Liquid cooling module, cooling device, and computing device

Abstract

The embodiment of the application provides a liquid cooling module, a cooling device and a computing device, the liquid cooling module comprises a liquid cooling plate, the inside of the liquid cooling plate is defined as a cooling flow channel for the flow of a cooling medium, and the cooling flow channel comprises at least two flow channels, and the directions of the at least two flow channels are opposite. The application can realize the effect of counter-flow heat exchange by setting the flow directions of the cooling medium of the at least two flow channels to be opposite (for example, the flow directions of the cooling medium in the adjacent joint parts of the first flow channel and the second flow channel are opposite), so that the cooling medium can exchange heat more fully in the adjacent flow channels, thereby improving the overall balance of the liquid cooling system, being beneficial to uniformly distributing the temperature of the liquid cooling plate, reducing the situation that the liquid cooling plate is locally overheated or the temperature gradient is too large, guaranteeing the stable operation of a heat source device such as a computing power board, ensuring that the heat of the computing power board can be quickly taken away, and improving the overall heat dissipation efficiency of the liquid cooling module.

Description

[0001] This application claims priority to Chinese Patent Application No. 202520134460.7, filed on January 20, 2025, entitled "Liquid Cooling Module, Cooling Device and Computing Equipment", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic equipment technology, and in particular to a liquid cooling module, a cooling device, and a computing device. Background Technology

[0003] Data centers typically house multiple computing devices and cooling systems. The computing devices generate a significant amount of heat during operation, and the cooling systems ensure that the computing devices operate within a safe temperature range, preventing performance degradation and hardware damage due to overheating.

[0004] In related technologies, cooling equipment generally includes multiple fans to dissipate heat from computing devices. However, since the cooling airflow can only flow through a limited number of components, the overall heat dissipation effect of computing devices still needs to be improved. Utility Model Content

[0005] This application provides a liquid cooling module, a cooling device, and a computing device to solve or alleviate one or more technical problems in the prior art.

[0006] As one aspect of the embodiments of this application, this application embodiment provides a liquid cooling module, including:

[0007] Liquid cooling plate, the interior of which is defined by cooling channels for the flow of cooling medium;

[0008] The cooling channel includes at least two channels, and the directions of the at least two channels are opposite.

[0009] In some embodiments, the cooling channel includes a first channel and a second channel, wherein the flow direction of the first channel is opposite to that of the second channel.

[0010] In some embodiments, the liquid cooling plate is defined with at least two liquid inlets and at least two liquid outlets.

[0011] In some embodiments, at least one outlet and at least one inlet are connected together.

[0012] In some embodiments, at least two liquid inlets include a first liquid inlet and a second liquid inlet, and at least two liquid outlets include a first liquid outlet and a second liquid outlet; wherein the first liquid outlet and the second liquid inlet are connected.

[0013] In some embodiments, the input end of the first flow channel is connected to the first liquid inlet, the output end of the first flow channel is connected to the first liquid outlet, the input end of the second flow channel is connected to the second liquid inlet, and the output end of the second flow channel is connected to the second liquid outlet.

[0014] In some embodiments, the inlet and outlet of at least two flow channels are located on the same side of the liquid cooling plate.

[0015] In some embodiments, the first liquid inlet, the first liquid outlet, the second liquid inlet, and the second liquid outlet are located on the same side of the liquid cooling plate.

[0016] In some embodiments, the first liquid inlet, the second liquid outlet, the second liquid inlet and the first liquid outlet are arranged sequentially on the same side of the liquid cooling plate in the first direction.

[0017] In some embodiments, the first liquid inlet and the second liquid outlet are disposed adjacent to one side of the liquid cooling plate in the second direction, and the first liquid outlet and the second liquid inlet are disposed adjacent to the other side of the liquid cooling plate in the second direction; the second direction is perpendicular to the first direction.

[0018] In some embodiments, at least two flow channels have the same extension path.

[0019] In some embodiments, the first flow channel includes a plurality of first sub-flow channels connected in sequence, the extension direction of the first sub-flow channels being parallel to a first direction, and the plurality of first sub-flow channels being spaced apart along a second direction, the second direction being perpendicular to the first direction.

[0020] In some embodiments, a plurality of first sub-channels are arranged at equal intervals in the direction from the input end of the first channel to the output end of the first channel.

[0021] In some embodiments, multiple first sub-channels are arranged at non-equidistant intervals in the direction from the input end of the first channel to the output end of the first channel.

[0022] In some embodiments, in the direction from the input end of the first flow channel to the output end of the first flow channel, the distance between two adjacent first sub-flow channels in a plurality of first sub-flow channels gradually decreases.

[0023] In some embodiments, in the direction from the input end of the first flow channel to the output end of the first flow channel, the plurality of first sub-flow channels are divided into multiple groups, and the distance between two adjacent groups of first sub-flow channels is greater than the distance between adjacent first sub-flow channels within each group.

[0024] In some embodiments, the second flow channel includes a plurality of second sub-flow channels connected in sequence, at least one of the second sub-flow channels extends in a direction parallel to the first direction, and the plurality of second sub-flow channels are spaced apart along a second direction, the first direction being perpendicular to the second direction.

[0025] In some embodiments, the extension directions of the plurality of second sub-channels are parallel to the first direction, and the extension paths of the first channel and the second channel are the same.

[0026] In some embodiments, the second liquid inlet and the first liquid outlet are disposed on one side of the liquid cooling plate in the second direction; the input end of the second flow channel defines a first clearance area communicating with the second liquid inlet, the first clearance area extending in a direction away from the first liquid outlet.

[0027] In some embodiments, at least one turbulence structure is provided in the first flow channel and / or the second flow channel.

[0028] In some embodiments, the first flow channel includes a plurality of first sub-flow channels connected in sequence.

[0029] In some embodiments, the number of turbulence structures in different first sub-channels is equal in the flow direction of the cooling channel.

[0030] In some embodiments, the number of turbulence structures in different first sub-channels gradually increases in the flow direction of the cooling channel.

[0031] In some embodiments, at least one turbulence structure is provided in the second sub-channel.

[0032] In some embodiments, the number of turbulence structures in different second sub-channels is equal in the direction of the cooling flow channel.

[0033] In some embodiments, the number of turbulence structures in different second sub-channels gradually increases in the flow direction of the cooling channel.

[0034] In some embodiments, the cooling channel is provided with multiple sets of baffle groups along its flow direction, each baffle group including at least one baffle structure, and the baffle structures of at least two adjacent baffle groups have different baffle directions.

[0035] In some embodiments, at least one turbulence structure is provided in the cooling channel.

[0036] As another aspect of the embodiments of this application, the embodiments of this application also provide a cooling device, which includes a liquid cooling module as described in any of the above embodiments.

[0037] As another aspect of the embodiments of this application, the embodiments of this application also provide a computing device, which includes a liquid cooling module as described in any of the preceding embodiments or a cooling device as described in any of the preceding embodiments.

[0038] The embodiments of this application have the following beneficial effects:

[0039] Based on the liquid cooling module, cooling device, and computing device provided above,

[0040] By setting at least two flow channels with opposite cooling medium flow directions (e.g., the cooling medium in the adjacent part of the first and second flow channels flows in opposite directions), countercurrent heat exchange can be achieved. This allows the cooling medium to exchange heat more fully in adjacent flow channels, thereby improving the overall uniformity of the liquid cooling system. It is beneficial to evenly distribute the temperature of the liquid cooling plate, reduce local overheating or excessive temperature gradient of the liquid cooling plate, ensure the stable operation of heat source equipment such as computing boards, ensure that the heat of the computing board can be quickly removed, and improve the overall heat dissipation efficiency of the liquid cooling module. Attached Figure Description

[0041] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0042] Figure 1 A cross-sectional view of a cooling device according to an embodiment of this application is shown;

[0043] Figure 2 An exploded schematic diagram of a cooling device according to an embodiment of this application is shown;

[0044] Figure 3 A schematic diagram of the computing board according to an embodiment of this application is shown;

[0045] Figure 4 A cross-sectional view of a cooling device according to an embodiment of this application is shown;

[0046] Figure 5 Show Figure 4 Enlarged diagram of A in the middle;

[0047] Figure 6 A cross-sectional view of a liquid cooling plate according to a first embodiment of this application is shown;

[0048] Figure 7 A cross-sectional view of a liquid cooling plate according to a second embodiment of this application is shown;

[0049] Figure 8 A cross-sectional view of a liquid cooling plate according to a third embodiment of this application is shown;

[0050] Figure 9 A cross-sectional view of a liquid cooling plate according to a fourth embodiment of this application is shown;

[0051] Figure 10 A cross-sectional view of a cooling device according to an embodiment of this application is shown;

[0052] Figure 11A schematic diagram of the structure of a computing device according to an embodiment of this application is shown.

[0053] Explanation of reference numerals in the attached figures:

[0054] 1. Computing equipment;

[0055] 10. Cooling device;

[0056] 100. Liquid cooling module; 110. Liquid cooling plate; 111. Cooling channel; 1111. First channel; 1111a. First sub-channel; 1112. Second channel; 1112a. Second sub-channel; 1112b. First clearance area; 1112c. Second clearance area; 112. Liquid cooling surface; 113. Positioning hole; 114. First liquid inlet; 115. Second liquid inlet; 116. First liquid outlet; 117. Second liquid outlet; 120. Cover plate; 121. First through hole; 130. Fastener;

[0057] 200, Computing board; 210, Computing module; 220, Second through hole;

[0058] 300. Connector;

[0059] 500. Turbulence structure;

[0060] X, the first direction; Y, the second direction. Detailed Implementation

[0061] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0062] The following combination Figures 1 to 10 The liquid cooling module 100 of the embodiments of this application will be described in detail.

