A heat dissipation structure for a fanless embedded computer

Abstract

The utility model discloses a kind of heat dissipation structure for fanless embedded computer, it is related to computer heat dissipation technical field, including frame, frame top is equipped with dust shield, frame outer side perimeter wall is equipped with heat dissipation fin, frame bottom is equipped with heat conduction plate, two pairs of heat conduction pipes are symmetrically welded on the heat conduction plate two side walls, one heat conduction pipe is equipped with suction pump, suction pump two ends are equipped with the connecting disc for connecting heat conduction pipe, frame bottom is equipped with the mounting plate for being connected with external device, the utility model is equipped with heat conduction plate, can be promptly from computer element transmission to heat dissipation part, avoid computer temperature excessively high due to heat accumulation;Through the setting of telescopic column, the flexibility and adaptability of heat dissipation structure installation can be increased, the problem that the heat dissipation structure installation adaptability is poor is solved, the application range of the heat dissipation structure is expanded, so that it can meet the needs of more different scenes;Through the setting of heat dissipation fin, the efficiency of fanless heat dissipation is improved.

Description

Technical Field

[0001] This utility model relates to the field of computer heat dissipation technology, and in particular to a heat dissipation structure for a fanless embedded computer. Background Technology

[0002] Embedded computers have been widely used in many fields such as industrial automation control, smart homes, medical equipment, and aerospace due to their significant advantages such as small size, stable performance, and low power consumption. These application scenarios place extremely high demands on the reliability, stability, and adaptability of embedded computers to the working environment, and heat dissipation has always been one of the key factors affecting the performance and lifespan of embedded computers.

[0003] Existing fanless cooling devices do not fully consider the internal layout and size specifications of different computers, making it difficult to adapt the cooling structure to diverse computer hardware during installation. This results in poor adaptability of the cooling structure installation, a single installation method, and a lack of flexible adjustment, thus failing to meet the needs of different scenarios and limiting its application scope. At the same time, some devices lack good thermal conductive components, resulting in low heat dissipation efficiency and an inability to dissipate the heat generated by the computer in a timely manner, leading to excessively high computer temperatures. Therefore, this application designs a fanless embedded computer cooling structure to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a fanless heat dissipation structure for embedded computers.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a fanless embedded computer heat dissipation structure, including a frame, a dust baffle plate at the top of the frame, heat dissipation fins installed on the outer peripheral wall of the frame, a heat-conducting plate at the bottom of the frame, two pairs of heat-conducting pipes symmetrically welded on the two side walls of the heat-conducting plate, a suction pump on one of the heat-conducting pipes, connecting plates for connecting the heat-conducting pipes at both ends of the suction pump, and an installation plate for connecting to external devices at the bottom of the frame.

[0006] Preferably, the top of the heat pipe is shaped like a square and connects to the inside of the frame, and a heat-conducting liquid flows inside the heat-conducting plate.

[0007] Preferably, the top surface of the dust baffle is provided with four screws, and the frame and the dust baffle are fixed by the screws.

[0008] Preferably, the mounting plate is provided with bolts for fixing to external equipment.

[0009] Preferably, four telescopic columns are fixed to the outer wall of the mounting plate, and the protruding ends of the four telescopic columns are provided with pins. The telescopic columns are fixed to the side wall at the bottom of the frame by the pins, and one end of the pin is provided with a knob cap.

[0010] Preferably, the telescopic column is provided with a positioning pin for fixing the adjustable position of the telescopic column.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: In this utility model, the combination of heat pipe and suction pump enables the circulation of heat transfer fluid, solving the problems of low heat dissipation efficiency and poor stability in fanless cooling methods, and preventing the computer from overheating due to heat accumulation; the combination of telescopic column and pin increases the flexibility and adaptability of the heat dissipation structure installation, solving the problem of poor adaptability of the heat dissipation structure installation, expanding the application range of the heat dissipation structure, and enabling it to meet the needs of more different scenarios; the setting of heat conduction plate enables timely transfer from computer components to heat dissipation parts; the setting of heat dissipation fins improves the efficiency of fanless cooling, solving the shortcomings of fanless cooling methods in terms of heat dissipation speed. Attached Figure Description

[0012] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the overall first-view structure proposed in this utility model; Figure 2 This is a schematic diagram of the overall second-view structure proposed in this utility model; Figure 3 This is a schematic diagram of the internal structure proposed in this utility model; Figure 4 This is a schematic diagram of some of the parts proposed in this utility model.

