A 1U server chassis

Abstract

The utility model provides a kind of 1U server case, it is related to the field of case heat dissipation.The 1U server case further includes: first fan assembly, in the first end of the length direction of the shell;The end face of the first end of the length direction of the shell is formed with the first air inlet part corresponding with the first fan assembly;Wind deflector;And second fan assembly, in the second end of the length direction of the shell, the upper cover is formed with the second air inlet part corresponding with the second fan assembly.

Description

Technical Field

[0001] This application relates to the field of chassis heat dissipation, and in particular to a 1U server chassis. Background Technology

[0002] 1U server chassis require high-density component deployment, resulting in limited space per node. This space constraint often leads to poor heat dissipation performance. Currently, high-speed small fans are typically used for chassis cooling, but these fans are difficult to place in confined spaces, resulting in poor cooling performance (e.g., inability to achieve precise cooling of the motherboard or expansion slots). In addition, high-speed fans cause significant noise from the chassis. Utility Model Content

[0003] In view of this, the purpose of this application is to provide a 1U server chassis to solve the problems of poor heat dissipation and high noise in existing 1U server chassis.

[0004] To achieve the above objectives, this utility model provides a 1U server chassis, including a shell and a top cover, wherein the 1U server chassis further includes:

[0005] A first fan assembly is located at a first end along the length of the housing; the end face of the first end along the length of the housing has a first air intake corresponding to the first fan assembly.

[0006] Air guide cover; and

[0007] The second fan assembly is located at the second end of the housing along its length, and the upper cover has a second air intake corresponding to the second fan assembly.

[0008] Preferably, the housing has a cavity, and the top cover is adapted to correspond to the opening of the cavity;

[0009] The first fan assembly and the air guide shroud are both located inside the cavity; the second fan assembly is located outside the cavity.

[0010] Preferably, the first fan assembly is located at the first end of the cavity along its length direction, and the first fan assembly includes a plurality of first fans arranged along the width direction of the cavity.

[0011] Preferably, the first air intake is formed as a hollow structure so that the cavity is connected to the external space.

[0012] Preferably, a motherboard is provided at the bottom of the cavity, and the air guide shroud is provided at the top of the motherboard so as to cover the outside of the heat sink of the motherboard.

[0013] Preferably, along the length of the cavity, both the first and second ends of the air guide shroud are formed into an open shape, and the first end of the air guide shroud corresponds to the first fan assembly.

[0014] Preferably, the second fan assembly includes at least two second fans arranged along the width of the housing; each second fan is connected to the housing by screws.

[0015] Preferably, a through hole is formed on the end face of the second end of the housing to form a passage from the cavity to the second fan.

[0016] Preferably, the cavity is provided with a plurality of expansion slots, and the second air intake corresponds one to one of the expansion slots.

[0017] Preferably, each of the second air intakes includes a plurality of circular heat dissipation holes; in each of the second air intakes, the plurality of heat dissipation holes are arranged in a matrix.

[0018] According to the 1U server chassis of this utility model, a first fan assembly is provided at the first end of the housing, and a first air intake corresponding to the first fan assembly is provided on the end face of the first end of the housing. This allows cool air from the outside space to be introduced into the cavity of the housing, and then the motherboard is cooled by the air guide shroud. Furthermore, a second fan assembly is provided at the second end of the housing, which can exhaust the hot air after heat absorption and accelerate the airflow in the cavity to improve the heat dissipation effect. In addition, the second air intake and the second fan assembly work together to cool the expansion slots. The first and second fan assemblies located at the ends of the housing, as well as the air guide shroud, do not occupy too much space, thus effectively improving the heat dissipation effect of the chassis within a limited space.

[0019] Furthermore, based on the cooperation of the above-mentioned components, a low-speed fan can be installed in the first fan assembly and the second fan assembly to achieve the technical effect of reducing noise.

[0020] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1This is a partially exploded view of a 1U server chassis according to an embodiment of the present invention.

[0023] Icons: 11-Shell; 111-Cavity; 12-Top cover; 21-First fan; 22-Second fan; 31-First air intake; 32-Second air intake; 4-Air guide cover; 41-Top plate; 42-Second side plate. Detailed Implementation

[0024] The following detailed embodiments are provided to help the reader gain a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will be apparent after understanding the disclosure of this application. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein; changes that will be apparent after understanding the disclosure of this application are possible, except for operations that must occur in a specific order. Furthermore, for clarity and brevity, descriptions of features known in the art may be omitted.

[0025] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many feasible ways of implementing the methods, apparatus, and / or systems described herein that will be apparent upon understanding the disclosure of this application.

[0026] Throughout the specification, when an element (such as a layer, region, or substrate) is described as being "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, it may be directly "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, or there may be one or more other elements in between. In contrast, when an element is described as being "directly on" another element, "directly connected to" another element, "directly bonded to" another element, "directly on" another element, or "directly covering" another element, there may be no other elements in between.