[0063] Figure 1 A cross-sectional view of the cooling device 10 according to an embodiment of this application is shown. Figure 2 An exploded view of the cooling device 10 according to an embodiment of this application is shown. See also: Figure 1 and Figure 2 The liquid cooling module 100 of this application embodiment includes a cooling structure for achieving a cooling effect through heat transfer. The cooling structure may be a heat sink, a liquid cooling box, a liquid cooling plate 110, etc., but is not limited to the above examples. Specifically, the cooling structure is a liquid cooling plate 110, and the interior of the liquid cooling plate 110 defines a cooling channel 111 for the flow of cooling medium.

[0064] The cooling channel 111 includes at least two channels, and the directions of the at least two channels are opposite.

[0065] For example, the cooling channel 111 may include two channels, three channels, four channels, five channels, etc. It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. For example, the cooling medium flowing within the liquid cooling plate 110 may also have six channels, seven channels, etc.

[0066] It should be noted that the flow direction of the flow channel can be understood as the flow direction of the cooling medium from the inlet to the outlet of the flow channel. At least two flow channels have opposite directions, which means that the flow direction of the cooling medium in one flow channel is generally opposite to the flow direction in the other flow channel. For example, the flow direction of the cooling medium in the adjacent part of the first flow channel 1111 and the second flow channel 1112 is opposite.

[0067] Therefore, by setting at least two flow channels with opposite cooling medium flow directions (for example, the cooling medium in the adjacent part of the first flow channel 1111 and the second flow channel 1112 flows in opposite directions), the effect of countercurrent heat exchange can be achieved, so that the cooling medium can exchange heat more fully in the adjacent flow channels, thereby improving the overall balance of the liquid cooling system, which is conducive to the uniform distribution of the temperature of the liquid cooling plate 110, reducing the situation of local overheating or excessive temperature gradient of the liquid cooling plate 110, ensuring the stable operation of heat source equipment such as the computing board 200, ensuring that the heat of the computing board 200 can be quickly removed, and improving the overall heat dissipation efficiency of the liquid cooling module 100.

[0068] In some embodiments, see Figure 1 The cooling channel 111 may include a cooling pipe structure with at least one channel. Specifically, the cooling channel 111 includes a first channel 1111 and a second channel 1112, wherein the flow direction of the first channel 1111 is opposite to the flow direction of the second channel 1112.

[0069] It should be noted that the flow direction of the first flow channel 1111 can be understood as the flow direction of the cooling medium from the input end to the output end of the first flow channel 1111. Similarly, the flow direction of the second flow channel 1112 can be understood as the flow direction of the cooling medium from the input end to the output end of the second flow channel 1112. The fact that the flow directions of the first flow channel 1111 and the second flow channel 1112 are opposite means that the general flow direction of the cooling medium within the first flow channel 1111 is generally opposite to the general flow direction within the second flow channel 1112. For example, the flow direction of the cooling medium in the adjacent portions of the first flow channel 1111 and the second flow channel 1112 is opposite.

[0070] Therefore, the cooling medium forms a circulating flow path in the liquid cooling plate 110 through the first flow channel 1111 and the second flow channel 1112, which can effectively utilize the internal space of the liquid cooling plate 110, making the cooling device 10 more compact and efficient, ensuring that the cooling medium can fully cover the area of ​​the computing board 200 that needs heat dissipation, and ensuring that the heat of the computing board 200 can be quickly carried away, which is conducive to improving the overall heat dissipation efficiency of the liquid cooling module 100.

[0071] In the embodiments of this application, see Figure 1 , Figures 6 to 9 The first flow channel 1111 and the second flow channel 1112 have opposite flow directions and are adjacent to each other. Since the temperature of the cooling medium in the second flow channel 1112 is always higher than that in the first flow channel 1111, the opposite flow directions of the first flow channel 1111 and the second flow channel 1112 enable heat conduction between them. Heat can be evenly transferred between the first flow channel 1111 and the second flow channel 1112, avoiding local overheating and ensuring the uniformity of temperature distribution in the first flow channel 1111 and the second flow channel 1112.

[0072] It is understood that the diameters of the first flow channel 1111 and the second flow channel 1112 can be selected according to the computing module 210 on the computing board 200. For example, to improve the heat dissipation effect of the computing board 200, the diameters of the first flow channel 1111 and the second flow channel 1112 can be adapted to the width of the computing module 210. With this configuration, when the computing module 210 is in contact with the liquid cooling surface 112 of the liquid cooling plate 110, the orthographic projection of the computing module 210 on the liquid cooling surface 112 falls within the orthographic projections of the first flow channel 1111 and the second flow channel 1112 on the liquid cooling surface 112, so that the first flow channel 1111 and the second flow channel 1112 can cover the computing module 210. It should be noted that this is merely an example and does not constitute a limitation of this application. Those skilled in the art will understand that the diameters of the first flow channel 1111 and the second flow channel 1112 can also be larger than the width of the computing module 210, and are not limited thereto.

[0073] In some embodiments, the liquid cooling plate 110 is provided with at least two liquid inlet structures and at least two liquid outlet structures for conveying the cooling medium. The liquid inlet structure may be a liquid inlet port, liquid inlet hole, liquid inlet tank, liquid inlet pipe, etc., and the liquid outlet structure may be a liquid outlet port, liquid outlet hole, liquid outlet tank, liquid outlet pipe, etc., but is not limited to the above examples. Specifically, the liquid inlet structure is a liquid inlet port, the liquid outlet structure is a liquid outlet port, and there are at least two liquid inlets and at least two liquid outlet ports.

[0074] In some embodiments, at least one outlet and at least one inlet are connected together.

[0075] In the cooling channel 111 of this application embodiment, by providing at least two liquid inlets and at least two liquid outlets, the cooling medium can be more evenly distributed and flowed on the liquid cooling plate 110, thereby avoiding the problem of local overheating of the liquid cooling plate 110 and improving the overall cooling efficiency. Secondly, the arrangement of multiple liquid inlets and outlets can optimize the distribution of the cooling channel 111 inside the liquid cooling plate 110, so that the cooling medium can more effectively cover and cool the entire surface of the liquid cooling plate 110, improving the heat exchange efficiency.

[0076] For example, see Figure 2 At least one surface of the liquid cooling plate 110 has a cooling structure for cooling a heat-generating element in contact with or near it. This cooling structure can be a liquid-cooled flat surface, a liquid-cooled curved surface, a liquid-cooled pad, etc., but is not limited to the examples listed above. Specifically, the contact structure is as follows: Figure 2 As shown in the liquid-cooled surface 112, the computing board 200 generates heat during operation. The computing board 200 is fixed on the liquid-cooled surface 112 of the liquid-cooled plate 110. That is, the heat generated by the computing board 200 can be quickly transferred to the liquid-cooled plate 110 through the liquid-cooled surface 112 by the contact between the computing board 200 and the liquid-cooled surface 112. The cooling medium flows in the cooling channel 111 inside the liquid-cooled plate 110, which can continuously absorb and remove the heat generated by the computing board 200 during operation, thereby continuously providing cooling for the computing board 200. This allows the computing board 200 to maintain a low temperature under high load operation, reducing the possibility of performance degradation or damage caused by overheating of the computing board 200, thereby improving the heat dissipation efficiency of the computing board 200.

[0077] In the embodiments of this application, the number of inlet and outlet can be one, two, three, four, etc. It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the number of inlet and outlet can be selected according to actual needs and is not limited thereto.

[0078] In some embodiments, see Figure 1 It has at least two liquid inlets, including a first liquid inlet 114 and a second liquid inlet 115, and at least two liquid outlets, including a first liquid outlet 116 and a second liquid outlet 117. The first liquid outlet 116 and the second liquid inlet 115 are connected.

[0079] In the cooling channel 111 of this embodiment, the cooling medium enters the interior of the first channel 1111 of the liquid cooling plate 110 from the first inlet 114. The cooling medium inside the first channel 1111 is then discharged from the first outlet 116. The cooling medium discharged from the first outlet 116 enters the second channel 1112 from the second inlet 115, and the cooling medium in the second channel 1112 is discharged from the second outlet 117. Thus, the arrangement of the first inlet 114, the first outlet 116, the second inlet 115, and the second outlet 117 allows the cooling medium to circulate within the liquid cooling plate 110, enabling more uniform distribution and flow of the cooling medium. This avoids localized overheating of the liquid cooling plate 110 and improves overall cooling efficiency. Secondly, the arrangement of multiple liquid inlets and outlets can optimize the distribution of cooling channels 111 inside the liquid cooling plate 110, so that the cooling medium can more effectively cover and cool the entire surface of the liquid cooling plate 110, thereby improving heat exchange efficiency.

[0080] In this embodiment, the cooling medium is a liquid capable of absorbing and reducing heat. Specifically, the cooling medium can be a liquid capable of continuously absorbing and carrying away the heat generated by the computing board 200 during the computing process.

[0081] In some examples, water can be used as the cooling medium.

[0082] In other examples, the cooling medium may be a fluorinated liquid.

