A pressure sensor module
By designing and packaging a stable pressure sensor module, the problems of complex structure, high cost and low yield in the existing technology have been solved, realizing automated batch calibration and efficient assembly, and is suitable for a variety of sensor types.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU YUEXIN MICRO-SENSING TECH CO LTD
- Filing Date
- 2025-08-07
- Publication Date
- 2026-07-21
AI Technical Summary
Existing pressure sensor modules are complex in structure, cumbersome in assembly, costly, and have low yield. Moreover, they mostly use strain gauge mounting, resulting in small output signals, narrow linear range, poor accuracy, and no possibility of automated calibration.
A pressure sensor module comprising a housing, a PCB module, and a cover assembly has been designed. It adopts a stable packaging structure, supports automated batch calibration and surface mount, uses locking components to fix the PCB module to ensure airtightness, and supports the installation of gauge pressure and absolute pressure sensors.
It achieves stable packaging process, reduces costs, improves assembly efficiency and yield, supports automated batch calibration, ensures airtightness, and is suitable for various sensor types.
Smart Images
Figure CN224535291U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip circuit verification, and in particular to a pressure sensor module. Background Technology
[0002] With the increasing demand for intelligent development in society, pressure sensors are finding wider and wider applications and are in greater demand. Pressure sensor modules are the end products of pressure sensors, which users can install and use directly according to their application environment.
[0003] Currently, terminal modules based on MEMS pressure chips are gaining increasing popularity due to their advantages of high performance, low power consumption, low cost, and miniaturized assembly. However, existing pressure sensor modules have several drawbacks: 1. Complex structure and cumbersome assembly, with non-standard customized components leading to high costs. 2. Primarily using strain gauge mounting, resulting in small output signals, narrow linear range, poor accuracy, and high costs. 3. Limited by structure and assembly methods, they often employ a pre-assembly and post-calibration approach, which is inefficient; poor assembly prevents calibration, leading to low yield and significant waste.
[0004] Therefore, considering the aforementioned technical problems, it is necessary to propose a new technical solution. Utility Model Content
[0005] To at least address one of the technical problems existing in the prior art, this utility model provides a pressure sensor module. The specific technical solution is as follows:
[0006] This utility model provides a pressure sensor module, which includes a housing, a PCB module, and a cover assembly;
[0007] The outer casing has a receiving cavity, a detection port, and a mounting port, both of which are connected to the receiving cavity;
[0008] The cavity contains a first sealing ring and a PCB module. The first sealing ring is located on the side of the PCB module near the detection port. The PCB module includes a PCB board and a pressure sensor. The PCB board and the pressure sensor are integrated into one package or the pressure sensor is surface-mounted on the PCB board. The pressure sensor corresponds to the detection port.
[0009] The cover assembly fits onto the mounting port.
[0010] As a preferred embodiment of the present invention, the cover assembly includes a locking member configured to fix the PCB module within the receiving cavity.
[0011] As a preferred embodiment of this utility model, the cover assembly further includes a cover plate, which covers the mounting opening.
[0012] As a preferred embodiment of this utility model, the locking element is a snap ring or a threaded element.
[0013] As a preferred embodiment of this utility model, the locking element is a snap ring, and the cover assembly also includes a washer located between the locking element and the PCB module. The washer is configured to prevent the snap ring from contacting the components on the PCB board.
[0014] As a preferred embodiment of this utility model, a connector is also encapsulated on the PCB board. The connector is located on the side of the PCB board near the mounting port. A connecting hole is provided on the cover assembly, and the connection port of the connector corresponds to the connecting hole.
[0015] As a preferred embodiment of this utility model, the outer shell includes an outer shell body and a detection end, with a receiving cavity, a detection port and an installation port disposed on the outer shell body, and the detection port being opened on the detection end.
[0016] As a preferred embodiment of this utility model, the outer diameter of the detection end is smaller than the outer diameter of the outer shell body, and a second sealing ring is fitted on the side of the detection end close to the outer shell body.
[0017] As a preferred embodiment of this utility model, a sealing platform is provided in the accommodating cavity, a first sealing ring is embedded in the sealing platform or sealing groove, and the PCB module is pressed on the first sealing ring.
[0018] As a preferred embodiment of this utility model, the pressure sensor includes a gauge pressure sensor and an absolute pressure sensor.
[0019] As a preferred embodiment of this utility model, when the pressure sensor is a gauge pressure sensor, the gauge pressure sensor is set on the side of the PCB board away from the detection port, and a through hole is opened on the PCB board. The air hole of the gauge pressure sensor corresponds to the through hole, and the air hole is connected to the detection port through the through hole.
[0020] As a preferred embodiment of this utility model, when the pressure sensor is an absolute pressure sensor, the pressure sensor is set on the side of the PCB board close to the detection port, and the air hole of the absolute pressure sensor faces the detection port.
[0021] Compared with the prior art, the present invention has at least the following beneficial effects:
[0022] This patented pressure sensor module features a mature and stable packaging process at a low price. The pressure sensors can be automatically calibrated and assembled in batches using simple and convenient tools, resulting in high assembly efficiency and yield. The PCB module has good airtightness and can accommodate both gauge and absolute pressure sensors.
