Chip liquid cooling phase change heat dissipation device

Abstract

The utility model relates to a kind of chip liquid cooling phase change heat sink, comprising: heat dissipation substrate;Heat dissipation cover, the heat dissipation cover with the heat dissipation substrate enclose and form heat dissipation chamber, the heat dissipation cover is also equipped with a pair of liquid cooling connector that is communicated cooling working medium flow space;Capillary wick, the capillary wick is in cooling working medium flow space, the capillary wick includes mutually adhering capillary wick cover layer and capillary wick bottom layer, the capillary wick cover layer is equipped with several capillary holes that pass through capillary wick cover layer;The side of the capillary wick bottom layer near the capillary wick cover layer is equipped with capillary groove and several capillary columns distributed in capillary groove.The utility model solves the problem of low heat exchange efficiency, poor heat dissipation, unstable operation, low life and long time high-power operation, etc., and realizes the efficient heat dissipation of CPU / GPU.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, specifically to a chip liquid-cooled phase change heat dissipation device. Background Technology

[0002] With the continuous development of electronic devices, especially the increasing performance of CPUs and GPUs in computers, heat dissipation has become a key factor affecting their stability and lifespan. Traditional air cooling methods are no longer sufficient to meet the heat dissipation requirements of high-performance CPUs and GPUs. Therefore, liquid cooling technology has gradually become an important solution.

[0003] Liquid cooling technology utilizes the high specific heat capacity and excellent heat transfer properties of liquids to remove heat through liquid flow, preventing performance degradation or even damage to high-power electronic devices caused by overheating. Although liquid cooling is more efficient than air cooling, it still faces many challenges in terms of structural design, maintenance, and ease of use. In terms of structural design, inappropriate microchannel dimensions and the accumulation of thermal resistance within the CPU / GPU chip package area limit heat dissipation efficiency; inadequate sealing methods can significantly increase maintenance costs. These pain points directly affect the stability and lifespan of a computer. Utility Model Content

[0004] To address at least one of the problems of existing liquid cooling heat sinks, such as low heat exchange efficiency, poor heat dissipation leading to unstable operation, short lifespan, and inability to operate at high power for extended periods, this utility model provides a chip liquid cooling phase change heat dissipation device.

[0005] The objective of this utility model can be achieved through the following technical solutions:

[0006] This utility model provides a chip liquid-cooled phase change heat dissipation device, comprising:

[0007] Heat dissipation substrate;

[0008] A heat dissipation cover, which together with the heat dissipation substrate forms a heat dissipation chamber, and the heat dissipation cover is also provided with a pair of liquid cooling connectors that communicate with the flow space of the cooling working fluid.

[0009] The capillary wick is located within the flow space of the cooling working fluid. The capillary wick includes a capillary wick cover layer and a capillary wick bottom layer that are attached to each other. The capillary wick cover layer has a plurality of capillary pores that penetrate the capillary wick cover layer. The capillary wick bottom layer has a capillary wick groove and a plurality of capillary columns distributed in the capillary wick groove on the side near the capillary wick cover layer.

[0010] More specifically, the heat dissipation substrate has a first fixing hole, a second fixing hole, and an inner wall. The first fixing hole is used to securely mount the heat dissipation device on the CPU / GPU chip, and the second fixing hole is used to install and fix the heat dissipation device with a fastener. The fastener is a key component that ensures close contact between the heat sink and the CPU / GPU chip and efficient heat conduction. The fastener uses mechanical pressure to tightly fit the heat sink base against the chip surface, reducing air gaps at the contact surface and thus reducing thermal resistance. The capillary core bottom layer has capillary core grooves and several capillary pillars. The capillary pillars are distributed inside the capillary grooves, and a second connecting surface is provided around the capillary grooves. The heat dissipation cover is attached to the inner wall of the heat dissipation substrate through the first connecting surface to form a heat dissipation chamber. Inside the heat dissipation chamber, the capillary core bottom layer is mounted on the inner wall of the heat dissipation substrate, and the capillary core cover layer is mounted directly above the capillary core bottom layer through its bottom surface contacting the second connecting surface and the top surface of the capillary pillars.

[0011] Furthermore, the heat dissipation cover has a square groove on the side near the heat dissipation substrate, and a pair of threaded holes are provided on the square groove, the pair of threaded holes being threadedly connected to the pair of liquid cooling connectors.

[0012] Furthermore, the capillary core layer is mounted on the inner wall of the heat dissipation substrate.

[0013] Furthermore, the pair of liquid cooling connectors serve as the outlet and inlet of the liquid cooling working fluid, respectively, and the directions of the outlet and inlet are any directions perpendicular to the top surface of the heat sink; the liquid cooling connectors are provided with a pagoda structure, which is a threaded structure or a quick-release structure.

[0014] Furthermore, the heat dissipation substrate and the heat dissipation cover are connected by brazing, threading, riveting, or snap-fit.

[0015] When the heat sink substrate and the heat sink cover are connected by brazing, the joint surfaces of the two are filled with solder, and a sealed connection is formed through the brazing process.

[0016] When the heat sink base plate and the heat sink cover are connected by threads, threaded holes and sealing grooves for placing sealing rings are evenly opened around the heat sink base plate and the heat sink cover. A sealing ring is provided between the heat sink base plate and the heat sink cover and placed in the sealing groove. The sealing ring is located inside the threaded hole. The sealing ring is pressed between the heat sink base plate and the heat sink cover by screwing a screw into the threaded hole to form a sealing structure.

