Chip holder and processing cartridge

Abstract

Chip holder for fixing a chip having a substrate and an electrical contact arranged on one surface of the substrate, the chip holder comprising a baffle and two positioning portions respectively extending from the baffle, the two positioning portions are arranged in a spaced manner and form a mounting space between them for mounting the chip; the positioning portion comprises a side wall, an upper wall and a lower wall, the upper wall and the lower wall both extend from the side wall towards the mounting space, in the up-down direction, the electrical contact is exposed upwards between the two upper walls, the lower wall is below the upper wall, and the side opposite to the baffle is a mounting side, the mounting space is between the baffle and the mounting side, and the chip is mounted from the mounting side; the chip holder further comprises a resilient arm extending from the baffle towards the mounting side, when the chip is mounted, the substrate is clamped and fixed between at least part of the resilient arm and the whole of the upper wall, and the lower wall is arranged in a non-contact manner with the chip, the chip holder provided by the utility model can smoothly insert and take out the chip.

Description

Technical Field

[0001] This utility model relates to the field of electrophotographic imaging, and more particularly to a processing box that can be detachably installed in an electrophotographic imaging device and a chip holder located in the processing box. Background Technology

[0002] Processing cartridges are commonly used consumables in electrophotographic imaging equipment. Chips are key components for communication between the processing cartridge and the imaging equipment. They typically include a substrate and electrical contacts on the surface of the substrate. Chips need to be fixed by a bracket to ensure stable connection between the electrical contacts and the probes of the imaging equipment. The reliability of chip assembly directly affects whether the processing cartridge can work. To achieve better chip fixation, existing chip brackets generally adopt a gapless design where the lower surface of the chip substrate is completely fitted to the bracket base plate.

[0003] The design has problems in practical applications: when the chip is inserted or removed from the bracket, the lower surface of the substrate needs to slide and rub against the surface of the bracket base plate throughout the entire process. Excessive friction not only increases the operating resistance and makes it easy for the chip to get stuck in the installation path and not be able to be smoothly installed, but may also scratch the surface of the substrate or the area around the electrical contacts, affecting the chip's communication function. Utility Model Content

[0004] This utility model provides a chip scaffold that solves the above-mentioned technical problems. The specific solution is as follows:

[0005] A chip holder is used to fix a chip having a substrate and an electrical contact portion disposed on one surface of the substrate. The chip holder includes a baffle and two positioning portions extending from the baffle, the two positioning portions being spaced apart and forming a mounting space for mounting the chip. The positioning portions include a side wall, an upper wall, and a lower wall, both the upper and lower walls extending from the side wall toward the mounting space. Along the vertical direction, the electrical contact portion is exposed upward through the space between the two upper walls, and the lower wall is located below the upper walls. The side opposite to the baffle is the mounting side, and the mounting space is located between the baffle and the mounting side. The chip is mounted from the mounting side. The chip holder also includes an elastic arm extending from the baffle toward the mounting side. When the chip is mounted, the substrate is clamped and fixed between at least a portion of the elastic arm and the entire upper wall, and the lower wall and the chip are arranged in a non-contact manner.

[0006] In some embodiments, the elastic arm and the positioning part are spaced apart.

[0007] In some embodiments, the resilient arm includes a main body and a protrusion extending from the main body into the mounting space. When the chip is mounted, the protrusion supports the chip, and the main body does not contact the chip.

[0008] In some embodiments, the main body has a suspended surface and the lower wall has a lower wall surface. Along the vertical direction, the suspended surface is lower than the protrusion and the lower wall surface.

[0009] In some embodiments, the substrate has an upper surface and a lower surface disposed opposite to each other, an electrical contact portion is located on the upper surface of the substrate, the lower surface of the substrate does not contact the lower wall surface, and the baffle is provided with an exposed portion. When the chip is mounted to the chip holder, the lower surface of the exposed portion is lower than the upper surface of the substrate in the vertical direction.

[0010] In some embodiments, the lower surface of the exposed portion is flush with the middle portion of the substrate in the thickness direction.

[0011] In some embodiments, when viewed along a direction intersecting the vertical direction, the exposed lower surface, lower wall surface, and suspended surface are arranged from top to bottom.

