TOF camera module and electronic device

Abstract

The utility model provides a kind of TOF camera module and electronic equipment, the TOF camera module includes transmitting end module and receiving end module, transmitting end module includes first substrate, first support, first chip and laser transmitter, first support is installed on first substrate, first chip is installed on first substrate and is electrically connected with first substrate, laser transmitter is used to emit light, laser transmitter is located on first chip and is electrically connected with first chip, receiving end module includes second substrate and receiving main body, receiving main body is installed on second substrate and is electrically connected with second substrate, for receiving reflected light to obtain depth image, first substrate and second substrate are arranged in parallel in up-down direction interval, first substrate and second substrate are connected by connecting plate each other, first substrate is provided with avoiding hole, avoiding hole is used to pass through reflected light, receiving main body is placed to receive reflected light corresponding avoiding hole.

Description

Technical Field

[0001] This utility model relates to the field of TOF (Time of Flight) technology, and in particular to a TOF camera module and electronic device. Background Technology

[0002] With the rapid development of 3D imaging technology, Time-of-Flight (TOF) imaging technology has also developed accordingly, enabling TOF camera modules to be increasingly applied in various fields, such as LiDAR, facial recognition, and VR devices. TOF camera modules measure the depth information of the object being measured using the Time-of-Flight (TOF) method.

[0003] Currently, the TOF camera in the mobile phone industry mainly consists of a transmitter module and a receiver module. The transmitter module is used to emit light, and the receiver module is used to receive light. The transmitter module is composed of DOE or Diffuser (as a diffraction lens to expand the measurement range of the TOF camera module), collimator lens, VCSEL, bracket, ceramic substrate, circuit board and other devices. The receiver module (20) needs to use lens, bracket, circuit board and other devices.

[0004] Because existing TOF camera modules require the transmitter and receiver modules to be arranged side-by-side with a certain distance between them to prevent interference and meet performance requirements, the side-by-side arrangement and the need for sufficient distance generally result in relatively large TOF camera modules. With the market demanding minimization of camera requirements, reducing the size of TOF camera modules has become a key focus for module manufacturers' R&D personnel. Utility Model Content

[0005] The purpose of this invention is to provide a TOF camera module and electronic device to solve the problem of excessive size.

[0006] This utility model provides a TOF camera module, including a transmitter module and a receiver module. The transmitter module includes a first substrate, a first bracket, a first chip, and a laser emitter. The first bracket is fixedly mounted on the first substrate. The first chip is mounted on the first substrate and electrically connected to it. The laser emitter is used to emit light and is disposed on and electrically connected to the first chip. The receiver module includes a second substrate and a receiver body. The receiver body is mounted on the second substrate and electrically connected to it, and is used to receive reflected light to obtain a depth image. The first substrate and the second substrate are arranged parallel to each other in the vertical direction and are connected to each other by a connecting plate. The first substrate has a clearance hole for the reflected light to pass through. The receiver body is placed corresponding to the clearance hole to receive the reflected light.

[0007] In one embodiment of the present invention, the receiving body includes a second bracket, a second chip, a lens, and a lens mount. The second bracket is mounted on the first substrate, the second chip is mounted on the second substrate and electrically connected to the second substrate, the lens mount is fixedly mounted on the second bracket, and the lens is assembled on the lens mount. The lens is used to collect reflected light.

[0008] In one embodiment of the present invention, the transmitting module further includes a first molding base, which is located between the first substrate and the first support. The first support, the first molding base, and the first substrate are stacked sequentially and connected in a relatively fixed manner. The receiving module further includes a second molding base, which is located between the first substrate and the second substrate. The first substrate, the second molding base, and the second substrate are stacked sequentially and connected in a relatively fixed manner.

[0009] In one embodiment of the present invention, the first molded base has a first hollow area and a second hollow area, and the second molded base has a third hollow area. The first hollow area is located in the emission path of the laser emitter, and both the second hollow area and the third hollow area are used to allow reflected light to pass through so that the reflected light is received by the receiving body.

[0010] In one embodiment of the present invention, the transmitting module further includes a light homogenizer, which is disposed between the first bracket and the first molded base and located in the emission path of the laser emitter. The light homogenizer is used to homogenize the light emitted by the laser emitter.