[0017] When the heat dissipation substrate and the heat dissipation cover are connected by riveting, holes for installing rivets and sealing grooves for placing sealing rings are evenly opened around the heat dissipation substrate and the heat dissipation cover. A sealing ring is provided between the heat dissipation substrate and the heat dissipation cover and placed in the sealing groove. The sealing ring is located inside the rivet hole. The rivet passes through the rivet hole and is fixed by riveting. The axial pressure of the rivet presses the sealing ring between the heat dissipation substrate and the heat dissipation cover to form a sealed cavity.

[0018] When the heat sink and the heat sink cover are connected by snap-fit, the lower surface of the heat sink and the upper surface of the heat sink cover are provided with grooves for installing the snap-fit; the mating surfaces of the heat sink and the heat sink cover are provided with sealing grooves for placing the sealing ring, and a sealing ring is provided between the heat sink and the heat sink cover and placed in the sealing groove; the elastic deformation force of the snap-fit ​​presses the sealing ring between the heat sink and the heat sink cover, achieving quick locking and sealing.

[0019] Furthermore, the connection between the heat sink cover and the liquid cooling connector is a threaded connection or welding; the materials of the heat sink substrate and the heat sink cover are one of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, and silicon nitride.

[0020] Furthermore, the capillary core is mounted on the inner wall of the heat dissipation substrate by metal sintering; the capillary core bottom layer is mounted on the heat dissipation substrate by metal sintering, and the capillary core grooves and capillary columns on the capillary core bottom layer are processed by laser etching.

[0021] The capillary wick cover layer is installed on the capillary wick bottom layer by metal sintering, and the capillary holes are processed by laser etching.

[0022] The materials of the capillary wick bottom layer and the capillary wick top layer are one of copper, copper alloy, aluminum, aluminum alloy, stainless steel and silver.

[0023] Furthermore, the shape of the capillary column includes frustum, cube, square prism, triangular prism, mushroom shape, hemisphere, cone, cylinder, S-shape and raindrop shape;

[0024] When the capillary column is a quadrangular prism, the length of the capillary column parallel to the inner wall of the heat dissipation substrate is between 20 micrometers and 10 millimeters, the width is between 20 micrometers and 10 millimeters, and the height perpendicular to the inner wall of the heat dissipation substrate is between 20 micrometers and 10 millimeters.

[0025] When the capillary column is a triangular prism, the side length of the triangle parallel to the inner wall of the heat dissipation substrate is between 20 micrometers and 10 millimeters, and the height perpendicular to the inner wall of the heat dissipation substrate is between 20 micrometers and 10 millimeters.

[0026] When the capillary column is a frustum, the length of the capillary column parallel to the inner wall of the heat dissipation substrate is between 20 micrometers and 10 millimeters, the width is between 20 micrometers and 10 millimeters, and the height perpendicular to the inner wall of the heat dissipation substrate is between 20 micrometers and 10 millimeters.

[0027] When the capillary column is a cylinder or a cone, the diameter of the capillary column parallel to the inner wall of the heat dissipation substrate is between 20 micrometers and 10 millimeters, and the height perpendicular to the inner wall of the heat dissipation substrate is between 20 micrometers and 10 millimeters.

[0028] When the capillary column is hemispherical, the radius of the capillary column is between 20 micrometers and 5 millimeters;

[0029] When the capillary column is mushroom-shaped, raindrop-shaped, or S-shaped, the length, maximum diameter, or width of the capillary column parallel to the inner wall of the heat dissipation substrate is between 20 micrometers and 10 millimeters, the height perpendicular to the inner wall of the heat dissipation substrate is between 20 micrometers and 10 millimeters, and the distance between two adjacent capillary columns is between 20 micrometers and 10 millimeters.

[0030] Furthermore, the capillary columns are staggered, and the diameter of the capillary pores is between 20 micrometers and 10 millimeters.

[0031] Furthermore, the surface of the capillary column is covered with a hydrophilic layer and / or a hydrophobic layer, that is, the surface of the capillary column can be treated with hydrophilic and hydrophobic properties to better achieve heat dissipation.

[0032] Further, the vertical distance between the side of the capillary column near the heat dissipation cover and the inner wall of the heat dissipation substrate is denoted as H1, and the vertical distance between the side of the capillary column near the heat dissipation cover and the inner wall of the heat dissipation cover is denoted as H2, and H1 / H2 is between 0.01 and 100.

[0033] This utility model also provides a phase change liquid cooling heat dissipation system, which includes the CPU / GPU chip liquid cooling phase change heat dissipation device as described above, and also includes a motherboard, a chip to be cooled and a working fluid heat dissipation device;

[0034] The chip to be cooled is mounted on the motherboard. Preferably, the chip to be cooled is mounted on the motherboard by soldering.

[0035] The CPU / GPU chip liquid cooling phase change heat dissipation device is pressed onto the chip to be cooled, and a thermally conductive medium is filled between the outer wall of the heat dissipation substrate and the heat dissipation surface of the chip to be cooled.

