Heat dissipation device and computing device

Abstract

The embodiment of the present application provides a heat dissipation device and a computing device. The heat dissipation device comprises an evaporator, a capillary baffle and a condenser. The evaporator has a containing cavity. The evaporator comprises a bottom plate, which is used to contact a heat dissipation object. The capillary baffle is located in the containing cavity. The capillary baffle divides the containing cavity into a liquid return cavity and an evaporation cavity. The evaporation cavity is closer to the bottom plate than the liquid return cavity. The condenser comprises a pipeline. A first end of the pipeline is in communication with the liquid return cavity. A second end of the pipeline is in communication with the evaporation cavity to form a flow loop. The pressure in the flow loop is less than the atmospheric pressure. The flow loop is used to contain a cooling fluid. The heat dissipation device provided by the embodiment of the present application can have lower operation energy consumption and higher heat dissipation efficiency.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and more particularly to a heat dissipation device and a computing device. Background Technology

[0002] With the rise of big data, cloud computing, and artificial intelligence (AI), the computing power requirements for computing devices are becoming increasingly higher.

[0003] Components in computing devices can be cooled using heat pipes, but this method has relatively low heat dissipation efficiency. As the computing power of computing devices increases, the heat dissipation of components also increases. Liquid cooling radiators offer higher heat dissipation efficiency and can be used to cool components. A liquid cooling radiator consists of a pump, cold plate, piping, and radiator, forming a circulation loop containing coolant. The pump provides the power to flow the coolant. However, using the pump increases the energy consumption of the radiator during operation.

[0004] In related technologies, it is difficult for heat sinks to simultaneously achieve both low operating energy consumption and high heat dissipation efficiency. Utility Model Content

[0005] This application provides a heat dissipation device and a computing device, wherein the heat dissipation device can have both low operating power consumption and high heat dissipation efficiency.

[0006] In a first aspect, embodiments of this application provide a heat dissipation device, comprising: an evaporator, a capillary baffle, and a condenser. The evaporator has a receiving cavity and includes a base plate for contacting the component to be cooled. The capillary baffle is located in the receiving cavity and divides the receiving cavity into a return liquid cavity and an evaporation cavity, with the evaporation cavity being closer to the base plate than the return liquid cavity. The condenser includes a pipe, with a first end of the pipe communicating with the return liquid cavity and a second end of the pipe communicating with the evaporation cavity to form a flow loop. The pressure in the flow loop is less than atmospheric pressure, and the flow loop is used to contain cooling fluid.

[0007] The heat dissipation device provided in this application embodiment divides the receiving cavity into a return liquid cavity and an evaporation cavity through a capillary baffle, with the evaporation cavity closer to the bottom plate than the return liquid cavity. This exposes the entire surface of the capillary baffle facing away from the bottom plate in the return liquid cavity, resulting in higher circulation efficiency of the cooling fluid. The entire surface of the capillary baffle facing the bottom plate is exposed in the evaporation cavity, accelerating liquid vaporization. The higher vaporization rate further increases the circulation efficiency of the cooling fluid. Higher fluid circulation efficiency is more conducive to the dissipation of processor heat, thus increasing the heat dissipation efficiency of the heat dissipation device. By ensuring the pressure in the flow loop is lower than atmospheric pressure, the coolant is more easily vaporized after heating, and the volume expansion of the vaporized cooling fluid provides the driving force for cooling fluid circulation. The adsorption force of the capillary pores in the capillary baffle also provides the driving force for cooling fluid circulation. The heat dissipation device provided in this application embodiment provides the driving force for cooling fluid flow through its own structure, reducing the energy consumption of the heat dissipation device. Therefore, the heat dissipation device can achieve both low operating energy consumption and high heat dissipation efficiency.

[0008] In one possible implementation, the heat dissipation device provided in this application embodiment has a plurality of protrusions on the side of the capillary baffle facing the base plate. These protrusions extend along a first direction and are spaced apart along a second direction. The side of the protrusions facing the base plate abuts against the base plate, and the space between adjacent protrusions forms a first flow channel. The protrusions can further increase the surface area of ​​the capillary baffle facing the base plate, providing more vaporization nuclei and evaporation interfaces for the liquid, thereby further accelerating the vaporization rate of the liquid. The first flow channel can guide the flow of gas, increasing the gas flow velocity to further increase the gas flow rate.

[0009] In one possible implementation, the heat dissipation device provided in this application embodiment further includes capillary patches disposed on the side of the base plate facing the capillary baffle. The base plate also has a capillary structure, which can provide more vaporization nuclei and evaporation interfaces for the liquid, and can further accelerate the vaporization rate of the liquid.

