Hollow metal fin structure

Abstract

The utility model discloses a hollow metal radiating fin structure, including two radiating fin bodies and memory strip, two radiating fin bodies cover respectively the front and back of memory strip, two radiating fin bodies install same connection component, the connection component includes hinged seat, hinged seat fixedly connected in one radiating fin body one end, another radiating fin body same end fixedly connected with connector, the connector is hinged in the hinged seat inside, two radiating fin bodies another end all fixedly connected with an extension rod, two extension rod interiors all are provided with recess, and one recess inside rotationally connected with screw rod, the screw rod outside thread connection has the screw bush, the utility model discloses a connection component is set up, makes two radiating fin bodies can be fixed on memory strip surface on the same time, also can when needing it its quick dismounting, will not influence the memory strip maintenance work's progress.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation structure technology, specifically a hollow metal heat sink structure. Background Technology

[0002] As electronic devices become increasingly miniaturized and highly integrated, their power density has exceeded 500W / cm². Traditional solid heat sinks, due to their long heat conduction paths and limited heat capacity, are no longer sufficient to meet the demands for efficient heat dissipation. Hollow structures, by optimizing heat flow paths and increasing the heat dissipation surface area, have become a key direction for improving heat dissipation efficiency.

[0003] A search revealed a utility model patent with Chinese patent publication number CN222260008U, which discloses a hollow thin-film metal heat sink, relating to the field of commercial memory module heat dissipation technology. This patent solves the technical problem of thick copper heat sinks having mediocre heat dissipation performance. The hollow thin-film metal heat sink includes a heat sink body made of metal material, which has a hollow, thin-walled structure with an internal heat dissipation cavity for the flow of high-pressure, high-speed cooling liquid.

[0004] The aforementioned device is used for cooling memory modules, so it needs to fit tightly against the surface of the memory modules. However, the structure lacks fixing components, so it can only be connected with adhesive, which will lead to inconvenience in disassembly and make it difficult to repair the memory modules. Utility Model Content

[0005] The purpose of this invention is to provide a hollow metal heat sink structure to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a hollow metal heat sink structure, comprising two heat sink bodies and a memory module, wherein the two heat sink bodies respectively cover the front and back of the memory module, and the two heat sink bodies are equipped with the same connecting component, the connecting component including a hinge, the hinge being fixedly connected to one end of one of the heat sink bodies, and a connector being fixedly connected to the same end of the other heat sink body, the connector being hinged inside the hinge, and an extension rod being fixedly connected to the other end of each of the two heat sink bodies, both extension rods having grooves inside, and a screw being rotatably connected inside one of the grooves, the screw being threadedly connected to a threaded sleeve, the threaded sleeve being inserted into the other groove, and the width of the end portion of the threaded sleeve being greater than the width of the groove of the extension rod.

[0007] This design allows the two heatsinks to be fixed to the surface of the memory module while also being able to be quickly removed when needed, without affecting memory module maintenance. The clearance groove inside the contact strip can fit over the chip, which helps ensure the fit between the heatsink and the memory module. Another heatsink is hinged to the outside of this heatsink via a hinge and connector. Then, the other heatsink is moved to fit against the back of the memory module. A screw is installed on the movable end of one of the heatsinks. The screw is then turned so that it moves closer to the other heatsink. The screw sleeve is then inserted into the extension rod. The screw sleeve is then turned so that its end moves closer to the limiting part, thus fixing the movable ends of the two heatsinks together and fixing the heat dissipation structure to the outside of the memory module.

[0008] As a further preferred embodiment of this technical solution, each of the two heat sink bodies is provided with a flow component. The flow component includes two liquid inlets opened inside the heat sink body. The two liquid inlets are respectively located on both sides of the heat sink body. A flow channel is opened in the middle of the heat sink body. The flow channel is wavy. The two liquid inlets are respectively connected to the two ends of the flow channel.

