A display device and a notebook computer

Abstract

The utility model discloses a kind of display device and notebook computer, and the display device of one embodiment includes display panel, heat dissipation part and the heat dissipation hole being set on display device shell, wherein, the display panel includes display screen and the heat conduction sheet being set in the side of the display screen and for exporting heat;The heat dissipation part includes multiple piezoelectric jet heat dissipation devices of array arrangement, and the piezoelectric jet heat dissipation device includes the air outlet hole towards the heat conduction sheet.The display device provided by the utility model through multiple piezoelectric jet heat dissipation devices being set in heat dissipation part, the air outlet hole of piezoelectric jet heat dissipation device is towards the heat conduction sheet of display panel, heat exchange occurs in heat conduction sheet position, to effectively improve the heat dissipation performance of display device.In the embodiment of notebook computer, the heat dissipation performance of notebook computer is effectively improved by multiple heat dissipation devices being set below display screen, while saving internal space, with practical application value.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to a display device and a laptop computer. Background Technology

[0002] As the performance of consumer electronics products gradually improves, so too does their power consumption, resulting in increased computing power and display quality. This leads to the problem of heat dissipation, as the majority of energy consumption is ultimately dissipated as heat. However, given the limited size of consumer electronics products and the fixed heat dissipation area, improving heat dissipation performance and optimizing the internal space of laptops have become pressing technical challenges in this field. Utility Model Content

[0003] To address at least one of the aforementioned problems, a first embodiment of the present invention provides a display device, including a display panel, a heat dissipation unit, and heat dissipation holes disposed on a housing of the display device, wherein...

[0004] The display panel includes a display screen and a heat-conducting sheet disposed on one side of the display screen for dissipating heat;

[0005] The heat dissipation section includes multiple piezoelectric jet heat dissipation devices arranged in an array, and each piezoelectric jet heat dissipation device includes an air outlet facing the heat-conducting plate.

[0006] For example, in some embodiments of the present application, the display panel includes a control unit disposed on the display screen away from the light-emitting side, and a heat pipe for conducting the heat generated by the control unit to the heat-conducting sheet;

[0007] In a direction perpendicular to the light emission direction of the display screen, the heat-conducting sheet is disposed on one side of the display screen, and the heat dissipation part is disposed on the side of the heat-conducting sheet away from the control unit. The lateral width of the heat dissipation part is greater than the thickness of the display screen, the lateral width of the heat dissipation part is greater than the thickness of the control unit, and the lateral width of the heat dissipation part is less than or equal to the thickness of the display panel.

[0008] The heat dissipation unit and the display panel are integrated into one unit.

[0009] For example, in some embodiments of the display device provided in this application, the display device further includes a connecting shaft connecting the display panel and the heat sink.

[0010] The display panel includes a control unit disposed on the side of the display screen away from the light-emitting side, a heat pipe for conducting the heat generated by the control unit to the heat-conducting sheet, and an air inlet hole disposed on the display panel housing corresponding to the heat-conducting sheet;

[0011] The heat dissipation unit is located on the side of the heat-conducting plate away from the control unit, and the heat dissipation unit and the display panel are separate units.

[0012] For example, in some embodiments of the display device provided in this application, the heat dissipation part is driven by the connecting shaft, and the angle formed between the connecting shaft and the display panel is greater than or equal to a first threshold.

[0013] For example, in some embodiments of the display device provided in this application, the piezoelectric jet heat dissipation device includes:

[0014] Vibrating substrate;

[0015] A microcavity structure is disposed on one side of the vibration substrate, the vibration substrate and the microcavity structure enclose the microcavity to form a microcavity, and one side surface of the microcavity structure includes at least one air outlet hole;

[0016] A piezoelectric structure is disposed on the side of the vibrating substrate opposite to the microcavity structure.

[0017] For example, in some embodiments of the display device provided in this application, the distance between the air outlet of the piezoelectric jet heat dissipation device and the heat-conducting sheet is greater than or equal to a third threshold.

