Microscope observation auxiliary device for semiconductor devices
By designing auxiliary devices for the base, pillars, and clamping components, the problem of unclear imaging caused by pin deformation or chip detachment from the substrate during microscope observation of semiconductor devices was solved, enabling clear observation of devices and rapid defect identification.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- MEASUREMENT & TESTING TECH RES INST OF HUBEI AEROSPACE TECH RES INST
- Filing Date
- 2025-07-17
- Publication Date
- 2026-07-21
AI Technical Summary
Existing microscope observation platforms cannot provide clear images when semiconductor device pins are deformed or chips detach from the substrate, making defect identification difficult.
An auxiliary device comprising a base, a column, and a clamping assembly was designed. Utilizing a spherical crown-shaped blind hole, a connecting rod, and a toothed bayonet structure, it achieves stable clamping and multi-angle observation of semiconductor devices. By adjusting the angle of the clamping assembly and the focus of the microscope, clear chip imaging is ensured.
It enables clear observation and rapid defect identification of semiconductor devices with different packages, and features a simple structure, easy assembly, and convenient operation.
Smart Images
Figure CN224536270U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the inspection of semiconductor components, specifically an auxiliary device for microscopic observation of semiconductor devices. Background Technology
[0002] Semiconductor devices are widely used in smartphones, communication technologies, and the medical field, forming the foundation of modern electronic devices. Microscopic observation is a common method for inspecting semiconductor components for defects. According to standards, the magnification for microscopic observation of semiconductor devices is generally no less than 10. However, for defects requiring quantitative criteria, the magnification should be based on the ability to identify the corresponding quantity. When the specified magnification cannot clearly determine the nature of a suspected defect, the magnification should be increased or other measures should be taken. Existing microscope observation platforms often only allow for linear movement of the device in the XYZ directions. While this usually provides relatively good observation of semiconductor devices, special circumstances can arise in practice. For example, deformed or missing semiconductor component leads, or chips detaching from the substrate, can result in uneven surfaces during microscopic observation, making clear imaging impossible and thus hindering the determination of any suspected defects. This introduces a risk into the testing process.
[0003] To address the aforementioned shortcomings of existing technologies, this invention proposes an auxiliary device for microscopic observation of semiconductor devices that is simple in structure, easy to assemble, and convenient to operate. Using this invention facilitates clear observation and rapid defect identification of semiconductor devices with different packages. Utility Model Content
[0004] The purpose of this invention is to provide an auxiliary device for microscopic observation of semiconductor devices that is simple in structure, easy to assemble, and convenient to operate.
[0005] To achieve the above objectives, the present invention adopts the following technical solution:
[0006] An auxiliary device for microscopic observation of semiconductor devices includes a base, a column, and a clamping assembly. The base has an eurygmus-shaped blind hole; the column includes a connecting rod and an eurygmus-shaped crown; the clamping assembly includes a base plate, a fixed locking strip, a movable locking strip, and a stop. The base plate has a guide rail and a spring groove. The fixed locking strip and the stop are fixed to the left and right ends of the base plate, respectively. The bottom of the movable locking strip has a sliding groove, allowing it to be positioned on the guide rail and move laterally along it. A spring is placed in the spring groove, with its two ends connected to the movable locking strip and the stop, respectively. The inner side of the fixed locking strip has a first toothed notch, and the side of the movable locking strip opposite to the fixed locking strip has a second toothed notch. The top of the connecting rod is connected to the bottom of the base plate. The eurygmus-shaped crown engages with the eurygmus-shaped blind hole, allowing it to be positioned within the blind hole and rotate or stop.
[0007] Furthermore, the guide rail has two sections, located on both sides of the spring groove.
[0008] Furthermore, the spring is a helical compression spring.
[0009] Furthermore, the tip angles of both the first and second toothed bayonets are 90 degrees. 0 -120 0 .
[0010] The working process of this utility model is as follows: Drag the movable locking strip to the right until the distance between it and the fixed locking strip is greater than the width of the semiconductor device to be observed. Place the semiconductor device to be observed between the toothed jaws of the fixed and movable locking strips. Release the movable locking strip so that it clamps the semiconductor device to be observed with the fixed locking strip. Place this utility model on a microscope observation platform and observe the device under the microscope. If the chip inside the device cannot be clearly imaged, focus the microscope upwards. If the chip image gradually becomes clearer from left to right, it indicates that the chip is lower on the left and higher on the right. At this time, slightly rotate the clamping assembly clockwise so that the observer can find an angle under the microscope where the chip appears as a plane when viewed from the Z direction. At this point, the chip can be clearly imaged under the microscope.
[0011] Using this invention facilitates clear observation and rapid identification of defects in semiconductor devices with different packages.
[0012] This utility model has a simple structure, is easy to assemble, and is convenient to operate. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the structure of this utility model;
[0014] Figure 2 This is a schematic diagram of the structure of the base of this utility model;
[0015] Figure 3 This is a schematic diagram of the structure of the column of this utility model;
[0016] Figure 4 This is a schematic diagram of the structure of the movable card strip of this utility model.