[0010] In one possible implementation, the heat dissipation device provided in this application includes an evaporator further comprising a cover plate and side plates surrounding the cover plate. The side plates connect the cover plate and a bottom plate, and the cover plate, side plates, and bottom plate together form a receiving cavity. A capillary baffle is connected to the side plates. The side plates include a first side plate, which is disposed on one side of the cover plate along a first direction. The first side plate has a communicating portion. The evaporator also includes an extension, one end of which is connected to the cover plate, and the other end of which is connected to the bottom plate. The space between the extension and the first side plate forms a gas collecting cavity. The gas collecting cavity is connected to a plurality of first flow channels through the communicating portion, and the second end of the pipeline is connected to the gas collecting cavity. By causing the gas in the first flow channels to converge in the gas collecting cavity, the gas in the gas collecting cavity can have a larger pressure, thereby providing a larger driving force for the gas to enter the pipeline and further increasing the circulation efficiency of the cooling fluid.

[0011] In one possible implementation, the heat dissipation device provided in this application includes an evaporator further comprising a cover plate and side plates surrounding the cover plate, the cover plate, side plates, and bottom plate forming a receiving cavity; a capillary baffle connected to the side plates; the side plates include a first side plate and a second side plate, the first side plate being disposed on one side of the cover plate along a first direction, and the second side plate connecting the bottom plate and the cover plate; a second flow channel is provided between the first side plate and the bottom plate, and the second flow channel is connected to a plurality of first flow channels; the evaporator further includes an extension, one end of which is connected to the cover plate, and the other end of which is connected to the bottom plate, the space between the extension and the first side plate forming a gas collecting cavity, the gas collecting cavity being connected to the second flow channel, and the second end of the pipeline being connected to the gas collecting cavity.

[0012] In one possible implementation, the heat dissipation device provided in this application embodiment has a first side plate with a plurality of spaced-apart cutouts along a second direction, and reinforcing ribs between adjacent cutouts. The cutouts can reduce the heat transferred from the gas to the liquid, so that the temperature of the liquid is lower when it enters the evaporation chamber from the return chamber, thereby absorbing as much heat from the processor as possible. The reinforcing ribs reduce heat transfer while ensuring the strength of the first side plate.

[0013] In one possible implementation, the heat dissipation device provided in this application embodiment has a capillary baffle with a plurality of spaced-apart support columns on its side facing away from the base plate. The support columns abut against the cover plate. The abutment between the support columns and the cover plate can prevent the cover plate from collapsing. The support columns also have a plurality of capillary pores, which can also be used to adsorb liquid, resulting in a high liquid adsorption rate.

[0014] In one possible implementation, the heat dissipation device provided in this application embodiment further includes a heat exchanger in the condenser. The heat exchanger is disposed on the side of the evaporator away from the component to be scaldredged, and some of the piping is coiled in the heat exchanger. The heat exchanger being disposed on the side of the evaporator away from the component to be scaldredged makes the structure of the heat dissipation device more compact, thereby reducing the space occupied by the heat dissipation device in the housing.

[0015] Secondly, embodiments of this application provide a computing device, including a heat-dissipating component and the aforementioned heat dissipation device, wherein the base plate of the heat dissipation device is in contact with the heat-dissipating component.

[0016] In one possible implementation, the computing device provided in this application embodiment further includes peripheral devices located around the periphery of the component to be cooled. The heat exchanger of the condenser includes a first heat exchange section and a second heat exchange section connected to the first heat exchange section. A portion of the first heat exchange section is attached to the side of the evaporator away from the component to be cooled. The second heat exchange section is located around the periphery of the component to be cooled and is offset from the peripheral devices. The second heat exchange section increases the extension path of the piping, resulting in a lower temperature of the cooling fluid in the piping, thereby improving the heat dissipation capacity of the cooling device. The offset arrangement of the second heat exchange section from the peripheral devices allows for full utilization of the space within the housing while improving the heat dissipation capacity of the cooling device. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a computing device provided in an embodiment of this application;

[0018] Figure 2 Another schematic diagram of the structure of the computing device provided in the embodiments of this application;

[0019] Figure 3 This is a schematic diagram of the structure of the heat dissipation device provided in the embodiments of this application;

[0020] Figure 4 for Figure 3 Another structural diagram;

[0021] Figure 5 An exploded view of the heat dissipation device provided in the embodiments of this application;

[0022] Figure 6 For along Figure 3 A cross-sectional view of the AA plane;

[0023] Figure 7 This is a schematic diagram of the evaporator in the heat dissipation device provided in the embodiments of this application;

[0024] Figure 8 This is a schematic diagram of the condenser in the heat dissipation device provided in the embodiments of this application;

[0025] Figure 9An exploded view of the evaporator and capillary baffle in the heat dissipation device provided in the embodiment of this application;

