Probe card probe contact mechanism with cushioning protection

Abstract

The utility model relates to electronic probe equipment technical field discloses the probe card probe contact mechanism with buffer protection, including device frame, the top middle part fixed connection of device frame has the operating table, the top all around of device frame is provided with rotating mechanism, the top front side of operating table is provided with elevating system, the top of rotating mechanism is provided with probe adjusting mechanism, the left side bottom of probe adjusting mechanism is provided with buffer protection mechanism, the top middle part of operating table is provided with the mechanism of being examined. In the utility model, the engagement of connecting screw rod and screw hole realizes probe quick replacement, the cooperation of rotating component and sliding component can flexibly adjust probe angle and position, the sliding adaptation of telescopic sleeve and telescopic pipe can change horizontal position, and each part cooperates to make probe realize multi -angle, multi -position adjustment, improves the applicability of device to different specifications chip detection, strengthens the flexibility and convenience of operation.

Description

Technical Field

[0001] This utility model relates to the field of electronic probe equipment technology, and in particular to a probe card probe contact mechanism with buffer protection. Background Technology

[0002] In the semiconductor wafer testing process, the probe card, as a key interface between the tester and the chip, bears the heavy responsibility of electrical performance testing. The performance of the probe testing mechanism directly affects the accuracy and stability of the test results. The probe contact mechanism of the probe card with buffer protection, as the core component of the probe card, effectively absorbs and disperses the impact force at the moment of contact between the probe and the chip pad through a specially designed buffer structure, avoiding damage to the probe due to rigid contact, ensuring a stable, low-impedance electrical connection, and is the core component for ensuring high-precision and high-reliability chip testing.

[0003] Currently, the technology of probe contact mechanisms in probe cards is constantly advancing: some advanced designs have introduced piezoelectric drive technology, which enables precise control of probe contact force and improves contact stability; some manufacturers have innovated in probe materials, using high-toughness, low-resistance alloy materials to enhance probe durability; in addition, some high-end probe cards are equipped with automatic calibration systems that can monitor and adjust the probe contact position in real time to improve testing accuracy.

[0004] However, existing probe card probe contact mechanisms still have significant drawbacks in practical applications: conventional probes and detection devices are mostly manufactured as a single unit, and due to their small size, they are easily damaged in daily use. When probes are damaged or replaced, the repair and replacement operations are complicated. Furthermore, current probe detection devices can only detect chips of corresponding specifications, resulting in extremely low compatibility. These drawbacks lead to low chip detection efficiency. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a probe card probe contact mechanism with buffer protection, which aims to improve the problems of complex probe replacement and low adaptability to different environments in the prior art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a probe card probe contact mechanism with buffer protection, including a device frame, an operating table fixedly connected to the top center of the device frame, a rotating mechanism arranged around the top of the device frame, a lifting mechanism arranged on the front side of the top of the operating table, a probe adjustment mechanism arranged at the top of the rotating mechanism, a buffer protection mechanism arranged at the bottom left side of the probe adjustment mechanism, and an inspection mechanism arranged at the top center of the operating table.

[0007] The probe adjustment mechanism includes a support arm, the bottom of which is fixedly connected to the top of the rotating mechanism. A connecting arm is rotatably connected to the top left end of the support arm. A sliding block is slidably connected to the left end of the connecting arm. A telescopic sleeve is fixedly connected to the lower left side of the sliding block. A spiral power cord is fixedly connected to the lower left side of the sliding block. A fixing tube is fixedly connected to the left end of the spiral power cord. A connecting tube is fixedly connected to the right end of the fixing tube. A telescopic tube is fixedly connected to the right end of the inner wall of the connecting tube. The right end of the outer wall of the telescopic tube is slidably connected to the left end of the inner wall of the telescopic sleeve.

[0008] As a further description of the above technical solution:

[0009] The buffer protection mechanism includes a probe sleeve, the top of which is fixedly connected to the bottom of a connecting screw. A buffer spring is fixedly connected to the top of the inner wall of the probe sleeve, and a gasket is fixedly connected to the bottom of the buffer spring. A blocking ring is fixedly connected to the bottom of the inner wall of the probe sleeve. A spring power line is fixedly connected to the middle of the top of the inner wall of the probe sleeve, and the bottom of the spring power line is fixedly connected to the middle of the top of the gasket. A probe cap is slidably connected to the lower middle part of the inner wall of the probe sleeve, and a probe hole is opened at the bottom of the probe cap. A miniature probe is provided at the middle of the bottom of the gasket. An insulating sleeve is provided around the outer wall of the miniature probe, and the top of the outer wall of the insulating sleeve is fixedly connected to the middle of the bottom of the gasket. The miniature probe and the insulating sleeve pass through the probe hole.