[0083] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. For example, the cooling medium flowing within the liquid cooling plate 110 may also be ethylene glycol solvent, glycerin, or other types of liquid coolants.

[0084] In some embodiments, the input end of the first flow channel 1111 is connected to the first liquid inlet 114, the output end of the first flow channel 1111 is connected to the first liquid outlet 116, the input end of the second flow channel 1112 is connected to the second liquid inlet 115, and the output end of the second flow channel 1112 is connected to the second liquid outlet 117. The structure of the first flow channel 1111 and the second flow channel 1112 can be adapted to the shape of the liquid cooling plate 110 to facilitate the flow of the cooling medium.

[0085] For example, the extension path of the first flow channel 1111 from the first liquid inlet 114 to the first liquid outlet 116 can be as follows: extending from the input end of the first flow channel 1111 along the first direction X to the first edge of the liquid cooling plate 110, then extending a predetermined distance along the second direction Y and then extending again along the first direction X to the second edge, then extending a predetermined distance along the second direction Y and then extending again along the first direction X to the first edge, and so on, to form the first flow channel 1111. The first edge and the second edge are two opposite edges of the liquid cooling plate 110 in the first direction X. It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the extension path of the first flow channel 1111 can also extend along multiple directions to adapt to the heat dissipation requirements of the computing board 200, and is not limited to this.

[0086] Exemplarily, the extension path of the second flow channel 1112 from the second inlet 115 to the second outlet 117 can be as follows: extending from the input end of the second flow channel 1112 along the first direction X to the first edge of the liquid cooling plate 110, then extending a predetermined distance along the second direction Y and then extending again along the first direction X to the second edge, then extending a predetermined distance along the second direction Y and then extending again along the first direction X to the first edge, and so on, to form the second flow channel 1112. The first edge and the second edge are two opposite edges of the liquid cooling plate 110 in the first direction X. It should be noted that this is merely an example and does not constitute a limitation of this application. Those skilled in the art will understand that the extension path of the second flow channel 1112 can also extend along multiple directions to adapt to the heat dissipation requirements of the computing board 200, and is not limited to this.

[0087] According to the embodiments of this application, the cooling medium forms a circulating flow path within the liquid cooling plate 110 through the first flow channel 1111 and the second flow channel 1112, which can effectively utilize the internal space of the liquid cooling plate 110, making the liquid cooling module 100 more compact and efficient. This ensures that the cooling medium fully covers the area of ​​the computing board 200 that needs heat dissipation, thereby ensuring that the heat of the computing board 200 can be quickly carried away by the cooling mechanism within the first flow channel 1111 and the second flow channel 1112, thus improving the overall heat dissipation efficiency of the liquid cooling module 100.

[0088] In some embodiments, the inlet and outlet of at least two flow channels are located on the same side of the liquid cooling plate 110.

[0089] For example, the cooling channel 111 includes a first channel 1111 and a second channel 1112, with the input and output ends of the first channel 1111 and the second channel 1112 located on the same side of the liquid cooling plate 110.

[0090] See in some examples Figure 1The input and output ends of the first flow channel 1111 are arranged at intervals on the same side of the liquid cooling plate 110 in the first direction X. That is, the first liquid inlet 114 and the first liquid outlet 116 are arranged at intervals on the same side of the liquid cooling plate 110 in the first direction X. This allows the pipes connected to the first liquid inlet 114 and the first liquid outlet 116 to be integrated on the same side of the liquid cooling plate 110 in the first direction X, thereby making the pipeline layout of the liquid cooling module 100 more concentrated and simplifying the installation and maintenance of the liquid cooling module 100.

[0091] In some embodiments, the first liquid inlet 114, the first liquid outlet 116, the second liquid inlet 115, and the second liquid outlet 117 are disposed on the same side of the liquid cooling plate 110.

[0092] In some embodiments, the first liquid inlet 114, the second liquid outlet 117, the second liquid inlet 115, and the first liquid outlet 116 are arranged sequentially on the same side of the liquid cooling plate 110 in the first direction X.

[0093] See in some examples Figure 1 The first liquid inlet 114, the second liquid outlet 117, the second liquid inlet 115, and the first liquid outlet 116 are arranged at intervals on the same side of the liquid cooling plate 110 in the first direction X, so that the pipes connected to the first liquid inlet 114 and the first liquid outlet 116, and the pipes connected to the second liquid inlet 115 and the second liquid outlet 117 can be integrated on the same side of the liquid cooling plate 110 in the first direction X, thereby making the pipeline layout of the liquid cooling module 100 more concentrated, which is beneficial to simplifying the installation and maintenance of the liquid cooling module 100.

[0094] In some embodiments, the first liquid inlet 114 and the second liquid outlet 117 are disposed adjacent to one side of the liquid cooling plate 110 in the second direction Y, and the first liquid outlet 116 and the second liquid inlet 115 are disposed adjacent to the other side of the liquid cooling plate 110 in the second direction Y. The second direction Y is perpendicular to the first direction X.

[0095] In this embodiment, the first liquid inlet 114 and the second liquid outlet 117 are disposed on one side of the liquid cooling plate 110 in the second direction Y, and the first liquid outlet 116 and the second liquid inlet 117 are disposed on the other side of the second direction Y. This arrangement enables a more efficient flow path design for the cooling medium within the liquid cooling plate 110, reducing dead zones and stagnant areas, and thus improving heat exchange efficiency. Furthermore, this arrangement effectively supports designs where the flow directions of the cooling medium in adjacent channels are opposite (e.g., the flow directions in the first channel 1111 and the second channel 1112 are opposite), facilitating a counter-current heat exchange effect and further enhancing heat dissipation performance. Furthermore, by setting the first liquid inlet 114 and the second liquid outlet 117 on one side of the liquid cooling plate 110 in the second direction Y, and setting the first liquid outlet 116 and the second liquid inlet 117 on the other side, the overall spatial layout requirements of the liquid cooling plate 110 can be better adapted, facilitating connection with external cooling systems (such as pumps, pipelines, etc.). At the same time, it can also reduce fluid resistance caused by changes in flow direction or unreasonable flow channel design, which is beneficial to improving the fluid dynamics performance of the system.

[0096] In some embodiments, the extension path of the first flow channel 1111 is the same as the extension path of the second flow channel 1112.

[0097] This configuration increases the area covered by the first flow channel 1111 and the second flow channel 1112 on the liquid cooling plate 110, reduces the gap between the first flow channel 1111 and the second flow channel 1112, and increases the flow distance and coverage area of ​​the cooling medium in the first flow channel 1111 and the second flow channel 1112. On the one hand, this embodiment of the application can effectively utilize the internal space of the liquid cooling plate 110, thereby making the liquid cooling module 100 more compact. On the other hand, the cooling medium can fully cover the area on the computing board 200 that needs heat dissipation, ensuring that the heat of the computing board 200 can be quickly carried away, which is beneficial to improving the overall heat dissipation efficiency of the liquid cooling module 100.

[0098] In some embodiments, the extension directions of the plurality of second sub-channels 1112a are parallel to the first direction X. This configuration can maximize the flow distance and coverage area of ​​the cooling medium in the first channel 1111 and the second channel 1112. On the one hand, this embodiment can effectively utilize the internal space of the liquid cooling plate 110, thereby making the liquid cooling module 100 more compact. On the other hand, the cooling medium can fully cover the area on the computing board 200 that needs heat dissipation, ensuring that the heat of the computing board 200 can be quickly carried away, thereby improving the overall heat dissipation efficiency of the liquid cooling module 100.

[0099] In some embodiments, see Figure 1The first flow channel 1111 includes a plurality of first sub-flow channels 1111a connected in sequence. The extension direction of the first sub-flow channels 1111a is parallel to the first direction X. The plurality of first sub-flow channels 1111a are spaced apart along the second direction Y, which is perpendicular to the first direction X.

[0100] Figure 3 A schematic diagram of the computing board 200 according to an embodiment of this application is shown. See also: Figure 3 In some embodiments, the computing board 200 is provided with multiple sets of computing modules 210 arranged at intervals along the second direction Y, and multiple computing modules 210 in each set of computing modules 210 are arranged adjacently along the first direction X.

[0101] Understandably, the computing modules 210 on the computing board 200 are usually the most heat-generating parts. These computing modules 210 (such as CPU, GPU, etc.) generate a lot of heat when running under high load. If heat is not dissipated in a timely and effective manner, the computing modules 210 may overheat, thereby affecting system performance and stability, and may even damage the hardware.

[0102] Based on the issues mentioned above, see Figure 1 The cooling channel 111 includes a first channel 1111, which in turn includes a plurality of first sub-channels 1111a connected in sequence. The extension direction of the first sub-channels 1111a is parallel to the first direction X. The plurality of first sub-channels 1111a are spaced apart along the second direction Y, which is perpendicular to the first direction X. Each set of computing modules 210 corresponds to at least one first sub-channel 1111a. It should be noted that, since the cooling medium in the first sub-channel 1111a is constantly flowing and thus carrying away the heat of the liquid cooling plate 110, the temperature is lower and the cooling rate is faster in the entire cooling device 10 at locations closer to the first sub-channel 1111a. Therefore, in this embodiment, the computing modules 210 are respectively associated with the first sub-channels 1111a to bring the locations in the liquid cooling plate 110 with faster cooling rates into close contact with the computing modules 210, thereby further improving the heat dissipation efficiency of the computing board 200.

