A light module heat sink

Abstract

The utility model provides a kind of optical module heat dissipation device, comprising: optical module main body, its top end is equipped with heat conduction piece and heat conduction piece bottom end is fixedly attached with optical module main body outer wall, and heat conduction piece top end is equipped with heat dissipation groove;Wavy radiator, be in heat dissipation groove, wavy radiator is formed by a plurality of several type heat dissipation fins and cross section is in succession sinusoidal wave, and the recess of each several type heat dissipation fin forms first heat dissipation air duct, and second heat dissipation air duct is formed between every two adjacent several type heat dissipation fins, and the fin heat dissipation surface in the valley of in succession sinusoidal wave of each several type heat dissipation fin is fixedly welded with the bottom end inner wall of heat dissipation groove;Cover plate, cover is equipped in wavy radiator top end, and the fin heat dissipation surface in the crest of in succession sinusoidal wave of each several type heat dissipation fin is fixedly welded with the bottom end of cover plate.Arrangement has the beneficial effect that the utility model can optimize airflow path increase effective heat dissipation area, realize the efficient stable heat dissipation of optical module.

Description

Technical Field

[0001] This utility model relates to the technical field of optical modules, and more specifically, to a heat dissipation device for optical modules. Background Technology

[0002] As a core component of optical communication systems, optical modules generate a significant amount of heat during operation. If this heat cannot be dissipated in time, the internal temperature of the optical module will rise, severely affecting the wavelength stability of the laser, the transmission power, and the sensitivity of the receiver. This, in turn, threatens the performance and reliability of the entire optical communication link and shortens the lifespan of the optical module. With the development of data centers towards higher speeds and higher densities, the power consumption and heat generation of optical modules are increasing daily, posing even greater challenges to heat dissipation technology.

[0003] Traditional cooling solutions typically place the heatsink and cover on top of the optical module. However, these traditional heatsinks mostly use flat or simply shaped heatsink fins, which have significant limitations. First, their heatsink fin structure is simple, with a limited effective heat dissipation area, resulting in low efficiency in heat exchange with the cooling airflow. Second, this simple fin layout has poor airflow guidance, easily creating significant wind resistance. This forces the system fan to consume more energy to maintain the required airflow, and under high wind resistance, the actual airflow speed through the heat dissipation channel decreases, further weakening the effect of forced convection cooling.

[0004] In addition, the heat conduction path between the heat sink and the heat-conducting substrate and cover plate in the existing technology is often not optimized enough, and there may be connection points with high thermal resistance, which prevents heat from being transferred quickly and evenly from the optical module body to the entire heat dissipation surface, forming local hot spots.

[0005] Therefore, there is an urgent need for a new type of optical module heat dissipation device that can significantly increase the effective heat dissipation area within a limited space, while optimizing the airflow path to reduce wind resistance and constructing multiple efficient and reliable heat conduction paths, thereby achieving efficient and stable heat dissipation for high-power optical modules. Utility Model Content

[0006] The technical problem to be solved by this utility model is how to optimize the airflow path to increase the effective heat dissipation area and achieve efficient and stable heat dissipation of the optical module. In order to overcome the defects of the above-mentioned prior art (or related technology), this utility model provides an optical module heat dissipation device.

[0007] This utility model provides a heat dissipation device for an optical module, comprising: An optical module body, wherein a heat-conducting component is provided at the top of the optical module body and the bottom end of the heat-conducting component is attached and fixed to the outer wall of the optical module body, and a heat dissipation groove is formed at the top of the heat-conducting component; A wave-shaped radiator is disposed in the heat dissipation groove. The two ends of the wave-shaped radiator are the air inlet and the air outlet, respectively. The wave-shaped radiator is formed by sequentially splicing multiple Z-shaped heat dissipation fins. The cross-section of the wave-shaped radiator is a continuous sine wave. The groove of each Z-shaped heat dissipation fin forms a first heat dissipation channel, and the space between two adjacent Z-shaped heat dissipation fins forms a second heat dissipation channel. The heat dissipation surface of each Z-shaped heat dissipation fin located at the trough of the continuous sine wave is welded and fixed to the bottom inner wall of the heat dissipation groove. A cover plate is placed on top of the wave-shaped radiator, and the heat dissipation surface of each of the zigzag heat dissipation fins located at the peak of a continuous sine wave is welded and fixed to the bottom end of the cover plate.

