A new computer case
By exposing the control components and integrated power supply box on the front cover of the computer chassis and adopting a cross-flow heat dissipation design, the problems of operational complexity and hardware stability in the existing technology are solved, achieving convenient monitoring and efficient heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GOLDEN FIELD IND CO LTD
- Filing Date
- 2025-04-25
- Publication Date
- 2026-07-21
AI Technical Summary
In current computer case designs, the control panel is located inside the case, which requires users to frequently open the cover to operate, increasing complexity and affecting hardware stability and heat dissipation.
The control components (control switches, display screen) are exposed on the front cover surface, the power supply box is integrated inside the front cover, the heat dissipation components adopt a dual-fan cross airflow design, and the data transmission components are integrated inside the support components.
It enables real-time monitoring of system status and quick setup without opening the cover, reducing operational complexity, ensuring hardware stability and heat dissipation, and improving ease of use.
Smart Images

Figure CN224536426U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chassis technology, specifically a novel computer chassis. Background Technology
[0002] With the rapid development of computer technology, computers have become an indispensable tool in people's daily lives. As the carrier and protective device for computer hardware, the design and function of the computer case are constantly evolving. In existing computer case designs, the control panel is typically located inside the front panel. While this design satisfies users' needs for basic computer status monitoring and operation to some extent, it also has some obvious limitations. For example, when users need to check the computer's operating status or make certain settings, they often need to open the front panel, which not only increases the complexity of operation but may also affect the stability and heat dissipation of the internal hardware. Furthermore, for users who need to frequently check or adjust settings, this design is clearly inconvenient. Therefore, to address this problem, the inventors have proposed a novel computer case. Summary of the Invention
[0003] To address the shortcomings of the aforementioned technologies, this utility model provides a novel computer chassis.
[0004] To achieve the above objectives, the present invention adopts the following technical solution: a novel computer chassis, comprising a support component, a heat dissipation component, a control component, and a data transmission component. The heat dissipation component is disposed on the inner side wall of the support component for dissipating heat from inside the chassis. The control component is disposed on one side wall of the support component for easy operation of the chassis. The data transmission component is disposed on the inner side wall of the support component and electrically connected to the control component for easy data transmission. The control component includes a control switch, a display screen, and a power supply box. The power supply box is disposed on the inner side wall of the support component, the control switch is disposed on the inner side wall of the support component, and the display screen is disposed on the inner side wall of the support component. The control switch and the display screen are respectively electrically connected to the power supply box.
[0005] As further explained, the heat dissipation component includes a heat dissipation slot, a first heat dissipation fan, and a second heat dissipation fan. The heat dissipation slot is formed on the inner side wall of the support component. The first heat dissipation fan is located on the inner side wall of the support component. The second heat dissipation fan is located on the inner side wall of the support component. A connecting plate is provided at one end of the intersection of the first heat dissipation fan and the second heat dissipation fan. The connecting plate is respectively located at one end of the first heat dissipation fan and the second heat dissipation fan.
[0006] As further explained, the data transmission component includes a graphics card body, a graphics card housing, and a motherboard. The motherboard is located on the inner wall of the support component, the graphics card housing is located on the inner wall of the support component, and the graphics card body is located on the inner wall of the graphics card body.
[0007] As further explained, the motherboard extends outwards and is equipped with a CPU cooling fan located on the inner sidewall of the motherboard. Multiple memory card slots are also provided on the inner sidewall of the motherboard and spaced apart. An operating slot is also provided on the inner sidewall of the motherboard. A data transmission board is disposed on the inner side wall of the support component and is used for data transmission.
[0008] As further explained, the support assembly includes support feet, a base plate, and side plates. The base plate is disposed on the upper surface of the support feet. Multiple support feet are provided and spaced apart. The side plates are vertically disposed on the base plate. The main plate is located on the inner side wall of the side plates.
[0009] As further explained, the side panel extends outward and is provided with a decorative panel, which is located on one side wall of the side panel. The side panel extends outward and is provided with an upper cover plate, which is located on the upper surface of the side panel. The upper cover plate extends outward and is provided with a rear cover plate, which is located at one end of the upper cover plate. The first heat dissipation is located on the inner side wall of the upper cover plate.
[0010] As further explained, one end of the upper cover plate is provided with a front cover plate corresponding to the rear cover plate. The front cover plate is located at one end of the upper cover plate. The power supply box is located on the inner side wall of the front cover plate. The control switch is located on the inner side wall of the front cover plate. The display screen is located on the inner side wall of the front cover plate. The heat dissipation slots are located on the inner side walls of the upper cover plate and the rear cover plate respectively. The second cooling fan is located on the inner side wall of the rear cover plate. The graphics card housing is located on the inner side wall of the front cover plate. The data transmission board is located on the inner side wall of the front cover plate.
[0011] As further explained, the front cover plate extends inward and has a groove formed on the inner sidewall of the front cover plate.