[0009] As a further preferred embodiment of this technical solution, the same connecting pipe is fixedly installed at the same end of the two heat sink bodies, and the two ends of the connecting pipe are respectively connected to two liquid inlets inside the two heat sink bodies, and the connecting pipe is made of a rectangular flexible tube.

[0010] The coolant enters the inlet through the opening in the heat sink body, then passes through the drainage channel, and then enters the connecting pipe from the inlet at the other end. Finally, it is discharged to the outside through the flow component inside another heat sink body, thus achieving circulation. Because the drainage channel is designed in a wave shape, this structure will disrupt the laminar flow state of the fluid and promote the fluid to generate turbulence. This can increase the contact area and contact time between the fluid and the surface of the heat sink, thereby enhancing heat exchange and improving the heat dissipation effect.

[0011] As a further preferred embodiment of this technical solution, a contact strip is fixedly connected to the outer wall of one end of the heat sink body near the memory module. The contact strip has several clearance slots inside, and the clearance slots correspond to the positions of several chips on the front of the memory module.

[0012] As a further preferred embodiment of this technical solution, one of the extension rods is provided with a limiting part at the end away from the heat sink body, and the limiting part is arc-shaped.

[0013] As a further preferred embodiment of this technical solution, the outer walls of the heat sink body and the contact strip at their closest points are both provided with a thermally conductive rubber layer.

[0014] As a further preferred embodiment of this technical solution, the two heat sink bodies are made of aluminum alloy.

[0015] This utility model provides a hollow metal heat sink structure, which has the following advantages:

[0016] (1) By setting a connecting component, the present invention enables two heat sink bodies to be fixed on the surface of the memory module, and can also be quickly disassembled when needed without affecting the maintenance of the memory module. The avoidance groove set inside the contact strip can be fitted on the outside of the chip, which helps to ensure the fit between the heat sink body and the memory module. Another heat sink body is hinged to the outside of this heat sink body through a hinge seat and a connector. Then, the other heat sink body is moved to fit against the back of the memory module. The screw is installed on the movable end of one of the heat sink bodies. Then, the screw is flipped to move closer to the other heat sink body. The screw sleeve outside the screw is then inserted into the extension rod. Then, the screw sleeve is twisted to move its end closer to the limiting part. The movable ends of the two heat sink bodies will be fixed together, and the heat dissipation structure will be fixed to the outside of the memory module.

[0017] (2) By setting up a flow component, the coolant enters the inlet through the opening of the heat sink body, then passes through the diversion groove, and then enters the connecting pipe from the inlet at the other end. Finally, it is discharged to the outside through the flow component inside another heat sink body, thus realizing circulation. Since the diversion groove is set in a wave shape, this structure will destroy the laminar flow state of the fluid and promote the fluid to generate turbulence, which can increase the contact area and contact time between the fluid and the surface of the heat sink, thereby strengthening heat exchange and improving the heat dissipation effect. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall first-view structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the overall second-view structure of this utility model;

[0020] Figure 3 This is a schematic diagram of the contact strip structure of this utility model;

[0021] Figure 4 This is a schematic diagram of the internal structure of the heat sink body of this utility model;

[0022] Figure 5 For the present utility model Figure 1 Enlarged structural diagram at point A in the middle;

[0023] In the diagram: 1. Heat sink body; 2. Connecting pipe; 3. Contact strip; 4. Clearance groove; 5. Memory module; 6. Connecting assembly; 7. Flow assembly; 601. Hinge; 602. Connector; 603. Extension rod; 604. Screw; 605. Screw sleeve; 606. Limiting part; 701. Liquid inlet; 702. Drainage groove. Detailed Implementation

[0024] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0025] This utility model provides a technical solution: such as Figure 2 and Figure 5 As shown in this embodiment, a hollow metal heat sink structure includes two heat sink bodies 1 and a memory module 5. The two heat sink bodies 1 cover the front and back of the memory module 5, respectively. The two heat sink bodies 1 are equipped with the same connecting component 6. The connecting component 6 includes a hinge 601, which is fixedly connected to one end of one of the heat sink bodies 1. A connector 602 is fixedly connected to the same end of the other heat sink body 1. The connector 602 is hinged inside the hinge 601. An extension rod 603 is fixedly connected to the other end of each of the two heat sink bodies 1. A groove is opened inside each of the two extension rods 603. A screw 604 is rotatably connected inside one of the grooves. A threaded sleeve 605 is threaded to the outside of the screw 604. The threaded sleeve 605 is inserted into the other groove, and the width of the end portion of the threaded sleeve 605 is greater than the width of the groove of the extension rod 603.