[0010] As a further description of the above technical solution:

[0011] The probe adjustment mechanism also includes a double sleeve, the right side of which is fixedly connected to the left end of the fixed tube. A rotating shaft is rotatably connected to the inner wall of the double sleeve. Fixed knobs are provided at both the front and rear ends of the rotating shaft. A single sleeve is rotatably connected to the middle of the rotating shaft. A rotating tube is fixedly connected to the bottom of the single sleeve. A probe mounting tube is fixedly connected to the bottom of the rotating tube. A screw hole is provided at the bottom of the probe mounting tube. A connecting screw is provided at the bottom of the probe mounting tube. The connecting screw engages with the probe mounting tube through the screw hole. A sliding component is provided at the left end of the connecting arm. A rotating component is provided on the left side of the top end of the support arm.

[0012] As a further description of the above technical solution:

[0013] The sliding assembly includes two sliders, the right sides of which are fixedly connected to the front and rear sides of the left end of the same connecting arm. A limiting groove is provided in the lower middle part of the right side of the slider, and a sliding groove is provided in the front and rear sides of the limiting groove.

[0014] As a further description of the above technical solution:

[0015] The rotating assembly includes a double sleeve, the bottom right side of which is fixedly connected to the top left side of the support arm. A single sleeve is fixedly connected to the bottom right side of the connecting arm. A rotating shaft is rotatably connected to the inner wall of the double sleeve. The middle part of the rotating shaft is rotatably connected to the single sleeve. Fixed knobs are provided at both the front and rear ends of the rotating shaft.

[0016] As a further description of the above technical solution:

[0017] The rotating mechanism includes a ring track, the bottom of which is fixedly connected to the top of the device frame around the perimeter. A second slider is slidably connected to the right side of the top of the ring track. The top center of the second slider is fixedly connected to the bottom of the support arm. A stabilizing block is fixedly connected to the top of the second slider.

[0018] As a further description of the above technical solution:

[0019] The lifting mechanism includes a power button, the bottom of which is fixedly connected to the middle of the top front end of the outer wall of the operating platform. An up button is fixedly connected to the left side of the top front end of the outer wall of the operating platform, and a down button is fixedly connected to the right side of the top front end of the outer wall of the operating platform.

[0020] As a further description of the above technical solution:

[0021] The tested device includes a wafer disk, the bottom of the outer wall of the wafer disk is slidably connected to the inner wall of the operating table, and the tested chip is disposed at the top center of the wafer disk.

[0022] This utility model has the following beneficial effects:

[0023] 1. In this utility model, the probe adjustment mechanism achieves rapid probe replacement through the coordinated operation of its components, the engagement of the connecting screw and the screw hole, the flexible adjustment of the probe's vertical angle and position through the cooperation of the rotating component and the sliding component, the sliding adaptation of the telescopic sleeve and the telescopic tube to change the horizontal position, and the combination of the double sleeve and the rotating shaft to facilitate the adjustment of the installation angle. The coordinated operation of these components allows the probe to achieve multi-angle and multi-position adjustment without being limited by a fixed detection orientation, greatly improving the applicability of the device to the detection of chips of different specifications and enhancing the flexibility and convenience of operation.

[0024] 2. In this utility model, through the flexible cooperation of the various components of the buffer protection mechanism, the buffer spring can adaptably compress and buffer the test pressure when the probe contacts the chip, the blocking ring prevents the probe cap from falling off and ensures structural stability, the spring power line extends and retracts with the buffer spring to ensure that the electrical signal transmission is not affected, the insulating sleeve avoids external interference and ensures signal accuracy, and the synergistic effect of the various components enables the probe to adapt to pressure impact and transmit signals stably during detection, effectively solving the problem that traditional probes are easily damaged by hard contact or have unstable signal transmission, and improving the stability and durability of the device. Attached Figure Description

[0025] Figure 1 This is a perspective view of the probe contact mechanism of the probe card with buffer protection proposed in this utility model.