[0036] The pair of liquid-cooled joints are respectively connected to the hot working fluid inlet and the cold working fluid outlet of the working fluid heat dissipation device through working fluid flow pipes to form a heat exchange cycle;

[0037] The working fluid circulating in the heat dissipation system is a phase change material, including water, alcohols, hydrocarbons, refrigerants, mineral oil, transformer oil, and fluorinated liquid.

[0038] Compared with the prior art, the present invention has the following beneficial effects:

[0039] (1) By designing and assembling the heat dissipation substrate, heat dissipation cover, liquid cooling connector and capillary core, this utility model improves the contact area between the heat dissipation device and the CPU / GPU chip and the contact area between the working fluid and the base plate, thereby improving the heat exchange rate and heat dissipation efficiency of the heat dissipation device, as well as the working efficiency and lifespan of the CPU / GPU.

[0040] (2) In this utility model, the capillary core includes a capillary core cover layer and a capillary core bottom layer that are attached to each other. The capillary core cover layer has a number of capillary holes that penetrate the capillary core cover layer. The capillary core bottom layer has a capillary core groove and a number of capillary columns distributed in the capillary core groove on the side near the capillary core cover layer. The number of through capillary holes opened in the capillary core cover layer can provide a flow path for the cooling working fluid, expand the phase change interface and guide gas-liquid separation. The capillary core groove on the side near the capillary core bottom layer can store the working fluid, guide its uniform spread and regulate the flow resistance. The capillary columns distributed in the groove greatly increase the contact area between the working fluid and the solid surface. The working fluid is circulated by capillary force and phase change turbulence is induced, which significantly improves the heat exchange efficiency and increases the heat dissipation effect.

[0041] (3) This utility model uses liquid phase change heat dissipation material. When the liquid phase change material changes into gas, it absorbs a large amount of heat, which greatly improves the heat dissipation effect.

[0042] (4) The components of this utility model are easy to process and assemble, making it easy to promote and apply;

[0043] (5) This utility model also has the advantages of high heat dissipation efficiency, small size, low noise and convenient maintenance. Attached Figure Description

[0044] Figure 1 This is a schematic diagram of the heat dissipation device of this utility model;

[0045] Figure 2 This is an exploded structural diagram of the heat dissipation device of this utility model;

[0046] Figure 3 This is a cross-sectional view of the heat dissipation device of this utility model;

[0047] Figure 4 This is a schematic diagram of the heat dissipation substrate structure of this utility model;

[0048] Figure 5 This is a schematic diagram of the structure of the heat dissipation cover of this utility model;

[0049] Figure 6 This is a schematic diagram of the structure of the liquid cooling connector of this utility model;

[0050] Figure 7 This is a schematic diagram of the capillary core structure of this utility model;

[0051] Figure 8 This is a schematic diagram of the exploded capillary wick structure of this utility model;

[0052] Figure 9 This is a schematic diagram of the capillary wick cover layer of this utility model;

[0053] Figure 10 This is a schematic diagram of the structure of the capillary core layer of this utility model;

[0054] Figure 11 This is a schematic diagram of the capillary column of this utility model;

[0055] In the figure: 1-heat dissipation substrate; 2-heat dissipation cover; 3-liquid cooling connector; 4-capillary wick; 11-first fixing hole; 12-second fixing hole; 13-inner wall of heat dissipation substrate; 21-square groove; 22-first connecting surface; 23-threaded hole; 31-thread; 32-pagoda structure; 41-capillary wick cover layer; 42-capillary wick bottom layer; 411-capillary hole; 421-capillary wick groove; 422-capillary column; 423-second connecting surface. Detailed Implementation

[0056] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. These embodiments are implemented based on the technical solution of the present invention, providing detailed implementation methods and specific operating procedures. However, the scope of protection of the present invention is not limited to the following embodiments.

[0057] To address the problems of low heat exchange efficiency, poor heat dissipation leading to unstable operation, short lifespan, and inability to operate at high power for extended periods in existing liquid cooling radiators, this invention provides a chip liquid cooling phase change heat dissipation device that can provide efficient liquid cooling for CPU / GPU chips. The device includes:

[0058] Heat dissipation substrate 1;

[0059] Heat dissipation cover 2, which together with the heat dissipation substrate 1 forms a heat dissipation chamber, and the heat dissipation cover 2 is also provided with a pair of liquid cooling connectors 3 that communicate with the flow space of the cooling working fluid;

[0060] The capillary wick 6 is located within the cooling working fluid flow space. The capillary wick 6 includes a capillary wick cover layer 41 and a capillary wick bottom layer 42 that are attached to each other. The capillary wick cover layer 41 has a plurality of capillary holes 411 that penetrate the capillary wick cover layer 41. The capillary wick bottom layer 42 has a capillary wick groove 421 and a plurality of capillary columns 422 distributed in the capillary groove 421 on the side near the capillary wick cover layer 41.

