A PCB slicing module and a circuit board thereof
By setting up a dense combination of plated vias and conductive vias in the PCB slicing module, the electrochemical and hydrodynamic conditions of high-density areas of the circuit board are simulated, solving the problem of distorted test results in traditional slicing modules and achieving efficient and reliable production monitoring and quality judgment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- APCB ELECTRONICS SHENZHEN CO LTD
- Filing Date
- 2025-08-01
- Publication Date
- 2026-07-21
AI Technical Summary
The monitoring hole design of traditional PCB slicing modules is disconnected from the high-density areas inside the circuit board, resulting in distorted test results that cannot accurately reflect the production quality of high-density areas. Furthermore, the need for destructive verification increases production costs and reduces yield.
The design of the PCB slicing module simulates the area with the highest wiring density in the main circuit of the circuit board. A combination of plated through holes and conductive holes is used, with a center-to-center spacing of ≤20mil, preferably 12mil. The monitoring holes are connected by conductive copper foil lines to form a continuous conductive loop.
It enables precise monitoring of high-density areas, avoids unnecessary production scrap, reduces manufacturing costs, improves production monitoring efficiency and product yield, and ensures the reliability of the production process.
Smart Images
Figure CN224536129U_ABST