[0012] This utility model also provides a processing box, which includes a processing box housing and a chip holder as described above, wherein the chip holder is disposed on the processing box housing.

[0013] In some embodiments, the processing box housing is provided with reinforcing ribs to enhance the strength of the housing, and the exposed portion is also provided with a first inclined surface intersecting the lower surface, the direction in which the first inclined surface extends is parallel to the direction in which at least a portion of the reinforcing ribs extends. Attached Figure Description

[0014] Figure 1 This is a perspective view of the processing box involved in this utility model.

[0015] Figure 2 and Figure 3 This is a three-dimensional view of the photosensitive housing and chip holder that are combined together according to this utility model.

[0016] Figure 4 This is a perspective view of the chip assembly involved in this utility model.

[0017] Figure 5 This is a cross-sectional view of the chip holder involved in this utility model after being cut along the rotation axis L1 of the photosensitive drum and in a direction perpendicular to both the vertical and horizontal directions.

[0018] Figure 6 This is a cross-sectional view of the chip support involved in this invention, taken along a direction parallel to the rotation axis L1 of the photosensitive drum and perpendicular to the surface of the chip substrate where the electrical contact portion is provided. Detailed Implementation

[0019] Figure 1 This is a perspective view of the processing box involved in this utility model; Figure 2 and Figure 3 This is a three-dimensional view of the photosensitive housing and chip holder that are combined together according to this utility model; Figure 4 This is a perspective view of the chip assembly involved in this utility model; Figure 5This is a cross-sectional view of the chip holder involved in this utility model after being cut along the rotation axis L1 of the photosensitive drum and in a direction that is perpendicular to both the vertical and horizontal directions. Figure 6 This is a cross-sectional view of the chip support involved in this invention, taken along a direction parallel to the rotation axis L1 of the photosensitive drum and perpendicular to the surface of the chip substrate where the electrical contact portion is provided.

[0020] like Figure 1 As shown, the processing cartridge C includes a photosensitive unit 1 and a developing unit 2 that are coupled together. The photosensitive unit 1 includes a photosensitive housing 11 and a photosensitive drum 12 rotatably disposed within the photosensitive housing 11. The developing unit 2 includes a developing housing 21 and a developing roller 22 rotatably disposed within the developing housing 21. The developing housing 21 is used to contain the developer required for imaging, and the developing roller 22 is used to carry the developer and supply it to the photosensitive drum 12. The surface of the photosensitive drum 12 is used to form an electrostatic latent image. The photosensitive drum 12 rotates about a first rotation axis L1, and the developing roller 22 rotates about a second rotation axis L2. The first rotation axis L1 and the second rotation axis L2 are parallel to each other. The developing unit 2 can be installed separately and detachably into the imaging device, or the photosensitive unit 1 and the developing unit 2 can be combined to form the processing cartridge C, and then the processing cartridge C can be detachably installed into the imaging device. Alternatively, one of the photosensitive unit 1 and the developing unit 2 can be pre-installed in the imaging device, and the user only needs to detachably install the other of the photosensitive unit 1 and the developing unit 2 into the imaging device.

[0021] The processing cartridge C includes a photosensitive end cap 13 and a developing end cap 23. The photosensitive end cap 13 is disposed at both longitudinal ends of the photosensitive housing 11, and the developing end cap 23 is disposed at both longitudinal ends of the developing housing 21. The photosensitive housing 11, the developing housing 21, the photosensitive end cap 13, and the developing end cap 23 can all be considered as the housing of the processing cartridge. In some embodiments, the photosensitive end cap 13 and the developing end cap 23 at the same longitudinal end of the processing cartridge can be combined with each other, thereby combining the photosensitive unit 1 and the developing unit 2. In some embodiments, the photosensitive end cap 13 and the developing end cap 23 can be omitted, and the assembly of the photosensitive unit 1 and the developing unit 2 can be completed directly by combining the photosensitive housing 11 and the developing housing 21.