[0008] Compared with the prior art, the optical module heat dissipation device proposed in this application has the following advantages: In this application, a compact, robust, and efficient heat dissipation structure is formed by embedding a wave-shaped heat sink within the heat dissipation groove of the heat-conducting component and encapsulating it together with a cover plate. This heat dissipation structure ensures that heat is efficiently conducted from the optical module body to the heat-conducting component, and then to the entire wave-shaped heat sink, where it is ultimately carried away by forced convection. The dual-channel design, which combines a first heat dissipation channel and a second heat dissipation channel, maximizes the effective heat dissipation area and efficiency. The continuous sinusoidal cross-section of the wave-shaped heat sink, along with its clearly defined inlet and outlet, provides a smooth and continuous flow path for the cooling airflow, optimizing the airflow path. Compared to traditional rectangular or simple-shaped heat dissipation fins, this design effectively reduces airflow resistance, resulting in higher airflow speeds or greater airflow at the same air volume or fan power, thereby enhancing the effect of forced convection cooling.

[0009] In one possible implementation, the wave-shaped radiator is made of 0.25mm thick copper sheet metal and is obtained through integral stamping.

[0010] In one possible implementation, the thermal conductivity of the copper sheet metal is not less than 380 W / (m·K), and the surface of the copper sheet metal is electroplated.

[0011] Compared with existing technologies, the above-mentioned technical solution can utilize the high thermal conductivity of copper sheet metal to ensure that heat can be rapidly diffused within the entire wave-shaped heat sink, avoiding the generation of local hot spots and making full use of the effective heat dissipation area; the 0.25mm thickness allows the wave-shaped heat sink to achieve lightweight and compact design while ensuring structural strength, making it very suitable for space-sensitive optical module applications; electroplating treatment can effectively prevent oxidation, corrosion or sulfidation of the copper sheet metal surface during long-term use, maintaining its good appearance and thermal conductivity, and extending the service life and reliability of the heat dissipation device.

[0012] In one possible implementation, the wave-shaped radiator is formed by splicing 14 of the above-mentioned zigzag heat dissipation fins, the number of the first heat dissipation air ducts is 7, and the number of the second heat dissipation air ducts is 8.

[0013] Compared with existing technologies, the above technical solution can clearly define the specific structure of the wave-shaped radiator and the number and configuration of the first and second heat dissipation air ducts, so as to achieve the best balance between effective heat dissipation area and wind resistance in a limited space, and ensure that the heat dissipation performance meets the requirements.

[0014] In one possible implementation, the vertical length of each of the zigzag heat dissipation fins is 4 mm.

[0015] In one possible implementation, the spacing between any two adjacent zigzag heat dissipation fins is 2.78 mm.

[0016] In one possible implementation, the top of the heat-conducting component is provided with two support plates, and the two support plates are arranged at both ends of the air inlet of the wave-shaped heat sink. One end of the two Z-shaped heat dissipation fins on the outer side is welded and fixed to the inner wall of the corresponding support plate.

[0017] Compared with the existing technology, the above technical solution can provide additional welding fixing points for both ends of the wave-shaped radiator by setting support plates, which enhances the mechanical stability of the entire heat dissipation device when subjected to vibration or impact, and prevents the wave-shaped radiator from loosening or deforming in the flow channel. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the exploded structure of this utility model; Figure 3 This is a cross-sectional schematic diagram of the wave-shaped radiator of this utility model; Explanation of reference numerals in the attached figures: 1. Optical module body; 2. Thermal conductive component; 3. Heat dissipation groove; 4. Wave-shaped heat sink; 5. Z-shaped heat dissipation fins; 6. First heat dissipation air duct; 7. Second heat dissipation air duct; 8. Cover plate; 9. Support plate. Detailed Implementation

[0019] First, those skilled in the art should understand that these embodiments are merely used to explain the technical principles of the embodiments of this application and are not intended to limit the scope of protection of the embodiments of this application. Those skilled in the art can make adjustments as needed to adapt to specific application scenarios.