[0103] For example, the computing module 210 can be attached to a position corresponding to one of the first sub-channels 1111a in the liquid cooling plate 110, so that the cooling medium flowing in the first sub-channel 1111a can carry away the heat of the computing module 210 at that position. The computing module 210 can be attached to a position corresponding to two of the first sub-channels 1111a in the liquid cooling plate 110, so that the cooling medium flowing in the first sub-channels 1111a can carry away the heat of the computing module 210 at that position. In other examples, the computing module 210 can be attached to a position corresponding to three of the first sub-channels 1111a in the liquid cooling plate 110, so that the cooling medium flowing in the first sub-channels 1111a can carry away the heat of the computing module 210 at that position. It should be noted that these are merely examples and do not constitute a limitation of this application. Those skilled in the art will understand that the computing module 210 can be selected to correspond to a corresponding number of first sub-channels 1111a according to heat dissipation requirements, and is not limited thereto.

[0104] In some embodiments, a plurality of first sub-channels 1111a are arranged at equal intervals in the direction from the input end of the first channel 1111 to the output end of the first channel 1111.

[0105] For example, the computing board 200 is provided with multiple sets of computing modules 210 arranged at equal intervals along the second direction Y. Multiple computing modules 210 in each set are arranged adjacently along the first direction X. Multiple first sub-channels 1111a extend along the first direction X, such that the extension directions of the multiple first sub-channels 1111a are parallel, and the spacing between two adjacent first sub-channels 1111a in the second direction Y is equal. This arrangement ensures that the multiple first sub-channels 1111a and the multiple sets of computing modules 210 are arranged in a one-to-one correspondence, guaranteeing that the cooling medium is evenly distributed within the cooling channels 111. That is, the proportion of cooling medium at both ends in the first direction X is equal or approximately equal, and the proportion of cooling medium at both ends in the second direction Y is equal or approximately equal. This avoids localized overheating of the liquid cooling plate 110, thereby ensuring a more uniform temperature distribution on the liquid cooling plate 110.

[0106] In other embodiments, multiple first sub-channels 1111a are arranged at non-equal intervals in the direction from the input end of the first channel 1111 to the output end of the first channel 1111.

[0107] For example, the computing board 200 is provided with multiple sets of computing modules 210 arranged at non-equidistant intervals along the second direction Y. Multiple computing modules 210 in each set are arranged adjacently along the first direction X. Multiple first sub-channels 1111a extend along the first direction X, such that the extension directions of the multiple first sub-channels 1111a are parallel, and the spacing between adjacent first sub-channels 1111a in the second direction Y is unequal. This arrangement ensures that the multiple first sub-channels 1111a and the multiple sets of computing modules 210 are configured in a one-to-one correspondence, thereby adapting the positions of the multiple first sub-channels 1111a to the positions of the multiple sets of computing modules 210.

[0108] In some embodiments, in the direction from the input end of the first flow channel 1111 to the output end of the first flow channel 1111, the distance between two adjacent first sub-flow channels 1111a in the plurality of first sub-flow channels 1111a gradually decreases.

[0109] For example, the computing board 200 is provided with multiple sets of computing modules 210 arranged at intervals along the second direction Y. In the second direction Y, the distance between adjacent sets of computing modules 210 gradually decreases. Multiple computing modules 210 in each set are arranged adjacently along the first direction X. Multiple first sub-channels 1111a extend along the first direction X, such that the extension directions of the multiple first sub-channels 1111a are parallel, and the distance between adjacent first sub-channels 1111a gradually decreases. This arrangement ensures that the multiple first sub-channels 1111a and the multiple sets of computing modules 210 are configured in a one-to-one correspondence, thereby adapting the positions of the multiple first sub-channels 1111a to the positions of the multiple sets of computing modules 210.

[0110] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the arrangement of the first sub-channels 1111a can also be partially equidistant or partially unequal, and is not limited thereto.

[0111] In some embodiments, see Figure 1 In the direction from the input end of the first flow channel 1111 to the output end of the first flow channel 1111, the multiple first sub-flow channels 1111a are divided into multiple groups, and the distance between two adjacent groups of first sub-flow channels 1111a is greater than the distance between adjacent first sub-flow channels 1111a within each group.

[0112] This configuration, by increasing the distance between adjacent sets of first sub-channels 1111a, allows the cooling medium to flow more easily between adjacent sets of first sub-channels 1111a during the flow process, reducing the possibility of flow blockage in the coiled first sub-channels 1111a, thereby improving the cooling efficiency of the liquid cooling plate 110. Secondly, since each set of first sub-channels 1111a is in contact with at least one computing board 200, the distance between adjacent first sub-channels 1111a within each set in this embodiment is small, which is conducive to generating turbulence in the cooling medium within each set of first sub-channels 1111a during fluid flow, increasing the contact area between the cooling medium and the wall of the first sub-channel 1111a, thereby improving the heat exchange efficiency of the liquid cooling plate 110.

[0113] In some embodiments, see Figure 1 The second liquid inlet 115 and the first liquid outlet 116 are disposed on one side of the liquid cooling plate 110 in the second direction Y. The input end of the second flow channel 1112 defines a first clearance area 1112b that communicates with the second liquid inlet 115, and the first clearance area 1112b extends in a direction away from the first liquid outlet 116.

[0114] In this embodiment, connectors are respectively provided on the second inlet 115 and the first outlet 116. These connectors are used to connect the input or output end to an external pipe or other water system equipment. The connector can be a connecting pipe, a connecting seat, or other water system connection structure, but is not limited to the examples listed above. Specifically, the connector is as follows: Figure 8 The connector 300 is shown. The two connectors 300 are connected by a pipe. In this embodiment, by setting the first clearance area 1112b, the distance between the input end of the second flow channel 1112 and the output end of the first flow channel 1111 can be increased, thereby increasing the distance between the second liquid inlet 115 and the first liquid outlet 116, and further increasing the distance between the two connectors 300 that are respectively connected to the second liquid inlet 115 and the first liquid outlet 116. This reduces the degree of bending of the pipe connecting the two connectors 300, thereby making the flow of the cooling medium in the pipe between the two connectors 300 smoother.

[0115] In some embodiments, at least one turbulence structure 500 is provided in the cooling channel 111.

[0116] In some embodiments, at least one turbulence structure 500 is provided in the first flow channel 1111 and / or the second flow channel 1112.

[0117] For example, a turbulence-inducing structure 500 is provided in the first flow channel 1111, meaning that the cooling medium only experiences a turbulence-inducing effect within the first flow channel 1111. In other examples, a turbulence-inducing structure 500 is provided in the second flow channel 1112, meaning that the cooling medium only experiences a turbulence-inducing effect within the second flow channel 1112. In still other examples, a turbulence-inducing structure 500 is provided in both the first flow channel 1111 and the second flow channel 1112, meaning that the cooling medium can achieve a turbulence-inducing effect in both the first flow channel 1111 and the second flow channel 1112.

[0118] Figure 6 A cross-sectional view of the liquid cooling plate 110 according to a first embodiment of this application is shown. Figure 7 A cross-sectional view of the liquid cooling plate 110 according to a second embodiment of this application is shown. Figure 8 A cross-sectional view of the liquid cooling plate 110 according to a third embodiment of this application is shown. Figure 9 This illustration shows a cross-sectional view of the liquid cooling plate 110 according to a fourth embodiment of this application. In some embodiments, see [link to relevant documentation]. Figures 6 to 9 At least one turbulence structure 500 is provided in the first sub-channel 1111a.

[0119] In the first sub-channel 1111a of this application embodiment, due to the presence of at least one turbulence structure 500, the cooling medium will collide with the turbulence structure 500 when flowing in the first sub-channel 1111a. At this time, the cooling medium around the turbulence structure 500 can obtain a larger local flow velocity due to the collision, thereby generating turbulence in the cooling medium in the first sub-channel 1111a, accelerating the heat transfer between the cooling medium and the computing board 200, and accelerating the heat transfer inside the cooling medium in the cooling channel 111, thereby giving the liquid cooling module 100 of this application a stronger heat exchange capacity.

[0120] In the embodiments of this application, the number of turbulence structures 500 can be one, two, three, four, etc. It should be noted that the above is only an example and does not constitute a limitation on this application. Those skilled in the art will understand that the selection can be based on the length and width of the cooling channel 111, and is not limited thereto.

[0121] For example, a flow-disrupting structure 500 is provided in one of the multiple first sub-flow channels 1111a. Alternatively, a flow-disrupting structure 500 may be provided in two of the multiple first sub-flow channels 1111a. Yet another example is that a flow-disrupting structure 500 may be provided in all three of the multiple first sub-flow channels 1111a. It should be noted that these are merely examples and do not constitute a limitation on this application. Those skilled in the art will understand that whether or not a flow-disrupting structure 500 is provided in the first sub-flow channel 1111a needs to be selected according to actual needs and is not limited thereto.

[0122] In this embodiment, a turbulence structure 500 is provided in the first sub-channel 1111a, which enables the turbulence structure 500 in the first sub-channel 1111a to generate turbulence in the cooling medium in the corresponding first sub-channel 1111a, thereby accelerating the heat transfer between the cooling medium and the computing board 200, and accelerating the heat transfer inside the cooling medium in the first sub-channel 1111a, so that the liquid cooling module 100 of this application has a stronger heat exchange capacity.

[0123] In some embodiments, see Figure 1 The first sub-channel 1111a extends in a direction parallel to the first direction X, and multiple first sub-channels 1111a are spaced apart along the second direction Y, with the first direction X perpendicular to the second direction Y.