[0026] Figure 2 This is a front view of the probe contact mechanism of the probe card with buffer protection proposed in this utility model;

[0027] Figure 3 This is a structural exploded view of the probe adjustment mechanism of the probe card probe contact mechanism with buffer protection proposed in this utility model;

[0028] Figure 4 This is a structural exploded view of the buffer protection mechanism of the probe contact mechanism of the probe card with buffer protection proposed in this utility model;

[0029] Figure 5 This is a cross-sectional view of the buffer protection mechanism of the probe contact mechanism of the probe card with buffer protection proposed in this utility model.

[0030] Legend:

[0031] 1. Device frame; 2. Probe adjustment mechanism; 201. Support arm; 202. Connecting arm; 203. Sliding block; 204. Telescopic sleeve; 205. Spiral power cord; 206. Fixing tube; 207. Connecting tube; 208. Telescopic tube; 209. Double sleeve one; 210. Rotating shaft one; 211. Fixing knob one; 212. Single sleeve one; 213. Rotating tube; 214. Probe mounting tube; 215. Screw hole; 216. Connecting screw; 217. Sliding assembly; 2171. Slider one; 2172. Limiting groove; 2173. Slide groove; 218. Rotating assembly; 2181. Double sleeve two; 21 82. Single sleeve II; 2183. Rotating shaft II; 2184. Fixed knob II; 3. Buffer protection mechanism; 301. Probe sleeve; 302. Buffer spring; 303. Gasket; 304. Barrier ring; 305. Spring power cord; 306. Probe cap; 307. Probe hole; 308. Miniature probe; 309. Insulating sleeve; 4. Operating table; 5. Rotating mechanism; 501. Circular track; 502. Slider II; 503. Stabilizing block; 6. Lifting mechanism; 601. Power button; 602. Up button; 603. Down button; 7. Tested mechanism; 701. Wafer disk; 702. Tested chip. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] Reference Figure 1 , Figure 3 and Figure 5 The present invention provides an embodiment of a probe card probe contact mechanism with buffer protection, including a device frame 1, which is a device support for the probe card probe contact mechanism. An operating table 4 is fixedly connected to the top center of the device frame 1 for installing and placing related operating components. A rotating mechanism 5 is provided around the top of the device frame 1 to provide horizontal rotation capability for the probe. A lifting mechanism 6 is provided on the front side of the top of the operating table 4 to lift the chip to a suitable height. A probe adjustment mechanism 2 is provided at the top of the rotating mechanism 5 for quick replacement and operation adjustment of the probe. A buffer protection mechanism 3 is provided at the bottom left side of the probe adjustment mechanism 2 to provide buffer protection for the probe. An inspection mechanism 7 is provided at the top center of the operating table 4 to contact the probe.

[0034] The probe adjustment mechanism 2 includes a support arm 201 for stabilizing the probe and related connecting mechanisms. The bottom of the support arm 201 is fixedly connected to the top of the rotating mechanism 5. The top left end of the support arm 201 is rotatably connected to a connecting arm 202, which can change direction by rotation. The left end of the connecting arm 202 is slidably connected to a sliding block 203, which drives the probe to move up and down when sliding. The lower left side of the sliding block 203 is fixedly connected to a telescopic sleeve 204. The lower left side of the sliding block 203 is fixedly connected to a spiral power line 205 to ensure stable electrical signal transmission during horizontal telescopic movement. The left end of the spiral power line 205 is fixedly connected to a fixed tube 206. The right end of the fixed tube 206 is fixedly connected to a connecting tube 207. The right end of the inner wall of the connecting tube 207 is fixedly connected to a telescopic tube 208. The right end of the outer wall of the telescopic tube 208 is slidably connected to the left end of the inner wall of the telescopic sleeve 204. The telescopic tube 208 slides left and right on the horizontal plane, which drives the connecting tube 207 connected to it to slide, ultimately causing the probe to move on the horizontal plane.