[0061] More specifically, the heat dissipation substrate 1 has a first fixing hole 11, a second fixing hole 12, and an inner wall 13. The first fixing hole 11 is used to securely mount the heat dissipation device on the CPU / GPU chip, and the second fixing hole 12 is used to install and fix the heat dissipation device with a fastener. The fastener is prior art and not the focus of this utility model, so its specific structure will not be described in detail. The fastener is a key component that ensures close contact between the heat sink and the CPU / GPU chip and efficient heat conduction. The fastener uses mechanical pressure to make the heat sink base fit tightly against the chip surface, reducing the air gap at the contact surface and thus reducing thermal resistance. The capillary core bottom layer 42 has capillary core grooves 421 and several capillary pillars 422. The capillary pillars 422 are distributed inside the capillary grooves 421, and a second connecting surface 423 is provided around the capillary grooves 421. The heat dissipation cover 2 is fitted and installed with the inner wall 13 of the heat dissipation substrate on the heat dissipation substrate through the first connecting surface 22 to form a heat dissipation chamber. Inside the heat dissipation chamber, the capillary wick bottom layer 42 is mounted on the inner wall 13 of the heat dissipation substrate, and the capillary wick cover layer 41 is mounted directly above the capillary wick bottom layer 42 through its bottom surface contacting the second connecting surface 423 and the top surface of the capillary column 422.

[0062] In some embodiments of this utility model, the heat dissipation cover 2 has a square groove 21 on the side near the heat dissipation substrate 1, and a pair of threaded holes 23 are provided on the square groove 21, and the pair of threaded holes 23 are threadedly connected to the pair of liquid cooling connectors 3.

[0063] In some embodiments of this utility model, the capillary core bottom layer 42 is installed on the inner wall of the heat dissipation substrate 1; the pair of liquid cooling connectors 3 serve as the outlet and inlet of the liquid cooling working fluid, and the direction of the outlet and inlet is any direction perpendicular to the top surface of the heat dissipation cover; the liquid cooling connector 3 is provided with a pagoda structure 32, which is a threaded structure or a quick-release structure.

[0064] In some embodiments of this utility model, the heat dissipation substrate 1 and the heat dissipation cover 2 are connected by brazing, threading, riveting or snap-fit.

[0065] When the heat dissipation substrate 1 and the heat dissipation cover 2 are connected by brazing, the joint surfaces of the two are filled with solder, and a sealed connection is formed by the brazing process.

[0066] When the heat dissipation substrate 1 and the heat dissipation cover 2 are connected by threads, threaded holes and sealing grooves for placing sealing rings are evenly opened around the heat dissipation substrate 1 and the heat dissipation cover 2. A sealing ring is provided between the heat dissipation substrate 1 and the heat dissipation cover 2 and placed in the sealing groove. The sealing ring is located inside the threaded hole. The sealing ring is pressed between the heat dissipation substrate 1 and the heat dissipation cover 2 by screwing a screw into the threaded hole to form a sealing structure.

[0067] When the heat dissipation substrate 1 and the heat dissipation cover 2 are connected by riveting, holes for installing rivets and sealing grooves for placing sealing rings are evenly opened around the heat dissipation substrate 1 and the heat dissipation cover 2. A sealing ring is provided between the heat dissipation substrate 1 and the heat dissipation cover 2 and placed in the sealing groove. The sealing ring is located inside the rivet hole. The rivet passes through the rivet hole and is fixed by riveting. The axial pressure of the rivet presses the sealing ring between the heat dissipation substrate 1 and the heat dissipation cover 2 to form a sealed cavity.

[0068] When the heat dissipation substrate 1 and the heat dissipation cover 2 are connected by a snap fastener, the lower surface of the heat dissipation substrate 1 and the upper surface edge of the heat dissipation cover 2 are provided with grooves for installing the snap fasteners; the mating surfaces of the heat dissipation substrate 1 and the heat dissipation cover 2 are provided with sealing grooves for placing sealing rings, and a sealing ring is provided between the heat dissipation substrate 1 and the heat dissipation cover 2 and placed in the sealing groove; the elastic deformation force of the snap fasteners presses the sealing ring between the heat dissipation substrate 1 and the heat dissipation cover 2 to achieve quick locking and sealing.

[0069] In some embodiments of this utility model, the heat dissipation cover 2 and the liquid cooling connector 3 are connected by threaded connection or welding; the heat dissipation substrate 1 and the heat dissipation cover 2 are made of one of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride and silicon nitride.

[0070] In some embodiments of this utility model, the capillary core 4 is mounted on the inner wall 41 of the heat dissipation substrate by metal sintering; the capillary core bottom layer 42 is mounted on the heat dissipation substrate 1 by metal sintering, and the capillary core groove 421 and capillary column 422 on the capillary core bottom layer 42 are processed by laser etching.

[0071] The capillary wick cover layer 41 is mounted on the capillary wick bottom layer 42 by metal sintering, and the capillary holes 411 are processed by laser etching.

[0072] The capillary wick bottom layer 42 and capillary wick top layer 41 are made of one of the following materials: copper, copper alloy, aluminum, aluminum alloy, stainless steel, and silver.

[0073] In some embodiments of this utility model, the shape of the capillary column 422 includes frustum, cube, square prism, triangular prism, mushroom shape, hemisphere, cone, cylinder, S-shape and raindrop shape;

[0074] When the capillary column 422 is a quadrangular prism, the length of the capillary column 422 parallel to the inner wall 13 of the heat dissipation substrate is between 20 micrometers and 10 millimeters, the width is between 20 micrometers and 10 millimeters, and the height perpendicular to the inner wall 13 of the heat dissipation substrate is between 20 micrometers and 10 millimeters.

[0075] When the capillary column 422 is a triangular prism, the side length of the triangle parallel to the inner wall 13 of the heat dissipation substrate is between 20 micrometers and 10 millimeters, and the height perpendicular to the inner wall 13 of the heat dissipation substrate is between 20 micrometers and 10 millimeters.

