A semi-automatic visual inspection machine

Abstract

The utility model provides a kind of semi-automatic visual inspection machine, including detection table, the side of detection table is sequentially equipped with first material table, first buffer table and second buffer table, and the first material table is used for wafer's loading and unloading;The first buffer table is used to place the wafer to be detected;The second buffer table is used to place the wafer after detection;Upper loading platform is side by side with the first buffer table and can move back and forth between the first buffer table and detection table, for the wafer to be detected is uploaded to the detection table piece by piece;Lower loading platform is side by side with the second buffer table and can move back and forth between the second buffer table and detection table, for the wafer after detection is downloaded to the second buffer table piece by piece.The utility model has the beneficial effect of improving detection efficiency, meeting production rhythm demand, ensuring that detection result is traceable, improving the accuracy of detection result record, can realize original input and original output and two working modes of shunting unloading, adapt to different production scene demand.

Description

Technical Field

[0001] This utility model belongs to the technical field of wafer visual inspection machine, and in particular relates to a semi-automatic visual inspection machine. Background Technology

[0002] After wafer processing, visual inspection is required to check for particles, scratches, contamination, and other defects on the wafer surface. Manual visual inspection via a transmission system is cumbersome, inefficient, leads to disorganized data management, and makes result traceability difficult. Due to process requirements, wafers sometimes need to be returned to their original cassette after inspection; other times, they need to be separated, with qualified and defective wafers placed in different cassettes for separate unloading. Existing visual inspection machines typically cannot accommodate both operating modes. Utility Model Content

[0003] To address the aforementioned technical problems, this utility model provides a semi-automatic visual inspection machine, which effectively solves the technical problems of cumbersome wafer visual inspection operations, low inspection efficiency, lack of traceability of inspection results, and incompatibility with multiple working modes, thus overcoming the shortcomings of existing technologies.

[0004] The technical solution adopted by this utility model is: a semi-automatic visual inspection machine, including an inspection table, characterized in that: a first material platform, a first buffer platform, and a second buffer platform are sequentially arranged on one side of the inspection table.

[0005] The first loading platform is used for loading and unloading wafers;

[0006] The first buffer stage is used to place the wafer to be tested;

[0007] The second buffer stage is used to place the tested wafers;

[0008] An upload stage, arranged side by side with the first buffer stage, can move back and forth between the first buffer stage and the detection stage, and is used to upload the wafers to be detected one by one to the detection stage;

[0009] The download station, which is set up side by side with the second buffer station, can move back and forth between the second buffer station and the testing station, and is used to download the tested wafers one by one to the second buffer station.

[0010] Furthermore, it also includes a second feed station, which is located on the side of the second buffer station away from the first buffer station, for feeding wafers.

[0011] Furthermore, the first material stage, the first buffer stage, the second buffer stage, the second material stage, the loading stage, and the download stage are all provided with placement grooves, which allow the silicon wafers to be placed vertically.

[0012] Furthermore, both the first and second material platforms include a fixed support and a movable support. The movable support is located outside the fixed support and can move up and down. The fixed support is provided with the placement groove for placing wafers, and the movable support is used to place wafer cassettes.

[0013] Furthermore, the movable tray is equipped with a reading module for identifying the coded information on the wafer cassette.

[0014] Furthermore, it also includes a clamping robot arm, which is disposed above the first material station, the first buffer station, the second buffer station, and the second material station, for placing the wafer on the first material station onto the first buffer station or placing the wafer on the second buffer station onto the first material station or the second material station.

[0015] Furthermore, the gripping robot is equipped with multiple grippers arranged along its height, and each gripper has multiple gripping grooves arranged side by side, which can grip multiple wafers simultaneously.

[0016] Furthermore, a single-wafer tray robot is provided on the opposite side of the first cache station and the opposite side of the second cache station, for placing the wafers on the first cache station one by one onto the loading station or placing the wafers on the download station onto the second cache station.