[0035] The probe adjustment mechanism 2 also includes a double sleeve 209. The right side of the double sleeve 209 is fixedly connected to the left end of the fixed tube 206. A rotating shaft 210 is rotatably connected to the inner wall of the double sleeve 209. A fixing knob 211 is provided at both the front and rear ends of the rotating shaft 210. A single sleeve 212 is rotatably connected to the middle of the rotating shaft 210. The angle of the double sleeve 209 is fixed. After rotating and loosening the two fixing knobs 211, the single sleeve 212 can rotate around the rotating shaft 210 within a certain angle limit. After rotating to the desired angle, the two fixing knobs 211 are rotated and tightened to fix the single sleeve 212. The bottom of the single sleeve 212 is fixed. A rotating tube 213 is connected to provide a handheld force position for the rotation of the single sleeve 212. A probe mounting tube 214 is fixedly connected to the bottom of the rotating tube 213 for connecting the probe. A screw hole 215 is opened at the bottom of the probe mounting tube 214. A connecting screw 216 is provided at the bottom of the probe mounting tube 214. The connecting screw 216 is engaged with the probe mounting tube 214 through the screw hole 215. A sliding component 217 is provided at the left end of the connecting arm 202, which stabilizes the connecting arm 202 and provides the chain probe with the ability to move vertically. A rotating component 218 is provided on the left side of the top of the support arm 201, which provides the connecting arm 202 with the function of vertical rotation.

[0036] The sliding assembly 217 includes two sliders 2171 for connecting the connecting arm 202 and the sliding block 203. The right sides of the two sliders 2171 are fixedly connected to the front and rear sides of the left end of the same connecting arm 202. The lower right side of the sliding block 203 has a limiting groove 2172 to limit the vertical movement of the connecting arm 202. The front and rear sides of the limiting groove 2172 are provided with sliding grooves 2173 to facilitate the movement of the corresponding sliders 2171.

[0037] The rotating assembly 218 includes a double sleeve 2181. The bottom right side of the double sleeve 2181 is fixedly connected to the top left side of the support arm 201. The bottom right side of the connecting arm 202 is fixedly connected to a single sleeve 2182. The inner wall of the double sleeve 2181 is rotatably connected to a rotating shaft 2183. The middle part of the rotating shaft 2183 is rotatably connected to the single sleeve 2182. The front and rear ends of the rotating shaft 2183 are provided with fixing knobs 2184. The angle of the double sleeve 2181 is fixed. After loosening the fixing knobs 2184, the single sleeve 2182 can be rotated around the rotating shaft 2183 by holding the connecting arm 202. After rotating to a suitable position, tightening the fixing knobs 2184 can fix the angle of the single sleeve 2182.

[0038] Specifically, when adjusting the probe, the operator can first loosen the fixing knob 2184 by rotating component 218, hold the connecting arm 202 to drive the single sleeve 2182 to rotate around the rotating shaft 2183, adjust the vertical angle of the connecting arm 202, tighten the fixing knob 2184 after adjustment, and then use the sliding component 217 to let the slider 2171 at the left end of the connecting arm 202 slide along the slide groove 2173 of the sliding block 203 in the limiting groove 2172 to achieve vertical movement of the probe. If horizontal adjustment is required, the telescopic sleeve 2 can be used. The sliding engagement of 04 with the telescopic tube 208 pushes the connecting tube 207 to drive the probe to move horizontally, and the spiral power cord 205 ensures stable electrical signal transmission. When adjusting the probe installation angle, loosen the fixing knob 211, and the single sleeve 212 rotates around the rotating shaft 210. After reaching the appropriate angle, tighten the fixing knob 211. The probe can also be quickly disassembled and assembled by the engagement of the connecting screw 216 with the screw hole 215. All components work together to achieve flexible adjustment of the probe in multiple dimensions, accurately adapt to the chip detection requirements, and complete the contact detection operation.