[0076] When the capillary column 422 is a frustum, the length of the capillary column 422 parallel to the inner wall 13 of the heat dissipation substrate is between 20 micrometers and 10 millimeters, the width is between 20 micrometers and 10 millimeters, and the height perpendicular to the inner wall 13 of the heat dissipation substrate is between 20 micrometers and 10 millimeters.

[0077] When the capillary column 422 is a cylinder or a cone, the diameter of the capillary column 422 parallel to the inner wall 13 of the heat dissipation substrate is between 20 micrometers and 10 millimeters, and the height perpendicular to the inner wall 13 of the heat dissipation substrate is between 20 micrometers and 10 millimeters.

[0078] When the capillary column 422 is a hemisphere, the radius of the capillary column 422 is between 20 micrometers and 5 millimeters;

[0079] When the capillary column 422 is mushroom-shaped, raindrop-shaped, or S-shaped, the length, maximum diameter, or width of the capillary column 422 parallel to the inner wall 13 of the heat dissipation substrate is between 20 micrometers and 10 millimeters, the height perpendicular to the inner wall 13 of the heat dissipation substrate is between 20 micrometers and 10 millimeters, and the distance between two adjacent capillary columns 422 is between 20 micrometers and 10 millimeters.

[0080] In some embodiments of this utility model, the capillary columns 422 are staggered from each other, and the diameter of the capillary pores 411 is between 20 micrometers and 10 millimeters.

[0081] In some embodiments of this utility model, the surface of the capillary column 422 is covered with a hydrophilic layer and / or a hydrophobic layer, that is, the surface of the capillary column 422 can be treated with hydrophilic and hydrophobic properties.

[0082] In some embodiments of this utility model, the vertical distance between the side of the capillary column 422 near the heat dissipation cover 2 and the inner wall of the heat dissipation substrate 1 is denoted as H1, and the vertical distance between the side of the capillary column 422 near the heat dissipation cover 2 and the inner wall of the heat dissipation cover 2 is denoted as H2, and H1 / H2 is between 0.01 and 100.

[0083] This utility model also provides a phase change liquid cooling heat dissipation system, which includes the CPU / GPU chip liquid cooling phase change heat dissipation device as described above, and also includes a motherboard, a chip to be cooled and a working fluid heat dissipation device;

[0084] The chip to be cooled is mounted on the motherboard. Preferably, the chip to be cooled is mounted on the motherboard by soldering.

[0085] The CPU / GPU chip liquid cooling phase change heat dissipation device is pressed onto the chip to be cooled, and a thermally conductive medium is filled between the outer wall of the heat dissipation substrate and the heat dissipation surface of the chip to be cooled.

[0086] The pair of liquid-cooled joints 3 are respectively connected to the hot working fluid inlet and the cold working fluid outlet of the working fluid heat dissipation device through working fluid flow pipes to form a heat exchange cycle;

[0087] The working fluid circulating in the heat dissipation system is a phase change material, including water, alcohols, hydrocarbons, refrigerants, mineral oil, transformer oil, and fluorinated liquid.

[0088] Example 1

[0089] This embodiment provides a chip liquid-cooled phase-change heat dissipation device, see Figure 1-11 It includes a heat dissipation substrate 1, a heat dissipation cover 2, a liquid cooling connector 3, and a capillary wick 4 attached to the upper surface of the heat dissipation substrate 1, which are stacked in sequence.

[0090] The heat dissipation substrate 1 has a first fixing hole 11, a second fixing hole 12, and an inner wall 13. The first fixing hole 11 is used to securely install the heat dissipation device on the CPU / GPU chip, and the second fixing hole 12 is used to install and fix the heat dissipation device with a fastener. The fastener is a key component that ensures that the heat sink is in close contact with the CPU / GPU chip and conducts heat efficiently. The fastener uses mechanical pressure to make the heat sink base fit tightly against the chip surface, reducing the air gap at the contact surface and thus reducing thermal resistance.

[0091] The heat dissipation cover 2 has a square groove 21 in the middle, and a first connecting surface 22 is provided around it. Threaded holes 23 that pass through the heat dissipation cover 2 are provided on both sides of the heat dissipation cover 2.

[0092] The liquid cooling connector 3 includes a thread 31 and a pagoda structure 32;

[0093] The capillary core 4 includes a capillary core cover layer 41 and a capillary core bottom layer 42 that are attached one to the other in sequence.

[0094] The capillary wick cover layer 41 is provided with a plurality of capillary pores 411 that penetrate the capillary wick cover layer 41;

[0095] The capillary core bottom layer 42 is provided with capillary core grooves 421 and a number of capillary columns 422. The capillary columns 422 are distributed inside the capillary grooves 421, and a second connecting surface 423 is provided around the capillary grooves 421.

[0096] The heat dissipation cover 2 is attached to the inner wall 13 of the heat dissipation substrate via the first connecting surface 22 to form a heat dissipation chamber. Inside the heat dissipation chamber, the capillary wick bottom layer 42 is mounted on the inner wall 13 of the heat dissipation substrate, and the capillary wick cover layer 41 is mounted directly above the capillary wick bottom layer 42 through its bottom surface contacting the second connecting surface 423 and the top surface of the capillary column 422.

