Flexible circuit board temperature resistance testing equipment

Abstract

The utility model discloses a kind of flexible circuit board temperature resistance test equipment, belong to flexible circuit board test technical field, installation in the conveying line end of flexible circuit board, including receiving material part, the receiving material part quantity is two groups and is oppositely arranged, the receiving material part includes receiving material cylinder, receiving material mounting piece and receiving material suction cup, the receiving material mounting piece is located the receiving material cylinder drive end, the receiving material suction cup is installed on the receiving material mounting piece;Feeding part, the feeding part includes feeding module and feeding carrier plate, the feeding carrier plate is installed on the feeding module and is driven by the feeding module;Temperature resistance box, the temperature resistance box is located the side of the feeding module.The utility model can be effectively docked with the front end production conveying line of flexible circuit board, directly finished product flexible circuit board is moved to temperature resistance box and carries out temperature resistance test, without manual operation in this process, can greatly improve the test efficiency to flexible circuit board.

Description

Technical Field

[0001] This utility model belongs to the field of flexible circuit board testing technology, and in particular relates to a flexible circuit board temperature resistance testing device. Background Technology

[0002] Flexible printed circuit boards (FPCs) are highly reliable and extremely flexible printed circuit boards made with polyimide or polyester film as the substrate. They are characterized by high wiring density, light weight, thinness, and good bending properties.

[0003] After the production and processing of flexible printed circuit boards (FPCBs) are completed, they often need to undergo temperature resistance testing. Therefore, after the FPCBs are processed, they need to be transferred to a temperature resistance chamber for testing. Currently, the transfer of FPCBs is usually done manually, that is, the operator manually transfers the FPCBs to the temperature resistance chamber for testing. This method consumes a lot of manpower, has low operating efficiency, and cannot be effectively connected with the front-end production conveyor line of the FPCBs, thus making it difficult to improve the testing efficiency of FPCBs. Utility Model Content

[0004] This invention overcomes the shortcomings of the prior art by providing a flexible circuit board temperature resistance testing device to solve the problems existing in the prior art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a flexible circuit board temperature resistance testing device, installed at the end of the conveyor line of the flexible circuit board, the flexible circuit board temperature resistance testing device comprising...

[0006] The receiving section consists of two sets arranged opposite to each other. Each receiving section includes a receiving cylinder, a receiving mounting plate, and a receiving suction cup. The receiving mounting plate is located at the driving end of the receiving cylinder, and the receiving suction cup is mounted on the receiving mounting plate to pick up and receive the flexible circuit board.

[0007] The feeding unit includes a feeding module and a feeding carrier plate. The feeding carrier plate is mounted on the feeding module and driven by the feeding module. The receiving cylinder moves the flexible circuit board onto the feeding carrier plate.

[0008] A heat-resistant chamber is located on the side of the feeding module. The feeding module drives the feeding carrier to feed the flexible circuit board into the heat-resistant chamber.

[0009] In a preferred embodiment of the present invention, a base plate is also included, and the receiving part, the feeding part, and the temperature-resistant box are all located on the base plate.

[0010] In a preferred embodiment of this utility model, the receiving cylinder is a rotary cylinder, which includes a receiving state and a discharging state. When the receiving cylinder is in the receiving state, the receiving suction cup faces upward to adsorb the flexible circuit board. When the receiving cylinder is in the discharging state, the receiving suction cup faces downward to place the flexible circuit board on the feeding carrier.

[0011] In a preferred embodiment of this utility model, the receiving mounting piece is a continuous L-shaped sheet structure, and the receiving mounting piece is provided with a mounting groove to install the receiving suction cup.

[0012] In a preferred embodiment of this utility model, the two sets of receiving parts are symmetrically arranged about the feeding module so as to simultaneously transfer two flexible circuit boards to the feeding carrier.

[0013] In a preferred embodiment of this utility model, the feeding carrier plate is provided with negative pressure holes, and negative pressure is formed at the location of the negative pressure holes to adsorb and position the flexible circuit board.

[0014] In a preferred embodiment of this utility model, there are two heat-resistant boxes located on both sides of the feeding module. Each heat-resistant box is provided with an inlet, through which the flexible circuit board enters the heat-resistant box.

[0015] In a preferred embodiment of this utility model, the inlet corresponds to the position of the feeding carrier plate, and the flexible circuit board is introduced into the heat-resistant box through the feeding carrier plate.