[0027] As used herein, the term “and / or” includes any one of the relevant items listed and any combination of any two or more items.

[0028] Although terms such as “first,” “second,” and “third” may be used herein to describe individual components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts are not limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teachings of the examples described herein, the first component, assembly, region, layer, or part referred to as the second component, assembly, region, layer, or part may also be referred to as the second component, assembly, region, layer, or part.

[0029] For ease of description, spatial relation terms such as “above,” “upper,” “below,” and “lower” are used herein to describe the relationship between one element and another, as shown in the accompanying drawings. Such spatial relation terms are intended to include not only the orientation depicted in the drawings but also different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “upper” relative to another element will subsequently be “below” or “lower” relative to that other element. Therefore, the term “above” includes both “above” and “below” orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relation terms used herein will be interpreted accordingly.

[0030] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms “comprising,” “including,” and “having” enumerate the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0031] Variations in the shapes shown in the accompanying drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include changes in shape that may occur during manufacturing.

[0032] The features of the examples described herein can be combined in various ways that will be apparent upon understanding the disclosure of this application. Furthermore, although the examples described herein have a wide variety of constructions, other constructions are possible, as will be apparent upon understanding the disclosure of this application.

[0033] This utility model provides a 1U server chassis, such as Figure 1As shown, the 1U server chassis in this embodiment includes a housing 11 and a top cover 12. The housing 11 is provided with a first fan 21 assembly, a second fan 22 assembly, an air guide shroud 4, and a first air intake 31 corresponding to the first fan 21 assembly. The top cover 12 is provided with a second air intake 32 corresponding to the second fan 22 assembly. These components effectively ensure heat dissipation and reduce noise within the limited space of the chassis. The specific structure and connection relationships of the above-mentioned parts of the 1U server chassis according to this utility model will be described in detail below.

[0034] In this embodiment, as Figure 1 As shown, the housing 11 forms a cavity 111, which houses conventional chassis components such as expansion slots and a motherboard (these components are standard chassis components and are not shown in the figure). The top cover 12 corresponds to and fits the opening of the cavity 111 and is assembled with the housing 11. The assembly methods of both are conventional techniques in the field and will not be described in detail. Furthermore, in this embodiment, the first fan 21 assembly is located inside the cavity 111 and at the first end of the length direction of the cavity 111, and the air guide shroud 4 is also located inside the cavity 111. The second fan 22 assembly is located outside the cavity 111 and at the second end of the length direction of the housing 11. This arrangement maximizes the use of the chassis layout space, ensuring the chassis's heat dissipation effect without affecting the assembly of components inside the chassis.

[0035] Specifically, the first fan 21 assembly includes a plurality of first fans 21, which are arranged along the width direction of the cavity 111. Furthermore, a first air intake 31 corresponding to the first fan 21 assembly is formed on the end face of the first end along the length direction of the housing 11. In this embodiment, the first air intake 31 is specifically formed as a mesh-like perforated structure to allow the cavity 111 to communicate with the external space. Thus, when the first fan 21 assembly is activated, external cold air can be introduced into the cavity 111 through the first air intake 31.

[0036] Furthermore, the mainboard is located at the bottom of the cavity 111 (a conventional technique in the art), and in this embodiment, the air guide shroud 4 is located on top of the mainboard. Figure 1As shown, the air guide shroud 4 in this embodiment is composed of a first side plate, a top plate 41, and a second side plate 42 connected in sequence. The first side plate and the second side plate 42 are respectively connected to both ends of the motherboard in the width direction, while the top plate 41 is parallel to the motherboard, thus covering the outside of the motherboard. Furthermore, along the length direction of the cavity 111, both the first and second ends of the air guide shroud 4 are formed into an open shape, and the first end of the air guide shroud 4 corresponds to the first fan 21 assembly, that is, the air guide shroud 4 is open towards the first fan 21 assembly, so that cold air can be introduced into the air guide shroud 4. Under the action of the first side plate, the second side plate 42, and the top plate 41, the heat dissipation effect of the cold air on the motherboard can be effectively improved.

[0037] Furthermore, in this embodiment, the second side plate 42 is formed in a bent shape, that is, the opening at the second end of the air guide shroud 4 is smaller than the opening at its first end, such as... Figure 1 As shown, this arrangement allows cool air to be more concentrated at the second end of the air duct 4. Correspondingly, the motherboard heatsink is located at the second end of the air duct 4, thereby effectively improving the heat dissipation of the chassis.

[0038] In this embodiment, the second fan 22 assembly enables airflow within the chassis and precise heat dissipation for the expansion slots. For example... Figure 1 As shown, the second fan 22 assembly includes two second fans 22 (the number is not fixed, but at least two should be provided to ensure heat dissipation). The two second fans 22 are arranged along the width direction of the housing 11, and each second fan 22 is connected to the housing 11 by screws. In addition, a through hole is formed on the end face of the second end of the housing 11 to form a passage from the cavity 111 to the second fan 22. Preferably, the second fan 22 assembly is arranged correspondingly to the second end of the air guide shroud 4, so that the cold air entering the cavity 111 from the first air intake 31 can be drawn out by the second fan 22 after heat exchange.