[0011] In one embodiment of the present invention, the receiving module further includes a filter element located between the second bracket and the first molding base. The filter element is used to filter out light of a specific wavelength to achieve light adjustment and processing.

[0012] In one embodiment of this utility model, the first bracket and the second bracket are integrated into one unit.

[0013] In one embodiment of this utility model, the connecting plate is bent, and the bending radius of the connecting plate is ≥0.5cm.

[0014] In one embodiment of the present invention, the first chip includes a first PAD point and a second PAD point, the first substrate has a LEAD point, the first PAD point and the LEAD point are electrically connected, the laser emitter has a third PAD point, and the second PAD point and the third PAD point are electrically connected.

[0015] This utility model also provides an electronic device, including the TOF camera module as described above.

[0016] In the TOF camera module and electronic device of this utility model, the first substrate and the second substrate are arranged parallel to each other in the vertical direction. The laser emitter is disposed on the first substrate and electrically connected to it, and the receiving body is disposed on the second substrate and electrically connected to it. The first substrate and the second substrate are connected by a connecting plate. This arrangement reduces the overall size of the TOF. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a TOF camera module according to an embodiment of the present invention.

[0018] Figure 2 This is a first-view exploded structural diagram of a TOF camera module according to an embodiment of the present invention.

[0019] Figure 3 This is a second-view exploded structural diagram of a TOF camera module according to an embodiment of the present invention. Detailed Implementation

[0020] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0021] This utility model provides a TOF camera module, such as Figures 1-3As shown, one embodiment of the TOF camera module includes a transmitter module 10 and a receiver module 20. The transmitter module 10 includes a first substrate 11, a first support 12, a first chip 13, and a laser emitter 14. The first support 12 is fixedly mounted on the first substrate 11, and the first chip 13 is mounted on and electrically connected to the first substrate 11. The laser emitter 14 is used to emit light and is disposed on and electrically connected to the first chip 13. The receiver module 20 includes a second substrate 21 and a receiver body. The receiver body is mounted on and electrically connected to the second substrate 21 and is used to receive reflected light to obtain a depth image. The first substrate 11 and the second substrate 21 are arranged parallel to each other in the vertical direction and are connected to each other by a connecting plate 28. The first substrate 11 has a clearance hole 111 for the reflected light to pass through, and the receiver body is placed corresponding to the clearance hole 111 to receive the reflected light.

[0022] Specifically, the laser emitter 14 is mounted on the upper surface of the first substrate 11 and is electrically connected to the first substrate 11. A first support 12 is disposed on the upper surface of the first substrate 11 and surrounds the laser emitter 14. It can be understood that the upper surface of the first substrate 11 faces the emission direction of the laser emitter 14, and the lower surface of the first substrate 11 faces the opposite direction to the emission direction of the laser emitter 14. In other words, the emission direction of the laser emitter 14 points from the lower surface of the first substrate 11 to the upper surface.

[0023] In the TOF camera module of this utility model, the first substrate 11 and the second substrate 21 are arranged parallel to each other in the vertical direction. The laser emitter 14 is disposed on the first substrate 11 and electrically connected to it, and the receiving body is disposed on the second substrate 21 and electrically connected to it. The first substrate 11 and the second substrate 21 are connected by a connecting plate 28. This arrangement reduces the overall size of the TOF.

[0024] It should be noted that both the first substrate 11 and the second substrate 21 are PCBs (Printed Circuit Boards).

[0025] In this embodiment, the receiving body includes a second bracket 22, a second chip 23, a lens 24, and a lens mount 25. The second bracket 22 is mounted on the first substrate 11. The second chip 23 is a photosensitive chip, mounted on and electrically connected to the second substrate 21, used to receive optical signals, convert them into electrical signals, and process and generate images. The lens mount 25 is fixedly mounted on the second bracket 22 and used to mount and place the lens 24. The lens 24 is assembled on the lens mount 25 and used to focus the received reflected light, ensuring that the light signal is accurately projected onto the receiver of the second chip 23, thereby improving the receiver's receiving efficiency and accuracy.