[0016] This utility model solves the defects existing in the background technology, and has the following beneficial effects:

[0017] The flexible circuit board temperature resistance testing equipment of this utility model can be effectively connected to the front-end production conveyor line of flexible circuit boards, and directly transfer the finished flexible circuit boards into the temperature resistance chamber for temperature resistance testing. No manual operation is required in this process, which can greatly improve the testing efficiency of flexible circuit boards, reduce the labor intensity of operators, and save labor costs. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0019] Figure 1 This is a schematic diagram of the overall structure of a preferred embodiment of the present utility model;

[0020] Figure 2 This is a top view of a preferred embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of the material receiving part in a preferred embodiment of the present invention;

[0022] Figure 4 This is a schematic diagram of the feeding section in a preferred embodiment of the present invention;

[0023] In the diagram: 10, receiving section; 11, receiving cylinder; 12, receiving mounting plate; 121, mounting groove; 13, receiving suction cup; 20, feeding section; 21, feeding module; 22, feeding carrier plate; 221, negative pressure hole; 30, temperature resistant chamber; 31, inlet; 40, base plate. Detailed Implementation

[0024] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.

[0025] This embodiment provides a flexible circuit board temperature resistance testing device, which is installed at the end of the flexible circuit board conveyor line. This flexible circuit board temperature resistance testing device can be effectively connected with the front-end production conveyor line of the flexible circuit board, and directly transfer the finished flexible circuit board into the temperature resistance chamber 30 for temperature resistance testing. No manual operation is required in this process, which can greatly improve the testing efficiency of flexible circuit boards, reduce the labor intensity of operators, and save labor costs.

[0026] Combination Figures 1 to 4 As shown, the flexible circuit board temperature resistance testing equipment of this embodiment includes a receiving part 10, a feeding part 20, and a temperature resistance chamber 30. The receiving part 10 is located at the end of the flexible circuit board production conveyor line. After receiving the flexible circuit board, the feeding part 20 sends the flexible circuit board into the temperature resistance chamber 30 for temperature resistance testing.

[0027] In this embodiment, the flexible circuit board temperature resistance testing equipment also includes a base plate 40, and the receiving part 10, the feeding part 20 and the temperature resistance chamber 30 are all located on the base plate 40.

[0028] Combination Figures 1 to 3As shown, in this embodiment, there are two sets of receiving sections 10 arranged opposite to each other. Each receiving section 10 includes a receiving cylinder 11, a receiving mounting plate 12, and a receiving suction cup 13. The receiving mounting plate 12 is located at the driving end of the receiving cylinder 11, and the receiving suction cup 13 is mounted on the receiving mounting plate 12 to pick up and receive the flexible circuit board. The receiving cylinder 11 is a rotary cylinder and includes a receiving state and a discharging state. When the receiving cylinder 11 is in the receiving state, the receiving suction cup 13 faces upward to adsorb the flexible circuit board. When the receiving cylinder 11 is in the discharging state... When the receiving suction cup 13 faces downward, the flexible circuit board is placed on the feeding carrier plate 22. In this embodiment, the receiving part 10 is located at the end of the flexible circuit board production conveyor line. The receiving cylinder 11 in the receiving state makes the receiving suction cup 13 face upward, thereby adsorbing and receiving the flexible circuit board. At this time, the flexible circuit board is above the receiving suction cup 13. After the flexible circuit board is received, the receiving cylinder 11 rotates 180 degrees, so that the flexible circuit board is flipped. At this time, the flexible circuit board is below the receiving suction cup 13, so that the flexible circuit board can be unloaded.

[0029] In this embodiment, the receiving mounting plate 12 is a continuous L-shaped sheet structure. The receiving mounting plate 12 is provided with a mounting groove 121 to install the receiving suction cup 13. In this embodiment, there are two receiving suction cups 13, which are set on the receiving mounting plate 12 through the mounting groove 121, and the receiving mounting plate 12 installs the receiving suction cup 13.

[0030] Combination Figure 1 and Figure 4 As shown, the feeding unit 20 in this embodiment includes a feeding module 21 and a feeding carrier plate 22. The feeding carrier plate 22 is mounted on the feeding module 21 and driven by the feeding module 21. The receiving cylinder 11 moves the flexible circuit board onto the feeding carrier plate 22. The feeding carrier plate 22 is provided with negative pressure holes 221. A negative pressure is formed at the position of the negative pressure holes 221 to adsorb and position the flexible circuit board. The feeding carrier plate 22 in this embodiment can simultaneously receive two flexible circuit boards. The two flexible circuit boards transferred by the receiving unit 10 are located at both ends of the feeding carrier plate 22 and are adsorbed and positioned by the negative pressure holes 221 on the feeding carrier plate 22 so that the flexible circuit board can be sent into the heat resistance box 30 later.