[0026] Figure 10 This is a schematic diagram of the capillary baffle in the heat dissipation device provided in the embodiments of this application;

[0027] Figure 11 A schematic diagram illustrating the fit between the capillary baffle and the housing in the heat dissipation device provided in the embodiments of this application;

[0028] Figure 12 For along Figure 7 A cross-sectional view of the BB plane;

[0029] Figure 13 Another exploded view of the evaporator and capillary baffle in the heat dissipation device provided in the embodiments of this application;

[0030] Figure 14 Another exploded schematic diagram of the evaporator and capillary baffle in the heat dissipation device provided in the embodiments of this application;

[0031] Figure 15 For along Figure 7 Another sectional view of the BB surface;

[0032] Figure 16 This is a schematic diagram of the structure of the cover plate and side plate in the heat dissipation device provided in the embodiments of this application;

[0033] Figure 17 For along Figure 7 A cross-sectional view of the C-plane.

[0034] Explanation of reference numerals in the attached figures:

[0035] 10. Computing equipment;

[0036] 100. Box body; 110. Bottom shell;

[0037] 200. Hard disk module;

[0038] 300. Fan module; 310. Fan;

[0039] 400. Motherboard module; 410. Board body; 420. Processor; 430. Memory;

[0040] 500. Function card module; 600. Power module;

[0041] 700. Heat dissipation device;

[0042] 710. Evaporator;

[0043] 7111, Cover plate; 7112, Side plate; 7112a, First side plate; 7112b, Second side plate; 7112b', First through hole; 7113, Stepped surface; 7113a, Groove; 7114, Extension; 7114a, First through hole; 7115, Hollowed-out part; 7116, Reinforcing rib;

[0044] 712. Base plate; 7121. Mounting section;

[0045] 713. Second flow channel;

[0046] 720. Capillary septum; 721. Protrusion; 7211. First surface; 7212. Second surface; 7213. Third surface;

[0047] 722. First flow channel; 723. Support column;

[0048] 730. Condenser;

[0049] 731, Pipeline; 7311, First end; 7312, Second end; 7313, Opening;

[0050] 732, Heat exchanger; 7321, Fins; 7322, First heat exchange section; 7323, Second heat exchange section;

[0051] 740. Receiving cavity; 741. Liquid return cavity; 742. Evaporation cavity; 743. Gas collection cavity;

[0052] 750. Capillary patch; 751. Dividing section;

[0053] X, first direction; Y, second direction; Z, third direction. Detailed Implementation

[0054] The terminology used in the implementation section of this application is only for explaining specific embodiments of this application and is not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0055] This application provides a heat dissipation device and a computing device, which can have both low operating power consumption and high heat dissipation efficiency.

[0056] The computing device can be a server, such as a high-density server, tower server, rack server, or full-rack server. Among them, rack servers can be configured with different function cards according to different needs, which has the advantages of high flexibility and wide applicability.

[0057] The following section uses a rack server as an example to illustrate the specific structure of the computing device 10.

[0058] Figure 1A schematic diagram of the structure of a computing device provided in an embodiment of this application.

[0059] See Figure 1 As shown, the computing device 10 provided in this application includes a housing 100. The housing 100 can be a cuboid structure, with its width direction being a first direction X, its length direction being a second direction Y, and its height direction being a third direction Z. The dimension of the housing 100 along the third direction Z is expressed in units of U, where 1U is approximately equal to 44.45 mm. The dimension of the housing 100 along the third direction Z can be 1U, 2U, 3U, or 4U, etc. Figure 1 The dimension of the box 100 shown along the third direction Z is 2U.

[0060] The enclosure 100 may include a bottom shell 110 and a cover (not shown in the figure). The bottom shell 110 has a receiving cavity for accommodating various components of the server 10, such as a hard drive module 200, a fan module 300, a motherboard module 400, and a function card module 500. Figure 1 In the illustrated embodiment, the hard disk module 200, fan module 300, motherboard module 400, and function card module 500 can be arranged sequentially along the second direction Y in the receiving cavity. The computing device 10 may also include a power supply module 600, which can be arranged side by side with the function card module 500 along the first direction X. The power supply module 600 is used to supply power to the hard disk module 200, fan module 300, motherboard module 400, and function card module 500.

[0061] The motherboard module 400 can be disposed in the middle region of the bottom shell 110 along the second direction Y. The motherboard module 400 includes a board body 410, a processor 420, memory 430, and other electronic components. The board body 410 can be mounted on the bottom shell 110 using fasteners. The processor 420 is disposed on the board body 410. Figure 1 The diagram schematically shows two processors 420 arranged along a first direction X. Each processor 420 has multiple memory modules 430 on both sides along the first direction X. The multiple memory modules 430 can be arranged at intervals along the first direction X. The memory modules 430 are electrically connected to the processors 420 through internal wiring of the board 410.