[0018] A second embodiment of this utility model provides a laptop computer, including a display enclosure and a main unit enclosure connected to the display enclosure via a hinge, wherein:

[0019] The display cabinet includes a display screen and multiple heat dissipation devices arranged in an array near the edge of the display screen on the side of the rotating shaft.

[0020] The main unit chassis includes a keyboard front and a back side arranged opposite to each other, four opposite sides connecting the keyboard front and the back side, and heat dissipation fins disposed therein;

[0021] The heat dissipation device includes an air outlet facing the heat dissipation fins, and the first side of the four sides closest to the air outlet includes an air inlet corresponding to the air outlet. The main unit chassis also includes a heat dissipation outlet.

[0022] For example, in some embodiments of the laptop provided in this application, the hinge includes a first hinge and a second hinge for connecting the display housing and the main unit housing. The first hinge and the second hinge are respectively disposed at positions near the edges of the display housing and the main unit housing extending in the width direction. The first hinge and the second hinge each include a first axle plate disposed inside the display housing and used to drive the display housing, and a second axle plate disposed inside the main unit housing and used to drive the main unit housing.

[0023] When the display cabinet and the host cabinet are folded, the plurality of heat dissipation devices are located between the first shaft plate of the first rotating shaft and the first shaft plate of the second rotating shaft, and the air inlet is located between the second shaft plate of the first rotating shaft and the second shaft plate of the second rotating shaft.

[0024] For example, in some embodiments of the laptop provided in this application, the first hinge and the second hinge further include a third axle plate disposed inside the display cabinet, and the maximum unfolding angle between the third axle plate and the corresponding second axle plate is less than or equal to a second threshold.

[0025] The display cabinet also includes a limiting plate disposed on the third shaft plate of the first rotating shaft and the third shaft plate of the second rotating shaft, the plurality of heat dissipation devices are disposed on the limiting plate, and the air outlet is perpendicular to the limiting plate.

[0026] For example, in some embodiments of the laptop provided in this application, the heat dissipation device is a blade fan or a piezoelectric fan.

[0027] For example, in some embodiments of the laptop provided in this application, the piezoelectric fan is a piezoelectric jet heat dissipation device, including:

[0028] Vibrating substrate;

[0029] A microcavity structure is disposed on one side of the vibration substrate, the vibration substrate and the microcavity structure enclose the microcavity to form a microcavity, and one air outlet is included on one side surface of the microcavity structure;

[0030] A piezoelectric structure is disposed on the side of the vibrating substrate opposite to the microcavity structure.

[0031] For example, in some embodiments of the laptop provided in this application, the heat dissipation fins are disposed on the side of the host chassis near the air inlet, and the distance between the air outlet of the piezoelectric jet heat dissipation device and the heat dissipation fins is greater than or equal to a third threshold.

[0032] For example, in some embodiments of the laptop provided in this application, the air inlet is a grille-shaped opening, including a plurality of first grille bars and a first opening formed by each of the first grille bars;

[0033] When the display cabinet and the main unit cabinet are folded, the orthographic projection of the air outlet on the first side falls into the orthographic projection of the first opening on the first side.

[0034] For example, in some embodiments of the laptop provided in this application, the display enclosure further includes sound-absorbing sponge disposed on one side of the air outlet.

[0035] For example, in some embodiments of the laptop provided in this application, the host chassis also includes a host and a heat pipe, the heat pipe being used to conduct the heat of the host to the heat dissipation fins;

[0036] The heat dissipation outlet includes a first heat dissipation outlet disposed on the back side and arranged in an array, the first heat dissipation outlet being disposed on the side of the heat dissipation fins away from the air inlet.

[0037] For example, in some embodiments of the laptop provided in this application, the four sides further include a second side and a third side disposed opposite to each other, and the heat dissipation outlets further include second heat dissipation outlets disposed on the second side and the third side.

[0038] The second heat dissipation outlet is a grid-shaped opening, including multiple second grid bars and a second opening formed by each second grid bar.