[0017] Furthermore, both the loading platform and the downloading platform are equipped with driving devices, which are located between the first buffer platform and the detection platform, and between the second buffer platform and the detection platform.

[0018] Furthermore, it also includes an operation screen, set on the testing platform, for recording testing results.

[0019] The advantages and positive effects of this utility model are: it realizes segmented transfer and wafer-by-wafer loading and inspection, improves inspection efficiency, meets production cycle requirements, records the inspection results of each wafer in real time, ensures traceability of inspection results, improves the accuracy of inspection result recording, can realize two working modes of original in-original out and diversion unloading, adapts to the needs of different production scenarios, has a simple structure and is easy to operate. Attached Figure Description

[0020] The above and other objects, features, and advantages of this utility model will become more apparent from the more detailed description of the embodiments thereof in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this utility model and form part of the specification. They are used together with the embodiments of this utility model to explain the utility model and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same parts or steps.

[0021] Figure 1This is an overall schematic diagram of a semi-automatic visual inspection machine according to an embodiment of this utility model.

[0022] Figure 2 This is a schematic diagram of a semi-automatic visual inspection machine removing partitions according to an embodiment of this utility model.

[0023] Figure 3 This is a schematic diagram of a semi-automatic visual inspection machine according to an embodiment of the present invention, showing the removal of the inspection table and the clamping robot.

[0024] Figure 4 This is another schematic diagram of a semi-automatic visual inspection machine according to an embodiment of the present invention, which removes the inspection table and the clamping robot.

[0025] Figure 5 This is a side view of a semi-automatic visual inspection machine according to an embodiment of the present invention.

[0026] In the picture:

[0027] 10. Testing table; 11. Operation screen; 12. Partition.

[0028] 13. Ventilation hole 20, First material platform 21. Fixed support platform

[0029] 211. Placement groove; 22. Movable support platform; 23. Support plate

[0030] 24. Support frame; 25. First drive device; 26. Guide rod

[0031] 27. Sleeve; 28. Positioning protrusion; 29. ​​Reading module

[0032] 30, First Cache Stage; 40, Second Cache Stage; 50, Upload Stage

[0033] 51. Linear module; 60. Downloading platform; 70. Second material platform

[0034] 80. Gripping robot arm; 81. First gripping robot arm; 811. Gripping arm

[0035] 812, Second drive unit; 813, Third drive unit; 814, Fourth drive unit

[0036] 815, gripper; 816, clamping groove; 90, single-piece support robot.

[0037] 91. Support platform; 92. Support arm; 93. Fifth drive unit

[0038] 94. Sixth drive unit Detailed Implementation

[0039] This utility model provides a semi-automatic visual inspection machine. The embodiments of this utility model will be described below with reference to the accompanying drawings.

[0040] In the description of the embodiments of this utility model, it should be understood that the terms "top," "bottom," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, it should be noted that unless otherwise expressly specified and limited, the terms "set" and "connected" should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can refer to a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication of two elements. Those skilled in the art can understand the specific meaning of the above terms in this utility model through specific circumstances.

[0041] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown in the figure, a semi-automatic visual inspection machine according to an embodiment of the present invention includes an inspection table 10. A first material platform 20, a first buffer platform 30, and a second buffer platform 40 are sequentially arranged on one side of the inspection table 10, side by side. The first material platform 20, the first buffer platform 30, and the second buffer platform 40 are arranged side by side. The first material platform 20 is used for loading and unloading wafers, enabling "original in, original out," meaning that wafers placed in a wafer cassette are loaded onto the first material platform 20, inspected, and then returned to the original cassette for unloading onto the first material platform 20. The first buffer platform 30 is used to hold wafers to be inspected. Since multiple wafers are placed in a wafer cassette, some wafers can be removed from the cassette in advance and moved to the first buffer platform 30 for buffering before inspection, thereby improving inspection efficiency. The loading platform 50 is arranged side by side with the first buffer platform 30 and can move back and forth between the first buffer platform 30 and the inspection table 10, used to load the wafers to be inspected onto the inspection table 10 one by one. The download stage 60 is arranged side by side with the second buffer stage 40 and can move back and forth between the second buffer stage 40 and the inspection stage 10. It is used to download the inspected wafers one by one to the second buffer stage 40. The upload stage 50 and the download stage 60 have the same structure.