[0022] During development, the photosensitive drum 12 receives driving force through a first driving force receiver located at a longitudinal end and rotates around the rotation axis L1. The developing roller 22 receives driving force through a second driving force receiver 24 located at a longitudinal end and rotates around the rotation axis L2. The first driving force receiver and the second driving force receiver 24 can receive driving force from the imaging device separately, or one of them can receive driving force from the imaging device while the other receives driving force indirectly from the imaging device. In some embodiments, the first driving force receiver and the second driving force receiver 24 are located at the same longitudinal end of the processing cartridge C. In another embodiment, the first driving force receiver and the second driving force receiver 24 are located at opposite longitudinal ends of the processing cartridge C.

[0023] Furthermore, such as Figure 4 As shown, the processing box C also includes a chip assembly 5, which is used to establish a stable electrical connection with the imaging device. The chip assembly 5 includes a chip holder 3 and a chip 4 fixedly mounted on the chip holder 3. The chip 4 includes a substrate 41 and an electrical contact portion 42 for forming an electrical connection with the stylus of the imaging device. The substrate 41 has an upper surface 41a and a lower surface 41b corresponding to the upper surface 41a. In some embodiments, the electrical contact portion 42 is located on the upper surface 41a of the substrate 41.

[0024] The chip holder 3 can be disposed on any one of the photosensitive housing 11, the developing housing 21, the photosensitive end cap 13, and the developing end cap 23. The installation position of the chip holder 3 is not limited, as long as the electrical contact part 22 can be stably connected with the imaging device. In some embodiments, the chip holder 3 and the photosensitive housing 11 are integrally formed.

[0025] like Figure 2 and Figure 3 As shown, the chip holder 3 includes a baffle 31 and two positioning parts 32 extending from the baffle 31 respectively. The two positioning parts 32 are spaced apart, and a mounting space 3a for the chip 4 is formed between the two positioning parts 32. The baffle 31 is used to restrict the mounting position of the chip 4. The side opposite to the baffle 31 is the mounting side 3b. The mounting space 3a is located between the baffle 31 and the mounting side 3b. The chip 4 is mounted from the mounting side 3b. The chip 4 also has a front end 4a and a rear end 4b. When the chip 4 is mounted to the chip holder 3, the rear end 4b is closer to the baffle 31 than the front end 4a.

[0026] The positioning part 32 includes a side wall 321, a lower wall 322, and an upper wall 323. Both the lower wall 322 and the upper wall 323 extend from the side wall 321 toward the mounting space 3a. The extension direction of at least a portion of the lower wall 322 is parallel to the extension direction of at least a portion of the upper wall 323. The lower wall 322 is provided with a lower wall surface 322a. When the chip 4 is mounted to the chip holder 3, the chip 4 / substrate 41 is in close contact with the upper wall 323, but does not contact the lower wall surface 322a / lower wall 322. In other words, the chip 4 is arranged in a non-contact manner with the lower wall surface 322a / lower wall 322. The electrical contact part 42 is exposed through the exposed side 323a between the two upper walls 323. Both the baffle 31 and the positioning part 32 can effectively prevent the chip 4 from falling off the chip holder 3. In some embodiments, both the lower wall 322 and the upper wall 323 have guide surfaces 32a on the side facing the mounting side 3b. When the chip 4 is mounted to the chip holder 3, the chip 4 can be smoothly mounted from the mounting side 3b into the mounting space 3a through the guide surfaces 32a.

[0027] For ease of description, the vertical direction is defined as the arrangement direction of the upper wall 323 and the lower wall 322 of the chip holder, with the upper wall 323 located above the lower wall 322 and the lower wall 322 located below the upper wall 323, and the electrical contact portion 42 exposed upward through the space between the two upper walls 323. This vertical direction intersects with the first rotation axis L1, and preferably, the vertical direction is perpendicular to the first rotation axis L1.

