A co-packaged optical connector

Abstract

The utility model relates to optical module technical field discloses a kind of co-encapsulation optical connectors, including support base, fiber array structure, high-precision thermal stability base and connecting piece;Wherein, fiber array structure is fixedly connected on support base, and micro-lens array structure is fixedly connected in support base front end, and micro-lens array structure is correspondingly arranged with fiber array structure;High-precision thermal stability base is used to integrate together with fiber array structure and electric chip cooperation, and support base is positioned and connected with high-precision thermal stability base by positioning member;Connecting piece is arranged on support base, and support base is detachably connected with high-precision thermal stability base by connecting piece.The utility model realizes multi-channel density and compactness, supports pluggable operation, significantly improves the performance, energy efficiency and reliability of high-speed interconnection system, solves the problems of traditional optical module technology, such as low power consumption, density and space utilization, and high cost, realizes to improve transmission efficiency, reduce power consumption and other problems.

Description

Technical Field

[0001] This utility model relates to the field of optical module technology, and in particular to a co-packaged optical connector. Background Technology

[0002] With the explosive growth of data center traffic, traditional optical module technologies (such as pluggable optical modules) are facing bottlenecks in terms of bandwidth, power consumption, density and space utilization, signal delay and loss, and cost, which affect transmission efficiency and result in high power consumption.

[0003] Co-Packaged Optics (CPO) technology integrates optical devices and electronic chips into the same package, which can significantly improve transmission efficiency and reduce power consumption. It is a key technology for next-generation high-speed interconnects. In CPO technology, optical connectors play the role of connecting optical devices (such as lasers, photodetectors, etc.) to optical fibers, and their performance directly affects the transmission efficiency and reliability of the system.

[0004] Therefore, there is an urgent need for a co-packaged optical connector to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a co-packaged optical connector to solve the problems existing in the prior art.

[0006] To achieve the above objectives, this utility model provides the following solution: This utility model provides a co-packaged optical connector, comprising:

[0007] Support base;

[0008] An optical fiber array structure is fixedly connected to the support base, and a microlens array structure is fixedly connected to the front end of the support base. The microlens array structure is arranged correspondingly to the optical fiber array structure.

[0009] A high-precision thermally stable base is used to integrate the fiber array structure with the electrical chip. The high-precision thermally stable base is provided with a positioning element, and the support base is positioned and connected to the high-precision thermally stable base through the positioning element.

[0010] A connector is provided on the support base, and the support base is detachably connected to the high-precision thermally stable base through the connector.

[0011] According to the present invention, a co-packaged optical connector is provided, wherein the fiber array structure includes a plurality of optical fibers, and the plurality of optical fibers are mounted axially on the support base.

[0012] According to the present invention, a co-packaged optical connector is provided, wherein the support base includes a support platform and a cover plate, the top of the support platform is provided with a plurality of V-shaped grooves at equal intervals along the axial direction, the optical fiber is located in the V-shaped grooves, and the cover plate is connected to the support platform to press the optical fiber.

[0013] According to the present invention, a co-packaged optical connector is provided, wherein the microlens array structure includes a frame, an elongated hole is provided on the frame, and a plurality of microlenses are fixedly connected in the elongated hole along the circumferential direction, and the optical fiber is correspondingly arranged with the microlenses.

[0014] According to the present invention, a co-packaged optical connector includes a first magnet slot formed on the support platform and a second magnet slot formed on the high-precision thermally stable base. Magnets are fixedly connected in both the first magnet slot and the second magnet slot, and the two magnets attract each other.

[0015] According to the present invention, a co-packaged optical connector includes a positioning element comprising a first ceramic sleeve fixedly connected to both ends of a high-precision thermally stable base, a positioning pin fixedly connected inside the first ceramic sleeve, and a second ceramic sleeve fixedly connected to both ends of the support platform and the cover plate, wherein the positioning pin extends into the second ceramic sleeve.

[0016] According to the present invention, a co-packaged optical connector is provided, wherein the microlens is a convex square structure.