[0026] One heat sink body 1 is hinged to another heat sink body 1 via a hinge 601 and a connector 602. Then, the other heat sink body 1 is moved to fit against the back of the memory module 5. A screw 604 is installed on the movable end of one of the heat sink bodies 1. Then, the screw 604 is turned so that it moves closer to the other heat sink body 1. The screw sleeve 605 on the outside of the screw 604 is then inserted into the extension rod 603. The screw sleeve 605 is then twisted so that its end moves closer to the limiting part 606. The movable ends of the two heat sink bodies 1 are then fixed together, and the heat dissipation structure is fixed to the outside of the memory module 5.

[0027] like Figure 2 and Figure 4 As shown, each of the two heat sink bodies 1 is provided with a flow component 7. The flow component 7 includes two liquid inlets 701 opened inside the heat sink body 1. The two liquid inlets 701 are located on both sides of the heat sink body 1. A flow channel 702 is opened in the middle of the heat sink body 1. The flow channel 702 is wavy. The two liquid inlets 701 are connected to the two ends of the flow channel 702 respectively.

[0028] Two heat sink bodies 1 are fixedly installed with the same connecting pipe 2 at the same end. The two ends of the connecting pipe 2 are respectively connected to two liquid inlets 701 inside the two heat sink bodies 1, and the connecting pipe 2 is made of rectangular flexible tubing.

[0029] The coolant enters the inlet 701 through the opening of the heat sink body 1, then passes through the drainage channel 702, and then enters the connecting pipe 2 from the other end of the inlet 701. Finally, it is discharged to the outside through the flow component 7 inside another heat sink body 1, thus realizing circulation. Since the drainage channel 702 is wavy, this structure will disrupt the laminar flow state of the fluid and promote the fluid to generate turbulence, which can increase the contact area and contact time between the fluid and the surface of the heat sink, thereby enhancing heat exchange and improving the heat dissipation effect.

[0030] like Figure 3 As shown, a contact strip 3 is fixedly connected to the outer wall of one end of the heat sink body 1 near the memory module 5. Several clearance grooves 4 are provided inside the contact strip 3. The clearance grooves 4 correspond to the positions of several chips on the front of the memory module 5. The clearance grooves 4 inside the contact strip 3 can be fitted onto the outside of the chips, which helps to ensure the fit between the heat sink body 1 and the memory module 5.

[0031] like Figure 5 As shown, one of the extension rods 603 has a limiting part 606 at the end away from the heat sink body 1, and the limiting part 606 is arc-shaped. When the screw sleeve 605 contacts the limiting part 606, the limiting part 606 restricts the screw sleeve 605 from contacting the extension rod 603.

[0032] like Figure 1 As shown in Figure 2, the outer walls of the heat sink body 1 and the contact strip 3 at their closest points are provided with a thermally conductive rubber layer, which helps to improve the fit between the heat sink body 1 and the contact strip 3 and the memory module 5, and will not affect heat conduction too much.

[0033] like Figure 1 As shown in Figure 2, the two heat sink bodies 1 are made of aluminum alloy. This material can ensure the strength of the heat sink body 1 while reducing the overall strength of the structure.