[0062] The hard drive module 200 can be disposed at one end of the bottom case 110 along the second direction Y. The hard drive module 200 can be electrically connected to the motherboard module 400. The function card module 500 can be disposed at the other end of the bottom case 110 along the second direction Y. The fan module 300 can be disposed between the hard drive module 200 and the motherboard module 400, and the fan module 300 includes multiple fans 310, which can be arranged along the first direction X. The airflow direction of the fans 310 is the second direction Y.

[0063] Both the hard disk module 200 and the function card module 500 are electrically connected to the motherboard module 400 board 410, and are electrically connected to the processor 420 through the internal wiring of the board 410. The processor 420 is the core working component when the computing device 10 is running. The processor 420 generates a large amount of heat when it is working. The memory 430 is used to temporarily store the calculation data in the processor 420.

[0064] Figure 2 Another schematic diagram of the computing device provided in an embodiment of this application.

[0065] See Figure 2 As shown, this embodiment of the application uses the processor 420 in the computing device 10 as the component to be cooled. A heat dissipation device 700 can be provided on the processor 420 to dissipate heat from the processor 420. The structure of the heat dissipation device 700 provided in this embodiment of the application will be described below.

[0066] Figure 3 This is a schematic diagram of the heat dissipation device provided in an embodiment of this application. Figure 4 for Figure 3 Another structural diagram from which to view Figure 5 This is an exploded view of the heat dissipation device provided in the embodiments of this application. Figure 6 For along Figure 3 A cross-sectional view of plane AA.

[0067] See Figures 3 to 6 As shown, the heat dissipation device 700 includes an evaporator 710, a capillary baffle 720, and a condenser 730. The evaporator 710 has a receiving cavity 740 and includes a base plate 712 for contacting the component to be cooled. The capillary baffle 720 is located in the receiving cavity and divides the receiving cavity 740 into a return liquid cavity 741 and an evaporation cavity 742, with the evaporation cavity 742 being closer to the base plate 712 than the return liquid cavity 741. The condenser 730 includes a pipe 731, with a first end 7311 communicating with the return liquid cavity 741 and a second end 7312 communicating with the evaporation cavity 742 to form a flow loop for supplying fluid, the pressure in the flow loop being less than atmospheric pressure.

[0068] The first, second, and third directions of the heat dissipation device 700 are consistent with the first X, second Y, and third Z directions of the housing 100.

[0069] Figure 7 This is a schematic diagram of the evaporator in the heat dissipation device provided in the embodiments of this application.

[0070] See Figures 3 to 7As shown, the heat dissipation device 700 includes an evaporator 710, which can be a cuboid structure. The evaporator 710 includes a base plate 712, which is used to attach to the processor 420. A thermally conductive film can also be disposed between the base plate 712 and the processor 420. The base plate 712 has evenly spaced mounting portions 7121 on its periphery. When the base plate 712 of the evaporator 710 is attached to the processor 420, the mounting portions 7121 can be connected to the board body 410 to connect the evaporator 710 to the motherboard module 400. Figure 5 and Figure 7 In the embodiment shown, the mounting part 7121 can be a mounting hole, and fasteners can be inserted into the mounting hole to connect the base plate 712 to the plate body 410.

[0071] The evaporator 710 has a receiving cavity 740 for receiving cooling fluid. Please continue reading. Figure 5 and Figure 6 As shown, a capillary baffle 720 is located in the receiving cavity 740, dividing the receiving cavity 740 into a liquid return cavity 741 and an evaporation cavity 742. Specifically, the side away from the bottom plate 712 is the liquid return cavity 741, and the side closer to the bottom plate 712 is the evaporation cavity 742. The capillary baffle 720 can be formed by sintering metal powder (such as copper powder or nickel powder), and the capillary baffle 720 has multiple capillary pores.

[0072] Figure 8 This is a schematic diagram of the condenser in the heat dissipation device provided in the embodiments of this application.

[0073] See Figures 3 to 6 as well as Figure 8 As shown, the condenser 730 also includes a heat exchanger 732, which includes multiple fins 7321. These fins 7321 extend along a second direction Y and are spaced apart along a first direction X. Some pipes 731 are coiled within the heat exchanger 732 and pass sequentially through the multiple fins 7321, forming air ducts between adjacent fins 7321. Figure 3 and Figure 4 In the illustrated embodiment, the heat exchanger 732 is disposed on the side of the evaporator 710 away from the heat-dissipating component, making the structure of the heat dissipation device 700 more compact and reducing the space occupied by the heat dissipation device 700 in the housing 100 along the first direction X and the second direction Y. The air duct extends along the second direction Y. The pipe 731 has a first end 7311 and a second end 7312 opposite to each other along its coiled path, wherein the first end 7311 communicates with the return liquid chamber 741, and the second end 7312 communicates with the evaporation chamber 742. In other embodiments, the heat exchanger 732 may also be disposed on one side of the evaporator 710 along the first direction X or the second direction Y, and the extension direction of the fins 7321 in the heat exchanger 732 may also be other directions.