[0017] Compared with the prior art, the present invention has the following advantages and technical effects:

[0018] This utility model provides a co-packaged optical connector. A fiber optic array structure is mounted on a support base, and a microlens array structure is mounted on the support base and correspondingly positioned to the fiber optic array structure. The support base and a high-precision thermally stable base are connected via connectors and positioning components. After connection, the fiber optic array and the electrical chip are integrated together. This application achieves multi-channel density and compactness, supports pluggable operation, and significantly improves the performance, energy efficiency, and reliability of high-speed interconnect systems. It solves the problems of low bandwidth, power consumption, density, space utilization, and high cost of traditional optical module technologies, such as pluggable optical modules, thereby improving transmission efficiency and reducing power consumption. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the support base structure of this utility model;

[0022] Figure 3 This is a schematic diagram of the overall structure of the microlens array structure of this utility model;

[0023] Figure 4 This is a schematic diagram of the high-precision thermally stable base structure of this utility model;

[0024] Figure 5 This is a schematic diagram of the parallel optical field manipulation light output of this utility model;

[0025] Among them, 1. Support base; 11. Support platform; 12. Cover plate; 2. Fiber optic array structure; 3. High-precision thermally stable base; 4. Microlens array structure; 41. Frame; 42. Microlens; 5. Positioning component; 51. First ceramic sleeve; 52. Positioning pin; 53. Second ceramic sleeve; 6. First magnet groove; 7. Second magnet groove. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0028] Reference Figures 1-5 This utility model provides a co-packaged optical connector, comprising:

[0029] Support base 1;

[0030] The fiber array structure 2 is fixedly connected to the support base 1. The front end of the support base 1 is fixedly connected to the microlens array structure 4, and the microlens array structure 4 is set to correspond to the fiber array structure 2.

[0031] The high-precision thermal stability base 3 is used to integrate the fiber array structure 2 with the electrical chip. The high-precision thermal stability base 3 is equipped with a positioning element 5, and the support base 1 is positioned and connected to the high-precision thermal stability base 3 through the positioning element.

[0032] A connector is provided on the support base 1, and the support base 1 is detachably connected to the high-precision thermally stable base 3 through the connector.

[0033] In one embodiment of this utility model, an optical fiber array structure 2 is provided on the support base 1 to form an optical fiber array. A microlens array structure 4 is installed on the support base 1 and is correspondingly arranged with the optical fiber array structure 2. The support base 1 and the high-precision thermally stable base 3 are docked through the provided connectors and positioning components. After docking, the optical fiber array and the electrical chip are integrated together, which alleviates positioning tolerance, improves connector return loss, and improves device performance.

[0034] As an optional implementation, the fiber array structure 2 includes a plurality of optical fibers, which are mounted axially on the support base 1.

[0035] In one embodiment of this utility model, a fiber array composed of several optical fibers is connected to a microlens array structure 4.

[0036] As an optional implementation, the support base 1 includes a support platform 11 and a cover plate 12. The top of the support platform 11 is provided with a plurality of V-shaped grooves at equal intervals along the axial direction. The optical fiber is located in the V-shaped grooves. The cover plate 12 is connected to the support platform 11 to press the optical fiber.

[0037] In one embodiment of this utility model, the optical fiber is placed in a V-groove, and a cover plate 12 is used to press the optical fiber together. By applying adhesive, the V-groove, the optical fiber, and the cover plate 12 are precisely tangent to achieve high channel density and compactness.

[0038] As an optional implementation, the microlens array structure 4 includes a frame 41 with an elongated hole. Several microlenses 42 are fixedly connected circumferentially inside the elongated hole, and optical fibers are correspondingly arranged with the microlenses 42.

[0039] In one embodiment of this utility model, a plurality of microlenses 42 form a microlens array corresponding to the optical fiber array. Through an adhesive bonding process, the microlenses 42 are directly bonded to the FA, which alleviates the positioning tolerance from + / -0.5um to + / -5um, improves the reliability of the device, and reduces the difficulty and cost.

[0040] In one embodiment of this utility model, the high-precision microlens array is made of silicon material. On one surface, there are multiple protruding square-shaped microlenses 42. Its working principle is that the high-precision microlens array independently divides and controls the light wavefront through densely arranged micron-level lens units to achieve parallel light field manipulation and light output. The lenses are attached to the fiber end face of the fiber array to output light.