[0124] For example, when the computing board 200 is attached to the liquid cooling surface 112 of the liquid cooling plate 110, the extension direction of the computing module 210 on the computing board 200 is the same as the extension direction and the spacing direction of the first sub-channel 1111a, so that when the computing board 200 is attached to the liquid cooling plate 110, the area corresponding to the first sub-channel 1111a and the computing module 210 on the computing board 200 is maximized, ensuring that the heat of the computing board 200 can be quickly carried away, thereby improving the overall heat dissipation efficiency of the liquid cooling module 100.

[0125] In some embodiments, the number of turbulence structures 500 in different first sub-channels 1111a is equal in the flow direction of the cooling channel 111.

[0126] For example, in the flow direction of the cooling channel 111, there are N turbulence structures 500 in the first sub-channel 1111a, N turbulence structures 500 in the second sub-channel 1111a, and N turbulence structures 500 in the third sub-channel 1111a. It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the number of turbulence structures 500 can be selected according to actual needs and is not limited thereto.

[0127] This configuration ensures that the cooling medium experiences the same turbulence when flowing through different first sub-channels 1111a, so that the flow rate and heat transfer of the cooling medium in different first sub-channels 1111a are the same, and that the cooling medium has a fixed heating rate in the guiding direction of the cooling channel 111.

[0128] In other embodiments, the number of turbulence structures 500 in different first sub-channels 1111a gradually increases in the flow direction of the cooling channel 111.

[0129] For example, in the flow direction of the cooling channel 111, there are N turbulence structures 500 in the first sub-channel 1111a, N+1 turbulence structures 500 in the second sub-channel 1111a, and N+2 turbulence structures 500 in the third sub-channel 1111a. It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the number of turbulence structures 500 can be selected according to actual needs and is not limited thereto.

[0130] In this embodiment, more turbulence structures 500 can increase the contact area and mixing effect between the cooling medium and the wall of the first sub-channel 1111a, thereby gradually increasing the degree of turbulence in the flow direction of the first sub-channel 1111a. Combined with the gradual increase in the temperature of the cooling medium in the flow direction of the first sub-channel 1111a, the temperature of the first sub-channel 1111a in the flow direction of this embodiment is more uniform.

[0131] With this configuration, even if the temperature of the cooling medium in the first sub-channel 1111a gradually increases in the flow direction, as the number of turbulence structures 500 in the flow direction of the first sub-channel 1111a increases, the fluid path of the first sub-channel 1111a gradually becomes more complex, and the heat dissipation effect of the first sub-channel 1111a in the flow direction becomes better. This makes the temperature of the first sub-channel 1111a more uniform at different positions in the flow direction, thereby improving the heat dissipation effect of the liquid cooling plate 110, ensuring the uniformity of the heat dissipation effect of the liquid cooling plate 110, and improving the temperature balance and stability of the liquid cooling module 100.

[0132] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the number of the perturbation structures 500 can be selected according to actual needs and is not limited thereto.

[0133] In some embodiments, see Figure 1 , Figures 6 to 9 The cooling channel 111 also includes a second channel 1112. The output end of the first channel 1111 is connected to the input end of the second channel 1112. The flow direction of the first channel 1111 is opposite to that of the second channel 1112.

[0134] In some embodiments, see Figure 1 , Figures 6 to 9 The second flow channel 1112 includes a plurality of second sub-flow channels 1112a connected in sequence. The extension direction of at least one second sub-flow channel 1112a is parallel to the first direction X. The plurality of second sub-flow channels 1112a are spaced apart along the second direction Y. The first direction X is perpendicular to the second direction Y.

[0135] This configuration allows each set of computing modules 210 to correspond to at least one first sub-channel 1111a and / or at least one second sub-channel 1112a. It should be noted that, because the cooling medium within the first sub-channel 1111a and / or the second sub-channel 1112a is constantly flowing and carrying away heat from the liquid cooling plate 110, the temperature is lower and the cooling rate is faster at locations closer to the first sub-channel 1111a and / or the second sub-channel 1112a in the entire cooling device 10. Therefore, in this embodiment, the computing modules 210 are respectively associated with the first sub-channel 1111a and / or the second sub-channel 1112a to bring the locations with faster cooling rates in the liquid cooling plate 110 into close contact with the computing modules 210, thereby further improving the heat dissipation efficiency of the computing board 200.

[0136] For example, the computing module 210 can be attached to the position in the liquid cooling plate 110 corresponding to the first sub-flow channel 1111a, so that the cooling medium flowing in the first sub-flow channel 1111a can carry away the heat of the computing module 210 at that position. In some other examples, the computing module 210 can be attached to the position in the liquid cooling plate 110 corresponding to the second sub-flow channel 1112a, so that the cooling medium flowing in the second sub-flow channel 1112a can carry away the heat of the computing module 210 at that position. In still some examples, the computing module 210 can be attached to the positions in the liquid cooling plate 110 corresponding to both the first sub-flow channel 1111a and the second sub-flow channel 1112a, so that the cooling medium flowing in both the first sub-flow channel 1111a and the second sub-flow channel 1112a can carry away the heat of the computing module 210 at that position. It should be noted that these are merely examples and do not constitute a limitation of this application. Those skilled in the art will understand that the computing module 210 can be selected to correspond to the first sub-channel 1111a and / or the second sub-channel 1112a according to the heat dissipation requirements, and is not limited thereto.

[0137] In some embodiments, see Figure 1 , Figures 6 to 9 The first liquid inlet 114 and the second liquid outlet 117 are disposed on one side of the liquid cooling plate 110 in the second direction Y. The output end of the second flow channel 1112 defines a second clearance area 1112c that communicates with the second liquid outlet 117, and the second clearance area 1112c extends in a direction away from the first liquid inlet 114.

[0138] In this embodiment, connectors 300 are respectively provided on the first inlet 114 and the second outlet 117, and the two connectors 300 are connected by a pipe. By providing the second clearance area 1112c, this embodiment increases the distance between the input end of the first flow channel 1111 and the output end of the second flow channel 1112, thereby increasing the distance between the first inlet 114 and the second outlet 117, and further increasing the distance between the two connectors 300 connected to the first inlet 114 and the second outlet 117 respectively. This reduces the curvature of the pipe connecting the two connectors 300, resulting in smoother flow of the cooling medium within the pipe between the two connectors 300.

[0139] In some embodiments, see Figure 1 , Figures 6 to 9 At least one turbulence structure 500 is provided in the second sub-channel 1112a.

[0140] In the second sub-channel 1112a of this application embodiment, due to the presence of at least one turbulence structure 500, the cooling medium will collide with the turbulence structure 500 when flowing in the second sub-channel 1112a. At this time, the cooling medium around the turbulence structure 500 can obtain a larger local flow velocity due to the collision, thereby generating turbulence in the cooling medium in the second sub-channel 1112a, accelerating the heat transfer between the cooling medium and the computing board 200, and accelerating the heat transfer inside the cooling medium in the second sub-channel 1112a, thereby giving the liquid cooling module 100 of this application a stronger heat exchange capacity.

[0141] In the embodiments of this application, the number of turbulence structures 500 can be one, two, three, four, etc. It should be noted that the above is only an example and does not constitute a limitation on this application. Those skilled in the art will understand that the selection can be based on the length and width of the cooling channel 111, and is not limited thereto.

[0142] For example, a flow-disrupting structure 500 is provided in one of the multiple second sub-flow channels 1112a. Alternatively, a flow-disrupting structure 500 may be provided in two of the multiple second sub-flow channels 1112a. Yet another example is that a flow-disrupting structure 500 may be provided in three of the multiple second sub-flow channels 1112a. It should be noted that these are merely examples and do not constitute a limitation on this application. Those skilled in the art will understand that whether or not a flow-disrupting structure 500 is provided in the second sub-flow channel 1112a needs to be selected according to actual needs and is not limited thereto.

[0143] In some embodiments, the number of turbulence structures 500 in different second sub-channels 1112a is equal in the flow direction of the second sub-channel 1112a.

[0144] For example, in the flow direction of the cooling channel 111, there are N turbulence structures 500 in the first second sub-channel 1112a, N turbulence structures 500 in the second second sub-channel 1112a, and N turbulence structures 500 in the third second sub-channel 1112a. It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the number of turbulence structures 500 can be selected according to actual needs and is not limited thereto.

[0145] This configuration ensures that the cooling medium experiences the same turbulence when flowing through different second sub-channels 1112a, so that the flow rate and heat transfer of the cooling medium in different second sub-channels 1112a are the same, and that the cooling medium has a fixed heating rate in the guiding direction of the second sub-channel 1112a.

[0146] In other embodiments, the number of turbulence structures 500 in different second sub-channels 1112a gradually increases in the flow direction of the cooling channel 111.

[0147] For example, in the flow direction of the cooling channel 111, there are N turbulence structures 500 in the first second sub-channel 1112a, N+1 turbulence structures 500 in the second second sub-channel 1112a, and N+2 turbulence structures 500 in the third second sub-channel 1112a. It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the number of turbulence structures 500 can be selected according to actual needs and is not limited thereto.

[0148] In this embodiment, more turbulence structures 500 can increase the contact area and mixing effect between the cooling medium and the wall of the second sub-channel 1112a, thereby gradually increasing the turbulence in the flow direction of the second sub-channel 1112a. Combined with the gradual increase in the temperature of the cooling medium in the flow direction of the second sub-channel 1112a, the temperature of the second sub-channel 1112a in the flow direction of this embodiment is more uniform.

