A tool for detecting defects in an insulation layer of a copper bar based on simulated pressure working conditions

Abstract

The utility model relates to a kind of tool based on copper bar insulation layer defect detection simulation pressure working condition, including rotating mechanism, top plate, bottom plate, and upper base plate and lower base plate are equipped with between top plate and bottom plate by guide pillar, the bottom of upper base plate is fixed with insulating upper pressing plate, the top of lower base plate is installed with the insulating lower pressing plate matched with insulating upper pressing plate, the top of insulating lower pressing plate is clamped with the purple copper module group for installing copper bar, and the outside of purple copper module group is equipped with binding post;Pressure sensor is installed between lower base plate and bottom plate.The scheme is mainly simulated when the measured copper bar is applied in energy storage battery pack or power battery pack and is subjected to different extrusion forces, whether the surface insulation layer of the measured copper bar can meet the insulation withstand voltage design requirement is detected, the scheme is provided with purple copper module group, the contact surface with copper bar insulation layer is increased, so that test voltage distribution is more uniform, the bad point detection rate of the insulation layer of copper bar is improved, and the copper bar with defects is reduced to flow and affect the electrical safety of battery pack.

Description

Technical Field

[0001] This utility model relates to the field of battery testing technology, and in particular to a tooling for simulating pressure conditions based on copper busbar insulation layer defect detection. Background Technology

[0002] In the detection of defects in the copper busbar insulation layer inside batteries, operators directly clamp the electrodes of the withstand voltage tester between the exposed end of the copper busbar and the surface of the insulation layer. This manual, direct retrieval method suffers from unstable electrode contact and uneven test voltage distribution. While existing metal clamps can be used to fix the copper busbar, parallel capacitance can easily form when the metal clamps contact the insulation layer, leading to misjudgments of leakage current. Furthermore, the direct pressure of the metal clamps on the insulation layer causes mechanical damage to the copper busbar, failing to simulate the mechanical stress state during actual assembly. Utility Model Content

[0003] The purpose of this invention is to provide a tooling for simulating pressure conditions based on copper busbar insulation layer defect detection, so as to solve the problems encountered in the above-mentioned background technology.

[0004] To achieve the above objectives, the technical solution of this utility model is as follows:

[0005] A fixture for simulating pressure conditions based on copper busbar insulation layer defect detection includes a rotating mechanism, a top plate, and a bottom plate. An upper base plate and a lower base plate are mounted between the top plate and the bottom plate via guide posts. The rotating mechanism is movably mounted on the top plate and rotatably connected to the upper base plate. An insulating upper pressure plate is fixed to the bottom of the upper base plate, and an insulating lower pressure plate that cooperates with the insulating upper pressure plate is installed on the top of the lower base plate. A copper module assembly for mounting copper busbars is snapped onto the top of the insulating lower pressure plate, and a terminal post is provided on the outer side of the copper module assembly. A pressure sensor is installed between the lower base plate and the bottom plate.

[0006] In the above scheme, the top of the insulating lower pressure plate is provided with a U-shaped slot, and the insulating lower pressure plate is engaged with the copper module assembly through the U-shaped slot. As a preferred embodiment, the copper module assembly is provided with at least two copper blocks arranged side by side, and its top is provided with a mounting groove for installing copper busbars. Each copper block is engaged with the insulating lower pressure plate, and each copper block has a terminal block on its outer side.

[0007] In the above scheme, the bottom of the insulating upper pressure plate is provided with a boss, and a buffer layer is bonded to the bottom of the boss. The buffer layer covers the entire copper busbar during operation. As a preferred embodiment, the length of the buffer layer is the same as the length of the copper busbar, and the width of the buffer layer is the same as the width of the copper busbar.

[0008] In the above scheme, the top of the insulating lower pressure plate is provided with an elastic buffer structure that is elastically connected to the copper module assembly. As a preferred embodiment, the elastic buffer structure includes a perforated groove on the top of the insulating lower pressure plate, within which 2-4 rows of springs are arranged, with 4-8 springs per row. As another preferred embodiment, a flexible insulating layer is placed on top of all the springs.

[0009] In the above scheme, the middle part of the rotating mechanism is movably connected to the top plate, and the bottom of the rotating mechanism is rotatably connected to the upper base plate through a bearing in the bearing mounting sleeve. As a preferred embodiment, the rotating mechanism includes a screw and a handle, the top of the screw is fixedly connected to the handle, the middle part of the screw is fitted to the top plate through a screw sleeve, and the bottom of the screw is rotatably connected to the upper base plate through a bearing.

