A heat dissipation device for a computer processor

Abstract

The utility model belongs to computer processor technical field especially is a computer processor's heat abstractor, including processor component, processor component includes base, and installs on the processor body of base, still includes setting up on the heat abstractor of processor component, heat abstractor includes heat dissipation box, heat dissipation box fixedly connected on the support seat of base upper surface setting, the bottom of heat dissipation box is embedded with heat conduction structure. The utility model discloses a heat abstractor is set up on the processor component, and heat abstractor is composed of heat conduction structure, heat dissipation box and disc type water -cooled pipe, and heat conduction structure can realize heat transfer, and heat transfer on the processor body's heat to the inside of heat dissipation box, and the disc type water -cooled pipe is staggered with the heat dissipation convex of heat conduction structure and sets up, can heat dissipation to it fast, effectively reduces the temperature of processor body, solved the problem that the device cooling mode is not good of present stage.

Description

Technical Field

[0001] This utility model relates to the field of computer processor technology, specifically to a heat dissipation device for a computer processor. Background Technology

[0002] A computer processor is a very large-scale integrated circuit and the core of a computer's computation and control. It mainly consists of two major components: the arithmetic logic unit (ALU) and the control unit. Its main functions are to execute computer instructions and process data in computer software. However, computer processors generate a lot of heat during high-speed operation, which requires timely heat dissipation; otherwise, it will affect the processor's performance and lifespan. Existing processor cooling devices mostly use a single air cooling or water cooling method: air cooling devices rely on fans to drive airflow for heat dissipation, which is greatly affected by ambient temperature and has limited heat dissipation efficiency, making it difficult to meet the heat dissipation requirements of high-performance processors; although traditional water cooling devices have better heat dissipation effects than air cooling, the pipe design is fixed and cannot dynamically adjust the heat dissipation intensity according to the processor load. In addition, some devices have problems such as insufficient heat dissipation area and incomplete water circulation cooling, which can easily lead to heat dissipation bottlenecks and affect the stable operation of the processor. Utility Model Content

[0003] (a) Technical problems to be solved To address the shortcomings of existing technologies, this utility model provides a heat dissipation device for a computer processor. By setting a heat dissipation component on the processor assembly, the heat dissipation component consists of a heat-conducting structure, a heat sink, and a disc-shaped water-cooling pipe. The heat-conducting structure enables heat transfer, transferring the heat from the processor body to the interior of the heat sink, which is filled with cooling water. The disc-shaped water-cooling pipe and the heat dissipation protrusions on the heat-conducting structure are arranged alternately to quickly dissipate heat, effectively reducing the temperature of the processor body and solving the problem of inadequate cooling methods in current devices.

[0004] (II) Technical Solution To achieve the above objectives, this utility model specifically adopts the following technical solution: A heat dissipation device for a computer processor includes a processor assembly. The processor assembly includes a base and a processor body mounted on the base. It also includes a heat dissipation component disposed on the processor assembly. The heat dissipation component includes a heat sink, which is fixedly connected to a support seat disposed on the upper surface of the base. A heat-conducting structure is embedded in the bottom of the heat sink and abuts against the processor body. The heat-conducting structure includes a heat-conducting substrate and a heat-conducting block integrally formed on one side of the heat-conducting substrate. The heat-conducting substrate contacts the processor body and is embedded in a corresponding groove on the lower surface of the heat sink. A hollow cavity extending through the groove of the heat sink is formed into the heat sink. The top of the heat-conducting block extends through the hollow cavity to the inner side of the heat sink and is fixedly connected to a heat sink plate. The upper surface of the heat sink plate is fixedly connected with equidistantly distributed heat dissipation protrusions.

[0005] Furthermore, the heat dissipation protrusion has a trapezoidal design, and the outer wall of the heat dissipation protrusion is provided with equally spaced heat dissipation grooves.

[0006] Furthermore, a disc-shaped water-cooling tube is fixedly connected to the heat dissipation box, and the disc-shaped water-cooling tube is staggered with the heat dissipation protrusion. Both sides of the heat dissipation box are provided with through holes, and both ends of the disc-shaped water-cooling tube extend to the outside of the heat dissipation box through the corresponding through holes. A sealing cover is fixedly connected to the top of the heat dissipation box.