[0149] With this configuration, even if the temperature of the cooling medium in the second sub-channel 1112a gradually increases in the flow direction, as the number of turbulence structures 500 in the flow direction of the second sub-channel 1112a increases, the fluid path of the second sub-channel 1112a gradually becomes more complex, and the heat dissipation effect of the second sub-channel 1112a in the flow direction becomes better. This makes the temperature of the second sub-channel 1112a more uniform at different positions in the flow direction, thereby improving the heat dissipation effect of the liquid cooling plate 110, ensuring the uniformity of the heat dissipation effect of the liquid cooling plate 110, and improving the temperature balance and stability of the liquid cooling module 100.

[0150] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the number of the perturbation structures 500 can be selected according to actual needs and is not limited thereto.

[0151] In some embodiments, see Figure 1 , Figures 6 to 9 The input and output ends of the first flow channel 1111 and the input and output ends of the second flow channel 1112 are arranged at intervals on the same side of the liquid cooling plate 110 in the first direction X, so that the liquid inlet and liquid outlet of the entire liquid cooling module 100 are located on the same side of the liquid cooling plate 110 in the first direction X, so that the pipes connected to the liquid inlet and liquid outlet of the liquid cooling module 100 can be integrated on the same side of the liquid cooling plate 110 in the first direction X, thereby making the pipeline layout of the liquid cooling module 100 more concentrated, which helps to simplify the installation and maintenance of the liquid cooling module 100.

[0152] For example, the second flow channel 1112 is located inside the first flow channel 1111. In other examples, the first flow channel 1111 is located inside the second flow channel 1112. It should be noted that this is merely an example and does not constitute a limitation of this application. Those skilled in the art will understand that the spacing order of the first flow channel 1111 and the second flow channel 1112 can be arranged according to actual pipeline requirements and is not limited thereto.

[0153] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the liquid cooling plate 110 may include multiple first sub-channels 1111a or multiple second sub-channels 1112a, or simultaneously include multiple first sub-channels 1111a and multiple second sub-channels 1112a, and can be selected according to actual needs, and is not limited thereto.

[0154] In some embodiments, see Figure 1 , Figures 6 to 9In the direction from the input end of the first flow channel 1111 to the output end of the first flow channel 1111, multiple first sub-flow channels 1111a and second sub-flow channels 1112a are divided into multiple flow channel groups. The distance between two adjacent flow channel groups is greater than the distance between adjacent first sub-flow channels 1111a and / or second sub-flow channels 1112a within each flow channel group.

[0155] This configuration, by increasing the distance between the channels of two adjacent channel groups, allows the cooling medium to flow more easily between the two adjacent channel groups during the flow process, reducing the possibility of flow blockage in the first sub-channel 1111a and the second sub-channel 1112a after the coiling arrangement, thereby improving the cooling efficiency of the liquid cooling plate 110. Secondly, since each channel group is attached to at least one computing board 200, the distance between adjacent first sub-channels 1111a and / or second sub-channels 1112a within each channel group in this embodiment is small. This is beneficial for the cooling medium in the first sub-channel 1111a and / or second sub-channel 1112a within each channel group to generate turbulence during the fluid flow process, increasing the contact area between the cooling medium and the walls of the first sub-channel 1111a and / or second sub-channel 1112a, thereby improving the heat exchange efficiency.

[0156] In some embodiments, there are multiple liquid cooling plates 110, and the multiple liquid cooling plates 110 are stacked.

[0157] For example, multiple liquid cooling plates 110 can be stacked in a direction perpendicular to the liquid cooling plates 110.

[0158] This configuration makes full use of the vertical space of computing device 1, making computing device 1 more compact and efficient. The stacked design not only optimizes space utilization but also adapts to the needs of high-density computing environments, thereby achieving better heat dissipation within a limited space.

[0159] In other examples, multiple liquid cooling plates 110 may be stacked in the first direction X or in the second direction Y. It should be noted that these are merely examples and do not constitute a limitation of this application. Those skilled in the art will understand that the stacking method of the liquid cooling plates 110 can be selected according to the actual layout of the computing device 1 and is not limited thereto.

[0160] Figure 10 A cross-sectional view of the cooling device 10 according to an embodiment of this application is shown. See also Figure 10 In some embodiments, the cooling channels 111 of at least two adjacent liquid cooling plates 110 are connected in series. This arrangement enables the computing device 1 to have a cooling medium input pipe and a cooling medium output pipe, thereby reducing the number of pipes in the liquid cooling module 100, simplifying the installation and maintenance of the liquid cooling module 100, and improving the layout rationality of the liquid cooling module 100.

[0161] In some embodiments, see Figure 10 In two adjacent liquid cooling modules 100, the output end of the first flow channel 1111 of the first liquid cooling module 100 is connected to the input end of the first flow channel 1111 of the second liquid cooling module 100, the output end of the first flow channel 1111 of the second liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the second liquid cooling module 100, and the output end of the second flow channel 1112 of the second liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the first liquid cooling module 100. This arrangement allows the computing device 1 to have one cooling medium input pipe and one cooling medium output pipe, thereby reducing the number of pipes in the liquid cooling module 100, simplifying the installation and maintenance of the liquid cooling module 100, and improving the layout rationality of the liquid cooling module 100.

[0162] For example, in an embodiment where there are two liquid cooling modules 100, the output end of the first flow channel 1111 of the first liquid cooling module 100 is connected to the input end of the first flow channel 1111 of the second liquid cooling module 100, the output end of the first flow channel 1111 of the second liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the second liquid cooling module 100, and the output end of the second flow channel 1112 of the second liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the first liquid cooling module 100.

[0163] For example, in an embodiment where the number of liquid cooling modules 100 is three, the output end of the first flow channel 1111 of the first liquid cooling module 100 is connected to the input end of the first flow channel 1111 of the second liquid cooling module 100, the output end of the first flow channel 1111 of the second liquid cooling module 100 is connected to the input end of the first flow channel 1111 of the third liquid cooling module 100, the output end of the first flow channel 1111 of the third liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the third liquid cooling module 100, the output end of the second flow channel 1112 of the third liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the second liquid cooling module 100, and the output end of the second flow channel 1112 of the second liquid cooling module 100 is connected to the input end of the second flow channel 1112 of the first liquid cooling module 100.

[0164] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the number of liquid cooling modules 100 can be selected according to actual needs and is not limited thereto.

[0165] In some examples, in two adjacent liquid cooling modules 100, computing boards 200 are respectively arranged on both sides of the first liquid cooling module 100, and computing boards 200 are arranged on one side of the second liquid cooling module 100.

[0166] For example, there are three computing boards 200, namely a first computing board 200, a second computing board 200 and a third computing board 200. The first computing board 200 and the second computing board 200 are respectively attached to both sides of the liquid cooling plate 110 of the first liquid cooling module 100, and the third computing board 200 is attached to one side of the liquid cooling plate 110 of the second liquid cooling module 100. The cooling medium in the first flow channel 1111 and the second flow channel 1112 of the first liquid cooling module 100 carries away the heat from the first computing board 200 and the second computing board 200 when it flows. The cooling medium in the first flow channel 1111 and the second flow channel 1112 of the second liquid cooling module 100 carries away the heat from the third computing board 200 when it flows. Since the cooling capacity of the first liquid cooling module 100 is better than that of the second liquid cooling module 100, the first liquid cooling module 100 is used to cool the two computing boards 200, and the second liquid cooling module 100 is used to cool the one computing board 200. This ensures the uniformity of heat dissipation of the first computing board 200, the second computing board 200 and the third computing board 200, and improves the temperature balance and stability of the liquid cooling module 100.

[0167] In some embodiments, at least one flow disturbance structure 500 is disposed in the second flow channel 1112 of the first liquid cooling module 100 and / or the second flow channel 1112 of the second liquid cooling module 100.

[0168] For example, at least one turbulence structure 500 is provided in the second flow channel 1112 of the first liquid cooling module 100, while no turbulence structure 500 is provided in the second flow channel 1112 of the second liquid cooling module 100.

[0169] For example, at least one turbulence structure 500 is provided in the second flow channel 1112 of the first liquid cooling module 100, and at least one turbulence structure 500 is provided in the second flow channel 1112 of the second liquid cooling module 100.

[0170] For example, the second flow channel 1112 of the first liquid cooling module 100 does not have at least one turbulence structure 500, while the second flow channel 1112 of the second liquid cooling module 100 has at least one turbulence structure 500.

[0171] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the arrangement of the second flow channel 1112 of the first liquid cooling module 100 and the turbulence structure 500 of the second flow channel 1112 of the second liquid cooling module 100 can be selected according to actual needs and is not limited thereto.

[0172] In some embodiments, the cooling channel 111 includes a plurality of third sub-channels, the input end and the output end of the cooling channel 111 are spaced apart on opposite sides of the liquid cooling plate 110 in the first direction X, the plurality of third sub-channels are spaced apart along the second direction Y, and at least one turbulence structure 500 is provided in each third sub-channel, the first direction X and the second direction Y are perpendicular to each other.

