colloid. The insulating base has an insulating base body and a stepped hole; the insulating base body includes a fixing part and a miniature infrared camera mounting part; the miniature infrared camera mounting part is arranged perpendicularly to the fixing part; the stepped hole is disposed through the miniature infrared camera mounting part and has a large hole section and a small hole section. The infrared image sensor is housed within the large aperture section and abuts against the top surface of the small aperture section; the lens aperture of the infrared image sensor is smaller than the aperture of the large aperture section but larger than the aperture of the small aperture section. The infrared image data acquisition board is located above the infrared image sensor and is electrically connected to the infrared image sensor; The insulating colloid is fastened to the top of the infrared image data acquisition board and is sealed to the insulating base; The main control module is electrically connected to the infrared image data acquisition board of each of the miniature infrared image cameras.

2. The power module temperature monitoring system according to claim 1, characterized in that, The fixing part has two fixing holes for fixing the miniature infrared image camera and the temperature component.

3. The power module temperature monitoring system according to claim 1, characterized in that, The top surface of the mounting part for the miniature infrared camera is curved.

4. The power module temperature monitoring system according to claim 1, characterized in that, The insulating base is made of polytetrafluoroethylene.

5. The power module temperature monitoring system according to claim 1, characterized in that, The infrared image data acquisition board integrates an RS-485 bus communication interface for the miniature infrared image camera to transmit data to the outside world.

6. The power module temperature monitoring system according to claim 5, characterized in that, The main control module is connected to the miniature infrared image camera via an RS-485 bus communication interface.

7. The power module temperature monitoring system according to claim 1, characterized in that, The infrared image data acquisition board sends infrared image acquisition commands to the infrared image sensor and receives infrared image data acquired by the infrared image sensor.

8. The power module temperature monitoring system according to claim 1, characterized in that, The infrared image sensor has a data acquisition rate of 10 frames per second and a resolution of 3 mm.

9. The power module temperature monitoring system according to claim 1, characterized in that, The infrared image sensor has a viewing angle of 90°, a sampling distance of 50mm, and a sampling range of 100mm×75mm.

10. A diagnostic device for an uninterruptible power supply (UPS), characterized in that, The power module temperature monitoring system includes any one of the claims 1-9 above, wherein the miniature infrared image camera of the power module temperature monitoring system is installed on the heat sink of the power component of the UPS, and the main control module is electrically connected to the communication port of the UPS via an RS-485 bus.

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