A transceiver optical module

Abstract

The utility model relates to a kind of transceiving integrated optical modules, including packaging shell assembly, packaging shell assembly is equipped with packaging inner shell assembly in, cooperate the circuit board equipped with circuit module in packaging inner shell assembly;Cooperate the heat dissipation auxiliary unit of packaging shell assembly, packaging inner shell assembly and circuit board is equipped;The packaging shell assembly of cooperation circuit module is externally provided with elastic electric connecting piece.The utility model effectively handles the contact problem of heat dissipation and electric connection position while completing miniaturization, high density and high speed;Through the heat dissipation auxiliary unit of cooperative packaging shell assembly, packaging inner shell assembly and circuit board realizes heat conduction and heat dissipation, so that heat management efficiency is higher;Through elastic electric connecting piece, the electric interface of optical module itself is better protected, and the feasibility of maintenance and the reliability of application are considered.

Description

Technical Field

[0001] This utility model relates to the technical field of optical components, systems or instruments, and in particular to an integrated transceiver optical module. Background Technology

[0002] Optical modules are core components in fiber optic communication systems, performing photoelectric and electro-optic conversion. Depending on their function, optical modules include optical transmitting modules, optical receiving modules, integrated optical transceiver modules, and optical forwarding modules.

[0003] With the development of optical communication technology, parallel optical modules are playing an increasingly important role in the field of optical communication. The accelerating pace of digitization places increasingly higher demands on the information processing capacity of a single optical module per unit time, leading to the emergence of parallel optical modules. Compared to traditional single-channel optical modules, parallel optical modules increase the number of communication transmission channels, typically offering 4, 12, or 24 channels, significantly improving the integration density of a single optical module.

[0004] It is evident that optical modules, as core components of high-speed photoelectric conversion, face multiple technical challenges in pursuing miniaturization, high density, and high speed. Among these, heat dissipation and electrical contact issues are particularly prominent. Inside optical modules, especially in the areas of the optical receiver and emitter chips, localized heat accumulation is prone to occur, with temperature rises reaching 5–10°C in some scenarios. Increasingly compact packaging structures limit the heat dissipation area, resulting in low natural convection cooling efficiency. Furthermore, in addition to wear and increased contact resistance due to frequent insertion and removal, which can lead to signal attenuation or power outages, electrical contacts are also prone to accelerated wear due to micro-movements in industrial vibration environments, causing intermittent connection failures and affecting the normal operation of the optical module. Utility Model Content

[0005] This invention solves the problems existing in the prior art and provides an integrated optical transceiver module.

[0006] The technical solution adopted by this utility model is a transceiver integrated optical module, including a packaged outer shell assembly, an inner packaged shell assembly inside the packaged outer shell assembly, a circuit board inside the inner packaged shell assembly, and a circuit module inside the circuit board; a heat dissipation auxiliary unit is provided in conjunction with the packaged outer shell assembly, the inner packaged shell assembly, and the circuit board; and an elastic electrical connector is provided outside the packaged outer shell assembly in conjunction with the circuit module.

[0007] Preferably, the circuit module includes a light receiving component and a light emitting component disposed on the top surface of the circuit board, the light receiving component and the light emitting component being connected to an optical fiber, and an electrical connector being provided on the bottom surface of the circuit board.

[0008] Preferably, the inner shell assembly includes an upper inner shell cover that is disposed on the top surface of the circuit board and cooperates with the light receiving component and the light emitting component respectively, and a lower inner shell cover that cooperates with the electrical connectors disposed on the bottom surface of the circuit board. An inner shell side cover is provided between the upper inner shell cover and the lower inner shell cover.

[0009] Preferably, the encapsulation housing assembly includes an upper fitting and a lower fitting that are configured to cooperate. The lower fitting that cooperates with the electrical connector has an assembly hole at its bottom, and the lower fitting that cooperates with the optical fiber has a through groove on its side.