[0173] For example, a plurality of baffles are provided in the cooling channel 111, and the baffles extend along a first direction X. A third sub-channel is defined between two adjacent baffles, thereby defining a plurality of third sub-channels that extend along the first direction X respectively. A first diversion region is defined between the input end of the cooling channel 111 and the input end of the third sub-channel, and a second diversion region is defined between the output end of the cooling channel 111 and the output end of the third sub-channel. The cooling medium enters from the input end of the cooling channel 111, passes through the first diversion region, and then enters the third sub-channel from the input ends of different third sub-channels respectively. After being discharged from the output end of the third sub-channel, the cooling medium flows out from the output end of the cooling channel 111 through the second diversion region.

[0174] With this configuration, the input and output ends of the cooling channels 111 are spaced apart along the first direction X at opposite ends of the liquid cooling plate 110. This allows the cooling medium to be evenly distributed within the liquid cooling plate 110, preventing localized overheating and achieving uniform cooling of the computing board 200. Uniform cooling helps maintain the computing board 200 within its optimal operating temperature range, preventing performance degradation or malfunctions caused by localized overheating, thus extending the equipment's lifespan. Furthermore, each third sub-channel is equipped with a turbulence structure 500, making the flow path within the third sub-channel more complex and increasing the degree of turbulence, significantly enhancing the heat exchange efficiency of the liquid cooling plate 110.

[0175] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that there are many other ways to define the third sub-channel, such as forming the third sub-channel by cutting a groove in the liquid cooling plate 110, and it is not limited to this.

[0176] In some examples, the spacing of the third sub-channels in the second direction Y is equal.

[0177] This configuration, with equal spacing between the third sub-channels in the second direction Y, prevents the cooling medium from stagnating or flowing too slowly in certain areas, thus ensuring uniform distribution of the cooling medium within the liquid cooling plate 110. Furthermore, the uniform cooling effect and efficient heat exchange performance help maintain the computing board 200 within its optimal operating temperature range, preventing performance degradation or malfunctions caused by localized overheating, thereby extending the service life of the computing board 200.

[0178] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the spacing of the third sub-channels in the second direction Y may not be completely equal, and is not limited thereto.

[0179] In some embodiments, the turbulence structure 500 includes a cylindrical turbulence element (see...). Figure 6 ), frustum-shaped spoiler (not shown in the figure), prism-shaped spoiler (not shown in the figure), pyramid-shaped spoiler (see Figure 7 The multiple turbulence structures 500 in this application may include at least one of the following: waist-shaped columnar turbulence element (not shown in the figure), trapezoidal columnar turbulence element (not shown in the figure). The multiple turbulence structures 500 in this application may include a variety of turbulence elements with different structures, or may include a turbulence element with a single structure.

[0180] See in some examples Figure 6 The turbulence structure 500 includes a cylindrical turbulence element, which can provide a uniform turbulence effect and is suitable for most cooling medium flow conditions. The cylindrical turbulence element can generate a uniform turbulence effect during the flow of the cooling medium, thereby improving the heat exchange efficiency in the cooling channel 111.

[0181] In some examples, the turbulence structure 500 includes a frustum-shaped turbulence element, which can provide a gradual turbulence effect for the cooling medium, suitable for cooling medium flow conditions with large velocity variations. The frustum-shaped turbulence element can generate a gradual turbulence effect during the flow of the cooling medium, which is beneficial for optimizing the flow path of the cooling medium.

[0182] In some examples, the turbulence structure 500 includes prismatic turbulence elements, which can provide a strong directional turbulence effect for the cooling medium, suitable for cooling medium flow conditions with a relatively fixed flow direction. Prismatic turbulence elements can generate a strong directional turbulence effect during fluid flow, which is beneficial for improving heat transfer efficiency.

[0183] See in some examples Figure 7 The turbulence structure 500 includes a pyramidal turbulence element, which provides a strong concentrated turbulence effect and is suitable for cooling medium flow conditions where the heat source distribution is relatively concentrated. The pyramidal turbulence element can generate a strong concentrated turbulence effect during the flow of the cooling medium, which is beneficial to improving the local heat exchange efficiency of the liquid cooling plate 110.

[0184] In some examples, the turbulence structure 500 includes a waist-shaped columnar turbulence element, which provides a streamlined turbulence effect suitable for cooling medium flow conditions with high flow velocities. The waist-shaped columnar turbulence element can generate a streamlined turbulence effect during the flow of the cooling medium, which helps to reduce the flow resistance of the cooling medium and improve the heat exchange efficiency of the liquid cooling plate 110.

[0185] In some examples, the turbulence structure 500 includes trapezoidal columnar turbulence elements, which can provide a combination of gradual and concentrated turbulence effects on the cooling medium, suitable for cooling medium flow conditions with large variations in flow velocity and heat source distribution. The trapezoidal columnar turbulence elements can generate a combination of gradual and concentrated turbulence effects during the flow of the cooling medium, which is beneficial for optimizing the flow path of the cooling medium and improving heat transfer efficiency.

[0186] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the turbulence structure 500 may also include turbulence elements of other structures, and the turbulence structure 500 may include a variety of different turbulence elements, or it may include a single turbulence element, and is not limited thereto.

[0187] In some embodiments, see Figure 7 In the direction of the flow of the cooling channel 111, the cross-sectional area of ​​the turbulence structure 500 gradually decreases.

[0188] According to the continuity equation in fluid mechanics, this configuration, with its smaller cross-sectional area, leads to an increase in flow velocity. This, in turn, gradually increases the velocity of the cooling medium within the cooling channel 111, thereby improving the heat exchange efficiency of the liquid cooling plate 110 and allowing the heat from the computing board 200 to be transferred to the cooling medium more quickly. Secondly, the gradually decreasing cross-sectional area of ​​the turbulence structure 500 causes the cooling medium to continuously change direction and velocity during flow, increasing the turbulence. This turbulence breaks the laminar flow state, increasing the contact area between the cooling medium and the sidewalls of the cooling channel 111, further improving the heat exchange efficiency of the liquid cooling plate 110 and allowing the heat from the computing board 200 to be transferred to the cooling medium more quickly. Furthermore, the gradually decreasing cross-sectional area of ​​the turbulence structure 500 optimizes the flow path of the cooling medium, preventing stagnation or excessively low velocity in certain areas, thus ensuring uniform distribution of the cooling medium within the cooling channel 111 and improving the cooling effect of the liquid cooling plate 110.

[0189] In other embodiments, see Figure 8 and Figure 9 The turbulence structure 500 includes a turbulence plate, which is disposed in the cooling channel 111 along the flow direction of the cooling channel 111.

[0190] This design allows the baffle to generate turbulence during the flow of the cooling medium, creating complex flow paths within the cooling channel 111. By increasing the degree of turbulence within the cooling channel 111, this application can significantly improve the heat exchange efficiency of the cooling medium. Secondly, the baffle can guide the fluid to form diverse flow paths within the channel, preventing stagnation or excessively low flow rates in certain areas of the cooling medium and avoiding localized overheating of the liquid cooling plate 110. Furthermore, the baffle can disrupt the thermal boundary layer formed by the cooling medium near the channel wall, allowing heat to be transferred to the cooling medium more quickly, thereby improving the heat transfer efficiency of the cooling medium within the cooling channel 111.

[0191] In some embodiments, the cooling channel 111 is provided with multiple sets of turbulence-disrupting elements along its flow direction. Each turbulence-disrupting element set includes at least one turbulence-disrupting structure 500. The turbulence-disrupting directions of the turbulence-disrupting structures 500 in at least two adjacent turbulence-disrupting element sets are different. In the flow direction of the cooling channel 111, multiple turbulence-disrupting structures 500 are arranged alternately.

[0192] For example, the first group of turbulence-inducing components has three turbulence structures 500, with a first gap between two adjacent turbulence structures 500. The second group of turbulence-inducing components has two turbulence structures 500. In the flow direction of the cooling channel 111, the turbulence structures 500 of the second group of turbulence-inducing components correspond to the first gap in the first group of turbulence-inducing components, thereby achieving a staggered arrangement of multiple turbulence structures 500. The staggered arrangement of the turbulence structures 500 can generate more complex turbulence effects during the flow of the cooling medium, causing the cooling medium to form diverse flow paths within the cooling channel 111, thereby significantly improving the heat exchange efficiency of the cooling medium. Secondly, the staggered arrangement of multiple turbulence structures 500 can guide the cooling medium to form diverse flow paths within the cooling channel 111, avoiding stagnation or excessively low flow rates in certain areas of the cooling medium, and preventing localized overheating of the liquid cooling plate 110.

[0193] In some embodiments, at least one clamping structure is also included. The clamping structure can be a structure for fixing the computing board 200 to the liquid cooling surface 112, such as a bolt clamping structure, a spring clamping structure, a pneumatic or hydraulic clamping structure, etc., but not limited to the above examples. Specifically, the clamping structure is a cover plate 120. At least one side surface of the liquid cooling plate 110 is formed with a liquid cooling surface 112. The cover plate 120 is connected to the liquid cooling plate 110 and is used to fix the computing board 200 to the liquid cooling surface 112. The computing board 200 generates heat during operation. In this embodiment, the computing board 200 is fixed to the liquid cooling surface 112 of the liquid cooling plate 110 by the cover plate 120. That is, by the way the computing board 200 and the liquid cooling surface 112 are in contact, it is ensured that the heat generated by the computing board 200 can be quickly transferred to the liquid cooling plate 110 through the liquid cooling surface 112, thereby improving the heat dissipation efficiency of the computing board 200. Secondly, the cooling medium flows through the cooling channels 111 inside the liquid cooling plate 110, which can continuously absorb and remove the heat generated by the computing board 200 during the operation, thereby continuously providing cooling for the computing board 200. This allows the computing board 200 to maintain a low temperature during high-load operation, reducing the possibility of performance degradation or damage caused by overheating of the computing board 200.