[0010] Compared with existing technologies, the advantages of this invention are as follows: By embedding a rotating mechanism through a hole in the center of the top plate, the real-time downward pressure can be adjusted via a handle to simulate the required working pressure value. A silicone rubber buffer layer covers the pressure surface of the insulating upper pressure plate to increase the contact area and improve the uniformity of pressure distribution. The copper module group consists of multiple long strips or rhomboid copper blocks connected in series, allowing for insulation withstand voltage testing by splicing and matching copper busbars of different lengths and specifications. Compared with traditional testing methods, this invention improves the detection rate of defects on the copper busbar insulation surface, enhances the consistency of testing methods for different specifications, materials, and manufacturers, and improves the reliability of evaluation and testing; it also improves the testing efficiency of the copper busbar and avoids damage to the copper busbar insulation layer, better simulating the mechanical stress state during actual assembly of the copper busbar. Attached Figure Description

[0011] The disclosure of this utility model is illustrated with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of this utility model. In the drawings, the same reference numerals are used to refer to the same parts. Wherein:

[0012] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0013] Figure 2 This is a schematic diagram of the half-section structure of this utility model;

[0014] Figure 3 This is a front view of the present invention;

[0015] Figure 4 This is a schematic diagram of the installation of the insulating lower pressure plate and the copper busbar in this utility model;

[0016] Figure 5 This is a schematic diagram of the elastic buffer structure in this utility model;

[0017] Figure 6 for Figure 5 Schematic diagram of the AA section structure.

[0018] The following numbers are used in the diagram: 1-Rotating mechanism; 11-Bearing mounting sleeve; 12-Handle; 13-Screw; 14-Screw sleeve; 2-Top plate; 21-Guide post; 3-Insulating upper pressure plate; 31-Upper base plate; 32-Buffer layer; 4-Insulating lower pressure plate; 41-Copper module assembly; 42-Lower base plate; 43-Terminal post; 44-Hollow slot; 45-Spring; 46-Flexible insulating layer; 5-Base plate; 51-Pressure sensor; 6-Copper busbar. Detailed Implementation

[0019] To make the technical means, creative features, achieved objectives and effects of this utility model easier to understand, the utility model will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of this utility model, and therefore only show the relevant components of this utility model.

[0020] Based on the technical solution of this utility model, without changing the essential spirit of this utility model, those skilled in the art can propose various interchangeable structural methods and implementation methods. Therefore, the following detailed embodiments and accompanying drawings are merely illustrative descriptions of the technical solution of this utility model, and should not be regarded as the entirety of this utility model or as a limitation or restriction of the technical solution of this utility model.

[0021] The technical solution of this utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0022] Example 1, as Figures 1 to 4 As shown, a tooling for simulating pressure conditions based on copper busbar insulation layer defect detection includes a rotating mechanism 1, a top plate 2, and a bottom plate 5. The copper busbar 6 is a component in a lithium battery, coated with insulating varnish. The insulating varnish is left unexposed at the mounting holes to connect conductive components. The areas in contact with the insulating varnish are in an insulating state and do not conduct electricity. An upper substrate 31 and a lower substrate 42 are mounted between the top plate 2 and the bottom plate 5 via guide posts 21. Guide sleeves are installed at the connections between the guide posts 21 and the upper substrate 31 and lower substrate 42 to allow for vertical sliding.

[0023] The rotating mechanism 1 is movably mounted on the top plate 2 and rotatably connected to the upper substrate 31. It is used to drive the upper substrate 31 to move downward by rotating, and after the test is completed, it reverses to drive the upper substrate 31 to move upward.

[0024] In implementation, the middle part of the rotating mechanism 1 is threadedly connected to the top plate 2, and the bottom of the rotating mechanism 1 is rotatably connected to the upper base plate 31 through a bearing in the bearing mounting sleeve 11, thereby enabling the upper base plate 31 to be pressed or lifted during rotation. The rotating mechanism 1 includes a screw 13 and a handle 12. The top of the screw 13 is fixedly connected to the handle 12, the middle part of the screw 13 is threadedly connected to the top plate 2 through a screw sleeve 14, and the bottom of the screw 13 is rotatably connected to the upper base plate 31 through a bearing.