[0074] Pipe 731, return chamber 741, and evaporation chamber 742 form a connected flow loop containing flowing cooling fluid. Specifically, pipe 731 has an opening 7313 through which a vacuum is created in the flow loop, followed by the injection of coolant. The opening 7313 can then be sealed with a plug. The pressure in the flow loop is less than atmospheric pressure. The coolant is a liquid cooling fluid.

[0075] The heat generated by the processor 420 during operation is transferred to the coolant in the evaporation chamber 742 via the base plate 712. Because the pressure in the flow circuit is lower than atmospheric pressure, the coolant has a lower boiling point, and the coolant in the evaporation chamber 742 absorbs heat and vaporizes. The vaporized coolant expands in volume, and the expanding gas generates a driving force, causing the vaporized coolant to enter pipe 731 from the second end 7312 back into pipe 731. As the vaporized coolant flows in pipe 731, the airflow from fan 310 passes through the air duct formed by the fins 7321 of heat exchanger 732, cooling the coolant in pipe 731, causing the gas in pipe 731 to condense into liquid. The liquid continues to flow along pipe 731, entering the return chamber 741 from the first end 7311. The adsorption force of the capillary pores in the capillary baffle 720 provides the driving force, and the coolant in the return chamber 741 enters the evaporation chamber 742 under the action of the capillary adsorption force. The coolant in the evaporation chamber 742 is heated and then vaporized again, thus circulating to dissipate heat from the processor 420.

[0076] By ensuring the pressure in the flow circuit is lower than atmospheric pressure, the coolant is more easily vaporized upon heating, and the volume expansion of the vaporized coolant provides the driving force for coolant circulation. The adsorption force of the capillary pores in the capillary baffle 720 also provides the driving force for coolant circulation. Compared to related technologies that rely on a pump for driving force, the heat dissipation device 700 provided in this embodiment provides the driving force for coolant flow through its own structure, reducing the energy consumption of the heat dissipation device 700. Furthermore, by ensuring the pressure in the flow circuit is lower than atmospheric pressure, leakage of coolant in the flow circuit can also be reduced.

[0077] The receiving cavity 740 is divided into a liquid return cavity 741 and an evaporation cavity 742 by a capillary baffle 720. The entire surface of the capillary baffle 720 facing away from the base plate 712 is exposed in the liquid return cavity 741 for liquid adsorption, resulting in a high liquid adsorption rate and thus a high cooling fluid circulation efficiency. The entire surface of the capillary baffle 720 facing the base plate 712 is exposed in the evaporation cavity 742. This porous surface provides more vaporization nuclei and evaporation interfaces for the liquid during vaporization in the evaporation cavity 742, accelerating vaporization and further increasing the cooling fluid circulation efficiency. This facilitates heat dissipation from the processor 420, increasing the heat dissipation efficiency of the heat sink 700. Therefore, the heat sink 700 achieves both low operating power consumption and high heat dissipation efficiency.

[0078] Furthermore, by dividing the receiving cavity 740 into a return liquid cavity 741 and an evaporation cavity 742 by the capillary baffle 720, it is possible to avoid setting other dividing structures in the evaporator 710, making the internal structure of the evaporator 710 relatively simple.

[0079] Figure 9 This is an exploded view of the evaporator and capillary baffle in the heat dissipation device provided in the embodiments of this application. Figure 10 This is a schematic diagram of the capillary baffle in the heat dissipation device provided in an embodiment of this application. Figure 11 This is a schematic diagram illustrating the fit between the capillary baffle and the housing in the heat dissipation device provided in the embodiments of this application. Figure 12 For along Figure 7 A cross-sectional view of the BB plane.

[0080] See Figures 9 to 12 As shown, in one possible implementation, the capillary septum 720 has a plurality of protrusions 721 on the side facing the bottom plate 712. The plurality of protrusions 721 extend along a first direction X and are spaced apart along a second direction Y. The side of the protrusions 721 facing the bottom plate 712 abuts against the bottom plate 712, and the space between adjacent protrusions 721 forms a first flow channel 722.