[0023] First, calibrate and standardize the pressure sensors or PCB modules in batches, and then select good products for module assembly to avoid waste.
[0024] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0025] To more clearly illustrate the technical solution of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0026] Figure 1 This is a cross-sectional perspective view of one embodiment of the pressure sensor module of this utility model;
[0027] Figure 2 This is an exploded structural diagram of one embodiment of the pressure sensor module of this utility model;
[0028] Figure 3 This is a cross-sectional perspective view of another embodiment of the pressure sensor module of this utility model;
[0029] Figure 4 This is an exploded structural diagram of another embodiment of the pressure sensor module of this utility model;
[0030] Figure 5 This is a cross-sectional perspective view of another embodiment of the pressure sensor module of this utility model;
[0031] Figure 6 This is an exploded structural diagram of another embodiment of the pressure sensor module of this utility model.
[0032] Among them, 1-outer shell, 2-PCB module, 3-covering assembly, 11-accommodating cavity, 12-detection port, 13-mounting port, 14-first sealing ring, 15-outer shell body, 16-detection end, 17-second sealing ring, 18-sealing groove, 21-PCB board, 221-gauge pressure sensor, 222-absolute pressure sensor, 22-pressure sensor, 23-connector, 31-locking component, 32-washer, 33-cover plate, 34-connecting hole. Detailed Implementation
[0033] The embodiments of this utility model are described in detail below, providing a comprehensive overview and complete description of their technical solutions. It is clear that the described embodiments are merely a portion, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.
[0034] Please see Figures 1-6 ,like Figure 1-6 As shown, the pressure sensor module provided by this utility model includes a housing 1, a PCB module 2, and a cover assembly 3;
[0035] The outer casing 1 has a receiving cavity 11, a detection port 12 and a mounting port 13, and the detection port 12 and the mounting port 13 are both connected to the receiving cavity 11;
[0036] The cavity 11 contains a first sealing ring 14 and a PCB module 2. The first sealing ring 14 is located on the side of the PCB module 2 near the detection port 12. The PCB module 2 includes a PCB board 21 and a pressure sensor 22. The PCB board 21 and the pressure sensor 22 are integrally packaged or the pressure sensor 22 is surface-mount packaged on the PCB board 21. The pressure sensor 22 corresponds to the detection port 12. The cover assembly 3 covers the mounting port 13.
[0037] This patented pressure sensor module features a mature and stable packaging process at a low price. The pressure sensors can be automatically calibrated and assembled in batches using simple and convenient tools, resulting in high assembly efficiency and yield. The PCB module has good airtightness and can accommodate both gauge and absolute pressure sensors.
[0038] In a preferred embodiment, the PCB module 2 is fixedly housed within the receiving cavity 11. In this example, the PCB module 2 is soldered into the receiving cavity 11 or glued into the receiving cavity 11, but this patent is not limited thereto.
[0039] Preferably, the pressure sensor is surface-mounted on the PCB board 21, and the pressure sensor is calibrated in batches before being surface-mounted and assembled; or the pressure sensor is surface-mounted and the module is assembled before the pressure sensor module is calibrated and calibrated.
[0040] In the example, the first sealing ring 14 is an O-ring.
[0041] In the example, the pressure sensor is a standard-sized pressure sensor.
[0042] In a preferred embodiment, the cover assembly 3 includes a locking member 31 configured to secure the PCB module 2 within the receiving cavity 11.
[0043] Preferably, the locking element 31 is a snap ring or a threaded element. A preferred example is... Figure 1-6 As shown, the locking member 31 is a retaining ring, and the cover assembly 3 also includes a washer 32, which is located between the locking member 31 and the PCB module 2. The washer 32 is configured to prevent the retaining ring from contacting the components on the PCB board 21. In one example, the locking member 31 is a threaded member (not shown in the figure), and the inner wall of the receiving cavity 11 near the mounting port 13 is provided with an internal thread, and the threaded member is fixedly screwed onto the internal thread.
[0044] Preferably, the cover assembly 3 further includes a cover plate 33, which covers the mounting opening 13. Of course, the cover plate 33 can be installed on the mounting opening by screwing, snap-fitting, welding, or other methods; this patent is not limited to these methods. The cover plate covers the internal structure of the outer casing, serving both aesthetic and protective purposes.
[0045] Preferably, a sealing platform 18 or a sealing groove is provided in the accommodating cavity 11, the first sealing ring 14 is embedded in the sealing platform 18 or the sealing groove, and the PCB module 2 is pressed against the first sealing ring 14.
[0046] In the example, the first sealing ring is embedded in the sealing platform, and the PCB module presses the first sealing ring tightly to form a sealing structure. The locking component locks the PCB in place through the gasket to provide a continuous force.
[0047] In a preferred embodiment, a connector 23 is also encapsulated on the PCB board 21. The connector 23 is located on the side of the PCB board 21 near the mounting port 13. A connecting hole 34 is provided on the cover assembly 3, and the connection port of the connector 23 corresponds to the connecting hole 34.