[0042] Preferably, a second feed stage 70 is also included, located on the side of the second buffer stage 40 away from the first buffer stage 30, for wafer unloading. When wafers need to be shunted, i.e., qualified wafers and defective wafers are placed in different wafer cassettes for separate unloading, the qualified wafers that have completed inspection can be moved to their original wafer cassettes on the first feed stage 20 for unloading, while the defective wafers can be moved to another wafer cassette on the second feed stage 70 for unloading, thus separating the qualified and defective wafers for unloading. The second feed stage 70 has the same structure as the first feed stage 20.

[0043] In this embodiment, two first buffer stations 30 and two second buffer stations 40 are included, both arranged side-by-side with the first material station 20 and the second material station 70. By setting up two first buffer stations 30, when the loading station 50 loads a wafer from one first buffer station 30, a wafer can be placed in the other first buffer station 30 beforehand. This allows for the immediate loading and testing of wafers from the other first buffer station 30 after the wafers on one first buffer station 30 have been tested, eliminating waiting time and improving testing efficiency. By setting up two second buffer stations 40, when splitting the unloading process is required, one second buffer station 40 is used to place qualified wafers, and the other second buffer station 40 is used to place defective wafers.

[0044] Specifically, to facilitate wafer placement, the first feed stage 20, the first buffer stage 30, the second buffer stage 40, the second feed stage 70, the loading stage 50, and the unloading stage 60 are all equipped with placement grooves 211, allowing the silicon wafers to be placed vertically. The first feed stage 20, the first buffer stage 30, the second buffer stage 40, and the second feed stage 70 each have multiple rows of placement grooves 211, arranged along the circumference of the wafer. Each row of placement grooves 211 has multiple placement grooves 211 arranged side-by-side, allowing multiple wafers to be placed vertically. The loading stage 50 and the unloading stage 60 are used for loading and unloading single wafers; therefore, each row of placement grooves 211 only needs to contain one placement groove 211.

[0045] Specifically, such as Figure 3 and Figure 4 Each first buffer station 30 is equipped with an upload station 50, and each second buffer station 40 is equipped with a download station 60. The upload stations 50 are located on opposite sides of the two first buffer stations 30, and the download stations 60 are located on opposite sides of the two second buffer stations 40. Both the upload station 50 and the download station 60 have a linear module 51 at their bottom, connected to the slide of the linear module 51 by a connecting bracket. The linear module 51 of the upload station 50 is fixed between the first buffer station 30 and the detection station 10, and the linear module 51 of the download station 60 is located between the second buffer station 40 and the detection station 10. The linear module 51 is fixed to a mounting bracket, which is fixed to the overall frame. The linear module 51 can drive the upload station or download station to move back and forth.

[0046] Specifically, such as Figure 5 As shown, both the first material platform 20 and the second material platform 70 include a fixed support platform 21 and a movable support platform 22. The movable support platform 22 is located outside the fixed support platform 21 and can move up and down. The fixed support platform 21 is provided with a placement groove 211 for placing wafers, and the movable support platform 22 is used to place wafer boxes.