[0028] Furthermore, such as Figure 2 and Figure 5 As shown, the chip holder 3 also includes an elastic arm 33 extending from the baffle 31 toward the mounting side 3b. The elastic arm 33 is spaced apart from the positioning part 32. The elastic arm 33 is located in the mounting space 3a, that is, the elastic arm 33 is located between the two positioning parts 32. When the chip is mounted, the substrate 41 is clamped and fixed between at least a part of the elastic arm 33 and the upper wall 323 as a whole. The elastic arm 33 includes a main body 331 and a protrusion 333 protruding from the main body 331 toward the mounting space 3a. The protrusion 333 is used to support the chip 4. The main body 331 is provided with a suspended surface 332a. In the vertical direction, the suspended surface 332a is lower than the protrusion 333 and the lower wall surface 322a.

[0029] When chip 4 is installed from mounting side 3b toward mounting space 3a, chip 4 is supported by protrusion 333, elastic arm 33 deforms, and main body 331 does not contact chip 4. That is, there is a gap between main body 331 / suspended surface 332a and chip 4. In some embodiments, at least part of chip 4 abuts against baffle 31. Along the mounting direction 3c, suspended surface 332a is closer to baffle 31 than protrusion 333.

[0030] The baffle 31 also has an exposure portion 311 for easy removal of the chip 4. When the chip 4 is mounted on the chip holder 3, at least a portion of the substrate 41 is exposed through the exposure portion 311 when viewed in the direction opposite to the mounting direction 3c. The exposure portion 311 can be configured as a bridge shape, a hole shape, a notch, etc. The shape of the exposure portion 311 is not limited, as long as at least a portion of the substrate 41 can be exposed through the exposure portion 311 in the direction opposite to the mounting direction 3c. Preferably, the exposure portion 311 is configured as a parallelogram notch. When the chip 4 is mounted on the chip holder 3, such as Figure 6 As shown, along the vertical direction, the lower surface 311a of the exposed portion 311 is lower than the electrical contact portion 42. Specifically, the lower surface 311a of the exposed portion 311 is lower than the upper surface 41a of the substrate 41. In some embodiments, the lower surface 311a of the exposed portion 311 is flush with the middle portion of the substrate 41 in the thickness direction. Figure 5 As shown, when viewed along the direction intersecting the vertical direction, the exposed lower surface 311a, lower wall surface 322a, and suspended surface 332a are arranged from top to bottom.

[0031] In addition, the housing / photosensitive housing 11 is provided with reinforcing ribs 11a to enhance the strength of the housing, and the exposed part 311 is also provided with a first inclined surface 311b intersecting the lower surface 311a, such as Figure 2 As shown, the direction in which the first inclined surface 311b extends is parallel to the direction in which at least a portion of the reinforcing rib 11a extends.

[0032] When the chip 4 is installed, the substrate 42 is clamped and fixed between the protrusion 333 and the upper wall 323. At the same time, the main body 331 and the lower wall 322 are separated from the chip 4 and arranged in a non-contact manner. The electrical contact part 42 is exposed through the exposed side 323a between the two upper walls 323, and when viewed in the direction opposite to the installation direction 3c, the substrate 41 is exposed through the exposed part 311.

[0033] [Beneficial Effects]

[0034] 1. An elastic arm 33 is provided in the chip holder 3 so that after the chip 4 is installed, the front end 4a of the chip 4 only contacts the chip 4 through the protrusion 333 of the elastic arm 33, while the rear end 4b of the chip 4 remains suspended from the main body 331. The elastic arm 33 deforms under force, which not only solves the adaptation problem of the thickness difference of the chip substrate 41 of different manufacturers and different batches, avoiding the situation of being too loose or too tight during assembly, but also greatly reduces the resistance of chip 4 installation and removal by reducing the contact area, while ensuring that the chip 4 is in close contact with the contact pin of the imaging device and improving the stability of electrical connection.

[0035] 2. The suspended surface 332a is lower than the lower wall surface 322a, which further increases the curvature of the elastic arm 33 to generate elasticity and thus increases the elastic force, enhances the thickness adaptation tolerance of the chip 4, and ensures that the chip holder 3 can stably clamp chips 4 of different thicknesses.

[0036] 3. After the chip 4 is assembled, there is a gap between the lower surface 41b of the substrate 41 and the lower wall surface 322a, keeping it suspended. The suspended structure can reduce the contact area between the substrate 41 and the positioning part 32, further reduce the friction when the chip 4 is disassembled and assembled, and improve the ease of operation. At the same time, the gap can also reserve space for heat dissipation of the substrate 41, and avoid heat accumulation affecting the life of the chip 4.