[0031] In this embodiment, the temperature resistance chamber 30 is located on the side of the feeding module 21. The feeding module 21 drives the feeding carrier plate 22 to feed the flexible circuit board into the temperature resistance chamber 30. There are two temperature resistance chambers 30 located on both sides of the feeding module 21. The temperature resistance chamber 30 is provided with an inlet 31. The flexible circuit board enters the temperature resistance chamber 30 through the inlet 31. After the flexible circuit board reaches the feeding carrier plate 22, the feeding module 21 drives the feeding carrier plate 22 so that part of the flexible circuit board enters the temperature resistance chamber 30 through the inlet 31. Then, the feeding carrier plate 22 is reset under the action of the feeding module 21, and the flexible circuit board falls into the temperature resistance chamber 30 under its own gravity for temperature resistance testing.

[0032] Furthermore, in this embodiment, the two sets of receiving parts 10 are symmetrically arranged about the feeding module 21 so as to simultaneously transfer two flexible circuit boards to the feeding carrier plate 22. The inlet 31 corresponds to the position of the feeding carrier plate 22. The flexible circuit board is introduced into the temperature resistance chamber 30 through the feeding carrier plate 22. Therefore, the feeding carrier plate 22 can simultaneously feed two flexible circuit boards into the corresponding temperature resistance chamber 30 each time to perform temperature resistance testing on the flexible circuit boards, thereby improving the testing efficiency of the flexible circuit boards.

[0033] In actual use, the flexible circuit board temperature resistance testing equipment of this embodiment connects the receiving part 10 with the flexible circuit board production conveyor line to receive the produced flexible circuit boards and transfer them to the feeding carrier plate 22 of the feeding part 20. Then the feeding module 21 drives the feeding carrier plate 22 and sends the flexible circuit board into the temperature resistance chamber 30 through the inlet 31 on the temperature resistance chamber 30 for temperature resistance testing.

[0034] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A flexible circuit board temperature resistance testing device, installed at the end of the conveyor line of the flexible circuit board, characterized in that, The flexible circuit board temperature resistance testing equipment includes The receiving section (10) consists of two sets arranged opposite to each other. Each receiving section (10) includes a receiving cylinder (11), a receiving mounting plate (12), and a receiving suction cup (13). The receiving mounting plate (12) is located at the driving end of the receiving cylinder (11), and the receiving suction cup (13) is mounted on the receiving mounting plate (12) to pick up and receive the flexible circuit board. The feeding unit (20) includes a feeding module (21) and a feeding carrier plate (22). The feeding carrier plate (22) is mounted on the feeding module (21) and driven by the feeding module (21). The receiving cylinder (11) moves the flexible circuit board onto the feeding carrier plate (22). A heat-resistant box (30) is located on the side of the feeding module (21). The feeding module (21) drives the feeding carrier (22) to feed the flexible circuit board into the heat-resistant box (30).

2. The flexible circuit board temperature resistance testing equipment according to claim 1, characterized in that, It also includes a base plate (40), on which the receiving part (10), the feeding part (20) and the heat-resistant box (30) are all located.

3. The flexible circuit board temperature resistance testing equipment according to claim 1, characterized in that, The receiving cylinder (11) is a rotary cylinder. The receiving cylinder (11) includes a receiving state and a discharging state. When the receiving cylinder (11) is in the receiving state, the receiving suction cup (13) faces upward to adsorb the flexible circuit board. When the receiving cylinder (11) is in the discharging state, the receiving suction cup (13) faces downward to place the flexible circuit board on the feeding carrier plate (22).

4. The flexible circuit board temperature resistance testing equipment according to claim 1, characterized in that, The receiving mounting plate (12) is a continuous L-shaped sheet structure, and the receiving mounting plate (12) is provided with a mounting groove (121) to install the receiving suction cup (13).

5. The flexible circuit board temperature resistance testing equipment according to claim 1, characterized in that, The two sets of receiving parts (10) are symmetrically arranged with respect to the feeding module (21) so as to simultaneously transfer two flexible circuit boards onto the feeding carrier (22).

6. The flexible circuit board temperature resistance testing equipment according to claim 5, characterized in that, The feeding carrier plate (22) is provided with a negative pressure hole (221), and a negative pressure is formed at the position of the negative pressure hole (221) to adsorb and position the flexible circuit board.

7. The flexible circuit board temperature resistance testing equipment according to claim 1, characterized in that, There are two heat-resistant boxes (30) located on both sides of the feeding module (21). Each heat-resistant box (30) has an inlet (31) through which the flexible circuit board enters the heat-resistant box (30).

8. The flexible circuit board temperature resistance testing equipment according to claim 7, characterized in that, The feed inlet (31) corresponds to the position of the feeding carrier plate (22), and the flexible circuit board is introduced into the heat-resistant box (30) through the feeding carrier plate (22).

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