[0047] A horizontal support plate 23 is installed at the bottom of the fixed support platform 21, and the support plate 23 is fixedly connected to the overall frame. A support frame 24 is vertically fixed on the support plate 23, and the fixed support platform 21 is fixed on the top of the support frame 24. The fixed support platform has a placement groove 211. A movable support platform 22 is sleeved on the outside of the fixed support platform 21, and the fixed support platform 21 and the movable support platform 22 are clearance-fitted. A first drive device 25 is fixed on the support plate 23. The specific form is not limited and can be a cylinder, hydraulic cylinder, or electric telescopic rod. The movable end of the first drive device 25 is fixedly connected to the bottom of the movable support platform 22, driving the movable support platform 22 to move up and down. Preferably, vertical guide rods 26 are fixed at the four corners of the bottom of the movable support platform 22. The bottom of the guide rods 26 passes through the support plate 23 and is connected to a connecting plate. A sleeve 27 is fixed on the support plate 23 relative to the guide rods 26, and the guide rods 26 and the sleeve 27 are clearance-fitted. The fixed tray 21 is equipped with positioning protrusions 28, which are used for positioning the wafer cassette when it is placed on the fixed tray 21. When the wafer cassette loaded with wafers is placed on the movable tray 22, the first drive device 25 drives the wafer cassette downward through the movable tray 22, so that the wafers inside the wafer cassette are placed vertically in the placement grooves 211 on the fixed tray 9121. To avoid the wafer cassette affecting the movement of the wafers, the wafer cassette needs to be moved to the bottom of the fixed tray 21. After all the wafers have been inspected and placed on the fixed tray 21, the first drive device 25 drives the wafer cassette upward through the movable tray 22, so that the wafers are placed inside the wafer cassette, thereby achieving original inlet and original outlet.

[0048] Optionally, to read the encoded information on the wafer cassette and record the inspection results of each wafer for traceability, a reading module 29 is fixed at the position of the movable tray 22 relative to the wafer cassette code for scanning the wafer cassette code. In this embodiment, the reading module 29 is configured as RFID.

[0049] Specifically, such as Figure 2As shown, the system also includes a clamping robot 80, positioned above the first feed platform 20, the first buffer platform 30, the second buffer platform 40, and the second feed platform 70. This robot is used to place wafers from the first feed platform 20 onto the first buffer platform 30 and wafers from the second buffer platform 40 onto either the first feed platform 20 or the second feed platform 70. In this embodiment, a first clamping robot 81 and a second clamping robot 82 are provided, both of which are connected to the overall frame. The first clamping robot 81 can move between the first feed platform 20, the first buffer platform 30, and the second buffer platform 40. It is used to place wafers from the first feed platform 20 onto the first buffer platform 30, or, in the original feed-to-original-output mode, place all wafers from the second buffer platform 40 onto the first feed platform 20, and in the split-feed mode, place qualified wafers from the second buffer platform 40 onto the first feed platform 20. The second gripping robot 82 can move between the second buffer platform 40 and the second material platform 70. In the material distribution and unloading working mode, it is used to place the problem piece on the second buffer platform 40 onto the second material platform 70.

[0050] Both the first gripping robot 81 and the second gripping robot 82 include gripping arms 811 arranged opposite each other. The gripping direction of the gripping arms 811 is perpendicular to the parallel direction of the first material table 20, the first buffer table 30, and the second buffer table 40. A second drive device 812 is connected to the gripping arm 811 to drive the opening and closing of the gripping arm 811. The second drive device 812 is connected to a third drive device 813, which can drive the second drive device 812 and the gripping arm 811 to move up and down. The third drive device 813 is mounted on a fourth drive device 814, which is mounted on the overall frame and can drive the third drive device 813 to move along the parallel direction of the first material table 20, the first buffer table 30, and the second buffer table 40. The specific forms of the second drive device 812, the third drive device 813, and the fourth drive device 814 are not limited. In this embodiment, the second drive device 812 and the third drive device 813 are configured as cylinders, and the fourth drive device 814 is configured as a linear module, all of which are existing technologies. Their specific structures and connection methods will not be described in detail here. The linear module of the first gripping robot 81 has a longer stroke than the linear module of the second gripping robot 82.