[0025] The operator manually rotates handle 12. When rotating clockwise, it drives screw 13 to rotate within screw sleeve 14, causing upper substrate 31 to move downwards. As upper substrate 31 moves downwards, upper pressure plate 3 located below it also moves downwards, thus approaching insulating lower pressure plate 4. When rotating counterclockwise, it drives screw 13 to rotate within screw sleeve 14, causing upper substrate 31 to move upwards. As upper substrate 31 moves upwards, upper pressure plate 3 located below it also moves upwards, thus moving away from insulating lower pressure plate 4.

[0026] An insulating upper pressure plate 3 is fixed to the bottom of the upper substrate 31, and an insulating lower pressure plate 4 that mates with the insulating upper pressure plate 3 is installed on the top of the lower substrate 42. Both the insulating upper pressure plate 3 and the insulating lower pressure plate 4 are made of insulating material, such as polymer materials or various rigid plastics, which are non-conductive to facilitate pressing and fixing tests with the copper busbar 6. The overall fixture base adopts a high-strength insulating material and a multi-layer stacked fixing design. The insulating material base is cured by a high-temperature hot-pressing process to form a high-strength composite insulating structure.

[0027] The top of the insulating pressure plate 4 is snapped with a copper module assembly 41 for mounting the copper busbar 6. A terminal block 43 is provided on the outer side of the copper module assembly 41. After the copper busbar 6 is installed, the insulation layer on the copper busbar 6 prevents multiple copper blocks from conducting electricity, allowing only a single copper busbar to conduct. The terminal block 43 is used to connect an external withstand voltage testing instrument. The other end of the withstand voltage testing instrument is connected to the copper busbar 6, thereby determining the operating condition of the copper busbar 6 under pressure.

[0028] A pressure sensor 51 is installed between the lower substrate 42 and the base plate 5 to measure the pressure exerted on the copper busbar 6 by the upward movement of the upper substrate 31. This pressure can be adjusted by the rotation mechanism 1 and simulates the pressure experienced by the copper busbar 6 inside the lithium battery during operation to determine the pressure conditions of the copper busbar. The pressure data is collected by a withstand voltage testing instrument. The pressure sensor 51 is placed vertically, and a cylindrical mold can be provided to facilitate the vertical installation of the pressure sensor 51. The top of the pressure sensor 51 contacts the lower substrate 42, and the bottom of the pressure sensor 51 rests against the middle of the base plate 5.

[0029] The pressure exerted on the copper busbar 6 by the upward movement of the upper substrate 31 is measured to determine the mechanical stress applied during the clamping process of this tooling. The mechanical stress data and the withstand voltage test data are collected simultaneously to analyze the performance changes of the insulation layer of the copper busbar 6 under different stress states.

[0030] In Example 2, based on the solution of Example 1, the top of the insulating lower pressure plate 4 is provided with a U-shaped slot. The insulating lower pressure plate 4 is engaged with the copper module assembly 41 through the U-shaped slot and can be further fixed with screws. Although the insulating lower pressure plate 4 is made of insulating material, it cannot be penetrated to avoid causing conductivity. The insulating lower pressure plate 4 has an embedded U-shaped positioning groove for the copper module assembly 41 to ensure precise fit between the copper module assembly 41 and the insulating lower pressure plate 4.

[0031] The copper module assembly 41 contains at least two copper blocks arranged side by side. Each block has a mounting groove on its top for installing a copper busbar 6. A long strip of copper busbar 6 to be tested is installed in this groove. Each copper block is snapped into the insulating pressure plate 4, and each copper block has a terminal block 43 on its outer side. In implementation, the copper module assembly 41 consists of multiple independent copper blocks, each in the shape of a long strip or rhombus, with a mirror-polished surface. The copper blocks are connected in series by wires via the terminal blocks 43, forming a snap-fit ​​engagement with the U-shaped groove of the insulating pressure plate 4, ensuring the stability of the copper module assembly 41 under stress.