[0007] Furthermore, it also includes a circulating water tank for real-time cooling of the heat sink and heat dissipation protrusions. Two circulating water tanks are provided. Each circulating water tank includes a tank body and a tank cover fixedly connected to the top of the tank body. The tank cover has an array of perforated holes. The tank body has equidistantly distributed strip-shaped cavities. A hollow waterproof sealing plate is fixedly connected to the outside of the strip-shaped cavities inside the tank body. A protective cover is fixedly connected to one side of the tank body, and a fan is installed on the protective cover.

[0008] Furthermore, both sides of the enclosure are provided with arrayed heat dissipation fins, and the bottom of both enclosures are provided with support frames.

[0009] Furthermore, a piping assembly is provided between the heat dissipation box and the two circulating water tanks. The piping assembly includes a drain pipe and an inlet pipe. The drain pipe is connected to one end of the disc-shaped water cooling tube, and the inlet pipe is connected to the other end of the disc-shaped water cooling tube. The end of the drain pipe away from the disc-shaped water cooling tube is connected to two first branch pipes through a water pipe connector. Both first branch pipes are connected to the corresponding box cover. The end of the inlet pipe away from the disc-shaped water cooling tube is connected to two second branch pipes through a water pipe connector. Both second branch pipes are connected to the bottom of the corresponding box body.

[0010] Furthermore, a first valve is installed on the first branch pipe, and a second valve is installed on the second branch pipe; a first water pump is installed between the drain pipe and the corresponding water pipe joint, and a second water pump is installed between the inlet pipe and the corresponding water pipe joint.

[0011] (III) Beneficial Effects Compared with the prior art, the present invention provides a heat dissipation device for a computer processor, which has the following beneficial effects: 1. This utility model provides a heat dissipation component on the processor assembly. The heat dissipation component consists of a heat-conducting structure, a heat sink, and a disc-type water-cooling pipe. The heat-conducting structure includes a heat-conducting substrate, a heat-conducting block, a heat sink plate, and heat dissipation protrusions. In use, the combination of the heat-conducting structure (heat dissipation protrusions and heat sinks to increase the heat dissipation area) and the disc-type water-cooling pipe (water cooling circulation) achieves dual heat dissipation of "heat conduction plus water cooling". This can quickly remove the large amount of heat generated by the processor body and solve the problem of insufficient efficiency of a single heat dissipation method.

[0012] 2. This utility model, by setting up a pipeline assembly and two circulating water tanks, with the pipeline assembly equipped with dual branch pipes and valve control, can dynamically adjust the water circulation intensity according to the processor load (e.g., single circulating water tank operation under low load, dual circulating water tank linkage under high load), which can not only ensure the heat dissipation requirements under high load, but also reduce energy consumption under low load, thus improving the energy efficiency of the device; secondly, the circulating water tanks are cooled by heat dissipation fins and fans, which can effectively reduce the temperature of the circulating coolant, avoid the decrease in heat dissipation effect caused by the coolant temperature rise, and ensure the long-term stable operation of the entire heat dissipation system. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a structural diagram of the heat dissipation component in this utility model when disassembled; Figure 3 This is a schematic diagram of the heat dissipation box in this utility model; Figure 4 This is a schematic diagram of the heat-conducting structure in this utility model; Figure 5 This is a schematic diagram of the structure of the circulating water tank in this utility model when disassembled; Figure 6 This is a schematic diagram of the pipeline assembly in this utility model.