[0081] The capillary baffle 720 has multiple protrusions 721 on the side facing the base plate 712. These protrusions 721 can further increase the surface area of ​​the capillary baffle 720 facing the base plate 712, providing more vaporization nuclei and evaporation interfaces for the liquid, thereby further accelerating the vaporization rate of the liquid. For example, the cross-section of the protrusion 721 can be rectangular, thus each protrusion 721 has a first surface 7211, a second surface 7212, and a third surface 7213. The second surface 7212 abuts against the base plate 712. The sum of the surface areas of the first surface 7211 and the third surface 7213 is larger.

[0082] Multiple protrusions 721 can extend along the first direction X and be arranged side by side at intervals along the second direction Y. The second surface 7212 abuts against the base plate 712. Thus, the space between the protrusions 721 can form a first flow channel 722. The first flow channel 722 also extends along the first direction X. The first flow channel 722 can guide the flow of gas and increase the flow speed of gas to further increase the flow rate of gas.

[0083] Figure 13 This is another exploded view of the evaporator and capillary baffle in the heat dissipation device provided in the embodiments of this application. Figure 14 This is another exploded view of the evaporator and capillary baffle in the heat dissipation device provided in the embodiments of this application. Figure 15 For along Figure 7 Another sectional view of the BB plane.

[0084] join Figures 13 to 15 As shown, in one possible implementation, the heat dissipation device 700 further includes a capillary patch 750 disposed on the side of the base plate 712 facing the capillary partition 720.

[0085] The capillary patch 750 also has multiple capillary pores. The capillary patch 750 can be formed by sintering metal powder, or it can be a mesh structure woven from copper wire. The capillary patch 750 is mounted on the base plate 712. Figures 13 to 15 In the illustrated embodiment, the capillary patch 750 can be attached to and connected to the base plate 712, for example, the capillary patch 712 can be soldered to the base plate 712.

[0086] Therefore, the base plate 712 also has a capillary structure, which can provide more vaporization nuclei and evaporation interfaces for the liquid, and can further accelerate the vaporization rate of the liquid.

[0087] The capillary patch 750 may have segments 751 arranged at intervals along the second direction Y, and protrusions 721 are inserted in the segments 751 to abut against the base plate 712.

[0088] The connection method between the capillary baffle 720 and the side plate 7112 will be described below.

[0089] Figure 16 This is a schematic diagram of the structure of the cover plate and side plate in the heat dissipation device provided in the embodiments of this application. Figure 17 For along Figure 7 A cross-sectional view of the C-plane.

[0090] See Figure 7 , Figure 9 , Figure 16 and Figure 17As shown, the evaporator 710 also includes a cover plate 7111 and a side plate 7112 surrounding the cover plate 7111. The cover plate 7111, the side plate 7112 and the bottom plate 712 together form a receiving cavity 740, and the capillary baffle 720 is connected to the side plate 7112.

[0091] The cover plate 7111 has a rectangular structure, and the side plates 7112 are arranged around the four sides of the cover plate 7111. Among them, the side plate 7112 located on one side of the cover plate 7111 along the first direction X is the first side plate 7112a, and the side plates located on the remaining three sides of the cover plate 7111 are the second side plates 7112b.

[0092] The four peripheral sides of the capillary baffle 720 can be welded to the four side plates 7112 respectively. Thus, the capillary baffle 720 divides the receiving cavity 740 into a return liquid cavity 741 and an evaporation cavity 742 along the third direction Z. No additional connecting structure is needed to connect the capillary baffle 720 and the side plates 7112, making the connection between the capillary baffle 720 and the side plates 7112 simple. One of the second side plates 7112b has a first through hole 7112b', which is located near the cover plate 7111 along the third direction Z. The first end 7311 of the pipe 731 is inserted into the first through hole 7112b' to communicate with the return liquid cavity 741.

[0093] Please continue reading Figure 16 and Figure 17 As shown, the side plate 7112 also has a stepped surface 7113, which is located between the cover plate 7111 and the bottom plate 712. The side of the capillary baffle 720 facing the cover plate 7111 in the third direction Z abuts against the stepped surface 7113. Thus, the size of the return chamber 741 in the third direction Z can be defined by the distance between the stepped surface 7113 and the cover plate 7111. The stepped surface 7113 is also provided with a plurality of grooves 7113a, and a sealing ring is provided in the grooves 7113a to prevent leakage at the contact point between the capillary baffle 720 and the stepped surface 7113.

