A processor heat dissipation unit, a processor module and a host
CN224536440UActive Publication Date: 2026-07-21SHENZHEN XINZHONGDA HEAT DISSIPATION CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN XINZHONGDA HEAT DISSIPATION CO LTD
- Filing Date
- 2025-03-24
- Publication Date
- 2026-07-21
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Figure CN224536440U_ABST
Abstract
The utility model provides a kind of processor heat dissipation unit, processor module and host computer, it is related to electronic equipment field.The processor heat dissipation unit provided by the utility model includes heat conduction plate, and recessed accommodating space is formed on heat conduction plate, and heat conduction step is protruded in accommodating space, and heat conduction step is used to be attached with processor.Processor module includes PCB, processor and aforementioned processor heat dissipation unit;Processor is arranged in PCB and is connected with PCB communication, and PCB is arranged in accommodating space and one end projects accommodating space;Processor is attached to heat conduction step.The host computer includes aforementioned processor module.The utility model provides host computer, and it is conducive to increasing processor heat dissipation efficiency, especially applicable to large model training.
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