[0097] The liquid cooling connector 3 is installed on the heat sink 2 through the threaded hole 2 and the thread 31, respectively serving as the outlet and inlet of the liquid cooling medium. The direction of the outlet and inlet is any direction perpendicular to the top surface of the heat sink.

[0098] The pagoda structure 32 on the liquid cooling connector 3 can also be a threaded structure or a quick-release structure.

[0099] The connection between the heat dissipation substrate 1 and the heat dissipation cover 2 can be achieved by welding, threaded connection, riveting connection or snap-fit ​​connection;

[0100] Preferably, when the heat dissipation substrate 1 and the heat dissipation cover 2 are connected by brazing, the joint surfaces of the two are filled with solder, and a sealed connection is formed by the brazing process.

[0101] Preferably, when the heat dissipation substrate 1 and the heat dissipation cover 2 are connected by threads, threaded holes and sealing grooves for placing sealing rings are evenly opened around the heat dissipation substrate 1 and the heat dissipation cover 2. A sealing ring is provided between the heat dissipation substrate 1 and the heat dissipation cover 2 and placed in the sealing groove. The sealing ring is located inside the threaded hole. The sealing ring is pressed between the heat dissipation substrate 1 and the heat dissipation cover 2 by screwing a screw into the threaded hole to form a sealing structure.

[0102] Preferably, when the heat dissipation substrate 1 and the heat dissipation cover 2 are connected by riveting, holes for installing rivets and sealing grooves for placing sealing rings are evenly opened around the heat dissipation substrate 1 and the heat dissipation cover 2. A sealing ring is provided between the heat dissipation substrate 1 and the heat dissipation cover 2 and placed in the sealing groove. The sealing ring is located inside the rivet hole. The rivet passes through the rivet hole and is fixed by riveting, so that the axial pressure of the rivet presses the sealing ring between the heat dissipation substrate 1 and the heat dissipation cover 2 to form a sealed cavity.

[0103] Preferably, when the heat dissipation substrate 1 and the heat dissipation cover 2 are connected by a snap fastener, the lower surface of the heat dissipation substrate 1 and the upper surface edge of the heat dissipation cover 2 are provided with grooves for installing the snap fastener; the mating surfaces of the heat dissipation substrate 1 and the heat dissipation cover 2 are provided with sealing grooves for placing sealing rings, and a sealing ring is provided between the heat dissipation substrate 1 and the heat dissipation cover 2 and placed in the sealing groove; the elastic deformation force of the snap fastener presses the sealing ring between the heat dissipation substrate 1 and the heat dissipation cover 2 to achieve quick locking and sealing.

[0104] The connection between the heat sink 2 and the liquid cooling connector 3 is either threaded or welded.

[0105] The heat dissipation substrate 1 and heat dissipation cover 2 are made of one of the following materials: copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, and silicon nitride.

[0106] The capillary core 4 is mounted on the inner wall 41 of the heat dissipation substrate by a metal sintering process.

[0107] The capillary core bottom layer 42 is presented on the heat dissipation substrate 1 by metal sintering, and the capillary core grooves 421 and capillary columns 422 on the capillary core bottom layer 42 are processed by laser etching.

[0108] The capillary wick capping layer 41 is presented directly above the capillary wick bottom layer 42 by metal sintering, and the capillary pores 411 are processed by laser etching.

[0109] The capillary wick bottom layer 42 and the capillary wick top layer 41 are made of one of copper and copper alloys, aluminum and aluminum alloys, stainless steel and silver.

[0110] The capillary column 422 has the following shapes: frustum, cube, square prism, triangular prism, mushroom shape, hemisphere, cone, cylinder, S-shape, and raindrop shape.

[0111] Preferably, see Figure 11When the capillary column 422 is a quadrangular prism, its length parallel to the inner wall 13 of the heat dissipation substrate is between 20 micrometers and 10 millimeters, its width is between 20 micrometers and 10 millimeters, and its height perpendicular to the inner wall 13 of the heat dissipation substrate is between 20 micrometers and 10 millimeters; when the capillary column 422 is a triangular prism, the side length of the triangle parallel to the inner wall 13 of the heat dissipation substrate is between 20 micrometers and 10 millimeters, and its height perpendicular to the inner wall 13 of the heat dissipation substrate is between 20 micrometers and 10 millimeters; when the capillary column 422 is a frustum, its length parallel to the inner wall 13 of the heat dissipation substrate is between 20 micrometers and 10 millimeters, its width is between 20 micrometers and 10 millimeters, and its height perpendicular to the inner wall 13 of the heat dissipation substrate is between 20 micrometers and 10 millimeters. The capillary column 422 is cylindrical or conical, with a diameter parallel to the inner wall 13 of the heat dissipation substrate ranging from 20 micrometers to 10 millimeters, and a height perpendicular to the inner wall 13 of the heat dissipation substrate ranging from 20 micrometers to 10 millimeters. When the capillary column 422 is hemispherical, its radius ranges from 20 micrometers to 5 millimeters. When the capillary column 422 is mushroom-shaped, teardrop-shaped, or S-shaped, its length, maximum diameter, or width parallel to the inner wall 13 of the heat dissipation substrate ranges from 20 micrometers to 10 millimeters, and its height perpendicular to the inner wall 13 of the heat dissipation substrate ranges from 20 micrometers to 10 millimeters. The spacing between the capillary columns 422 is between 20 micrometers and 10 millimeters.