[0032] As a preferred embodiment, a boss with a T-shaped structure is provided at the bottom of the insulating upper pressure plate 3. A buffer layer 32 is bonded to the bottom of the boss to facilitate better downward pressure on the copper busbar 6, and the buffer layer 32 covers the entire copper busbar 6 during operation. Furthermore, the length dimension of the buffer layer 32 is the same as the length dimension of the copper busbar 6, and the width dimension of the buffer layer 32 is the same as the width dimension of the copper busbar 6. That is to say, the size of the buffer layer 32 is the same as the size of the copper busbar 6. After the copper busbar 6 is positioned in the mounting groove in the copper module group 41, the upper substrate 31, under the vertical guidance of the guide post 21, drives the insulating upper pressure plate 3 to move downward, thereby fitting against the top of the copper busbar 6.

[0033] Example 3, based on the solution of Example 1, please refer to... Figure 5 and Figure 6 The top of the insulating lower pressure plate 4 is provided with an elastic buffer structure that is elastically connected to the copper module group 41 to achieve floating compression. Specifically, the elastic buffer structure is made by opening a hollow groove 44 on the top of the insulating lower pressure plate 4, and setting 2-4 rows of springs 45 in the hollow groove 44, with 4-8 springs 45 in a single row. The bottom of all springs 45 is set at the bottom of the hollow groove 44, and is welded to the springs 45 by screws and threaded to the bottom of the hollow groove 44. The top of all springs 45 abuts against the bottom of the copper module group 41.

[0034] As a preferred solution, a flexible insulating layer 46, such as a rubber pad or thermoplastic elastomer (TPE) insulating layer, can be placed on top of all springs 45 to achieve flexible contact. Alternatively, a rigid insulating plate fixed to the top of each spring 45 can be placed first, followed by the flexible insulating layer 46, making the tops of all springs 45 flush for better support of the copper module assembly 41. When the copper module assembly 41 is pressed down as a whole, it contacts the flexible insulating layer 46 to compensate for minor tolerance variations in the copper busbar thickness, while preventing mechanical damage to the copper busbar insulation layer from the tooling. Because the bottom of the insulating pressure plate 4 has a rectangular structure, four rows of springs 45 can be placed in the slot 44, with eight springs 45 per row, providing floating support for the entire copper module assembly 41.

[0035] In this design, a rotating mechanism 1 is embedded in the center of the top plate 2 through a hole. The real-time downward pressure is adjusted via the handle 12 to simulate the required working pressure value. A silicone rubber buffer layer 32 covers the pressure surface of the insulating upper pressure plate 31 to increase the contact area and improve the uniformity of pressure distribution. The copper module group 41 consists of multiple strip-shaped or rhomboid copper blocks connected in series, which can be spliced ​​and matched according to copper busbars 6 of different lengths to achieve insulation withstand voltage testing. Compared with traditional testing methods, this design improves the detection rate of defects on the insulation surface of the copper busbar 6, improves the consistency of testing methods for different specifications, materials, and manufacturers, and improves the reliability of evaluation and testing; it also improves the testing efficiency of the copper busbar 6 and avoids damage to the insulation layer of the copper busbar 6.

[0036] The insulating lower pressure plate 4 is rigidly fixed by the fixing bolts of the lower base 42. At the same time, an elastic buffer structure is set inside the base to accommodate the bending deformation of the copper busbar 6. The elastic buffer structure consists of multiple independent springs and damping supports to ensure that the pressure can be evenly distributed when subjected to force.

[0037] When implementing the above solution, the operational steps are as follows:

[0038] Before clamping the copper busbar 6, the tooling plate is cleaned manually using a rotating brush and an air gun to remove the oxide layer and impurities from the bottom surface of the copper busbar 6.

[0039] Install the copper busbar 6 to be tested into the upper and lower insulating pressure plates. Rotate the handle of the rotating mechanism 1 to make the screw 13 rotate and move the upper base plate 31 downward. The silicone buffer layer 32 at the bottom of the upper insulating pressure plate 3 contacts the upper surface of the copper busbar 6 to be tested. At the same time, the lower insulating pressure plate 4 has an elastic buffer structure inside to avoid hard contact damaging the surface insulation layer of the copper busbar 6. Check the value display of the pressure sensor 51. When the preset pressure value is reached, stop rotating the screw 13. Connect the red clip of the existing pressure withstand tester to the conductor end on the copper busbar 6, and connect the black clip of the insulation withstand voltage tester to the terminal 43 of the copper module group 41. Finally, press the start button of the pressure withstand tester to measure the insulation withstand voltage result of the copper busbar 6 under the set pressure.