[0010] Preferably, the upper fitting has several limiting blocks facing the lower fitting; the lower fitting, which cooperates with the inner shell assembly and the circuit board, has limiting posts on its inner side.

[0011] Preferably, the heat dissipation auxiliary unit includes a heat dissipation groove located on the inner bottom of the lower assembly.

[0012] Preferably, the circuit board that mates with the heat sink is provided with a plurality of heat dissipation holes, and any one of the heat dissipation holes is provided to penetrate the circuit board from top to bottom.

[0013] Preferably, the inner casing assembly with several heat dissipation holes is provided with through holes.

[0014] Preferably, the electrical connector is provided with a flexible electrical connector; the flexible electrical connector includes a carrier plate, and electrical connectors are provided on both sides of the carrier plate.

[0015] Preferably, the electrical connector facing the electrical plug end is a sphere.

[0016] This utility model relates to an integrated optical transceiver module, including a housing assembly, an inner housing assembly inside the housing assembly, a circuit board inside the inner housing assembly, and a circuit module on the circuit board; a heat dissipation auxiliary unit is provided in conjunction with the housing assembly, the inner housing assembly, and the circuit board; and an elastic electrical connector is provided on the outside of the housing assembly in conjunction with the circuit module.

[0017] The advantages of this invention are that it effectively addresses heat dissipation and electrical connection contact issues while achieving miniaturization, high density, and high speed; it achieves heat conduction and dissipation through the collaborative packaging of the outer shell assembly, the inner shell assembly, and the heat dissipation auxiliary unit of the circuit board, resulting in higher thermal management efficiency; and it better protects the electrical interface of the optical module itself through flexible electrical connectors, taking into account both maintenance feasibility and application reliability. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of this utility model;

[0019] Figure 2 This is an exploded view of the structure of this utility model;

[0020] Figure 3 for Figure 2 A magnified schematic diagram of the structure of part A in the diagram;

[0021] Figure 4 This is a schematic diagram of the structure of the inner shell assembly in this utility model after removing the inner shell cover and fitting it with the circuit board.

[0022] Figure 5 This is a cross-sectional view of the inner casing assembly and its circuit board in this utility model.

[0023] Figure 6 for Figure 5 A magnified schematic diagram of the partial structure of B in the diagram;

[0024] Figure 7 This is a structural schematic diagram of the inner shell assembly of the present invention from a bottom view angle. Detailed Implementation

[0025] The present invention will be further described in detail below with reference to the embodiments, but the scope of protection of the present invention is not limited thereto.

[0026] This utility model relates to an integrated optical transceiver module, including a housing assembly 1, an inner housing assembly 2 inside the housing assembly 1, a circuit board 3 inside the inner housing assembly 2, and a circuit module inside the circuit board 3; a heat dissipation auxiliary unit is provided in conjunction with the housing assembly 1, the inner housing assembly 2, and the circuit board 3; and an elastic electrical connector 4 is provided outside the housing assembly 1 in conjunction with the circuit module.

[0027] In this invention, the inner enclosure assembly 2 provides encapsulation space for the circuit board 3 and the circuit modules mounted on it, while also providing a heat collection channel to facilitate rapid heat dissipation. The outer enclosure assembly 1 integrates the inner enclosure assembly 2, the circuit modules, and the flexible electrical connector 4 to ensure the reliability of the transceiver optical module. The heat dissipation auxiliary unit enables rapid heat conduction and dissipation, ensuring the working efficiency of the optical module.

[0028] The use of the flexible electrical connector 4 here ensures the extension of the optical module's service life and application flexibility.

[0029] The following explanation uses a 4*25G transceiver optical module with a 10*10 array of electrical contacts converted to a 1*12 core fiber array as an example.

[0030] The circuit module includes a light receiving component and a light emitting component disposed on the top surface of the circuit board 3. The light receiving component and the light emitting component are connected to the optical fiber 11. The bottom surface of the circuit board 3 is provided with an electrical connector 12.