[0039] Reference Figure 2 , Figure 4 and Figure 5The buffer protection mechanism 3 includes a probe sleeve 301. The top end of the probe sleeve 301 is fixedly connected to the bottom of the connecting screw 216. A buffer spring 302 is fixedly connected to the top of the inner wall of the probe sleeve 301, which is the main buffer component. When the probe contacts the chip, the buffer spring 302 will be compressed accordingly. A pad 303 is fixedly connected to the bottom end of the buffer spring 302 to ensure that the buffer spring 302 is subjected to uniform force. A stop ring 304 is fixedly connected to the bottom end of the inner wall of the probe sleeve 301. A spring power cable 305 is fixedly connected to the middle of the top end of the inner wall of the probe sleeve 301, which can move together with the buffer spring 302 when it extends and retracts. The bottom end of the spring power cable 305 is fixedly connected to the middle of the top end of the pad 303. A probe cap 306 is slidably connected to the lower part of the inner wall of the probe sleeve 301. It can slide along the inner wall of the probe sleeve 301. When it moves to the bottom of the probe sleeve 301, it will be blocked by the blocking ring 304 and will not detach from the probe sleeve 301. A probe hole 307 is opened at the bottom end of the probe cap 306. A miniature probe 308 is provided at the bottom center of the pad 303. It can transmit electrical signals. Its bottom contacts the chip to detect whether the chip is qualified. An insulating sleeve 309 is provided around the outer wall of the miniature probe 308 to prevent the miniature probe 308 from being affected by the outside when transmitting electrical signals. The top of the outer wall of the insulating sleeve 309 is fixedly connected to the bottom center of the pad 303. The miniature probe 308 and the insulating sleeve 309 pass through the probe hole 307.

[0040] Specifically, when the miniature probe 308 contacts the chip for detection, if the contact pressure is too high, the chip exerts a reverse force on the miniature probe 308. The miniature probe 308, along with the pad 303, slides upward along the inner wall of the probe sleeve 301, compressing the buffer spring 302 to achieve buffering and prevent damage to the probe due to excessive force. The spring power line 305 moves synchronously with the extension and retraction of the buffer spring 302 to ensure continuous and stable electrical signal transmission. The blocking ring 304 blocks the probe cap 306 to prevent it from detaching from the probe sleeve 301. The insulating sleeve 309 isolates external interference, allowing the miniature probe 308 to accurately transmit electrical signals to detect the chip. After detection, the buffer spring 302 resets, driving the miniature probe 308 and the pad 303 back to their initial positions, effectively protecting the probe and the chip and improving detection stability and accuracy.

[0041] Reference Figure 1 , Figure 2 and Figure 3 The rotating mechanism 5 includes an annular track 501. The bottom of the annular track 501 is fixedly connected to the top of the device frame 1. A second slider 502 is slidably connected to the right side of the top of the annular track 501. The top of the second slider 502 is fixedly connected to the bottom of the support arm 201. The second slider 502 slides along the annular track 501, driving the probe adjustment mechanism 2 and the buffer protection mechanism 3 connected thereto to complete horizontal rotation. A stabilizing block 503 is fixedly connected to the top of the second slider 502 to reinforce the connection between the second slider 502 and the support arm 201.

[0042] The lifting mechanism 6 includes a power button 601. The bottom of the power button 601 is fixedly connected to the middle of the top front end of the outer wall of the operating table 4. An up button 602 is fixedly connected to the left side of the top front end of the outer wall of the operating table 4, and a down button 603 is fixedly connected to the right side of the top front end of the outer wall of the operating table 4. When the height of the chip and the position of the probe are significantly different, the power button 601 is pressed first to power on the device, and then the up button 602 or the down button 603 is pressed to make the adjustment. The adjustment operation can only be performed when both buttons are pressed at the same time, which ensures the safety and stability of the device.

[0043] The tested unit 7 includes a wafer disk 701, which is the receiving part of the chip and also the object of adjustment of the lifting mechanism 6. The bottom of the outer wall of the wafer disk 701 is slidably connected to the inner wall of the operating table 4. The tested chip 702 is set at the top center of the wafer disk 701.

[0044] Specifically, the rotating mechanism 5 carries the second slider 502 via the annular track 501. When the second slider 502 slides, it drives the support arm 201 and the connected probe adjustment mechanism 2 and buffer protection mechanism 3 to rotate horizontally. The stabilizing block 503 reinforces the connection between the second slider 502 and the support arm 201. The lifting mechanism 6 needs to be powered on by pressing the power button 601 first, and then adjusted by pressing the up button 602 or the down button 603. Both buttons must be pressed simultaneously to ensure safety and stability. The inspected mechanism 7 carries the inspected chip 702 on the wafer disk 701. The wafer disk 701 slides along the inner wall of the operating table 4 and serves as the adjustment object of the lifting mechanism 6, working with the probe to complete the chip inspection.

