An arithmetic server

Abstract

The utility model discloses a kind of operation servers, it includes shell, horizontally arranged computing board and heat dissipation component, shell side plate is equipped with air outlet, bottom plate is equipped with air inlet and forms bottom air inlet gap by raising structure, computing board is opened up and down through-hole, heat dissipation component contains centrifugal fan and radiator, centrifugal fan is fixed in computing board and air inlet corresponds with through-hole, air outlet is towards side plate, radiator is attached computing board heating element and located between fan air outlet and side plate. The utility model is realized high-efficiency active heat dissipation by directional air duct design (bottom air inlet-through-hole-fan-radiator-side plate air outlet), combined with computing board horizontal layout and heat dissipation component planarization integration, improve space utilization, significantly reduce the volume and weight of whole machine, reduce noise, applicable to family entertainment, personal workstation and other consumer scenarios, effectively solve the contradiction between operation server miniaturization and heat dissipation efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of edge computing technology, and in particular relates to a computing server. Background Technology

[0002] With the development of cloud computing, edge computing, and artificial intelligence technologies, the application scenarios of computing servers are gradually expanding from traditional commercial fields to consumer electronics. However, existing computing servers are limited by their complex internal structure, generally suffering from large chassis size and low integration, which leads to their main application in enterprise-level data centers or professional server rooms, making it difficult to meet the needs of consumer products for miniaturization, portability, and high space utilization.

[0003] To promote the adoption of computing servers in the consumer market, the industry has attempted to achieve miniaturization by simplifying the structure and compressing the size. However, the miniaturization process faces a serious heat dissipation bottleneck: traditional small servers mostly use passive heat dissipation, and their heat dissipation efficiency is limited by the space size. This cannot match the heat dissipation requirements of high-power components, resulting in decreased server stability, performance degradation, or even hardware damage. See Chinese patent document with patent application number CN202421324266.7.

[0004] Therefore, how to achieve efficient active heat dissipation while ensuring the miniaturization and high integration of computing servers has become a core technical challenge restricting their promotion to consumer products. Utility Model Content

[0005] Based on this, a computing server is provided to address the aforementioned technical problems.

[0006] The technical solution adopted in this utility model is as follows:

[0007] A computing server includes a housing, a computing board disposed within the housing, and a heat dissipation assembly for cooling the computing board. The housing features a side panel with an air outlet, a bottom panel with an air inlet, and a lifting structure on the housing for raising the server to create an air inlet gap between the bottom panel and the server's mounting surface. The computing board is horizontally arranged and has vertically oriented through-holes. The heat dissipation assembly includes a centrifugal fan and a heat sink. The centrifugal fan is fixed to the computing board, with its air inlet corresponding vertically to the through-holes and its air outlet facing the side panel. The heat sink is disposed on a heating element of the computing board and fixed to the computing board, and is located between the air outlet of the centrifugal fan and the side panel.

[0008] The beneficial effects of this utility model are as follows:

[0009] 1. Highly efficient active heat dissipation enhances operational stability.

[0010] By constructing air outlets on the side panels of the outer casing, air inlets on the bottom plate, and a raised structure (forming a bottom air inlet gap), a directional airflow path of "bottom air inlet - vertical through-hole - centrifugal fan - radiator - side panel air outlet" is created, forming a stable directional airflow with high heat dissipation efficiency;

[0011] The centrifugal fan corresponds to the through holes on the computing board, allowing it to directly draw in cool air from below the computing board and blow it through the through holes to the heat sink (covering the heat-generating components). Combined with the heat sink's high thermal conductivity material, this significantly improves heat dissipation efficiency and solves the problem of insufficient passive heat dissipation capacity in small servers.

[0012] The heat sink is directly attached to the core heat-generating components of the computing board and is located between the centrifugal fan exhaust vent and the side panel, shortening the heat dissipation path and ensuring rapid heat dissipation.

[0013] 2. High integration and space utilization enable miniaturized design.

[0014] The computing board is horizontally arranged, and the centrifugal fan and heat sink are integrated in a planar manner (the fan is fixed to the computing board and the heat sink is located between the fan and the side plate), which avoids the space waste of the traditional vertical layout, greatly reduces the thickness of the whole machine, and improves the space utilization rate.

[0015] 3. Adapt to the needs of consumer products and expand application scenarios.

[0016] Through the above structural optimization, the overall size and weight of the machine are greatly reduced, meeting the needs of consumer scenarios such as home entertainment, personal workstations, and edge computing nodes;

[0017] Centrifugal fans have lower operating noise compared to traditional axial fans, and combined with stable heat dissipation efficiency, they ensure that servers can operate reliably for extended periods in quiet environments such as desktops and living rooms.