[0012] In summary, this utility model has the following beneficial effects: This novel computer chassis exposes the control components (control switches, display screen) directly on the front cover surface, allowing users to monitor system status in real time or perform quick settings without opening the cover, significantly reducing operational complexity and avoiding the impact of frequent cover opening on internal hardware stability and heat dissipation. The power supply box is integrated inside the front cover, ensuring power supply safety and facilitating power cord plugging and unplugging for maintenance, thus improving ease of use. Attached Figure Description
[0013] Figure 1 This is a three-dimensional structural diagram of a novel computer chassis according to the present invention; Figure 2 This is a schematic diagram of the internal structure of a novel computer chassis according to this utility model; Figure 3 This is an exploded view of a novel computer chassis according to the present invention; Figure 4 This is a structural schematic diagram of a novel computer chassis according to the present invention. Detailed Implementation
[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0015] like Figure 1-4 As shown, this utility model discloses a novel computer chassis, including a support component, a heat dissipation component, a control component, and a data transmission component. The heat dissipation component is located on the inner wall of the support component to dissipate heat from inside the chassis. The control component is located on one side wall of the support component for easy operation of the chassis. The data transmission component is located on the inner wall of the support component and is electrically connected to the control component for easy data transmission. The control component includes a control switch 31, a display screen 32, and a power supply box 33. The power supply box 33, the control switch 31, and the display screen 32 are all located on the inner wall of the support component. The control switch and the display screen 32 are electrically connected to the power supply box 33.
[0016] Specifically, the control components are externally located on the surface of the front cover 13, and the power supply box 33 is located inside the front cover 13, providing power to the control switch 31, the display screen 32 and the motherboard 43. Users can directly operate the system start / stop and function mode through the control switch 31 on the outside of the front cover 13. The display screen 32 displays parameters such as CPU temperature and fan speed in real time, allowing for status monitoring and quick settings without opening the cover.
[0017] The heat dissipation assembly includes a heat dissipation slot 21, a first cooling fan 22, and a second cooling fan 23. The heat dissipation slot 21 is formed on the inner side wall of the support assembly. The first cooling fan is located on the inner side wall of the support assembly. The second cooling fan 23 is located on the inner side wall of the support assembly. A connecting plate 24 is provided at one end of the intersection of the first cooling fan 22 and the second cooling fan 23. The connecting plate 24 is respectively located at one end of the first cooling fan 22 and the second cooling fan 23.
[0018] Specifically, the heat dissipation component achieves efficient heat dissipation through a dual-fan cross airflow. The first cooling fan 22 (located inside the upper cover 14) draws in external cold air, which is then introduced into the chassis through the heat dissipation slot 21 to provide initial cooling for the motherboard 43 and the graphics card area. The second cooling fan 23 (located inside the rear cover 15) exhausts internal hot air through the heat dissipation slots 21 of the rear cover 15, forming a "front intake, rear exhaust" airflow circulation. The connecting plate 24 fixes the position of the dual fans, reduces vibration, and optimizes the airflow sealing. The CPU cooling fan 44 integrated into the motherboard 43 and the graphics card casing 42 assist in heat dissipation, forming a multi-stage heat dissipation system to ensure stable operation of the hardware in low-temperature environments.
[0019] The data transmission components include a graphics card body 41, a graphics card housing 42, and a motherboard 43. The motherboard 43 is located on the inner wall of the support component, the graphics card housing 42 is located on the inner wall of the support component, and the graphics card body 41 is located on the inner wall of the graphics card body 41.
[0020] A CPU cooling fan 44 extends outward from the motherboard 43 and is located on the inner sidewall of the motherboard 43. Multiple memory card slots 45 are also provided on the inner sidewall of the motherboard 43 and are spaced apart. A running slot 46 extends outward from the motherboard 43 and is located on the inner sidewall of the motherboard 43. Data transmission board 47 is located on the inner wall of the support assembly and is used for data transmission.
[0021] Specifically, the data transmission component is centered on the motherboard 43 and is directly connected to the graphics card body 41 via the data transmission board 47, reducing signal transmission loss. The graphics card casing 42 encloses the graphics card body 41, protecting the circuit board and assisting in heat dissipation. The motherboard 43 has multiple spaced memory card slots 45 and a RAM slot 46, supporting hardware hot-swapping and expansion upgrades. The layout of the CPU cooling fan 44 and memory card slots 45 optimizes space utilization and ensures high-density hardware compatibility.
[0022] The support assembly includes support feet 11, a base plate 18, and a side plate 16. The base plate 18 is located on the upper surface of the support feet 11. Multiple support feet 11 are provided and spaced apart. The side plate 16 is vertically arranged on the base plate 18. The main plate 43 is located on the inner side wall of the side plate 16.
[0023] A decorative panel 17 extends outward from the side panel 16 and is located on one side wall of the side panel 16. An upper cover 14 extends outward from the side panel 16 and is located on the upper surface of the side panel 16. A rear cover 15 extends outward from the upper cover 14 and is located at one end of the upper cover 14. The first heat dissipation is located on the inner side wall of the upper cover 14.