[0039] For example, in some embodiments of the laptop provided in this application, the keyboard surface includes a keyboard, and the heat dissipation outlet further includes a third heat dissipation outlet disposed on the keyboard surface.

[0040] In the horizontal direction of the keyboard, the third heat dissipation outlet is located on both sides of the keyboard.

[0041] For example, in some embodiments of the laptop provided in this application, the keyboard surface further includes speaker outlets disposed on both sides of the keyboard.

[0042] The speaker outlet is reused as the third heat dissipation outlet.

[0043] For example, in some embodiments of the laptop provided in this application, the host chassis also includes a host and a heat pipe, the heat pipe being used to conduct the heat of the host to the heat dissipation fins;

[0044] The heat dissipation outlet is composed of a fourth heat dissipation outlet arranged in an array on the back side, and the fourth heat dissipation outlet is located on the side of the heat dissipation fins away from the air inlet.

[0045] The main unit chassis also includes a heat insulation ring surrounding the fourth heat dissipation outlet. One side of the heat insulation ring is connected to the keyboard surface, and the other side of the heat insulation ring is connected to the back surface.

[0046] The beneficial effects of this utility model are as follows:

[0047] This invention addresses existing problems by providing a display device and a laptop computer. One embodiment of the display device utilizes multiple piezoelectric jet heat dissipation devices in its heat dissipation section. The air outlets of these devices face the heat-conducting fins of the display panel, allowing heat exchange to occur at the fins, thus effectively improving the heat dissipation performance of the display device. Specifically, considering the current heat dissipation problems and space optimization difficulties in laptops, one embodiment of the laptop computer uses multiple heat dissipation devices positioned near the hinge edge of the display screen within the display housing. The air outlets of these devices face the heat dissipation fins located within the main unit housing. Airflow from the heat dissipation devices is transmitted to the heat dissipation fins via air inlets on the corresponding side of the air outlets on the main unit housing. Heat exchange occurs at the heat dissipation fins, and the hot air is then exhausted through heat dissipation outlets on the main unit housing, effectively improving the laptop's heat dissipation performance. This embodiment also improves heat dissipation performance by placing the heat dissipation devices below the display screen, allowing the airflow to blow directly into the laptop. This forms a heat dissipation architecture based on heat dissipation devices—air outlets—air inlets—heat dissipation fins, ensuring heat dissipation performance while saving internal space in the laptop, improving product performance and user experience. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 This diagram shows a structural frame of the display device according to an embodiment of the present invention;

[0050] Figure 2a This diagram shows a top view of the display device according to an embodiment of the present invention.

[0051] Figure 2b This diagram shows a side view of the display device according to an embodiment of the present invention.

[0052] Figure 3a This diagram shows a top view of the display device according to another embodiment of the present invention.

[0053] Figure 3b This diagram shows a side view of the display device according to another embodiment of the present invention.

[0054] Figure 4 A schematic diagram illustrating heat dissipation in a laptop computer in the prior art is shown;

[0055] Figure 5This diagram illustrates the structure of a laptop computer according to one embodiment of the present invention.

[0056] Figure 6 This is a side view of a laptop computer in an unfolded state according to an embodiment of the present invention.

[0057] Figure 7 This is a top view of the laptop computer in a flattened state according to an embodiment of the present invention;

[0058] Figure 8 This diagram shows a structural schematic of the second side of the main unit casing of a laptop computer according to an embodiment of the present invention.

[0059] Figure 9 This diagram shows a structural schematic of the first side of the main unit casing of a laptop computer according to an embodiment of the present invention.

[0060] Figure 10 This diagram shows a schematic rear view of the main unit casing of a laptop computer according to an embodiment of the present invention.

[0061] Figure 11 This diagram illustrates the heat dissipation of the main unit casing of a laptop computer according to one embodiment of the present invention.

[0062] Figure 12 A partial structural schematic diagram of a laptop computer in its unfolded state according to an embodiment of the present invention is shown.