[0018] In summary, this utility model, through its innovative design of "structural integration + active heat dissipation optimization," effectively resolves the contradiction between miniaturization and heat dissipation efficiency of computing servers, providing key technical support for their widespread adoption in the consumer electronics field. Attached Figure Description

[0019] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments:

[0020] Figure 1 A three-dimensional structural diagram of a computing server provided for an embodiment of this utility model;

[0021] Figure 2 This is a schematic diagram of the internal structure of an embodiment of the present utility model;

[0022] Figure 3 This is a schematic diagram of the structure of the computing board according to an embodiment of the present invention;

[0023] Figure 4 This is a three-dimensional structural diagram of the base plate according to an embodiment of the present utility model. Figure 1 ;

[0024] Figure 5 This is a three-dimensional structural diagram of the base plate according to an embodiment of the present utility model. Figure 2 . Detailed Implementation

[0025] The embodiments of this utility model will be described below with reference to the accompanying drawings. It should be noted that the embodiments described in this specification are not exhaustive and do not represent the only embodiments of this utility model. The corresponding embodiments below are only for clearly illustrating the utility model content of this patent and are not intended to limit its implementation. For those skilled in the art, different variations and modifications can be made based on the described embodiments. Any obvious variations or modifications that fall within the technical concept and utility model content of this utility model are also within the protection scope of this utility model.

[0026] like Figure 1 and Figure 2 As shown in the figure, this application provides a computing server, including a housing 1100, a computing board 1200 and a heat dissipation assembly 1300.

[0027] like Figure 1 , Figure 2 and Figure 4 As shown, the outer shell 1100 consists of a top plate 1110, a front side plate 1120, a rear side plate 1130, a left side plate 1140, a right side plate 1150, and a bottom plate 1160. The front side plate 1120, the rear side plate 1130, the left side plate 1140, the right side plate 1150, and the bottom plate 1160 are integrally connected to form a lower shell. The upper opening of the lower shell forms a step, and the top plate 1110 is disposed on the step and can be fixed by adhesive.

[0028] Both the front panel 1120 and the rear panel 1130 have multiple slots. The rear panel 1130 is divided into a lower half and an upper half. The lower half has multiple slots, and the upper half has multiple air outlets 1131 evenly distributed. (See [reference]) Figure 3 and Figure 4 .

[0029] like Figure 4 As shown, the inner wall of the lower housing forms a plurality of evenly distributed protrusions 1170, and the protrusions 1170 have bolt holes 1171 in the vertical direction.

[0030] like Figure 4As shown, the base plate 1160 forms a concentric recessed groove 1161. Multiple air inlets 1162 are evenly distributed in the front half of the groove bottom 1161a. Simultaneously, to increase the air intake, multiple air inlets 1162 are evenly distributed in the groove wall 1161b of the groove 1161 and in the area surrounding the groove 1161 on the base plate 1160. (See also...) Figure 4 and Figure 5 .

[0031] like Figure 5 As shown, in order to allow air to enter smoothly through the air inlet 1162, the outer casing 1100 is provided with a lifting structure 1180 for raising the server so that there is an air intake gap between the base plate 1160 and the server placement surface. In this embodiment, the lifting structure 1180 includes four lifting feet 1181, which are evenly distributed on the lower surface of the base plate 1160 and can be fixed by adhesive.

[0032] like Figure 2 and Figure 3 As shown, the calculation board 1200 is arranged horizontally and is fixed by multiple bolts and multiple bolt holes 1171, thus being horizontally suspended above the base plate 1160.

[0033] The computing board 1200 has multiple heat-generating elements and multiple terminals. The heat-generating elements are arranged in the rear area of ​​the computing board 1200, including computing chips, DDR, inductors, etc. The terminals include USB-A, USB-C, push-button switches, HDMI, Ethernet ports, power Phoenix terminals, etc. The terminals are distributed on the front and rear sides of the computing board 1200 and are exposed from the corresponding slots.

[0034] The calculation board 1200 also has through holes 1210 in the vertical direction. The through holes 1210 are located in front of multiple heating elements and correspond vertically to multiple air inlets 1162 in the front half area of ​​the bottom of the slot 1161a.

[0035] The heat dissipation component 1300 is used to dissipate heat from the computing board, such as... Figure 2 As shown, it includes a centrifugal fan 1310 and a heat sink 1320. The centrifugal fan 1310 is fixed to the computing board 1200 by bolts. Its air inlet corresponds vertically to the through hole 1210, and its air outlet faces the rear side plate 1130. Since the heat of the computing board comes from multiple heat-generating elements, the heat sink 1320 is placed on the multiple heat-generating elements and fixed to the computing board 1200 by bolts, so that it is located between the air outlet of the centrifugal fan 1310 and the rear side plate 1130. In this embodiment, the heat sink 1320 is arranged adjacent to the centrifugal fan 1310 and the rear side plate 1130, which is compact and suitable for mini computing servers.