[0024] One end of the upper cover plate 14 is provided with a front cover plate 13 corresponding to the rear cover plate 15. The front cover plate 13 is located at one end of the upper cover plate 14. The power supply box 33 is located on the inner side wall of the front cover plate 13. The control switch 31 is located on the inner side wall of the front cover plate 13. The display screen 32 is located on the inner side wall of the front cover plate 13. The heat sink 21 is located on the inner side wall of the upper cover plate 14 and the rear cover plate 15 respectively. The second heat sink 23 is located on the inner side wall of the rear cover plate 15. The graphics card housing 42 is located on the inner side wall of the front cover plate 13. The data transmission board 47 is located on the inner side wall of the front cover plate 13.
[0025] The front cover plate 13 extends inward and has a groove 12, which is formed on the inner side wall of the front cover plate 13.
[0026] Specifically, the support assembly is based on the base plate 18, and provides stable support through multiple sets of spaced support feet 11. The side plates 16 are vertically fixed to the base plate 18 to form the main frame. The top cover plate 14, the rear cover plate 15 and the front cover plate 13 are connected in sequence to form a closed box structure.
[0027] The integrated design of the decorative panel 17 and the side panel 16 enhances the overall rigidity. The groove 12 on the inner side of the front cover 13 provides embedded installation space for the control components, which not only ensures the convenience of exposed operation, but also avoids structural interference caused by protruding components.
[0028] The control components (control switch 31, display screen 32) are directly exposed on the surface of the front cover 13, allowing users to monitor the system status in real time or make quick settings without opening the cover, significantly reducing operational complexity and avoiding the impact of frequent cover opening on the stability of internal hardware and heat dissipation. The power supply box 33 is integrated inside the front cover 13, ensuring power supply safety and facilitating power cord plugging and unplugging for maintenance, thus improving ease of use.
[0029] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
[0030] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A novel computer chassis, characterized in that: Including support components; A heat dissipation component is disposed on the inner side wall of the support component and is used to dissipate heat from inside the chassis. A control component is located on one side wall of the support component to facilitate the operation of the chassis; A data transmission component is disposed on the inner sidewall of the support component and electrically connected to the control component to facilitate data transmission; The control component includes a control switch, a display screen, and a power supply box. The power supply box is located on the inner wall of the support component, the control switch is located on the inner wall of the support component, and the display screen is located on the inner wall of the support component. The control switch and the display screen are electrically connected to the power supply box, respectively.
2. The novel computer chassis according to claim 1, characterized in that: The heat dissipation assembly includes a heat dissipation slot, a first heat dissipation fan, and a second heat dissipation fan. The heat dissipation slot is formed on the inner side wall of the support assembly. The first heat dissipation fan is located on the inner side wall of the support assembly. The second heat dissipation fan is located on the inner side wall of the support assembly. A connecting plate is provided at one end of the intersection of the first heat dissipation fan and the second heat dissipation fan. The connecting plate is respectively located at one end of the first heat dissipation fan and the second heat dissipation fan.
3. A novel computer chassis according to claim 2, characterized in that: The data transmission component includes a graphics card body, a graphics card housing, and a motherboard. The motherboard is located on the inner wall of the support component, the graphics card housing is located on the inner wall of the support component, and the graphics card body is located on the inner wall of the graphics card body.
4. A novel computer chassis according to claim 3, characterized in that: The motherboard extends outwards and is equipped with a CPU cooling fan, which is located on the inner sidewall of the motherboard. The motherboard also extends outwards and is equipped with memory card slots, which are located on the inner sidewall of the motherboard. There are multiple memory card slots that are spaced apart. The motherboard also extends outwards and is equipped with a running slot, which is located on the inner sidewall of the motherboard. as well as A data transmission board is disposed on the inner side wall of the support component and is used for data transmission.
5. A novel computer chassis according to claim 4, characterized in that: The support assembly includes support feet, a base plate, and side plates. The base plate is disposed on the upper surface of the support feet. Multiple support feet are provided and spaced apart. The side plates are vertically disposed on the base plate. The main plate is located on the inner side wall of the side plates.
6. A novel computer chassis according to claim 5, characterized in that: A decorative panel extends outward from the side panel and is located on one side wall of the side panel. A top cover extends outward from the side panel and is located on the upper surface of the side panel. A rear cover extends outward from the top cover and is located at one end of the top cover. The first heat dissipation device is located on the inner side wall of the top cover.
7. A novel computer chassis according to claim 6, characterized in that: One end of the upper cover plate is provided with a front cover plate corresponding to the rear cover plate. The front cover plate is located at one end of the upper cover plate. The power supply box is located on the inner side wall of the front cover plate. The control switch is located on the inner side wall of the front cover plate. The display screen is located on the inner side wall of the front cover plate. The heat dissipation slots are located on the inner side walls of the upper cover plate and the rear cover plate respectively. The second cooling fan is located on the inner side wall of the rear cover plate. The graphics card housing is located on the inner side wall of the front cover plate. The data transmission board is located on the inner side wall of the front cover plate.
8. A novel computer chassis according to claim 7, characterized in that: The front cover plate extends inward and has a groove formed on its inner sidewall.