[0020] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0021] See Figures 1-3 This application discloses an optical module heat dissipation device, mainly including an optical module body 1, a heat-conducting component 2, a heat dissipation groove 3, a wave-shaped heat sink 4, and a cover plate 8. In terms of structural assembly and spatial relationship, the heat-conducting component 2 is fixedly installed at the top of the optical module body 1, and its bottom end is in close physical contact and thermal connection with the outer shell of the optical module body 1 through thermal grease or welding, so as to ensure that heat can be conducted from the optical module body 1 to the heat-conducting component 2 with low resistance. The top of the heat-conducting component 2 is precision machined with a heat dissipation groove 3, which is used to accurately position and accommodate the core heat dissipation components. The wave-shaped heat sink 4 is stably installed in this heat dissipation groove 3, and its two ends form an air inlet for airflow entry and an air outlet for airflow exit in the longitudinal direction, respectively. The key to the design lies in the innovative structure of the wave-shaped heat sink 4, which is composed of multiple independent Z-shaped heat sink fins 5 spliced ​​together along its length to form an overall structure with a continuous sine wave cross-section. To achieve the optimal heat conduction path, the heat dissipation surface of each Z-shaped heat sink fin 5 located at the trough of the continuous sine wave is welded and fixed to the bottom inner wall of the heat sink 3 with high thermal conductivity solder paste. At the same time, the heat dissipation surface of the fin located at the peak of the continuous sine wave is also welded and fixed to the bottom of the cover plate 8 covering it with solder paste. This dual welding structure of "trough-bottom of the sink" and "peak-cover plate" together constitutes a closed heat dissipation module with high mechanical strength and short heat conduction path.

[0022] In this embodiment, the unique structure of the wave-shaped radiator 4 naturally forms a two-stage high-efficiency forced cooling airflow system in terms of functional airflow and heat dissipation principle. The first cooling airflow 6 is formed inside the groove of each of the Z-shaped heat dissipation fins 5. When the airflow passes through, it fully exchanges heat with the inner wall of the Z-shaped heat dissipation fins 5. The second cooling airflow 7 is formed in the gap between two adjacent Z-shaped heat dissipation fins 5. These airflows are the main channels for airflow. The first cooling airflow 6 and the second cooling airflow 7 are connected in parallel to form a forced cooling flow channel. During operation, the cooling airflow flows from... Air is blown in through the inlet and flows in parallel through all these first cooling ducts 6 and second cooling ducts 7, finally exiting from the outlet. During this process, the unique structure of the wave-shaped radiator 4 brings two core advantages: First, the continuous sine wave design greatly increases the effective heat dissipation surface area within a limited space; second, the airflow path of the continuous sine wave smooths the fluid movement and significantly optimizes the wind resistance characteristics. These two factors work together to achieve a leap in heat dissipation efficiency, effectively suppressing the operating temperature rise of the optical module body 1, ensuring its stable performance and reliable operation, and extending its service life.

[0023] In this embodiment, the wave-shaped radiator 4 is fixed to the heat-conducting component 2 by soldering with solder paste, and the cover plate 8 is also fixed to the wave-shaped radiator 4 by soldering with solder paste.

[0024] In this embodiment of the application, the continuous sinusoidal waveform cross-section of the wave-shaped heat sink can actually be understood as a waveform similar to a modified sine wave.

[0025] In this embodiment, the wave-shaped heat sink 4 is made of 0.25mm thick copper sheet metal using an integrated stamping process. The thermal conductivity of the copper sheet metal is ≥380W / (m·K), and the surface is electroplated to improve long-term stability. The vertical height of the Z-shaped heat sink fins 5 is 4mm, the spacing between two adjacent Z-shaped heat sink fins 5 is 2.78mm, and there are 14 Z-shaped heat sink fins 5. These 14 Z-shaped heat sink fins 5 can form 15 parallel flow channels, specifically 7 first heat dissipation air channels 6 and 8 second heat dissipation air channels 7. The width of the first heat dissipation air channels 6 and the second heat dissipation air channels 7 is 1.4mm. The effective heat dissipation area is increased by 40-60% compared with the traditional heat sink fin structure. At an airflow of 3cfm, the wind resistance is reduced by 15%, and the heat dissipation capacity can reach more than 35W.