[0036] The centrifugal fan 1310 is mounted on the calculation board 1200, which is horizontally suspended above the base plate 1160 (there is at least a distance of one fan thickness between the calculation board 1200 and the base plate 1160). This avoids the problem of large flow resistance and significantly increased noise caused by the air inlet of the centrifugal fan 1310 being in close contact with the base plate 1160.

[0037] The heat sink 1320 has multiple heat dissipation fins 1321 arranged at intervals on the left and right sides. The multiple heat dissipation fins 1321 extend along the air outlet direction (front and back direction) of the centrifugal fan 1310, so that airflow can pass through the gaps between the heat dissipation fins 1321 and carry away heat.

[0038] As can be seen from the above, the computing server provided in this application embodiment has the following beneficial effects:

[0039] 1. Highly efficient active heat dissipation enhances operational stability.

[0040] By constructing the air outlet on the side panel of the outer shell, the air inlet on the bottom plate, and the raised structure (forming a bottom air inlet gap), a directional airflow path of "bottom air inlet - vertical through hole - centrifugal fan - radiator - side panel air outlet" is created, forming a stable directional airflow.

[0041] The centrifugal fan corresponds to the through holes on the computing board, allowing it to directly draw in cool air from below the computing board and blow it through the through holes to the heat sink (covering the heat-generating components). Combined with the heat sink's high thermal conductivity material, this significantly improves heat dissipation efficiency and solves the problem of insufficient passive heat dissipation capacity in small servers.

[0042] The heat sink is directly attached to the core heat-generating components of the computing board and is located between the centrifugal fan exhaust vent and the side panel, shortening the heat dissipation path and ensuring rapid heat dissipation.

[0043] 2. High integration and space utilization enable miniaturized design.

[0044] The computing board is horizontally arranged, and the centrifugal fan and heat sink are integrated in a planar manner (the fan is fixed to the computing board and the heat sink is located between the fan and the side plate), which avoids the space waste of the traditional vertical layout, greatly reduces the thickness of the whole machine, and improves the space utilization rate.

[0045] 3. Adapt to the needs of consumer products and expand application scenarios.

[0046] Through the above structural optimization, the overall size and weight of the machine are greatly reduced, meeting the needs of consumer scenarios such as home entertainment, personal workstations, and edge computing nodes;

[0047] Centrifugal fans have lower operating noise compared to traditional axial fans, and combined with stable heat dissipation efficiency, they ensure that servers can operate reliably for extended periods in quiet environments such as desktops and living rooms.

[0048] In summary, this utility model, through its innovative design of "structural integration + active heat dissipation optimization," effectively resolves the contradiction between miniaturization and heat dissipation efficiency of computing servers, providing key technical support for their widespread adoption in the consumer electronics field.

[0049] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A computing server, comprising a casing, a computing board disposed within the casing, and a heat dissipation assembly for dissipating heat from the computing board, characterized in that, One side panel of the housing has an air outlet, and the bottom plate of the housing has an air inlet. The housing is provided with a lifting structure for raising the server to create an air intake gap between the bottom plate and the server placement surface. The computing board is arranged horizontally and has through holes in the vertical direction. The heat dissipation assembly includes a centrifugal fan and a heat sink. The centrifugal fan is fixed to the computing board, with its air inlet corresponding vertically to the through holes and its air outlet facing the side panel. The heat sink is disposed on the heating element of the computing board and fixed to the computing board, and the heat sink is located between the air outlet of the centrifugal fan and the side panel.

2. A computing server according to claim 1, characterized in that, The rear panel of the housing has the air outlet, the air outlet of the centrifugal fan faces the rear panel, and the heat sink is located between the air outlet of the centrifugal fan and the rear panel.

3. A computing server according to claim 1, characterized in that, The bottom plate of the outer casing forms a concave groove, and multiple air inlets are evenly distributed in the area corresponding to the bottom of the groove and the through hole.

4. A computing server according to claim 3, characterized in that, The groove wall and the area on the bottom plate surrounding the groove are both evenly distributed with multiple air inlets.

5. A computing server according to claim 3, characterized in that, The lifting structure includes four lifting pads, which are evenly distributed on the lower surface of the base plate.

6. A computing server according to claim 5, characterized in that, The four raised foot pads are evenly distributed on the lower surface of the bottom of the groove.

7. A computing server according to claim 1, characterized in that, The computing board is horizontally suspended and fixed above the base plate.

8. A computing server according to claim 1, characterized in that, The radiator is arranged adjacent to the air outlet and side plate of the centrifugal fan.

9. A computing server according to claim 1, characterized in that, The radiator has a plurality of heat dissipation fins arranged at intervals, the plurality of heat dissipation fins extending along the air outlet direction of the centrifugal fan.

10. A computing server according to claim 2, characterized in that, The computing board has multiple terminals distributed on its front and rear sides, and the front and rear panels of the housing each have multiple slots that expose the corresponding terminals.

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