[0026] In this embodiment, the transmitter module 10 further includes a first molding base 15, which is located between the first substrate 11 and the first support 12. The first support 12, the first molding base 15, and the first substrate 11 are stacked sequentially and connected in a relatively fixed manner. The receiver module 20 further includes a second molding base 26, which is located between the first substrate 11 and the second substrate 21. The first substrate 11, the second molding base 26, and the second substrate 21 are stacked sequentially and connected in a relatively fixed manner.

[0027] In this embodiment, molding (MOC) is applied to the TOF camera module (both the receiver and transmitter modules). Components soldered to the first substrate 11 and the second substrate 21 are encased using the MOC process (first molding base 15 and second molding base 26). This significantly reduces the increase in the TOF camera module's size caused by avoiding components, thereby reducing the overall dimensions of the TOF camera module. Specifically, one side of the first molding base 15 is attached to the upper surface of the first substrate 11, and the other side abuts against the first support 12 and the second support 22. The first molding base 15 fills and encapsulates the components on the first substrate 11 between the first support 12 / second support 22 and the first substrate 11. One side of the second molding base 26 is attached to the lower surface of the first substrate 11, and the other side is attached to the upper surface of the second substrate 21. The second molding base 26 fills and encapsulates the components on the second substrate 21 between the first substrate 11 and the second substrate 21.

[0028] In this embodiment, the first molded base 15 has a first hollow area 151 and a second hollow area 152, and the second molded base 26 has a third hollow area 261. The first hollow area 151 is located in the emission path of the laser emitter 14. The second hollow area 152 and the third hollow area 261 are both used to allow reflected light to pass through so that the reflected light is received by the receiving body.

[0029] Laser emitter 14 emits light rays along a transmission path. The light rays are reflected upon encountering an object, then refracted back along a receiving path and finally reach the receiving body. The first cutout area 151 is located along the transmission path, while the second cutout area 152, the clearance hole 111, and the third cutout area 261 are all located along the receiving path. Specifically, laser emitter 14 emits light rays that pass through the first cutout area 151, are emitted via the first support 12, reach the object being measured, are reflected back, pass through lens 24, and sequentially pass through the second cutout area 152, the clearance hole 111, and the third cutout area 261 before finally being received by the receiving body.

[0030] In this embodiment, the transmitting module 10 further includes a light homogenizer 16, which is disposed between the first support 12 and the first molding base 15 and located in the emission path of the laser emitter 14. The light homogenizer 16 is used to homogenize the light emitted by the laser emitter 14. Further, the receiving module 20 also includes a filter element 27, which is located between the second support 22 and the first molding base 15. The filter element 27 is used to filter out light of specific wavelengths to achieve light adjustment and processing.

[0031] In this embodiment, the first bracket 12 and the second bracket 22 are integrally formed, that is, the first bracket 12 and the second bracket 22 are made of the same material, making the entire TOF camera module integrated, which can improve the integration of the TOF camera module and reduce the size of the TOF module. Of course, the first bracket 12 and the second bracket 22 can also be formed separately.

[0032] Specifically, the first bracket 12 surrounds the light-diffusing element 16, meaning the light-diffusing element 16 is located within the first bracket 12. The second bracket 22 surrounds the light-filtering element 27, meaning the light-filtering element 27 is located within the second bracket 22. The laser emitter 14 emits light, which passes through the first hollow area 151 to reach the light-diffusing element 16, and is then emitted from the first bracket 12 under the action of the light-diffusing element 16. It should be noted that the first bracket 12 has a through hole in the emission path of the laser emitter 14 for the light to pass through. After the light is emitted, it is reflected back by the object being measured. The reflected light passes through the lens 24 and the light-filtering element 27, and then sequentially passes through the second hollow area 152, the clearance hole 111, and the third hollow area 261 to reach the second chip 23, where it is received for imaging.

[0033] Existing TOF camera modules use only one circuit board (PCB). This embodiment uses two circuit boards: a first substrate 11 and a second substrate 21. The first substrate 11 and the second substrate 21 are a main circuit board and a sub-circuit board, respectively. They are arranged parallel to each other in the vertical direction. The main circuit board primarily provides current output for the entire TOF camera module. The sub-circuit board is designed as a rigid-flex PCB to house the second chip 23 and related components. The first substrate 11 and the second substrate 21 are then sealed together by a second molded base 26. Finally, a connecting plate 28 connects the first substrate 11 and the second substrate 21. The connecting plate 28 is bent at 180°. The bending radius of the connecting plate 28 is ≥0.5cm to prevent excessive bending and tearing.