[0034] This utility model provides a hollow metal heat sink structure, the specific working principle of which is as follows:

[0035] When the device is working, the heat sink body 1 with contact strip 3 is first covered on the outside of the memory module 5 to prevent the external chip of the memory module 5 from affecting the subsequent fixing process. The clearance groove 4 set inside the contact strip 3 can be fitted on the outside of the chip, which helps to ensure the fit between the heat sink body 1 and the memory module 5. Another heat sink body 1 is hinged to the outside of this heat sink body 1 through hinge 601 and connector 602. Then, the other heat sink body 1 is moved to fit against the back of the memory module 5. The screw 604 is installed on the movable end of one of the heat sink bodies 1. Then, the screw 604 is turned to move it closer to the other heat sink body 1. The screw sleeve 605 on the outside of the screw 604 is then inserted into the extension rod 603. Then, the screw sleeve 605 is twisted so that its end moves closer to the limiting part 606. The movable ends of the two heat sink bodies 1 are then fixed together, and the heat dissipation structure is fixed to the outside of the memory module 5. Next, the inlet and outlet pipes of the external water circulation device are respectively inserted into the two heat sink bodies 1 and fixed with bolts. When in operation, the coolant enters the inlet 701 through the opening of the heat sink body 1, then passes through the diversion channel 702, and then enters the connecting pipe 2 from the inlet 701 at the other end. Finally, it is discharged to the outside through the flow component 7 inside the other heat sink body 1, thus realizing circulation. Since the diversion channel 702 is wavy, this structure will disrupt the laminar flow state of the fluid and promote the fluid to generate turbulence, which can increase the contact area and contact time between the fluid and the heat sink surface, thereby enhancing heat exchange and improving the heat dissipation effect.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A hollow metal heat sink structure, comprising two heat sink bodies (1) and a memory module (5), characterized in that: Two heat sink bodies (1) cover the front and back of the memory module (5) respectively. The two heat sink bodies (1) are equipped with the same connecting component (6). The connecting component (6) includes a hinge (601). The hinge (601) is fixedly connected to one end of one of the heat sink bodies (1). The other heat sink body (1) is fixedly connected to the same end of a connector (602). The connector (602) is hinged inside the hinge (601). An extension rod (603) is fixedly connected to the other end of each of the two heat sink bodies (1). The two extension rods (603) are provided with grooves inside. A screw (604) is rotatably connected inside one of the grooves. A threaded sleeve (605) is threaded to the outside of the screw (604). The threaded sleeve (605) is inserted into the other groove. The width of the end of the threaded sleeve (605) is greater than the width of the groove of the extension rod (603).

2. The hollow metal heat sink structure according to claim 1, characterized in that: Both heat sink bodies (1) are provided with flow components (7). The flow components (7) include two liquid inlets (701) opened inside the heat sink body (1). The two liquid inlets (701) are located on both sides of the heat sink body (1). A flow channel (702) is opened in the middle of the heat sink body (1). The flow channel (702) is wavy. The two liquid inlets (701) are connected to both ends of the flow channel (702).

3. The hollow metal heat sink structure according to claim 2, characterized in that: The two heat sink bodies (1) are fixedly installed with the same connecting pipe (2) at the same end. The two ends of the connecting pipe (2) are respectively connected to the two liquid inlets (701) inside the two heat sink bodies (1), and the connecting pipe (2) is made of a rectangular flexible tube.

4. The hollow metal heat sink structure according to claim 1, characterized in that: One of the heat sink bodies (1) has a contact strip (3) fixedly connected to the outer wall of one end near the memory module (5). The contact strip (3) has several clearance slots (4) inside, and the clearance slots (4) correspond to the positions of several chips on the front of the memory module (5).

5. The hollow metal heat sink structure according to claim 1, characterized in that: One of the extension rods (603) has a limiting part (606) at one end away from the heat sink body (1), and the limiting part (606) is arc-shaped.

6. The hollow metal heat sink structure according to claim 1, characterized in that: The outer walls of the heat sink body (1) and the contact strip (3) at their closest points are both provided with a thermally conductive rubber layer.

7. The hollow metal heat sink structure according to claim 1, characterized in that: The two heat sink bodies (1) are made of aluminum alloy.

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