[0045] Working Principle: In the operation of the probe contact mechanism with buffer protection, the rotating mechanism 5 and the probe adjustment mechanism 2 work together to achieve multi-dimensional flexible adjustment of the probe, providing a foundation for accurate detection. The operator can loosen the fixing knob 2184 by rotating component 218, and hold the connecting arm 202 to drive the single sleeve 2182 to rotate around the rotating shaft 2183 to adjust the vertical angle of the connecting arm 202. After adjustment, tighten the fixing knob. The sliding component 217 is used to allow the slider 2171 at the left end of the connecting arm 202 to slide along the sliding groove 2173 of the sliding block 203 in the limiting groove 2172, realizing the vertical movement of the probe. With the sliding cooperation of the telescopic sleeve 204 and the telescopic tube 208, the connecting tube 207 is pushed to drive the probe to move horizontally. The spiral power line 205 ensures the electrical signal. Transmission is stable. Loosen the fixing knob 211 and rotate the single sleeve 212 around the rotating shaft 210 to adjust the installation angle. After adjustment, tighten the fixing knob 211 to fix it. The engagement of the connecting screw 216 and the screw hole 215 allows for quick disassembly and assembly of the probe. At the same time, the slider 502 of the rotating mechanism 5 slides along the circular track 501, driving the probe adjustment mechanism 2 and the buffer protection mechanism 3 to complete horizontal rotation. The stabilizing block 503 reinforces the connection between the slider 502 and the support arm 201. The lifting mechanism 6 needs to be powered on by pressing the power button 601 first, and then the height of the wafer disk 701 needs to be adjusted by pressing the up button 602 or the down button 603. Both buttons must be pressed at the same time to operate and ensure safety. The wafer disk 701 of the inspected mechanism 7 receives the inspected chip 702 and works with the probe to complete contact testing.

[0046] The buffer protection mechanism 3 plays a crucial role in the detection process. The top of the probe sleeve 301 is fixed to the bottom of the connecting screw 216. The buffer spring 302 on the top of its inner wall serves as the main buffer component. The bottom end is connected to the gasket 303 to ensure uniform force distribution. The spring power line 305 on the top of the inner wall moves with the buffer spring 302 and is connected to the gasket 303. The probe cap 306 slides along the lower middle part of the inner wall of the probe sleeve 301. The probe hole 307 at the bottom end allows the micro probe 308 and the insulating sleeve 309 to pass through. The micro probe 308 is located in the middle of the bottom end of the gasket 303. The top of the insulating sleeve 309 on the outer wall is fixed to the gasket 303, and the bottom contacts the chip to transmit electrical signals. When the micro probe 308 contacts the chip, the buffer spring 302 is compressed to achieve buffering. The blocking ring 304 blocks the probe cap 306 to prevent it from detaching from the probe sleeve 301. After the detection is completed, the buffer spring 302 resets, driving all components back to their initial positions.

[0047] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A probe card probe contact mechanism with buffer protection, comprising a device frame (1), characterized in that: An operating table (4) is fixedly connected to the top center of the device frame (1). A rotating mechanism (5) is provided around the top of the device frame (1). A lifting mechanism (6) is provided on the front side of the top of the operating table (4). A probe adjustment mechanism (2) is provided at the top of the rotating mechanism (5). A buffer protection mechanism (3) is provided at the bottom left side of the probe adjustment mechanism (2). An inspection mechanism (7) is fixedly connected to the top center of the operating table (4). The probe adjustment mechanism (2) includes a support arm (201), the bottom of which is located at the top of the rotating mechanism (5). A connecting arm (202) is rotatably connected to the top left end of the support arm (201). A sliding block (203) is slidably connected to the left end of the connecting arm (202). A telescopic sleeve (204) is fixedly connected to the lower left side of the sliding block (203). A spiral power cord (205) is fixedly connected to the lower left side of the sliding block (203). A fixed tube (206) is fixedly connected to the left end of the spiral power cord (205). A connecting tube (207) is fixedly connected to the right end of the fixed tube (206). A telescopic tube (208) is fixedly connected to the right end of the inner wall of the connecting tube (207). The right end of the outer wall of the telescopic tube (208) is slidably connected to the left end of the inner wall of the telescopic sleeve (204).