[0034] Specifically, the connecting plate 28 is a flexible circuit board, which allows the positional constraints between the first substrate 11 and the second substrate 21 to be overcome, simplifying the structural design of the TOF camera module and facilitating the rational arrangement of the positions of the transmitting module 10 and the receiving module 20. Of course, in other examples of this utility model, the connecting plate 28 can also be implemented as other types of electrical connection devices such as ribbon cables, irregularly shaped circuit boards, etc., as long as it can ensure that the first substrate 11 can be electrically connected to the second substrate 21. This will not be elaborated further here.

[0035] In existing TOF camera modules, the Drive IC of the transmitter module is soldered onto one side of the VCSEL (Vertical-Cavity Surface-Emitting Laser) using pads. Because the Drive IC is relatively large, the Holder (lens support, mainly used for light shielding and sealing) needs to be enlarged to avoid interference, thus increasing the overall size of the TOF camera module. However, in this embodiment, the size of the first chip 13 used in the transmitter module 10 is increased. Instead of directly soldering the pads onto the PCB, PAD points (soldering points) are designed on the surface of the first chip 13 and wire-bonded to the LEAD points (pin points) on the surface of the first substrate 11. After connection, it is molded and encapsulated using MOC (Metal-on-Cylinder). A PAD point is reserved on the surface of the first chip 13 for connection with the laser emitter 14. The PAD points on the laser emitter 14 are then wire-bonded to the PAD points on the first chip 13.

[0036] Specifically, the first chip 13 includes a first PAD point and a second PAD point, and the first substrate 11 has a LEAD point. The first PAD point and the LEAD point are electrically connected. The laser emitter 14 has a third PAD point, and the second PAD point and the third PAD point are electrically connected. This design places the first chip 13 at the bottom of the laser emitter 14, that is, the laser emitter 14 and the first chip 13 are stacked vertically. This design has the following advantages:

[0037] 1) Reduce module size: By changing the placement and connection method of the first chip 13, the overall size of the transmitter module 10 can be significantly reduced. This is because the first chip 13 no longer occupies the space on the side of the module, but is placed at the bottom of the laser emitter 14, thereby freeing up the side space and making the module more compact overall.

[0038] 2) Improved integration: The new design improves the integration of the modules, making the connections between the various components tighter and more efficient.

[0039] 3) Optimize thermal management: Placing the first chip 13 at the bottom of the laser emitter 14 may help improve thermal management because heat can be dispersed over a larger area.

[0040] 4) Enhanced structural stability: By encapsulating the first chip 13 using the MOC molding process, the structural stability of the module can be enhanced, reducing the risk of damage caused by vibration or impact.

[0041] It should be noted that the beam homogenizer 16 described in this embodiment can be, but is not limited to, implemented as a diffuser, as long as it can make the light emitted by the laser emitter 14 more uniformly distributed. Furthermore, the laser emitter 14 in this embodiment can be, but is not limited to, implemented as a vertical-cavity surface-emitting laser (VCSEL) for emitting a laser beam.

[0042] It should be noted that the first support 12 and the second support 22 serve as supports, primarily for light shielding and sealing. The materials used for the first support 12 and the second support 22 are typically PC (polycarbonate), ABS (acrylonitrile-butadiene-styrene copolymer), LCP (liquid crystal polymer), or PA46 / 66 (polyamide 46 / 6) plastics. These materials can effectively control the particle condition of the first support 12 and the second support 22, ensuring the cleanliness and stability of the module's interior.

[0043] This invention also provides an electronic device, including the TOF camera module described above. The electronic device includes an electronic device body and at least one TOF camera module, wherein each TOF camera module is disposed on the electronic device body for acquiring depth images. It is worth noting that the type of electronic device body is not limited; for example, the electronic device body can be any electronic device capable of being configured with a TOF camera module, such as a robotic vacuum cleaner, drone, pipe cleaner, smartphone, or computer.