[0194] For example, liquid cooling surfaces 112 are formed on opposite sides of the liquid cooling plate 110, and two cover plates 120 are respectively connected to the two liquid cooling surfaces 112. The liquid cooling plate 110 is cuboid in shape, and the two cover plates 120 are respectively disposed on opposite sides of the liquid cooling plate 110. The two cover plates 120 fix the two computing boards 200 to opposite sides of the liquid cooling plate 110, so that one liquid cooling plate 110 can cool two computing boards 200 simultaneously.

[0195] Figure 5 Show Figure 4 An enlarged schematic diagram of A in some embodiments is shown below. Figure 4 and Figure 5 The cover plate 120 has multiple first through holes 121, the computing board 200 has multiple second through holes 220, and the liquid cooling plate 110 has multiple positioning holes 113. The cooling device 10 also includes a connecting structure for tightly fixing the cover plate 120, the liquid cooling plate 110, and the computing board 200. This connecting structure can be a bolt structure, screw structure, clip structure, tenon and mortise structure, etc., but is not limited to the examples listed above. Specifically, the connecting structure is as follows: Figure 5The fasteners 130 shown correspond one-to-one with the multiple fasteners 130, the multiple first through holes 121, and the multiple second through holes 220. The fasteners 130 are sequentially inserted into the corresponding first through holes 121, second through holes 220, and positioning holes 113. This arrangement prevents relative movement between the cover plate 120, the computing board 200, and the liquid cooling plate 110, and enables the fixing of the computing board 200, the cover plate 120, and the liquid cooling plate 110, thereby improving the connection stability between the cover plate 120, the computing board 200, and the liquid cooling plate 110.

[0196] For example, a first through hole 121 is provided at each of the four corners of the cover plate 120, four second through holes 220 are provided on the computing board 200, and positioning holes 113 are provided at each of the four corners of the liquid cooling plate 110. There are four fasteners 130, and the four fasteners 130 pass through the four first through holes 121, the four second through holes 220 and the four positioning holes 113 respectively, so that the corners of the computing board 200, the cover plate 120 and the liquid cooling plate 110 are limited, thereby realizing the fixation between the computing board 200, the cover plate 120 and the liquid cooling plate 110. Furthermore, in order to improve the connection stability between the cover plate 120, the computing board 200, and the liquid cooling plate 110, this embodiment of the application can also provide a plurality of first through holes 121 at intervals in the middle position of the cover plate 120, a plurality of second through holes 220 at intervals in the middle position of the computing board 200, and a plurality of positioning holes 113 at intervals in the middle position of the liquid cooling plate 110. By means of fasteners 130 passing through the first through holes 121 in the middle position of the cover plate 120, the second through holes 220 in the middle position of the computing board 200, and the positioning holes 113 in the middle position of the liquid cooling plate 110 respectively, the connection stability between the computing board 200, the cover plate 120, and the liquid cooling plate 110 can be further improved.

[0197] Of course, the above-described interval settings are merely illustrative examples and do not constitute a limitation on this application. The positions of the first through hole 121, the second through hole 220, and the positioning hole 113 are not limited to the above examples. Provided that a stable connection is achieved between the computing board 200, the cover plate 120, and the liquid cooling plate 110, all other variations or alternatives that can be conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the protection scope of this application.

[0198] As another aspect of this application, this application also provides a cooling device 10, which includes a liquid cooling module 100 as described in any of the above embodiments.

[0199] As another aspect of this application, this application also provides a computing device 1, which includes a liquid cooling module 100 as described in any of the above embodiments or a cooling device 10 as described above.

[0200] In the description of this specification, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0201] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0202] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0203] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0204] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0205] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A liquid cooling module, characterized in that, include: A liquid cooling plate, wherein the interior of the liquid cooling plate defines cooling channels for the flow of cooling medium; The cooling channel includes at least two channels, each including a first channel and a second channel. The first channel includes a plurality of first sub-channels connected in sequence, and the directions of the at least two channels are opposite. At least one turbulence structure is provided in the first channel and / or the second channel. In the flow direction of the cooling channel, the number of turbulence structures in different first sub-channels gradually increases.

2. The liquid cooling module according to claim 1, characterized in that, The flow direction of the first flow channel is opposite to that of the second flow channel.

3. The liquid cooling module according to claim 2, characterized in that, The liquid cooling plate is defined with at least two liquid inlets and at least two liquid outlets.

4. The liquid cooling module according to claim 3, characterized in that, At least one of the liquid outlets and at least one of the liquid inlets are connected.

5. The liquid cooling module according to claim 3, characterized in that, The at least two liquid inlets include a first liquid inlet and a second liquid inlet, and the at least two liquid outlets include a first liquid outlet and a second liquid outlet; wherein the first liquid outlet and the second liquid inlet are connected.

6. The liquid cooling module according to claim 5, characterized in that, The input end of the first flow channel is connected to the first liquid inlet, the output end of the first flow channel is connected to the first liquid outlet, the input end of the second flow channel is connected to the second liquid inlet, and the output end of the second flow channel is connected to the second liquid outlet.

7. The liquid cooling module according to claim 1, characterized in that, The input and output ends of at least two of the flow channels are located on the same side of the liquid cooling plate.

8. The liquid cooling module according to claim 6, characterized in that, The first liquid inlet, the first liquid outlet, the second liquid inlet, and the second liquid outlet are located on the same side of the liquid cooling plate.

9. The liquid cooling module according to claim 8, characterized in that, The first liquid inlet, the second liquid outlet, the second liquid inlet, and the first liquid outlet are arranged sequentially on the same side of the liquid cooling plate in the first direction.

10. The liquid cooling module according to claim 9, characterized in that, The first liquid inlet and the second liquid outlet are disposed adjacent to one side of the liquid cooling plate in the second direction, and the first liquid outlet and the second liquid inlet are disposed adjacent to the other side of the liquid cooling plate in the second direction; the second direction is perpendicular to the first direction.

11. The liquid cooling module according to claim 1, characterized in that, At least two of the flow channels have the same extension path.

12. The liquid cooling module according to claim 2, characterized in that, The first sub-channel extends in a direction parallel to the first direction, and the plurality of first sub-channels are spaced apart along a second direction, which is perpendicular to the first direction.

13. The liquid cooling module according to claim 12, characterized in that, The plurality of first sub-channels are arranged at equal intervals in the direction from the input end of the first channel to the output end of the first channel.

14. The liquid cooling module according to claim 12, characterized in that, The plurality of first sub-channels are arranged at non-equidistant intervals in the direction from the input end of the first channel to the output end of the first channel.

15. The liquid cooling module according to claim 12, characterized in that, In the direction from the input end of the first flow channel to the output end of the first flow channel, the distance between two adjacent first sub-flow channels in the plurality of first sub-flow channels gradually decreases.

16. The liquid cooling module according to claim 12, characterized in that, In the direction from the input end of the first flow channel to the output end of the first flow channel, the plurality of first sub-flow channels are divided into multiple groups, and the distance between two adjacent groups of first sub-flow channels is greater than the distance between adjacent first sub-flow channels within each group.

17. The liquid cooling module according to claim 5, characterized in that, The second flow channel includes a plurality of second sub-flow channels connected in sequence, at least one of the second sub-flow channels extends in a direction parallel to the first direction, and the plurality of second sub-flow channels are spaced apart along a second direction, wherein the first direction is perpendicular to the second direction.

18. The liquid cooling module according to claim 17, characterized in that, The extension directions of the multiple second sub-channels are parallel to the first direction, and the extension paths of the first channel and the second channel are the same.

19. The liquid cooling module according to claim 17, characterized in that, The second liquid inlet and the first liquid outlet are disposed on one side of the liquid cooling plate in the second direction; the input end of the second flow channel defines a first clearance area connected to the second liquid inlet, and the first clearance area extends in a direction away from the first liquid outlet.

20. The liquid cooling module according to claim 1, characterized in that, The first flow channel includes a plurality of first sub-flow channels connected in sequence.

21. The liquid cooling module according to claim 20, characterized in that, In the flow direction of the cooling channel, the number of turbulence structures in different first sub-channels is equal.

22. The liquid cooling module according to claim 17, characterized in that, At least one turbulence structure is provided in the second sub-channel.

23. The liquid cooling module according to claim 17, characterized in that, In the flow direction of the cooling channel, the number of turbulence structures in different second sub-channels is equal.

24. The liquid cooling module according to claim 22, characterized in that, In the flow direction of the cooling channel, the number of turbulence structures in different second sub-channels gradually increases.

25. The liquid cooling module according to claim 17, characterized in that, The cooling channel is provided with multiple sets of turbulence-disrupting components along its flow direction. Each turbulence-disrupting component set includes at least one turbulence-disrupting structure, and the turbulence-disrupting directions of the turbulence-disrupting structures of at least two adjacent turbulence-disrupting component sets are different.

26. The liquid cooling module according to claim 1, characterized in that, At least one turbulence structure is provided inside the cooling channel.

27. A cooling device, characterized in that, Includes the liquid cooling module as described in any one of claims 1 to 26.

28. A computing device, characterized in that, Includes the cooling device as described in claim 27.

Images