[0112] Furthermore, depending on the actual operating conditions, the surface of the capillary column 422 can be treated with hydrophilic or hydrophobic properties using methods such as spin coating or electrochemical deposition. Modifying the surface of the capillary column 422 with hydrophilic or hydrophobic properties can further increase the boiling rate of the working fluid and improve heat removal efficiency. The choice of hydrophilic or hydrophobic modification for the capillary column 422 is based on the heat flux density under specific operating conditions: hydrophobic modification yields better heat transfer performance at low heat flux densities, while hydrophilic modification yields better heat transfer performance at high heat flux densities. This is because, generally speaking, a hydrophilic surface yields a larger heat transfer coefficient at high heat flux densities, while a hydrophobic surface yields a larger heat transfer coefficient at low heat flux densities.

[0113] The capillary pores 411 are offset from the capillary columns 422 during processing, and the diameter of the capillary pores 411 is between 20 micrometers and 10 millimeters.

[0114] The vertical distance from the top of the capillary column 422 to the inner wall of the heat dissipation substrate 1 is denoted as H1, and the vertical distance from the top of the capillary column 422 to the heat dissipation cover 2 is denoted as H2. The ratio of H1 to H2 is between 0.01 and 100.

[0115] In the chip liquid-cooled phase change heat dissipation device, the liquid-cooled connector 3, the heat dissipation cover 2, the capillary wick 4, and the heat dissipation substrate 1 together constitute the working fluid flow channel of the phase change liquid-cooled heat dissipation device. Specifically, one of the liquid-cooled connectors 1 installed on the heat dissipation cover 2 is used as the working fluid inlet and the other as the working fluid outlet. The cold working fluid enters the heat dissipation device through the working fluid inlet and then enters the heat dissipation chamber formed by the heat dissipation substrate 1 and the heat dissipation cover 2. Then, it enters the capillary wick 4 through the capillary hole 411 and exchanges heat with the heat-generating chip through the heat dissipation substrate 1 and the capillary wick 4. The heat is transferred to the liquid working fluid through the heat dissipation substrate 1 and the capillary wick 4, causing the liquid working fluid to change from a liquid state to a gas state. The working fluid in the gas-liquid mixture state after heat exchange is discharged from the heat dissipation device through the working fluid outlet.

[0116] Example 2

[0117] This embodiment provides a phase change liquid cooling heat dissipation system, which includes the liquid cooling phase change heat dissipation device as described in Embodiment 1, and also includes a motherboard, a chip to be cooled, and a working fluid heat dissipation device.

[0118] The chip to be cooled is soldered or installed on the motherboard via a threaded connection; the chip liquid cooling phase change heat dissipation device is assembled on the motherboard via a fastener.

[0119] The chip liquid-cooled phase change heat dissipation device is pressed onto the chip to be cooled, and a thermally conductive medium is filled between the outer wall of the heat dissipation substrate and the heat dissipation surface of the chip to be cooled; a pair of liquid-cooled connectors 3 of the chip liquid-cooled phase change heat dissipation device are connected to the hot working medium inlet and the cold working medium outlet of the working medium heat dissipation device through the working medium flow pipe to form a heat exchange cycle.

[0120] The working fluid circulating in the heat dissipation system is a phase change material, including water, alcohols, hydrocarbons, refrigerants, mineral oil, transformer oil, fluorinated liquid, etc.

[0121] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from its technical solution shall still fall within the protection scope of this utility model.

Claims

1. A chip liquid-cooled phase-change heat dissipation device, characterized in that, include: Heat dissipation substrate (1); Heat dissipation cover (2), the heat dissipation cover (2) and the heat dissipation substrate (1) together form a heat dissipation chamber, and the heat dissipation cover (2) is also provided with a pair of liquid cooling connectors (3) that connect the cooling working fluid flow space. The capillary wick (4) is located in the cooling working fluid flow space. The capillary wick (4) includes a capillary wick cover layer (41) and a capillary wick bottom layer (42) that are attached to each other. The capillary wick cover layer (41) has a plurality of capillary holes (411) that penetrate the capillary wick cover layer (41). The capillary wick bottom layer (42) has a capillary wick groove (421) and a plurality of capillary columns (422) distributed in the capillary wick groove (421) on the side near the capillary wick cover layer (41).

2. The chip liquid-cooled phase-change heat dissipation device according to claim 1, characterized in that, The heat sink cover (2) has a square groove (21) on one side near the heat sink substrate (1). The square groove (21) has a pair of threaded holes (23) that penetrate the square groove (21). The pair of threaded holes (23) are threadedly connected to a pair of liquid cooling connectors (3) that communicate with the flow space of the cooling working fluid.

3. The chip liquid-cooled phase-change heat dissipation device according to claim 1, characterized in that, The capillary core layer (42) is mounted on the inner wall of the heat dissipation substrate (1).

4. The chip liquid-cooled phase-change heat dissipation device according to claim 1, characterized in that, The pair of liquid cooling connectors (3) that connect the cooling working fluid flow space serve as the outlet and inlet of the liquid cooling working fluid, respectively, and the direction of the outlet and inlet is any direction perpendicular to the top surface of the heat dissipation cover; the liquid cooling connector (3) is provided with a pagoda structure (32).