[0041] As an optional implementation, the connector includes a first magnet groove 6 formed on the support platform 11 and a second magnet groove 7 formed on the high-precision thermally stable base 3. Magnets are fixedly connected in both the first magnet groove 6 and the second magnet groove 7, and the two magnets attract each other.

[0042] In one embodiment of this utility model, the magnets on the support base 1 and the high-precision thermally stable base 3 attract each other, enabling convenient connection and disassembly of the support base 1 and the high-precision thermally stable base 3.

[0043] As an optional implementation, the positioning component 5 includes a first ceramic sleeve 51 fixedly connected to both ends of the high-precision thermally stable base 3, a positioning pin 52 fixedly connected inside the first ceramic sleeve 51, and a second ceramic sleeve 53 fixedly connected to both ends between the support platform 11 and the cover plate 12, with the positioning pin 52 extending into the second ceramic sleeve 53.

[0044] In one embodiment of this utility model, a positioning pin 52 is inserted into the corresponding second ceramic sleeve 53 to achieve precise positioning and docking between the support base 1 and the high-precision thermally stable base 3.

[0045] As an alternative implementation, the microlens 42 has a protruding square structure.

[0046] A method for manufacturing a co-packaged optical connector, comprising the following steps:

[0047] The fiber array structure 2 is fixedly connected to the support base 1;

[0048] The microlens array structure 4 is mounted on the support base 1 and docked with the fiber array structure 2.

[0049] The support base 1 and the high-precision thermally stable base 3 are connected by connectors and positioning components to achieve assembly.

[0050] In one embodiment of this utility model, the base is made by high-precision engraving and grinding processes. After processing, the thickness of the processed material is tested using a free spectrum range to ensure that the precision meets the high accuracy requirements. Ceramic sleeves are installed on both bases, and positioning pins 52 extend into the ceramic sleeves. Magnets are embedded in the bases.

[0051] Multiple optical fibers are fixed on a V-groove with precise spacing and arrangement. Then, a cover plate 12 is used to press the optical fibers together. By applying adhesive, the V-groove, optical fibers, and cover plate 12 are precisely tangent to achieve high channel density and compactness. After curing, precise fiber end face processing is used to reduce the energy loss of optical signals during transmission.

[0052] A frame 41 with several microlenses 42 is mounted on a support base 1. The microlenses 42 are glued to the end face of the optical fiber. Through the glue bonding process, the microlenses 42 are directly attached to the FA, which alleviates the positioning tolerance from + / -0.5um to + / -5um, improves the reliability of the device, and reduces the difficulty and cost.

[0053] As an optional implementation, the front end of the fiber array structure 2 is ground and polished. First, a high-precision fiber optic cleaver is used to pre-treat the front end of the fiber array structure 2. Then, the front end of the fiber array structure 2 is subjected to rough grinding, fine polishing and oblique polishing in sequence. After polishing, multiple ultrasonic cleaning processes are performed.

[0054] In one embodiment of this invention, precision fiber end-face polishing is a key fiber processing technique. It aims to achieve an ultra-smooth, defect-free mirror finish on the fiber end face through fine grinding and polishing, thereby minimizing insertion loss and return loss in optical signal transmission. First, a high-precision fiber cleaver is used for pre-treatment of the fiber to ensure initial flatness of the end face. Then, multi-stage grinding processes, such as rough grinding, fine polishing, and oblique polishing, are performed. The polishing machine pressure is precisely controlled to prevent fiber deformation under pressure. After polishing, multiple ultrasonic cleaning processes are conducted, using ultrasonic oscillation in deionized water to remove submicron-sized particles. An interferometer is used to monitor the polishing process to ensure the end face meets requirements.

[0055] As an optional implementation, the front end face of the fiber array structure 2 is bonded to the microlens array structure 4 using an adhesive bonding process.

[0056] In one embodiment of this utility model, the smooth surface of the microlens 42 is bonded to the end face of the optical fiber using an adhesive bonding process. Light comes out from 38 optical fibers, passes through the end face of the optical fibers, and is then transmitted to the microlens 42 for light output.