[0044] In the electronic device of this embodiment, the laser emitter 14 in the transmitter module 10 emits light, which passes through the light diffuser 16 to reach the object under test. Subsequently, the object under test reflects the light so that it reaches the lens 24. The lens 24 focuses the received light so that the light is accurately projected onto the receiver of the second chip 23. The second chip is one of the key components of the receiver module 20 and may include functions such as receiver, signal processing unit, and control circuit. It is used to receive, process and analyze the received light signal and calculate the distance between the object and the sensor.

[0045] In this document, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art will understand the specific meaning of these terms based on the specific circumstances.

[0046] In this document, the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inner", "outer", "vertical", and "horizontal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the purpose of clarifying the technical solution and for the convenience of description, and therefore should not be construed as limiting the present utility model.

[0047] In this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, which includes not only the elements listed but also other elements not expressly listed.

[0048] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A TOF camera module, characterized in that, The system includes a transmitter module (10) and a receiver module (20). The transmitter module (10) includes a first substrate (11), a first support (12), a first chip (13), and a laser emitter (14). The first support (12) is fixedly mounted on the first substrate (11). The first chip (13) is mounted on the first substrate (11) and electrically connected to it. The laser emitter (14) is used to emit light and is disposed on and electrically connected to the first chip (13). The receiver module (20)... The device includes a second substrate (21) and a receiving body. The receiving body is mounted on the second substrate (21) and electrically connected to the second substrate (21) for receiving reflected light to obtain a depth image. The first substrate (11) and the second substrate (21) are arranged parallel to each other in the vertical direction and are connected to each other by a connecting plate (28). The first substrate (11) has a clearance hole (111) for the reflected light to pass through. The receiving body is placed corresponding to the clearance hole (111) to receive the reflected light.

2. The TOF camera module according to claim 1, characterized in that, The receiving body includes a second bracket (22), a second chip (23), a lens (24), and a lens mount (25). The second bracket (22) is mounted on the first substrate (11), the second chip (23) is mounted on the second substrate (21) and electrically connected to the second substrate (21), the lens mount (25) is fixedly mounted on the second bracket (22), and the lens (24) is assembled on the lens mount (25). The lens (24) is used to collect reflected light.

3. The TOF camera module according to claim 2, characterized in that, The transmitting module (10) further includes a first molding base (15), which is located between the first substrate (11) and the first support (12). The first support (12), the first molding base (15) and the first substrate (11) are stacked in sequence and connected relatively fixedly. The receiving module (20) further includes a second molding base (26), which is located between the first substrate (11) and the second substrate (21). The first substrate (11), the second molding base (26) and the second substrate (21) are stacked in sequence and connected relatively fixedly.

4. The TOF camera module according to claim 3, characterized in that, The first molded base (15) has a first hollow area (151) and a second hollow area (152), and the second molded base (26) has a third hollow area (261). The first hollow area (151) is located in the emission path of the laser emitter (14). The second hollow area (152) and the third hollow area (261) are both used to allow reflected light to pass through so that the reflected light is received by the receiving body.

5. The TOF camera module according to claim 3, characterized in that, The transmitter module (10) further includes a light homogenizer (16), which is disposed between the first bracket (12) and the first molded base (15) and located in the emission path of the laser emitter (14). The light homogenizer (16) is used to homogenize the light emitted by the laser emitter (14).

6. The TOF camera module according to claim 3, characterized in that, The receiving module (20) also includes a filter element (27), which is located between the second bracket (22) and the first molded base (15). The filter element (27) is used to filter out light of a specific wavelength to achieve light adjustment and processing.

7. The TOF camera module according to claim 2, characterized in that, The first bracket (12) and the second bracket (22) are integrated into one unit.

8. The TOF camera module according to claim 1, characterized in that, The connecting plate (28) is bent, and the bending radius of the connecting plate (28) is ≥0.5cm.

9. The TOF camera module according to claim 1, characterized in that, The first chip (13) includes a first PAD point and a second PAD point, the first substrate (11) has a LEAD point, the first PAD point and the LEAD point are electrically connected, the laser emitter (14) has a third PAD point, the second PAD point and the third PAD point are electrically connected.

10. An electronic device, characterized in that, Includes the TOF camera module as described in any one of claims 1 to 9.

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