5. A chip liquid-cooled phase-change heat dissipation device according to claim 1, characterized in that, The heat dissipation substrate (1) and the heat dissipation cover (2) are connected by brazing, threading, riveting or snap-fit. When the heat dissipation substrate (1) and the heat dissipation cover (2) are connected by threads, threaded holes and sealing grooves for placing sealing rings are evenly opened around the heat dissipation substrate (1) and the heat dissipation cover (2). A sealing ring is provided between the heat dissipation substrate (1) and the heat dissipation cover (2) and placed in the sealing groove. The sealing ring is located inside the threaded hole. The sealing ring is pressed between the heat dissipation substrate (1) and the heat dissipation cover (2) by screwing a screw into the threaded hole to form a sealing structure. When the heat dissipation substrate (1) and the heat dissipation cover (2) are connected by riveting, holes for installing rivets and sealing grooves for placing sealing rings are evenly opened around the heat dissipation substrate (1) and the heat dissipation cover (2). A sealing ring is provided between the heat dissipation substrate (1) and the heat dissipation cover (2) and placed in the sealing groove. The sealing ring is located inside the rivet hole. The rivet passes through the rivet hole and is riveted and fixed, so that the axial pressure of the rivet presses the sealing ring between the heat dissipation substrate (1) and the heat dissipation cover (2) to form a sealed cavity. When the heat dissipation substrate (1) and the heat dissipation cover (2) are connected by a snap fastener, the lower surface of the heat dissipation substrate (1) and the upper surface edge of the heat dissipation cover (2) are provided with grooves for installing the snap fastener; the mating surfaces of the heat dissipation substrate (1) and the heat dissipation cover (2) are provided with sealing grooves for placing sealing rings, and a sealing ring is provided between the heat dissipation substrate (1) and the heat dissipation cover (2) and placed in the sealing groove; the elastic deformation force of the snap fastener presses the sealing ring between the heat dissipation substrate (1) and the heat dissipation cover (2) to achieve quick locking and sealing.

6. The chip liquid-cooled phase-change heat dissipation device according to claim 1, characterized in that, The heat dissipation cover (2) and the liquid cooling connector (3) are connected by thread or welding.

7. The chip liquid-cooled phase-change heat dissipation device according to claim 1, characterized in that, The capillary core (4) is mounted on the heat dissipation substrate (1) by metal sintering; the capillary core bottom layer (42) is mounted on the inner wall (13) of the heat dissipation substrate by metal sintering.

8. The chip liquid-cooled phase-change heat dissipation device according to claim 1, characterized in that, The capillary column (422) has the following shapes: frustum, cube, square prism, triangular prism, mushroom shape, hemisphere, cone, cylinder, S-shape and raindrop shape; When the capillary column (422) is a quadrangular prism, the length of the capillary column (422) parallel to the inner wall (13) of the heat dissipation substrate is between 20 micrometers and 10 millimeters, the width is between 20 micrometers and 10 millimeters, and the height perpendicular to the inner wall (13) of the heat dissipation substrate is between 20 micrometers and 10 millimeters. When the capillary column (422) is a triangular prism, the side length of the triangle of the capillary column (422) parallel to the inner wall (13) of the heat dissipation substrate is between 20 micrometers and 10 millimeters, and the height perpendicular to the inner wall (13) of the heat dissipation substrate is between 20 micrometers and 10 millimeters. When the capillary column (422) is a frustum, the length of the capillary column (422) parallel to the inner wall (13) of the heat dissipation substrate is between 20 micrometers and 10 millimeters, the width is between 20 micrometers and 10 millimeters, and the height perpendicular to the inner wall (13) of the heat dissipation substrate is between 20 micrometers and 10 millimeters. When the capillary column (422) is a cylinder or a cone, the diameter of the capillary column (422) parallel to the inner wall (13) of the heat dissipation substrate is between 20 micrometers and 10 millimeters, and the height perpendicular to the inner wall (13) of the heat dissipation substrate is between 20 micrometers and 10 millimeters. When the capillary column (422) is a hemisphere, the radius of the capillary column (422) is between 20 micrometers and 5 millimeters; When the capillary column (422) is mushroom-shaped, teardrop-shaped, or S-shaped, the length, maximum diameter, or width of the capillary column (422) parallel to the inner wall (13) of the heat dissipation substrate is between 20 micrometers and 10 millimeters, the height perpendicular to the inner wall (13) of the heat dissipation substrate is between 20 micrometers and 10 millimeters, and the distance between two adjacent capillary columns (422) is between 20 micrometers and 10 millimeters; The surface of the capillary column (422) is provided with a hydrophilic layer and / or a hydrophobic layer.

9. A chip liquid-cooled phase-change heat dissipation device according to claim 1, characterized in that, The capillary columns (422) are staggered from each other, and the diameter of the capillary pores (411) is between 20 micrometers and 10 millimeters.

10. A chip liquid-cooled phase-change heat dissipation device according to claim 1, characterized in that, The vertical distance between the side of the capillary column (422) near the heat dissipation cover (2) and the inner wall of the heat dissipation substrate (1) is denoted as H1, and the vertical distance between the side of the capillary column (422) near the heat dissipation cover (2) and the inner wall of the heat dissipation cover (2) is denoted as H2. H1 / H2 is between 0.01 and 100.

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