[0026] In this embodiment, during the operation of the optical module body 1, the heat generated by the optical module body 1 is rapidly transferred to the heat-conducting component 2. The heat-conducting component 2 conducts the heat to the wave-shaped heat sink 4. Due to the special structure of the first heat dissipation channel 6 and the second heat dissipation channel 7 inside the wave-shaped heat sink 4, it has a large effective heat dissipation area. At the same time, the wind resistance is optimized. The forced convection fluid flows through the forced heat dissipation channel formed by the heat-conducting component 2, the wave-shaped heat sink 4 and the cover plate 8, which quickly carries away the heat and effectively reduces the temperature of the optical module body 1.

[0027] In this embodiment, the top of the heat-conducting component 2 is provided with two support plates 9, and the two support plates 9 are arranged at both ends of the air inlet of the wave-shaped radiator 4. One end of the two Z-shaped heat dissipation fins 5 on the outer side is welded and fixed to the inner wall of the corresponding support plate 9.

[0028] In the description of this application, the references to terms such as "an embodiment," "some embodiments," "in this embodiment," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0029] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation device for an optical module, characterized in that, include: A light module body (1) is provided with a heat-conducting component (2) at the top and the bottom end of the heat-conducting component (2) is attached and fixed to the outer wall of the light module body (1). A heat dissipation groove (3) is opened at the top of the heat-conducting component (2). A wave-shaped radiator (4) is disposed in the heat dissipation groove (3). The two ends of the wave-shaped radiator (4) are the air inlet and the air outlet, respectively. The wave-shaped radiator (4) is formed by splicing multiple Z-shaped heat dissipation fins (5) in sequence. The cross-section of the wave-shaped radiator (4) is a continuous sine wave. A first heat dissipation channel (6) is formed in the groove of each Z-shaped heat dissipation fin (5). A second heat dissipation channel (7) is formed between two adjacent Z-shaped heat dissipation fins (5). The heat dissipation surface of the fins in each Z-shaped heat dissipation fin (5) at the trough of the continuous sine wave is welded and fixed to the bottom inner wall of the heat dissipation groove (3). A cover plate (8) is placed on the top of the wave-shaped radiator (4), and the heat dissipation surface of each of the zig-shaped heat dissipation fins (5) located at the peak of a continuous sine wave is welded and fixed to the bottom end of the cover plate (8).

2. The optical module heat dissipation device according to claim 1, characterized in that, The wave-shaped radiator (4) is made of 0.25mm thick copper sheet metal and is obtained by one-piece stamping.

3. The optical module heat dissipation device according to claim 2, characterized in that, The thermal conductivity of the copper sheet metal is not less than 380 W / (m·K), and the surface of the copper sheet metal is electroplated.

4. The optical module heat dissipation device according to claim 1, characterized in that, The wave-shaped radiator (4) is formed by splicing together 14 of the above-mentioned zigzag heat dissipation fins (5), the number of the first heat dissipation air ducts (6) is 7, and the number of the second heat dissipation air ducts (7) is 8.

5. The optical module heat dissipation device according to claim 1, characterized in that, The vertical length of each of the above-mentioned zigzag heat dissipation fins (5) is 4mm.

6. The optical module heat dissipation device according to claim 1, characterized in that, The spacing between the two adjacent zigzag heat dissipation fins (5) is 2.78 mm.

7. The optical module heat dissipation device according to claim 1, characterized in that, The top of the heat-conducting component (2) is provided with two support plates (9), and the two support plates (9) are arranged at both ends of the air inlet of the wave-shaped radiator (4). One end of the two zig-shaped heat dissipation fins (5) on the outer side is welded and fixed to the inner wall of the corresponding support plate (9).

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