[0037] 4. In the vertical direction, the lower surface 311a of the exposed part 311 is not higher than the upper surface of the substrate 41, which can ensure that the operator can directly apply a pushing force to the substrate 41 in the opposite direction to the mounting direction 3c through the exposed part 311; preferably, the lower surface 311a of the exposed part 311 is located in the middle of the thickness of the substrate 41. This design can make the pushing force act evenly on the substrate 41, improving the stability and convenience of the disassembly operation.

[0038] 5. The direction in which the first inclined surface 311b extends is parallel to the direction in which at least a portion of the reinforcing rib 11a extends. This design simplifies the mold structure and improves production efficiency.

[0039] 6. When chip 4 is installed on chip holder 3, chip 4 is located between two positioning parts 32 and chip 4 is in contact with upper wall 321. This structural design restricts the chip 4 from offset in the direction perpendicular to the installation direction 3c and its thickness direction through the two positioning parts 32. At the same time, the baffle 31 restricts its continued offset along the installation direction 3c, so that chip 4 can be more stably supported and positioned, and prevents tilting due to uneven force after assembly.

[0040] 7. The chip assembly 5 can be integrated with the housing or detachable, and its installation position is not limited by the photosensitive housing 11, the developing housing 21, or the end cap, which greatly improves the structural versatility and adapts to more application scenarios.

Claims

1. A chip holder for fixing a chip having a substrate and an electrical contact portion disposed on one surface of the substrate, the chip holder including a baffle and two positioning portions extending from the baffle, the two positioning portions being spaced apart and forming a mounting space for mounting the chip. The positioning part includes a side wall, an upper wall, and a lower wall. Both the upper and lower walls extend from the side wall toward the mounting space in the vertical direction. The electrical contact part is exposed upward through the space between the two upper walls. The lower wall is located below the upper wall. The side opposite to the baffle is the mounting side. The mounting space is located between the baffle and the mounting side. The chip is mounted from the mounting side. Its features are, The chip holder also includes a flexible arm extending from the baffle toward the mounting side. When the chip is mounted, the substrate is clamped and fixed between at least a portion of the flexible arm and the upper wall as a whole, while the lower wall and the chip are arranged in a non-contact manner.

2. The chip scaffold according to claim 1, characterized in that, The flexible arm and the positioning part are spaced apart.

3. The chip scaffold according to claim 2, characterized in that, The flexible arm includes a main body and a protrusion that protrudes from the main body into the mounting space. When the chip is mounted, the protrusion supports the chip, and the main body does not contact the chip.

4. The chip scaffold according to claim 3, characterized in that, The main body has a suspended surface, and the lower wall has a lower wall surface. Along the vertical direction, the suspended surface is lower than the protrusion and the lower wall surface.

5. The chip scaffold according to claim 4, characterized in that, The substrate has an upper surface and a lower surface that are arranged opposite to each other. The electrical contact portion is located on the upper surface of the substrate, and the lower surface of the substrate does not contact the lower wall surface. The baffle has an exposed portion. When the chip is mounted to the chip carrier, the lower surface of the exposed portion is lower than the upper surface of the substrate in the vertical direction.

6. The chip scaffold according to claim 5, characterized in that, The lower surface of the exposed portion is flush with the middle of the substrate in the thickness direction.

7. The chip scaffold according to claim 5, characterized in that, When viewed along the direction intersecting the vertical direction, the exposed lower surface, lower wall surface, and suspended surface are arranged from top to bottom.

8. A processing box, characterized in that, The processing cartridge includes a processing cartridge housing and a chip holder as described in any one of claims 1 to 7, the chip holder being disposed on the processing cartridge housing.

9. The processing box according to claim 8, characterized in that, The housing of the processing box is provided with reinforcing ribs to enhance the strength of the housing, and the exposed part is also provided with a first inclined surface intersecting the lower surface. The direction in which the first inclined surface extends is parallel to the direction in which at least a portion of the reinforcing ribs extends.

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