[0048] In a preferred embodiment, the outer casing 1 includes a casing body 15 and a detection end 16. A receiving cavity 11, a detection port 12, and a mounting port 13 are disposed on the casing body 15, and the detection port 12 is located on the detection end 16. In this example, the outer diameter of the detection end 16 is smaller than the outer diameter of the casing body 15. Preferably, a second sealing ring 17 is fitted onto the side of the detection end 16 closest to the casing body 15. In this example, the second sealing ring is an O-ring.
[0049] Preferably, the surface of the detection end 16 is provided with external threads or snaps, etc. The external threads or snaps on the detection end facilitate the installation of the pressure sensor module in the measurement environment. A second sealing ring is fitted onto the detection end to provide a seal.
[0050] In a preferred embodiment, the pressure sensor 22 includes a gauge pressure sensor 221 and an absolute pressure sensor 222.
[0051] One example, such as Figure 1-4As shown, the pressure sensor 22 is a gauge pressure sensor 221. The gauge pressure sensor 221 is located on the side of the PCB board 21 away from the detection port 12. A through hole is provided on the PCB board 21. The air hole of the gauge pressure sensor 221 corresponds to the through hole. The air hole is connected to the detection port 12 through the through hole.
[0052] One example, such as Figure 5-6 As shown, the pressure sensor 22 is an absolute pressure sensor 222. The pressure sensor 22 is located on the side of the PCB board 21 near the detection port 12, and the air hole of the absolute pressure sensor 222 faces the detection port 12.
[0053] Unless otherwise specified, the features described in the above embodiments or embodiments can be combined with each other in any way.
[0054] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.
[0055] Although embodiments of the present invention have been shown and described above, it is understood that these embodiments are exemplary, and it will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the present invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. A pressure sensor module, characterized in that, It includes a housing (1), a PCB module (2), and a cover assembly (3); The outer shell (1) has a receiving cavity, a detection port (12) and a mounting port (13), and the detection port (12) and the mounting port (13) are both connected to the receiving cavity; The cavity contains a first sealing ring (14) and a PCB module (2). The first sealing ring (14) is located on the side of the PCB module (2) near the detection port (12). The PCB module (2) includes a PCB board (21) and a pressure sensor (22). The PCB board (21) and the pressure sensor (22) are integrally packaged or the pressure sensor (22) is surface-mount packaged on the PCB board (21). The pressure sensor (22) corresponds to the detection port (12). The cover assembly (3) covers the mounting port (13).
2. The pressure sensor module according to claim 1, characterized in that, The cover assembly (3) includes a locking element (31) configured to secure the PCB module (2) within the receiving cavity.
3. The pressure sensor module according to claim 1, characterized in that, The cover assembly (3) also includes a cover plate (33) which covers the mounting port (13).
4. The pressure sensor module according to claim 1, characterized in that, The locking element (31) is a snap ring or a threaded part.
5. The pressure sensor module according to claim 1, characterized in that, The locking element (31) is a snap ring, and the cover assembly (3) also includes a washer (32) located between the locking element (31) and the PCB module (2). The washer (32) is configured to prevent the snap ring from contacting the components on the PCB board (21).
6. The pressure sensor module according to claim 1, characterized in that, A connector (23) is also encapsulated on the PCB board (21). The connector (23) is located on the side of the PCB board (21) near the mounting port (13). A connecting hole (34) is provided on the cover assembly (3). The connection port of the connector (23) corresponds to the connecting hole (34).
7. The pressure sensor module according to claim 1, characterized in that, The outer casing (1) includes an outer casing body (15) and a detection end (16). The accommodating cavity, the detection port (12) and the mounting port (13) are disposed on the outer casing body (15), and the detection port (12) is opened on the detection end (16).
8. The pressure sensor module according to claim 7, characterized in that, The outer diameter of the detection end (16) is smaller than the outer diameter of the outer shell body (15), and a second sealing ring (17) is fitted on the side of the detection end (16) close to the outer shell body (15).
9. The pressure sensor module according to claim 1, characterized in that, A sealing platform (18) or sealing groove is provided in the accommodating cavity, and the first sealing ring (14) is embedded in the sealing platform (18) or sealing groove, and the PCB module (2) is pressed on the first sealing ring (14).
10. The pressure sensor module according to claim 1, characterized in that, The pressure sensor (22) includes a gauge pressure sensor (221) and an absolute pressure sensor (222); When the pressure sensor (22) is a gauge pressure sensor (221), the gauge pressure sensor (221) is located on the side of the PCB board (21) away from the detection port (12). A through hole is provided on the PCB board (21), and the air hole of the gauge pressure sensor (221) corresponds to the through hole. The air hole is connected to the detection port (12) through the through hole; or When the pressure sensor (22) is an absolute pressure sensor (222), the pressure sensor (22) is set on the side of the PCB board (21) close to the detection port (12), and the air hole of the absolute pressure sensor (222) faces the detection port (12).