[0031] The inner shell assembly 2 includes an upper inner shell cover 5 that is disposed on the top surface of the circuit board 3 to cooperate with the light receiving component and the light emitting component, and a lower inner shell cover 6 that is disposed on the bottom surface of the circuit board 3 to cooperate with the electrical connector 12. An inner shell side cover is provided between the upper inner shell cover 5 and the lower inner shell cover 6.

[0032] In this embodiment, the optical receiving component includes an optical receiving chip 7 and its corresponding 4-channel optical receiver 8. Similarly, the optical transmitting component includes an optical transmitting chip 9 and its corresponding 4-channel optical transmitter 10. The optical receiving chip 7 and the optical transmitting chip 9 are arranged side by side on the side of the circuit board 3 facing the optical fiber 11, while the optical receiver 8 and the optical transmitter 10 are symmetrically distributed on the circuit board 3. An electrical connector 12 is provided on the back of the circuit board 3. It should be noted that the electrical connector 12 is located in the inner cavity of the encapsulation housing component 1.

[0033] Based on this, in order to better protect the optical receiver 8, optical transmitter 10 and other components, it is necessary to limit their positions to prevent unnecessary collisions. Therefore, the inner shell top cover 5 is provided with a convex cover 13 at least at the position corresponding to the optical receiver 8 and optical transmitter 10, which can completely cover the optical receiver 8 and optical transmitter 10. The inner shell top cover 5 and inner shell bottom cover 6 corresponding to other components can also be set accordingly. At the same time, considering the heat dissipation requirements, a certain gap 14 is left between the inner shell top cover 5 and inner shell bottom cover 6 and the corresponding optical receiver 8, optical transmitter 10 and other components to ensure heat conduction requirements.

[0034] To ensure the proper functioning of the chips, the inner casing cover 5 does not cover the light receiving chip 7 and the light emitting chip 9;

[0035] It is clear that the inner shell lower cover 6 does not cover the electrical connector 12.

[0036] The encapsulation housing assembly 1 includes an upper fitting 15 and a lower fitting 16 that are configured to cooperate. The bottom of the lower fitting 16 that cooperates with the electrical connector 12 is provided with an assembly hole 17, and the side of the lower fitting 16 that cooperates with the optical fiber 11 is provided with a through groove 18.

[0037] The upper fitting 15 is provided with a plurality of limiting blocks 19 facing the lower fitting 16; the lower fitting 16, which cooperates with the inner shell assembly 2 and the circuit board 3, is provided with limiting posts 20 on its inner side.

[0038] In this utility model, the configuration of the mounting hole 17 and the through slot 18 is easily understood by those skilled in the art. The mounting hole 17 provides the fitting space between the electrical connector 12 and the flexible electrical connector 14, and the through slot 18 provides the mounting space for the optical fiber 11. It should be noted that, in order to better increase the service life of the optical module and prevent unnecessary damage to the inner package assembly 2 when the upper and lower components 15 and 16 are closed, the assembly depth of the upper and lower components 15 and 16 is limited by the limiting block 19, and the position of the inner package assembly 2 and the circuit board 3 is limited by the limiting post 20 to prevent unnecessary vibration or misassembly within the outer package assembly 1.

[0039] The heat dissipation auxiliary unit includes a heat dissipation groove 21 located on the inner bottom of the lower assembly 16.

[0040] The circuit board 3, which is designed to work with the heat sink 21, is provided with a number of heat dissipation holes 22, and any one of the heat dissipation holes 22 is provided to penetrate the circuit board 3 from top to bottom.

[0041] The inner housing assembly 2, which is equipped with several heat dissipation holes 22, has through holes 23.