[0014] In the diagram: 1. Processor assembly; 101. Base; 102. Processor body; 103. Support base; 2. Heat dissipation assembly; 201. Thermal conductive structure; 2011. Thermal conductive substrate; 2012. Thermal conductive block; 2013. Heat sink; 2014. Heat dissipation protrusion; 2015. Heat dissipation groove; 202. Heat sink box; 203. Hollow cavity; 204. Sealing cover; 205. Through hole; 206. Disc-type water cooling tube; 207. Groove; 3. Piping assembly; 01. Drain pipe; 302. First water pump; 303. Water pipe joint; 304. First valve; 305. First branch pipe; 306. Second branch pipe; 307. Second valve; 308. Second water pump; 309. Inlet pipe; 4. Support frame; 5. Circulating water tank; 501. Tank body; 502. Heat dissipation fins; 503. Protective cover; 504. Fan; 505. Strip cavity; 506. Tank cover; 507. Hole; 508. Waterproof sealing plate. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] Example like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown in the figure, an embodiment of the present invention provides a heat dissipation device for a computer processor, including a processor assembly 1. The processor assembly 1 includes a base 101 and a processor body 102 mounted on the base 101. The base 101 is a supporting part of the processor body 102 and is mounted on the circuit board position of the chassis. It also includes a heat dissipation assembly 2 disposed on the processor assembly 1. The heat dissipation assembly 2 is used for real-time heat dissipation of the processor body 102, reducing the temperature of the processor body 102 and ensuring stable operation of the processor body 102. The heat dissipation assembly 2 includes a heat sink 202, which is fixedly connected to a support base 103 disposed on the upper surface of the base 101. The support base 103 enables the heat sink 202 to be installed and fixed. A heat-conducting structure 201 is embedded in the bottom of the heat sink 202, and the heat-conducting structure 201 abuts against the processor body 102. Heat is transferred through the heat-conducting structure 201, transferring the heat from the processor body 102 to the heat sink 202, thereby achieving heat dissipation of the processor body 102. For rapid heat dissipation of the body 102, the heat-conducting structure 201 includes a heat-conducting substrate 2011 and a heat-conducting block 2012 integrally formed on one side of the heat-conducting substrate 2011. The heat-conducting substrate 2011 contacts the processor body 102 and is embedded in a corresponding groove 207 on the lower surface of the heat sink 202. A hollow cavity 203 extending through the groove 207 of the heat sink 202 into the heat sink 202 is formed. The top of the heat-conducting block 2012 extends through the hollow cavity 203 to the inner side of the heat sink 202 and is fixedly connected to... The heat sink 2013 has equidistantly distributed heat dissipation protrusions 2014 fixedly connected to its upper surface. The heat-conducting substrate 2011 is set in the groove 207 to prevent heat dissipation and to completely transfer heat to the heat sink 2013 and the heat dissipation protrusions 2014. The heat sink 2013 and the heat dissipation protrusions 2014 are located inside the heat sink 202. The heat sink 202 is filled with cooling water, which then transfers heat to the cooling water to achieve water cooling. This heat dissipation method is highly efficient and has a good effect.

[0017] like Figure 4As shown, in some embodiments, the heat dissipation protrusion 2014 is trapezoidal in design, and the outer wall of the heat dissipation protrusion 2014 is provided with equally spaced heat dissipation grooves 2015.

[0018] It should be noted that the heat dissipation protrusion 2014 has a trapezoidal design, which makes it structurally stable and not easily damaged. It also has a larger heat dissipation area compared to a cuboid structure. By opening heat dissipation grooves 2015 on the outer wall of the heat dissipation protrusion 2014, the heat dissipation area of ​​the heat dissipation protrusion 2014 can be further increased, making it easier for heat to dissipate quickly.

[0019] like Figure 2 and Figure 4 As shown, in some embodiments, a disc-shaped water-cooling pipe 206 is fixedly connected to the heat sink 202. The disc-shaped water-cooling pipe 206 and the heat dissipation protrusion 2014 are staggered. Through holes 205 are provided on both sides of the heat sink 202. Both ends of the disc-shaped water-cooling pipe 206 extend to the outside of the heat sink 202 through the corresponding through holes 205. A sealing cover 204 is fixedly connected to the top of the heat sink 202.

[0020] It should be noted that the disc-type water cooling pipe 206 contains coolant, which can cool the water in the heat sink 202 in a timely manner to ensure the heat dissipation efficiency of the processor. The disc-type water cooling pipe 206 and the heat dissipation protrusion 2014 are arranged alternately, which helps to reduce the temperature of the heat dissipation protrusion 2014 and achieve rapid heat dissipation of the heat dissipation protrusion 2014.

[0021] like Figure 1 , Figure 2 and Figure 5 As shown, in some embodiments, a circulating water tank 5 is also included for real-time cooling of the heat sink 2013 and the heat dissipation protrusion 2014. The circulating water tank 5 is installed on the chassis, and the chassis has heat dissipation holes corresponding to the circulating water tank 5. There are two circulating water tanks 5. The circulating water tank 5 includes a tank body 501 and a cover 506 fixedly connected to the top of the tank body 501. The cover 506 has an array of perforated holes 507. The perforated holes 507 increase the cooling speed of the coolant and allow air circulation, which in turn facilitates the normal circulation of the coolant. The tank body 501 has equally spaced strip-shaped grooves 505. A hollow waterproof sealing plate 508 is fixedly connected to the outside of the strip-shaped grooves 505 inside the tank body 501. A protective cover 503 is fixedly connected to one side of the tank body 501, and a fan 504 is installed on the protective cover 503.