[0094] The evaporator 710 also includes an extension 7114, one end of which is connected to the cover plate 7111, and the other end of which is connected to the base plate 712. The space between the extension 7114 and the first side plate 7112a forms a gas collecting chamber 743, and the second end 7312 of the pipe 731 communicates with the gas collecting chamber 743. In one possible embodiment, the first side plate 7112a and the second side plate 7112b are both used to connect the cover plate 7111 and the base plate 712. The first side plate 7112a has a connecting portion (not shown in the figure), which can be multiple connecting holes formed on the first side plate 7112a. These multiple connecting holes communicate one-to-one with multiple first flow channels 722, allowing the first flow channels 722 to communicate with the gas collecting chamber 743. The second end 7312 of the pipe 731 communicates with the gas collecting chamber 743. Gases from multiple first flow channels 722 converge in a gas collecting chamber 743 via a connecting portion and then enter the pipe 731 from the gas collecting chamber 743. Thus, by ensuring that all the gas from the first flow channels 722 converges in the gas collecting chamber 743, the gas in the gas collecting chamber 743 can have a higher pressure, providing a greater driving force for the gas to enter the pipe 731, further increasing the circulation efficiency of the cooling fluid.

[0095] Please continue reading Figures 15 to 17 As shown, in another possible implementation, the second side plate 7112b connects the cover plate 7111 and the bottom plate 712, and the first side plate 7112a and the bottom plate 712 have a second flow channel 713, which communicates with a plurality of first flow channels 722.

[0096] Specifically, the dimension of the first side plate 7112a along the third direction Z is smaller than that of the second side plate 7112b, and the first side plate 7112a is not connected to the bottom plate 712. The gap between the first side plate 7112a and the bottom plate 712 forms a second flow channel 713, which extends along the second direction Y, and a plurality of first flow channels 722 extend along the first direction X and communicate with the second flow channel 713.

[0097] Please continue reading Figure 16 and Figure 17As shown, the evaporator 710 also includes an extension 7114, one end of which is connected to the cover plate 7111. The cross-sectional profile of the extension 7114 can be arc-shaped or polygonal, such that the other end of the extension 7114 extends to connect with the base plate 712. The extension 7114 and the first side plate 7112a have a gas collecting chamber 743, which is connected to a plurality of first flow channels 722 through a second flow channel 713. The extension 7114 has a second through hole 7114a, and the second end 7312 of the pipe 731 is inserted into the second through hole 7114a to communicate with the gas collecting chamber 743. The gas in the plurality of first flow channels 722 is collected in the gas collecting chamber 743 through the second flow channel 713 and enters the pipe 731 from the gas collecting chamber 743. Therefore, by ensuring that the gas in the first flow channel 722 is concentrated in the gas collecting chamber 743, the gas in the gas collecting chamber 743 can have a higher pressure, providing a greater driving force for the gas to enter the pipe 731, further increasing the circulation efficiency of the cooling fluid. Compared to providing a connecting portion on the first side plate 7112a, forming the second flow channel 713 using the gap between the first side plate 7112a and the bottom plate 712 simplifies the connection structure between the gas collecting chamber 743 and the first flow channel 722.

[0098] Please continue reading Figure 7 and Figure 17 As shown, in one possible implementation, the first side plate 7112a has a plurality of hollow portions 7115 arranged at intervals along the second direction Y, and there are reinforcing ribs 7116 between adjacent hollow portions 7115.

[0099] The first side plate 7112a can separate the return liquid chamber 741 and the gas collecting chamber 743 along the first direction X. The liquid in the return liquid chamber 741 has a lower temperature, while the gas in the gas collecting chamber 743 absorbs heat from the processor 420 and has a higher temperature. Therefore, by providing a perforated portion 7115 on the first side plate 7112a, the heat transferred from the gas to the liquid can be reduced, so that the temperature of the liquid entering the evaporation chamber 742 from the return liquid chamber 741 is lower, thereby absorbing as much heat from the processor 420 as possible. There are multiple perforated portions 7115, and reinforcing ribs 7116 are provided between the multiple perforated portions 7115, thereby ensuring the strength of the first side plate 7112a while reducing heat transfer.

[0100] Please continue reading Figures 9 to 15 As shown, in one possible implementation, a plurality of spaced support columns 723 are provided on the side of the capillary septum 720 facing away from the bottom plate 712, and the support columns 723 abut against the cover plate 7111.

[0101] The support column 723 abuts against the cover plate 7111 to prevent the cover plate 7111 from collapsing and deforming, thereby reducing the volume of the return liquid chamber 741. In addition, the support column 723 also has multiple capillary pores, which can also be used to adsorb liquid, resulting in a high liquid adsorption rate.

[0102] The computing device 10 also includes peripheral devices located around the component to be cooled. Please see [link to previous section]. Figure 1 and Figure 2 As shown, memory 430 is disposed on both sides of processor 420 along the first direction X. This example uses memory 430 as a peripheral device. Please continue reading... Figure 2 and Figure 8 As shown, the heat exchanger 732 includes a first heat exchange section 7322 and a second heat exchange section 7323 connected to the first heat exchange section 7322. Part of the first heat exchange section 7322 is attached to the side of the evaporator 710 away from the heat dissipation component. The second heat exchange section 7323 is located on the periphery of the heat dissipation component and is staggered from the peripheral components.