[0040] This solution primarily simulates the actual application of the tested copper busbar 6 under different compressive forces in energy storage or power battery packs to detect whether the surface insulation layer of the tested copper busbar 6 can meet the insulation withstand voltage design requirements. This solution is equipped with an elastic buffer structure to avoid damage to the copper busbar 6. At the same time, it is equipped with a copper module group 41 to increase the contact surface with the insulation layer of the copper busbar 6, making the test voltage distribution more uniform, improving the detection rate of defective insulation layers of the copper busbar 6, reducing the outflow of defective copper busbar 6, and thus reducing the impact on the electrical safety of the battery pack, causing battery pack performance failure or safety accidents.

[0041] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. These undisclosed elements are all prior art known to those skilled in the art.

[0042] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above description is only a specific embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A tooling for simulating pressure conditions based on copper busbar insulation layer defect detection, characterized in that: The system includes a rotating mechanism (1), a top plate (2), and a bottom plate (5). The top plate (2) and the bottom plate (5) are fitted with an upper base plate (31) and a lower base plate (42) through a guide post (21). The rotating mechanism (1) is movably mounted on the top plate (2) and rotatably connected to the upper base plate (31). An insulating upper pressure plate (3) is fixed at the bottom of the upper base plate (31). An insulating lower pressure plate (4) that cooperates with the insulating upper pressure plate (3) is installed on the top of the lower base plate (42). A copper module group (41) for installing copper busbars (6) is snapped onto the top of the insulating lower pressure plate (4). A terminal post (43) is provided on the outside of the copper module group (41). A pressure sensor (51) is installed between the lower base plate (42) and the bottom plate (5).

2. The tooling for simulating pressure conditions based on copper busbar insulation layer defect detection according to claim 1, characterized in that: The top of the insulating lower pressure plate (4) is provided with a U-shaped slot, and the insulating lower pressure plate (4) is connected to the copper module group (41) through the U-shaped slot.

3. The tooling for simulating pressure conditions based on copper busbar insulation layer defect detection according to claim 2, characterized in that: The copper module group (41) has at least two copper blocks arranged side by side, and its top is provided with a mounting groove for installing copper busbars (6). Each copper block is snapped into the insulating pressure plate (4), and each copper block is provided with the terminal block (43) on its outer side.

4. The tooling for simulating pressure conditions based on copper busbar insulation layer defect detection according to claim 1, characterized in that: The bottom of the insulating upper pressure plate (3) is provided with a boss, and a buffer layer (32) is bonded to the bottom of the boss. The buffer layer (32) covers the entire copper busbar (6) when working.

5. The tooling for simulating pressure conditions based on copper busbar insulation layer defect detection according to claim 4, characterized in that: The length of the buffer layer (32) is the same as the length of the copper busbar (6), and the width of the buffer layer (32) is the same as the width of the copper busbar (6).

6. The tooling for simulating pressure conditions based on copper busbar insulation layer defect detection according to claim 1, characterized in that: The top of the insulating pressure plate (4) is provided with an elastic buffer structure that is elastically connected to the copper module group (41).

7. The tooling for simulating pressure conditions based on copper busbar insulation layer defect detection according to claim 6, characterized in that: The elastic buffer structure includes a hollow groove (44) on the top of the insulating lower pressure plate (4), and 2-4 rows of springs (45) are arranged in the hollow groove (44), with 4-8 springs (45) arranged in a single row.

8. The tooling for simulating pressure conditions based on copper busbar insulation layer defect detection according to claim 7, characterized in that: A flexible insulating layer (46) is placed on the top of all the springs (45).

9. The tooling for simulating pressure conditions based on copper busbar insulation layer defect detection according to claim 1, characterized in that: The middle part of the rotating mechanism (1) is movably connected to the top plate (2), and the bottom of the rotating mechanism (1) is rotatably connected to the upper base plate (31) through the bearing in the bearing mounting sleeve (11).

10. The tooling for simulating pressure conditions based on copper busbar insulation layer defect detection according to claim 9, characterized in that: The rotating mechanism (1) includes a screw (13) and a handle (12). The top of the screw (13) is fixedly connected to the handle (12), the middle part of the screw (13) is connected to the top plate (2) through a screw sleeve (14), and the bottom of the screw (13) is rotatably connected to the upper base plate (31) through a bearing.

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