[0057] This invention provides a co-packaged optical connector and its manufacturing method. Through a high-density connection design, it supports multi-channel connections such as 38 / 48 / 72. It adopts a thermal stability design, selects high-temperature resistant materials to adapt to high-density integration environments, and uses a high-precision alignment process to achieve an alignment accuracy of 0.1-0.5um error. Furthermore, through the interaction of a high-precision ceramic sleeve and a high-precision stainless steel positioning pin, it achieves a repeatedly pluggable and pluggable effect, thus realizing the manufacturing of a co-packaged optical connector.

[0058] This invention achieves multi-channel density and compactness through the collaborative design of a high-density fiber array, a high-precision microlens array, and a high-precision thermal stability base, supports pluggable operation, and significantly improves the performance, energy efficiency, and reliability of high-speed interconnect systems.

[0059] Using a microlens array to directly bond the FA alleviates positioning tolerances from + / -0.5µm to + / -5µm, improving device reliability and reducing difficulty and cost.

[0060] By using a shaped microlens to bond with a wedge-shaped FA, the return loss of the connector is improved from 30dB to >50dB. This avoids crosstalk with the optical chip in the CPO module, thus improving device performance.

[0061] It uses a magnetic connection with a positioning pin for quick, convenient, and accurate positioning.

[0062] For glass or silicon substrates, FSR measurements are used to precisely control the width, ensuring high-precision dimensional control.

[0063] High reliability and long-term stability: The high-density fiber optic array, high-precision microlens array, and high-precision base are all made of materials with matching thermal expansion coefficients to ensure that alignment accuracy is maintained under temperature changes or mechanical vibration.

[0064] In the description of this utility model, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0065] The embodiments described above are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Various modifications and improvements made to the technical solutions of the present utility model by those skilled in the art without departing from the spirit of the present utility model should fall within the protection scope defined by the claims of the present utility model.

Claims

1. A co-packaged optical connector, characterized in that, include: Support base (1); The fiber array structure (2) is fixedly connected to the support base (1). The front end of the support base (1) is fixedly connected to the microlens array structure (4). The microlens array structure (4) is correspondingly arranged with the fiber array structure (2). A high-precision thermally stable base (3) is used to integrate the fiber array structure (2) with the electrical chip. The high-precision thermally stable base (3) is provided with a positioning element (5). The support base (1) is positioned and connected to the high-precision thermally stable base (3) through the positioning element. A connector is provided on the support base (1), and the support base (1) is detachably connected to the high-precision thermally stable base (3) through the connector.

2. The co-packaged optical connector according to claim 1, characterized in that: The fiber array structure (2) includes a plurality of optical fibers, which are mounted axially on the support base (1).

3. The co-packaged optical connector according to claim 1, characterized in that: The support base (1) includes a support platform (11) and a cover plate (12). The top of the support platform (11) is provided with several V-shaped grooves at equal intervals along the axial direction. The optical fiber is located in the V-shaped grooves. The cover plate (12) is connected to the support platform (11) to press the optical fiber.

4. The co-packaged optical connector according to claim 1, characterized in that: The microlens array structure (4) includes a frame (41), an elongated hole is provided on the frame (41), and a plurality of microlenses (42) are fixedly connected in the elongated hole along the circumferential direction. The optical fiber is arranged correspondingly to the microlenses (42).

5. A co-packaged optical connector according to claim 3, characterized in that: The connector includes a first magnet groove (6) on the support platform (11) and a second magnet groove (7) on the high-precision thermally stable base (3). Magnets are fixedly connected in both the first magnet groove (6) and the second magnet groove (7), and the two magnets attract each other.

6. A co-packaged optical connector according to claim 3, characterized in that: The positioning component (5) includes a first ceramic sleeve (51) fixedly connected to both ends of the high-precision thermally stable base (3), a positioning pin (52) fixedly connected inside the first ceramic sleeve (51), and a second ceramic sleeve (53) fixedly connected to both ends of the support platform (11) and the cover plate (12), with the positioning pin (52) extending into the second ceramic sleeve (53).

7. A co-packaged optical connector according to claim 1, characterized in that: The microlens (42) has a convex square structure.

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