[0103] The first heat exchange section 7322 includes a plurality of fins 7321 extending along the second direction Y and spaced apart along the first direction X, and is disposed on the cover plate 7111. The heat exchanger 732 also includes a second heat exchange section 7323, which also includes a plurality of fins 7321 extending along the second direction Y and spaced apart along the first direction X. The second heat exchange section 7323 increases the extension path of the pipe 731, resulting in a lower temperature of the cooling fluid in the pipe 731, thereby improving the heat dissipation capacity of the heat dissipation device 700.

[0104] exist Figure 2 In the embodiment shown, the second heat exchange unit 7323 is staggered from the memory unit 430, thereby improving the heat dissipation capacity of the heat dissipation device 700 while making full use of the space in the housing 100.

[0105] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0106] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation device, characterized in that, include: An evaporator having a receiving cavity, the evaporator including a base plate for contacting the component to be cooled; A capillary partition is located in the receiving cavity, and the capillary partition divides the receiving cavity into a liquid return chamber and an evaporation chamber, wherein the evaporation chamber is closer to the bottom plate than the liquid return chamber; A condenser includes a pipe, a first end of which is connected to the return liquid chamber and a second end of which is connected to the evaporation chamber to form a flow loop. The pressure in the flow loop is less than atmospheric pressure, and the flow loop is used to contain cooling fluid.

2. The heat dissipation device according to claim 1, characterized in that, The capillary septum has a plurality of protrusions on the side facing the bottom plate. The plurality of protrusions extend along a first direction and are spaced apart along a second direction. The side of the protrusions facing the bottom plate abuts against the bottom plate, and the space between adjacent protrusions forms a first flow channel.

3. The heat dissipation device according to claim 2, characterized in that, It also includes a capillary patch disposed on the side of the base plate facing the capillary septum.

4. The heat dissipation device according to claim 2, characterized in that, The evaporator further includes a cover plate and side plates surrounding the cover plate. The side plates connect the bottom plate and the cover plate. The cover plate, the side plates, and the bottom plate together form the receiving cavity. The capillary baffle is connected to the side plates. The side plate includes a first side plate, which is disposed on one side of the cover plate along a first direction; the first side plate has a connecting portion. The evaporator further includes an extension, one end of which is connected to the cover plate and the other end of which is connected to the bottom plate. The space between the extension and the first side plate forms a gas collection chamber. The gas collection chamber is connected to a plurality of first flow channels through the connecting part, and the second end of the pipeline is connected to the gas collection chamber.

5. The heat dissipation device according to claim 2, characterized in that, The evaporator further includes a cover plate and side plates surrounding the cover plate, the cover plate, the side plates, and the bottom plate forming the receiving cavity; the capillary baffle is connected to a portion of the side plates; The side plate includes a first side plate and a second side plate. The first side plate is disposed on one side of the cover plate along a first direction, and the second side plate connects the bottom plate and the cover plate. A second flow channel is provided between the first side plate and the bottom plate, and the second flow channel is connected to a plurality of the first flow channels; The evaporator further includes an extension, one end of which is connected to the cover plate and the other end of which is connected to the bottom plate. The space between the extension and the first side plate forms a gas collection chamber, which is connected to the second flow channel. The second end of the pipeline is connected to the gas collection chamber.

6. The heat dissipation device according to claim 4 or 5, characterized in that, The first side plate has a plurality of perforated portions spaced apart along the second direction, and there are reinforcing ribs between adjacent perforated portions.

7. The heat dissipation device according to any one of claims 4 or 5, characterized in that, The capillary septum has a plurality of spaced support columns on its side facing away from the bottom plate, and the support columns abut against the cover plate.

8. The heat dissipation device according to any one of claims 1 to 5, characterized in that, The condenser also includes a heat exchanger, which is disposed on the side of the evaporator away from the heat-dissipating component, and part of the piping is coiled in the heat exchanger.

9. A computing device, characterized in that, It includes a component to be cooled and a heat dissipation device as described in any one of claims 1 to 8, wherein the base plate of the heat dissipation device is in contact with the component to be cooled.

10. The computing device according to claim 9, characterized in that, The computing device also includes peripheral devices located around the component to be scald. The heat exchanger of the condenser includes a first heat exchange section and a second heat exchange section connected to the first heat exchange section. A portion of the first heat exchange section is attached to the side of the evaporator away from the component to be scald. The second heat exchange section is located around the component to be scald and is offset from the peripheral devices.

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