[0051] Preferably, the gripping robot 80 has multiple grippers 815 arranged along its height, and each gripper 815 has multiple gripping grooves 816 arranged side by side, which can grip multiple wafers simultaneously. In this embodiment, the bottom of the vertically arranged gripping arm 811 has two grippers 815, one above the other, and each gripper 815 has five gripping grooves 816 arranged side by side, which can grip five wafers at a time. On the corresponding first buffer stage 30 and second buffer stage 40, each row of placement grooves 211 includes five placement grooves 211, which can hold five wafers at the same time. By setting two grippers 815, the contact area with the wafer is increased, making the gripping more secure. In order to avoid contaminating the wafer, the contact surfaces of the grippers 815, the fixed support stage 21, the first buffer stage 30, the second buffer stage 40, the loading stage 50 and the unloading stage 60 with the wafer are all made of non-metallic material. The specific material is not limited, as long as it does not affect the wafer performance.

[0052] Specifically, such as Figure 3 and Figure 4 As shown, a single-wafer tray robot 90 is provided on the opposite side of the first buffer station 30 and the opposite side of the second buffer station 40, for placing the wafers on the first buffer station 30 onto the loading station 50 one by one or placing the wafers on the download station 60 onto the second buffer station 40. Each first buffer station 30 and each second buffer station 40 is equipped with a single-wafer tray robot 90.

[0053] The single-piece support platform robot 90 includes two opposing support platforms 91, each with a placement groove 211. The line connecting the two support platforms 91 is perpendicular to the parallel direction of the first buffer platform 30, the second buffer platform 40, the loading platform 50, and the unloading platform 60. A support arm 92 is fixed to the bottom of each support platform 91, and a fifth drive device 93 is mounted on the support arm 92 to move the support arm 92 and the support platform 91 vertically. The fifth drive device 93 is mounted on a sixth drive device 94, which can drive the fifth drive device 93 to move horizontally along the parallel direction of the first buffer platform 30, the second buffer platform 40, the loading platform 50, and the unloading platform 60. The sixth drive device 94 is fixed to the overall frame. The specific forms of the fifth drive device 93 and the sixth drive device 94 are not limited. In this embodiment, the fifth drive device 93 is a cylinder, and the sixth drive device 94 is a linear module; both are existing technologies, and their specific structures and connection methods are not described in detail here.

[0054] Specifically, such as Figure 1As shown, it also includes an operation screen 11, which is disposed on the testing station 10 and used to record testing results. In this embodiment, a partition 12 is fixed to the side of the testing station 10 near the first buffer station 30 and the second buffer station 40, and the operation screen 11 is fixedly mounted on the partition 12. Elongated holes are formed on the partition 12 and the testing station 10 at positions opposite to the loading station 50 and the download station 60. The elongated holes on the partition 12 are used for the wafer to pass through, and the elongated holes on the testing station 10 are used for the loading station 50 and the download station 60 to pass through, allowing the wafer to smoothly flow between the first buffer station 30 and the testing station 10, as well as between the testing station 10 and the second buffer station 40.

[0055] Optionally, the testing stage 10 is provided with vent holes 13. In order to prevent wafer contamination, an external air blowing device is usually installed above the testing stage 10 to blow air into the testing stage 10 from top to bottom. In order to facilitate gas flow, vent holes 13 are provided on both sides of the testing stage 10.

[0056] Workflow:

[0057] Original input, original output working mode:

[0058] An external handling device places the wafer cassette loaded with wafers onto the movable tray 22 of the first material station 20. The reading module 29 reads the coded information on the wafer cassette and uploads it to the control system. The first driving device 25 moves the wafer cassette downwards to the bottom of the fixed tray 21 via the movable tray 22, and the wafers inside the wafer cassette are placed vertically in the placement grooves 211 on the fixed tray 21. The first gripping robot 81 sequentially places five wafers from the fixed tray 21 onto one of the first buffer stations 30. Since there are two first buffer stations 30, when inspecting a wafer on one of the first buffer stations 30, the first gripping robot 81 can grip a wafer on the other first buffer station 30, allowing the wafer to enter the inspection state in advance. The single-wafer tray robot 90 places the wafers from the first buffer station 30 onto the loading stage 50 one by one, and the loading stage 50 moves the single wafer to the inspection stage 10. The inspector uses a suction pen to pick up the wafers from the loading stage 50, performs visual inspection, and records the inspection results for each wafer using the operation screen 11. The operation screen 11 is connected to the control system, which automatically and continuously encodes all wafers in the wafer cassette according to the wafer cassette coding information to ensure the uniqueness of the code. The download stage 60 is moved to the inspection stage 10 in advance, and the inspected wafers are placed on the download stage 60. The download stage 60 is then moved to a parallel position with the second buffer stage 40, and the single-wafer tray robot 90 places the wafers from the download stage 60 onto the second buffer stage 40. When one of the second buffer stages 40 is full of wafers, the first clamping robot 81 clamps the wafers from the second buffer stage 40 onto the fixed tray 21 of the first material stage 20 and places them in their original positions. After all wafers have been inspected and reset to their original positions on the fixed tray 21, the movable tray 22 of the first material station 20 moves upward to place the wafers into the wafer box, and then unloads them, achieving original inlet and original outlet.

[0059] Diversion and unloading working mode:

[0060] An external handling device places the wafer cassette loaded with wafers onto the movable tray 22 of the first material station 20. The reading module 29 reads the coded information on the wafer cassette and uploads it to the control system. The first driving device 25 moves the wafer cassette downwards to the bottom of the fixed tray 21 via the movable tray 22, and the wafers inside the wafer cassette are placed vertically in the placement grooves 211 on the fixed tray 21. The first gripping robot 81 sequentially places five wafers from the fixed tray 21 onto one of the first buffer stations 30. Since there are two first buffer stations 30, when inspecting a wafer on one of the first buffer stations 30, the first gripping robot 81 can grip a wafer on the other first buffer station 30, allowing the wafer to enter the inspection state in advance. The single-wafer tray robot 90 places the wafers from the first buffer station 30 onto the loading stage 50 one by one, and the loading stage 50 moves the single wafer to the inspection stage 10. Inspection personnel use a suction pen to pick up wafers from the loading stage 50, inspect them according to the visual inspection process, and record the inspection results of each wafer using the operation screen 11. The operation screen 11 is connected to the control system, which automatically encodes all wafers in the wafer cassette according to the wafer cassette coding information. Due to the split loading process, qualified wafers and defective wafers are placed in different wafer cassettes, and qualified wafers and defective wafers are coded separately to ensure the uniqueness of the codes. When a wafer is qualified, the download stage 60 corresponding to the second buffer stage 40 where qualified wafers are placed moves to the inspection stage 10, moving the qualified wafer to the side-by-side direction of the second buffer stage 40. The single-wafer tray robot 90 corresponding to the qualified wafer places the qualified wafer from the download stage 60 onto the second buffer stage 40 used to place qualified wafers. When a wafer is defective, the download station 60 corresponding to the second buffer station 40 for placing defective wafers moves to the inspection station 10, moving the defective wafer to a side-by-side position on the second buffer station 40. The single-wafer support robot 90 corresponding to the defective wafer places the defective wafer from the download station 60 onto the second buffer station 40 for placing defective wafers. When the second buffer station 40 for placing qualified wafers is full, the first clamping robot 81 clamps the qualified wafers onto the fixed support 21 of the first material station 20 and places them sequentially. When the second buffer station 40 for placing defective wafers is full, the second clamping robot 82 clamps the defective wafers onto the fixed support 21 of the second material station 70 and places them sequentially. After all wafers have been inspected, qualified wafers are placed sequentially on the fixed tray 21 of the first material station 20. The movable tray 22 of the first material station 20 moves upward to place the qualified wafers into the original wafer cassette, and then the wafers are unloaded. Defective wafers are placed sequentially on the fixed tray 21 of the second material station 70. The movable tray 22 of the second material station 70 moves upward to place the defective wafers into another wafer cassette, thus achieving the separation and unloading of qualified and defective wafers.