[0042] In this utility model, heat dissipation holes 22 are actually set on the original circuit board 3 to provide heat dissipation channels. The heat generated by the light receiving component and the light emitting component can be quickly guided downward through the heat dissipation holes 22 and quickly dissipated outward through the flat bottom plate of the lower mounting accessory 16. The heat dissipation groove 21 here not only retains more heat dissipation space, but also allows those skilled in the art to further embed a heat dissipation material layer in it during specific applications to meet different heat dissipation needs.

[0043] The through-hole 23 of the inner shell assembly 2 is generally set as a hollow structure, that is, the inner shell upper cover 5 and inner shell lower cover 6 corresponding to the heat dissipation hole 22 are completely removed to improve heat dissipation efficiency.

[0044] The electrical connector 12 is equipped with a flexible electrical connector 4; the flexible electrical connector 4 includes a carrier plate 24, and electrical connectors 25 are respectively provided on both sides of the carrier plate 24.

[0045] The electrical connector 25 facing the electrical connector 12 is a ball.

[0046] In this invention, the electrical connector 25 is shaped like a sphere to facilitate better connection with the electrical connector 12. In a specific implementation, the electrical connector 12 is configured as several conductive copper busbars 26 connected to the circuit board 3, with conductive holes 27 at different positions. After the spherical electrical connector 25 is connected to the conductive holes 27, electrical signals can be input, thereby allowing for the configuration of electrical connectors 25 of different specifications (including but not limited to 10*10 arrays) according to requirements, and flexibly controlling the acquisition of electrical signals of different array specifications.

[0047] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A transceiver integrated optical module, characterized in that: The device includes a housing assembly, within which is a housing assembly. A circuit board is housed within the housing assembly, and a circuit module is housed within the circuit board. A heat dissipation auxiliary unit is provided in conjunction with the housing assembly, housing assembly, and circuit board. An elastic electrical connector is provided on the outside of the housing assembly in conjunction with the circuit module.

2. The transceiver integrated optical module according to claim 1, characterized in that: The circuit module includes a light receiving component and a light emitting component disposed on the top surface of the circuit board. The light receiving component and the light emitting component are connected to an optical fiber. The bottom surface of the circuit board is provided with an electrical connector.

3. The transceiver integrated optical module according to claim 2, characterized in that: The encapsulated inner shell assembly includes an inner shell top cover that is respectively mounted on the top surface of the circuit board to cooperate with the light receiving component and the light emitting component, and an inner shell bottom cover that is mounted on the bottom surface of the circuit board to cooperate with the electrical connector. An inner shell side cover is provided between the inner shell top cover and the inner shell bottom cover.

4. The transceiver integrated optical module according to claim 2, characterized in that: The encapsulation housing assembly includes an upper fitting and a lower fitting that are configured to fit together. The lower fitting that fits the electrical connector has an assembly hole at its bottom, and the lower fitting that fits the optical fiber has a through groove on its side.

5. A transceiver integrated optical module according to claim 4, characterized in that: The upper assembly has several limiting blocks facing the lower assembly; the lower assembly, which cooperates with the inner shell assembly and circuit board, has limiting posts on its inner side.

6. The transceiver integrated optical module according to claim 4, characterized in that: The heat dissipation auxiliary unit includes a heat dissipation groove located on the inner bottom of the lower assembly.

7. A transceiver integrated optical module according to claim 6, characterized in that: The circuit board that mates with the heat sink is provided with a number of heat dissipation holes, and any one of the heat dissipation holes is arranged to penetrate the circuit board from top to bottom.

8. A transceiver integrated optical module according to claim 7, characterized in that: The inner casing assembly with several heat dissipation holes has through holes.

9. A transceiver integrated optical module according to claim 2, characterized in that: The electrical connector is equipped with a flexible electrical connector; the flexible electrical connector includes a carrier plate, and electrical connectors are provided on both sides of the carrier plate.

10. A transceiver integrated optical module according to claim 9, characterized in that: The electrical connector facing the electrical terminal is a sphere.

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