[0022] It should be noted that the circulating water tank 5 is used for cooling the coolant, ensuring the continuous and stable operation of the cooling system. Two circulating water tanks 5 are provided, and the number used can be selected according to needs. When the processor 102 operates at high power, both circulating water tanks 5 can work simultaneously, increasing the cooling efficiency of the coolant. When the processor 102 operates at low power, only one circulating water tank 5 can be used, resulting in greater energy savings. The main body of the circulating water tank 5 is the housing 501. A strip-shaped cavity 505 is formed in the housing 501, and a waterproof sealing plate 508 is fixedly connected to the strip-shaped cavity 505 within the housing 501. The waterproof sealing plate 508 provides a waterproof seal for the strip-shaped cavity 505, preventing coolant leakage. It should also be noted that the waterproof sealing plate 508 is made of a thermally conductive material, such as copper. When in use, the fan 504 operates, directing airflow to the waterproof sealing plate 508, thereby cooling the coolant inside the housing 501.

[0023] like Figure 1 and Figure 5 As shown, in some embodiments, arrayed heat dissipation fins 502 are provided on both sides of the housing 501, and support frames 4 are provided at the bottom of the two housings 501. The support frames 4 are fixed to the chassis to realize the installation and fixation of the circulating water tank 5 on the chassis.

[0024] It should be noted that by setting heat dissipation fins 502 on the outer wall of the housing 501, the heat dissipation rate of the coolant can be further increased, and the support frame 4 is used to support the housing 501.

[0025] like Figure 1 , Figure 2 , Figure 5 and Figure 6As shown, in some embodiments, a piping assembly 3 is provided between the heat sink 202 and the two circulating water tanks 5. The piping assembly 3 enables the circulation of coolant, providing real-time cooling to the processor body 102 as needed. The piping assembly 3 includes a drain pipe 301 and an inlet pipe 309. The drain pipe 301 is connected to one end of the disc-type water cooling tube 206, allowing coolant to be drawn out of the disc-type water cooling tube 206 and discharged into the circulating water tank 5. The inlet pipe 309 is connected to the other end of the disc-type water cooling tube 206, allowing coolant to be discharged into the disc-type water cooling tube 206, ensuring that the coolant temperature in the disc-type water cooling tube 206 remains within a low range. The end of the drain pipe 301 furthest from the disc-type water cooling tube 206 is connected to two first branch pipes 305 via a water pipe connector 303. Both first branch pipes 305 are connected to their respective tanks. On the cover 506, the first branch pipe 305 can discharge coolant into the corresponding housing 501 to achieve coolant circulation; the end of the inlet pipe 309 away from the disc water-cooling pipe 206 is connected to two second branch pipes 306 through the water pipe connector 303. Both second branch pipes 306 are connected to the bottom of the corresponding housing 501. The housing 501 can discharge coolant through the second branch pipes 306 and allow coolant to enter the disc water-cooling pipe 206 through the inlet pipe 309; a first valve 304 is installed on the first branch pipe 305 and a second valve 307 is installed on the second branch pipe 306 to control the inlet and outlet of coolant; a first water pump 302 is installed between the drain pipe 301 and the corresponding water pipe connector 303, and a second water pump 308 is installed between the inlet pipe 309 and the corresponding water pipe connector 303 to control the flow of coolant.

[0026] It should be noted that when the processor 102 is operating at high power, the first valve 304 and the second valve 307 can be opened simultaneously, and both water pumps and two circulating water tanks 5 can operate at the same time, increasing the cooling efficiency of the coolant and achieving rapid heat dissipation of the processor 102. In addition, one of the circulating water tanks 5 can be used alone, that is, the first valve 304 and the second valve 307 corresponding to one circulating water tank 5 can be closed, and the other circulating water tank 5 can be used for coolant circulation and heat exchange. This method is more energy-efficient. In addition, the two circulating water tanks 5 can be operated alternately, that is, the first valve 304 corresponding to one circulating water tank 5 can be opened and the second valve 307 corresponding to it can be closed, allowing coolant to flow in but not out, while the first valve 304 corresponding to the other circulating water tank 5 can be closed and the second valve 307 corresponding to it can be opened, allowing coolant to flow out but not in. This alternating operation can make the coolant cool more thoroughly and the heat dissipation effect of the processor 102 better.