[0017] In the figure: 1-base; 1.1-eurygmus crown-shaped blind hole; 2-column; 2.1-connecting rod; 2.2-eurygmus crown; 3-clamping assembly; 3.1-base plate; 3.1.1-guide rail; 3.1.2-spring groove; 3.2-fixing clip; 3.2.1-first toothed jaw; 3.3-moving clip; 3.3.1-slide groove; 3.3.2-second toothed jaw; 3.4-stop; 4-spring. Detailed Implementation
[0018] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments, but these embodiments should not be construed as limiting the present invention.
[0019] The auxiliary device for microscopic observation of semiconductor devices shown in the figure includes a base 1, a column 2, and a clamping assembly 3. The base 1 has an eurygmus-shaped blind hole 1.1. The column 2 includes a connecting rod 2.1 and an eurygmus-shaped crown 2.2. The clamping assembly 3 includes a base plate 3.1, a fixed clamping strip 3.2, a movable clamping strip 3.3, and a stop block 3.4. The base plate 3.1 has a guide rail 3.1.1 and a spring groove 3.1.2. The fixed clamping strip 3.2 and the stop block 3.4 are fixed to the left and right ends of the base plate 3.1, respectively. The bottom of the movable clamping strip 3.3 has a sliding groove 3.3.1, through which the movable clamping strip 3.3.1 connects with the guide rail. The guide rail 3.1.1 is placed on the guide rail 3.1.1 and can move left and right along the guide rail 3.1.1. The spring 4 is placed in the spring groove 3.1.2. The two ends of the spring 4 are connected to the movable retaining strip 3.3 and the stop block 3.4 respectively. The inner side of the fixed retaining strip 3.2 is provided with a first toothed retaining slot 3.2.1. The movable retaining strip 3.3 is provided with a second toothed retaining slot 3.3.2 on the side opposite to the fixed retaining strip 3.2. The top of the connecting rod 2.1 is connected to the bottom of the base plate 3.1. The eurygmus crown 2.2 is engaged with the eurygmus crown-shaped blind hole 1.1 so that the eurygmus crown 2.3 is located in the eurygmus crown-shaped blind hole 1.1 and can rotate or stop.
[0020] A preferred embodiment is that, in the above scheme, there are two guide rails 3.1.1, which are respectively located on both sides of the spring groove 3.1.2.
[0021] A preferred embodiment is that, in the above scheme, the spring 4 is a helical compression spring.
[0022] A preferred embodiment is that, in the above scheme, the tooth tip angles of both the first toothed jaw 3.2.1 and the second toothed jaw 3.3.2 are 90°. 0 -120 0 .
[0023] The contents not described in detail in this specification are existing technologies known to those skilled in the art.
Claims
1. An auxiliary device for microscopic observation of semiconductor devices, comprising a base (1), a column (2), and a clamping assembly (3), characterized in that: The base (1) is provided with an eurygmus crown-shaped blind hole (1.1), the column (2) includes a connecting rod (2.1) and an eurygmus crown (2.2), the clamping assembly (3) includes a base plate (3.1), a fixed clamping strip (3.2), a movable clamping strip (3.3) and a stop (3.4), the base plate (3.1) is provided with a guide rail (3.1.1) and a spring groove (3.1.2), the fixed clamping strip (3.2) and the stop (3.4) are respectively fixed at the left and right ends of the base plate (3.1), the bottom of the movable clamping strip (3.3) is provided with a sliding groove (3.3.1), the movable clamping strip (3.3) is placed on the guide rail (3) through the cooperation of the sliding groove (3.3.1) and the guide rail (3.1.1) (3.1.1). .1.1) can be moved left and right along the guide rail (3.1.1). The spring (4) is placed in the spring groove (3.1.2). The two ends of the spring (4) are connected to the movable locking strip (3.3) and the stop block (3.4) respectively. The inner side of the fixed locking strip (3.2) is provided with a first toothed slot (3.2.1). The movable locking strip (3.3) is provided with a second toothed slot (3.3.2) on the side opposite to the fixed locking strip (3.2). The top of the connecting rod (2.1) is connected to the bottom of the base plate (3.1). The eurygmus crown (2.2) cooperates with the eurygmus crown blind hole (1.1) so that the eurygmus crown (2.3) is located in the eurygmus crown blind hole (1.1) and can rotate or stop.
2. The auxiliary device for microscopic observation of semiconductor devices according to claim 1, characterized in that: There are two guide rails (3.1.1) located on both sides of the spring groove (3.1.2).
3. The auxiliary device for microscopic observation of semiconductor devices according to claim 1 or 2, characterized in that: The spring (4) is a helical compression spring.
4. The auxiliary device for microscopic observation of semiconductor devices according to claim 1 or 2, characterized in that: The tooth tip angles of both the first toothed notch (3.2.1) and the second toothed notch (3.3.2) are 90°. 0 -120 0 .
5. The auxiliary device for microscopic observation of semiconductor devices according to claim 3, characterized in that: The tooth tip angles of both the first toothed notch (3.2.1) and the second toothed notch (3.3.2) are 90°. 0 -120 0 .