[0013] The numbers in the diagram are: 1. Frame; 2. Heat dissipation fins; 3. Dust baffle; 4. Mounting plate; 5. Heat pipe; 6. Heat conduction plate; 7. Suction pump; 8. Connecting plate; 9. Telescopic column; 10. Pin; 11. Positioning pin; 12. Knob cap; 13. Screw; 14. Bolt. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0015] Example: See Figure 1-4This utility model discloses a fanless embedded computer heat dissipation structure, including a frame 1. A dust baffle 3 is provided at the top of the frame 1, which reduces the failure rate caused by dust contamination, improves the reliability and stability of the computer, and reduces maintenance costs and frequency. Heat dissipation fins 2 are installed on the outer peripheral wall of the frame 1, which improves heat dissipation efficiency and avoids problems such as performance degradation and hardware damage caused by overheating. A heat-conducting plate 6 is provided at the bottom of the frame 1, which facilitates heat transfer to the heat dissipation fins 2. Working in conjunction with heat pipes 5, it forms a highly efficient heat dissipation system, effectively... The temperature of the embedded computer is reduced; two pairs of heat pipes 5 are symmetrically welded on both sides of the heat-conducting plate 6, and a suction pump 7 is provided on one heat pipe 5. The suction pump 7 facilitates the normal circulation of the heat transfer fluid, maintains the efficient operation of the heat dissipation system, and ensures that heat can be removed in a timely and continuous manner, thereby improving the stability of the heat dissipation effect; the suction pump 7 has connecting plates 8 at both ends for connecting the heat pipes 5, and the bottom of the frame 1 has a mounting plate 4 for connecting with external devices. The mounting plate 4 facilitates the firm connection between the heat dissipation structure and the external devices, ensuring that the heat dissipation structure will not shake or shift during operation, and ensuring the normal operation of the heat dissipation system.

[0016] In this invention, the top of the heat pipe 5 is connected to the interior of the frame 1 in a U-shape. A heat-conducting liquid flows inside the heat-conducting plate 6, facilitating heat transfer to the heat dissipation fins 2. Four screws 13 are provided on the top surface of the dust baffle 3, and the frame 1 and dust baffle 3 are fixed together by these screws. Bolts 14 are provided on the mounting plate 4 for fixing to external equipment, ensuring reliable connection between the heat dissipation structure and the external equipment. Four telescopic columns 9 are fixed to the outer wall of the mounting plate 4, with pins 10 at their extended ends. The telescopic columns 9 are fixed to the bottom side wall of the frame 1 by these pins. One end of each pin 10 has a knob cap 12. The telescopic columns 9 increase the flexibility and adaptability of the heat dissipation structure installation, allowing for better matching and installation with different external equipment, thus improving the product's versatility. Positioning pins 11 are provided on the telescopic columns 9 for fixing their adjusted positions, ensuring the stability of the adjusted position and guaranteeing the accuracy and stability of the heat dissipation structure installation.

[0017] Working Principle: In use, the user mounting plate 4 is first located at the bottom of the frame 1 and fixedly connected to the external device by bolts 14, thus installing the entire heat dissipation structure. Simultaneously, the dust baffle 3 is placed at the top of the frame 1 and fixed to the frame 1 by screws 13, blocking dust and debris from entering the frame 1 and preventing dust accumulation on computer components and heat dissipation parts. Then, during the operation of the embedded computer, the internal electronic components generate heat. This heat is conducted to the interior of the heat dissipation plate 6 through the contact between the electronic components and the heat dissipation plate 6. In the heat transfer fluid, a suction pump 7 is then installed on a heat transfer pipe 5, which is tightly connected to the heat transfer pipe 5 through connecting plates 8 at both ends. The suction pump 7 starts working, providing power for the circulation of the heat transfer fluid. Under the action of the suction pump 7, the heat transfer fluid that has absorbed heat flows from the heat transfer plate 6 at the bottom of the frame 1 to the heat transfer pipe 5. When the heat-carrying heat transfer fluid flows through the heat transfer pipe 5, it will conduct heat to the heat dissipation fins 2. The heat dissipation fins 2 have a large surface area and are in full contact with the surrounding air for efficient heat dissipation. This concludes the use of a fanless embedded computer heat dissipation structure.

[0018] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A heat dissipation structure for a fanless embedded computer, comprising a frame (1), characterized in that: The frame (1) is provided with a dust baffle (3) at the top, heat dissipation fins (2) are installed on the outer peripheral wall of the frame (1), a heat conduction plate (6) is provided at the bottom of the frame (1), two pairs of heat conduction pipes (5) are symmetrically welded on the two side walls of the heat conduction plate (6), a suction pump (7) is provided on one of the heat conduction pipes (5), and a connecting plate (8) for connecting the heat conduction pipe (5) is provided at both ends of the suction pump (7). The frame (1) is provided with a mounting plate (4) for connecting with external equipment at the bottom. Four telescopic columns (9) are fixed to the outer wall of the mounting plate (4). The extended ends of the four telescopic columns (9) are provided with pins (10). The telescopic columns (9) are fixed to the side wall at the bottom of the frame (1) by the pins (10). One end of the pins (10) is provided with a knob cap (12).

2. The heat dissipation structure for a fanless embedded computer according to claim 1, characterized in that: The top of the heat pipe (5) is connected to the inside of the frame (1) in a square shape, and the heat-conducting liquid flows inside the heat-conducting plate (6).

3. The heat dissipation structure for a fanless embedded computer according to claim 1, characterized in that: The top surface of the dust baffle (3) is provided with four screws (13), and the frame (1) and the dust baffle (3) are fixed by the screws (13).

4. The heat dissipation structure for a fanless embedded computer according to claim 1, characterized in that: The mounting plate (4) is provided with bolts (14) for fixing to external equipment.

5. The heat dissipation structure for a fanless embedded computer according to claim 1, characterized in that: The telescopic column (9) is provided with a positioning pin (11) for fixing the adjustment position of the telescopic column (9).

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