[0027] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A heat dissipation device for a computer processor, comprising a processor assembly (1), the processor assembly (1) comprising a base (101) and a processor body (102) mounted on the base (101), characterized in that: It also includes a heat dissipation assembly (2) disposed on the processor assembly (1). The heat dissipation assembly (2) includes a heat sink (202), which is fixedly connected to a support base (103) disposed on the upper surface of the base (101). A heat-conducting structure (201) is embedded in the bottom of the heat sink (202), and the heat-conducting structure (201) abuts against the processor body (102). The heat-conducting structure (201) includes a heat-conducting substrate (2011) and a heat-conducting block (2012) integrally formed on one side of the heat-conducting substrate (2011). The heat-conducting substrate (2011) is in contact with the processor body (102) and is embedded in the groove (207) corresponding to the lower surface of the heat sink (202). The groove (207) of the heat sink (202) has a hollow cavity (203) that extends into the heat sink (202). The top of the heat-conducting block (2012) extends through the hollow cavity (203) to the inside of the heat sink (202) and is fixedly connected to a heat sink plate (2013). The upper surface of the heat sink plate (2013) is fixedly connected to heat dissipation protrusions (2014) that are evenly distributed.

2. The heat dissipation device for a computer processor according to claim 1, characterized in that: The heat dissipation protrusion (2014) is trapezoidal in design, and the outer wall of the heat dissipation protrusion (2014) is provided with equally spaced heat dissipation grooves (2015).

3. The heat dissipation device for a computer processor according to claim 1, characterized in that: The heat sink (202) is fixedly connected to a disc-shaped water cooling pipe (206), which is staggered with the heat dissipation protrusion (2014). Both sides of the heat sink (202) are provided with through holes (205), and both ends of the disc-shaped water cooling pipe (206) extend to the outside of the heat sink (202) through the corresponding through holes (205). A sealing cover (204) is fixedly connected to the top of the heat sink (202).

4. The heat dissipation device for a computer processor according to claim 1, characterized in that: It also includes a circulating water tank (5) for real-time cooling of the heat sink (2013) and heat sink protrusion (2014). There are two circulating water tanks (5). The circulating water tank (5) includes a tank body (501) and a cover (506) fixedly connected to the top of the tank body (501). The cover (506) has an array of perforated holes (507). The tank body (501) has equidistant strip-shaped cavities (505). A hollow waterproof sealing plate (508) is fixedly connected inside the tank body (501) to the outside of the strip-shaped cavities (505). A protective cover (503) is fixedly connected to one side of the tank body (501). A fan (504) is installed on the protective cover (503).

5. A heat dissipation device for a computer processor according to claim 4, characterized in that: Both sides of the box (501) are provided with arrayed heat dissipation fins (502), and the bottom of the two boxes (501) is provided with support frames (4).

6. A heat dissipation device for a computer processor according to claim 4, characterized in that: A piping assembly (3) is provided between the heat dissipation box (202) and the two circulating water tanks (5). The piping assembly (3) includes a drain pipe (301) and an inlet pipe (309). The drain pipe (301) is connected to one end of the disc-type water cooling pipe (206), and the inlet pipe (309) is connected to the other end of the disc-type water cooling pipe (206). The end of the drain pipe (301) away from the disc-type water cooling pipe (206) is connected to two first branch pipes (305) through a water pipe connector (303). Both first branch pipes (305) are connected to the corresponding box cover (506). The end of the inlet pipe (309) away from the disc-type water cooling pipe (206) is connected to two second branch pipes (306) through a water pipe connector (303). Both second branch pipes (306) are connected to the bottom of the corresponding box body (501).

7. A heat dissipation device for a computer processor according to claim 6, characterized in that: A first valve (304) is installed on the first branch pipe (305), and a second valve (307) is installed on the second branch pipe (306); a first water pump (302) is installed between the drain pipe (301) and the corresponding water pipe joint (303), and a second water pump (308) is installed between the inlet pipe (309) and the corresponding water pipe joint (303).

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