2. The probe contact mechanism of the probe card with buffer protection according to claim 1, characterized in that: The buffer protection mechanism (3) includes a probe sleeve (301), the top end of which is fixedly connected to the bottom of a connecting screw (216). A buffer spring (302) is fixedly connected to the top of the inner wall of the probe sleeve (301), and a pad (303) is fixedly connected to the bottom end of the buffer spring (302). A blocking ring (304) is fixedly connected to the bottom end of the inner wall of the probe sleeve (301), and a spring power cord (305) is fixedly connected to the middle of the top end of the inner wall of the probe sleeve (301). The bottom end of the spring power cord (305) is connected to the pad. The top center of the plate (303) is fixedly connected, and the probe cap (306) is slidably connected to the lower part of the inner wall of the probe sleeve (301). The probe cap (306) has a probe hole (307) at the bottom end. The bottom center of the pad (303) is provided with a micro probe (308). The outer wall of the micro probe (308) is provided with an insulating sleeve (309) around it. The top of the outer wall of the insulating sleeve (309) is fixedly connected to the bottom center of the pad (303). The micro probe (308) and the insulating sleeve (309) pass through the probe hole (307).

3. The probe contact mechanism of the probe card with buffer protection according to claim 1, characterized in that: The probe adjustment mechanism (2) further includes a double sleeve (209), the right side of which is fixedly connected to the left end of the fixed tube (206). A rotating shaft (210) is rotatably connected to the inner wall of the double sleeve (209). Fixed knobs (211) are provided at both the front and rear ends of the rotating shaft (210). A single sleeve (212) is rotatably connected to the middle of the rotating shaft (210). A rotating tube (213) is fixedly connected to the bottom of the single sleeve (212). The bottom of the rotating tube (213) is fixedly connected to a probe mounting tube (214). The bottom of the probe mounting tube (214) is provided with a screw hole (215). The bottom of the probe mounting tube (214) is provided with a connecting screw (216). The connecting screw (216) is engaged with the probe mounting tube (214) through the screw hole (215). The left end of the connecting arm (202) is provided with a sliding component (217). The top left side of the support arm (201) is provided with a rotating component (218).

4. The probe contact mechanism of the probe card with buffer protection according to claim 3, characterized in that: The sliding assembly (217) includes two sliders (2171), the right sides of which are fixedly connected to the front and rear sides of the left end of the same connecting arm (202). A limiting groove (2172) is provided in the lower middle part of the right side of the sliding block (203), and a sliding groove (2173) is provided in the front and rear sides of the limiting groove (2172).

5. The probe contact mechanism of the probe card with buffer protection according to claim 3, characterized in that: The rotating assembly (218) includes a double sleeve (2181), the bottom right side of the double sleeve (2181) is fixedly connected to the top left side of the support arm (201), the bottom right end of the connecting arm (202) is fixedly connected to a single sleeve (2182), the inner wall of the double sleeve (2181) is rotatably connected to a rotating shaft (2183), the middle part of the rotating shaft (2183) is rotatably connected to the single sleeve (2182), and the front and rear ends of the rotating shaft (2183) are provided with fixed knobs (2184).

6. The probe contact mechanism of the probe card with buffer protection according to claim 1, characterized in that: The rotating mechanism (5) includes an annular track (501), the bottom of which is fixedly connected to the top of the device frame (1) around the perimeter. A slider two (502) is slidably connected to the right side of the top of the annular track (501). The top middle of the slider two (502) is fixedly connected to the bottom of the support arm (201). A stabilizing block (503) is fixedly connected to the top of the slider two (502).

7. The probe contact mechanism of the probe card with buffer protection according to claim 1, characterized in that: The lifting mechanism (6) includes a power button (601). The bottom of the power button (601) is fixedly connected to the middle of the top front end of the outer wall of the operating table (4). An up button (602) is fixedly connected to the left side of the top front end of the outer wall of the operating table (4), and a down button (603) is fixedly connected to the right side of the top front end of the outer wall of the operating table (4).

8. The probe contact mechanism of the probe card with buffer protection according to claim 1, characterized in that: The tested mechanism (7) includes a wafer disk (701), the bottom of the outer wall of the wafer disk (701) is slidably connected to the inner wall of the operating table (4), and the tested chip (702) is provided at the top center of the wafer disk (701).

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