[0061] The advantages and positive effects of this utility model are:

[0062] 1. By setting up multiple material stations, the wafers are transported in segments. Compared with the traditional continuous transport, by optimizing the action sequence of the gripping robot, the wafers can be moved while the pre-positioning of each material station is completed, without affecting the normal inspection process, thus improving inspection efficiency and meeting production cycle requirements.

[0063] 2. Adopting a "one wafer at a time" working mode, the inspection results of each wafer can be recorded in real time through the operation screen, and the wafer box coding information is automatically scanned and uploaded to the control system through the reading module. The control system encodes each wafer in the wafer box to ensure traceability of results.

[0064] 3. By setting up a first material platform and a second material platform, the two working modes of original inlet and remote outlet and diversion unloading can be automatically switched.

[0065] The embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. It should be noted that implementations not illustrated or described in the drawings or the main text of the specification are forms known to those skilled in the art and have not been described in detail. Furthermore, the definitions of the various components described above are not limited to the specific structures, shapes, or methods mentioned in the embodiments, and those skilled in the art can easily modify or substitute them.

[0066] The embodiments of this utility model have been described in detail above, but the content described is only a preferred embodiment of this utility model and should not be considered as limiting the scope of implementation of this utility model. All equivalent changes and improvements made in accordance with the claims of this utility model should still fall within the patent coverage of this utility model.

Claims

1. A semi-automatic visual inspection machine, comprising an inspection table, characterized in that: The detection station is provided with a first material platform, a first buffer platform, and a second buffer platform in sequence on one side. The first loading platform is used for loading and unloading wafers; The first buffer stage is used to place the wafer to be tested; The second buffer stage is used to place the tested wafers; An upload stage, arranged side by side with the first buffer stage, can move back and forth between the first buffer stage and the detection stage, and is used to upload the wafers to be detected one by one to the detection stage; The download station, which is set up side by side with the second buffer station, can move back and forth between the second buffer station and the testing station, and is used to download the tested wafers one by one to the second buffer station.

2. The semi-automatic visual inspection machine according to claim 1, characterized in that: It also includes a second feed station, which is located on the side of the second buffer station away from the first buffer station, for feeding wafers.

3. A semi-automatic visual inspection machine according to claim 2, characterized in that: The first material stage, the first buffer stage, the second buffer stage, the second material stage, the loading stage, and the download stage are all provided with placement grooves, which allow the silicon wafers to be placed vertically.

4. A semi-automatic visual inspection machine according to claim 3, characterized in that: Both the first and second material platforms include a fixed support and a movable support. The movable support is located outside the fixed support and can move up and down. The fixed support is provided with a placement groove for placing wafers, and the movable support is used to place wafer cassettes.

5. A semi-automatic visual inspection machine according to claim 4, characterized in that: The movable tray is equipped with a reading module for identifying the coded information on the wafer cassette.

6. A semi-automatic visual inspection machine according to any one of claims 3-5, characterized in that: It also includes a gripping robot arm, which is positioned above the first feed station, the first buffer station, the second buffer station, and the second feed station, for placing the wafer on the first feed station onto the first buffer station or placing the wafer on the second buffer station onto the first feed station or the second feed station.

7. A semi-automatic visual inspection machine according to claim 6, characterized in that: The gripping robot is equipped with multiple grippers arranged along its height, and each gripper has multiple gripping grooves arranged side by side, which can grip multiple wafers at the same time.

8. A semi-automatic visual inspection machine according to any one of claims 1-5 and 7, characterized in that: Both the first and second buffer stations are equipped with single-wafer tray robots on opposite sides, used to place wafers from the first buffer station onto the loading platform or to place wafers from the download platform onto the second buffer station.

9. A semi-automatic visual inspection machine according to any one of claims 1-5 and 7, characterized in that: Both the upload station and the download station are equipped with driving devices, which are located between the first buffer station and the detection station, and between the second buffer station and the detection station.

10. A semi-automatic visual inspection machine according to any one of claims 1-5 and 7, characterized in that: It also includes an operation screen, which is set on the testing platform, for recording testing results.

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