[0039] Furthermore, the cover has multiple second air intakes 32, each with its own position and specifications determined by the expansion slot, meaning each second air intake 32 corresponds one-to-one with an expansion slot. Specifically, each second air intake 32 includes multiple circular heat dissipation holes arranged in a matrix to correspond to the shape of the expansion slot. Thus, when the second fan 22 assembly starts to draw air, external cool air can enter the cavity 111 through the second air intakes 32, achieving precise heat dissipation for the expansion slot. After heat exchange, the cool air can also be drawn out by the second fan 22 assembly.

[0040] It should be noted that there are no specific limitations on the specifications of the above-mentioned components. These should be determined based on actual conditions, such as the specifications of the chassis, as long as the aforementioned technical effects are achieved. For example, in this embodiment, the diameter of the heat dissipation holes is set to 5mm, and the spacing between adjacent heat dissipation holes is set to 2mm. Furthermore, as can be seen from the above, the chassis in this embodiment achieves better heat dissipation through the cooperation of the aforementioned components. Therefore, low-speed fans can be configured in the first fan assembly 21 and the second fan assembly 22 to reduce noise.

[0041] In addition, although not shown in the figure, a temperature sensor is also installed inside the cavity 111, which is connected in communication with the second fan 22 assembly. When the temperature sensor detects that the internal temperature of the cavity 111 is lower than the set temperature value, it can control the second fan 22 assembly to be turned off to save power and further reduce noise.

[0042] According to the 1U server chassis of this utility model, a first fan 21 assembly is provided at the first end of the housing 11, and a first air intake 31 corresponding to the first fan 21 assembly is provided on the end face of the first end of the housing 11. In this way, cool air from the outside space can be introduced into the cavity 111 of the housing 11, and then the motherboard can be cooled by the air guide shroud 4. Furthermore, a second fan 22 assembly is provided at the second end of the housing 11, which can exhaust the hot air after heat absorption and accelerate the airflow in the cavity 111 to improve the heat dissipation effect. In addition, the second air intake 32 and the second fan 22 assembly can be used to dissipate heat from the expansion slots. By setting the first fan 21 assembly and the second fan 22 assembly at both ends of the cavity 111 and covering the outside of the motherboard with the air guide shroud 4, the space occupied is not excessive (that is, sufficient assembly space is left for the chassis), thereby effectively improving the heat dissipation effect of the chassis within a limited space.

[0043] Finally, it should be noted that the above-described embodiments are merely specific implementations of this application, used to illustrate the technical solutions of this application, and not to limit them. The protection scope of this application is not limited thereto. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features, within the technical scope disclosed in this application. Such modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be covered within the protection scope of this application. Therefore, the protection scope of this application should be determined by the protection scope of the claims.

Claims

1. A 1U server chassis, comprising a shell and a top cover, characterized in that, The 1U server chassis also includes: A first fan assembly is located at a first end along the length of the housing; the end face of the first end along the length of the housing has a first air intake corresponding to the first fan assembly. Air guide cover; and The second fan assembly is located at the second end of the housing along its length, and the upper cover has a second air intake corresponding to the second fan assembly.

2. The 1U server chassis according to claim 1, characterized in that, The housing has a cavity, and the top cover is adapted to correspond to the opening of the cavity; The first fan assembly and the air guide shroud are both located inside the cavity; the second fan assembly is located outside the cavity.

3. The 1U server chassis according to claim 2, characterized in that, The first fan assembly is located at the first end of the cavity along its length direction. The first fan assembly includes a plurality of first fans, which are arranged along the width direction of the cavity.

4. The 1U server chassis according to claim 3, characterized in that, The first air intake is formed with a hollow structure so that the cavity is connected to the external space.

5. The 1U server chassis according to claim 2, characterized in that, The bottom of the cavity is provided with a motherboard, and the air guide shroud is provided on the top of the motherboard so as to cover the outside of the heat sink of the motherboard.

6. The 1U server chassis according to claim 5, characterized in that, Along the length of the cavity, both the first and second ends of the air guide shroud are formed into an open shape, and the first end of the air guide shroud corresponds to the first fan assembly.

7. The 1U server chassis according to claim 2, characterized in that, The second fan assembly includes at least two second fans arranged along the width of the housing; each second fan is connected to the housing by screws.

8. The 1U server chassis according to claim 7, characterized in that, A through hole is formed on the end face of the second end of the housing to form a passage from the cavity to the second fan.

9. The 1U server chassis according to claim 7, characterized in that, The cavity is provided with multiple expansion slots, and the second air intake corresponds to each of the expansion slots.

10. The 1U server chassis according to claim 9, characterized in that, Each of the second air intakes includes a plurality of circular heat dissipation holes; in each of the second air intakes, the plurality of heat dissipation holes are arranged in a matrix.

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