[0063] Figures 13a-13b A schematic diagram of the structure of the third shaft piece of the laptop's hinge according to an embodiment of the present invention is shown;

[0064] Figure 14 A schematic diagram showing the heat dissipation of the main unit casing of a laptop computer according to another embodiment of the present invention is shown;

[0065] Figure 15 This diagram shows a structural schematic of a piezoelectric jet heat dissipation device according to an embodiment of the present invention;

[0066] Figure 16 This diagram shows a top view of the main unit casing of a laptop computer according to an embodiment of the present invention. Detailed Implementation

[0067] To more clearly illustrate this utility model, the preferred embodiments and accompanying drawings will be used for further description. Similar components in the drawings are indicated by the same reference numerals. Those skilled in the art should understand that the specific description below is illustrative rather than restrictive and should not be construed as limiting the scope of protection of this utility model.

[0068] In related technologies, considering the limitations of product size, with a constant heat dissipation area, removing more heat can only be achieved through increasing the heat transfer coefficient and improving the temperature difference. However, increasing the temperature difference leads to an increase in the product's own temperature, which will seriously affect its lifespan. The heat generated by the CPU in the product first raises its own temperature. When the temperature rises, it creates a temperature difference with other surrounding components. This temperature difference acts as a driving force for heat conduction, causing heat flow. This heat flow further raises the temperature of other components, and so on, until it reaches the surface in contact with the outside air. When the surrounding air is still, the heat transfer coefficient is typically maintained at 5 W / m². 2 *k. If the temperature difference between the surface and the air is not large enough, it will be insufficient to transfer all the heat generated by the CPU. Heat will accumulate, further increasing the surface temperature. This increase in surface temperature leads to a decrease in the temperature difference between the CPU and the surface, and thermal conductivity will also be insufficient to transfer enough heat. The CPU's heat will continue to accumulate, causing its temperature to rise further until the temperature difference meets the heat flow requirement, balancing the heat generated and dissipated, at which point the temperature increase will stop. However, the efficiency and lifespan of the semiconductor materials used in CPUs decrease at high temperatures. Chip manufacturers typically prevent high CPU temperatures by reducing computing power (reducing power consumption and heat generation). Since the internal thermal conductivity is already very high, the main limitation comes from heat exchange with the air, much like the final tap in a water pipe. Therefore, improving the heat transfer coefficient becomes the primary convection cooling solution.

[0069] Currently, the mainstream solution to improve convective heat transfer efficiency is air cooling, which uses fans to dissipate heat. However, in many cases, such as mobile phones and televisions, noise and size constraints prevent the use of fans. Currently, mobile phones rarely use fans, and the use of fans in laptops depends primarily on their positioning; generally, the thinnest fans in thin and light laptops are only 4mm thick. Centrifugal fans, in conjunction with fins, work by transferring heat from the CPU via heat pipes, using fins to increase the heat dissipation area, and then using the centrifugal fan to draw in external air for heat exchange before blowing the hot air out.

[0070] Piezoelectric jet technology primarily utilizes the inverse piezoelectric effect of piezoelectric materials. High-frequency alternating current causes the piezoelectric material to reciprocate with a substrate, periodically compressing the air within a microcavity below, creating periodic high pressure. This high-pressure gas is then expelled through a small outlet hole, forming a jet. Due to the high velocity of the jet, turbulence is created in the flow area, thinning the boundary layer and significantly increasing heat transfer. Therefore, at the same flow rate, jet cooling is superior to the laminar flow of traditional fans. Another advantage of piezoelectric jets lies in their wind-generating mechanism. Traditional centrifugal fans rely on the rotation of a fan, which limits their space. For piezoelectric fans, this component that converts electrical energy into mechanical energy becomes planar, further reducing its size.

[0071] The principle of synthetic jets is to periodically blow fluid out and draw it into an excitation chamber, inducing the formation of a series of vortex rings or vortex pairs outside the orifice or slit. During their formation and downstream convection, the vortex rings or vortex pairs continuously entrain surrounding fluid through induction, thereby controlling the flow field. Because the net mass flow rate delivered to the external flow field is zero throughout the entire working cycle, it is also called a zero-mass jet. Therefore, in order to form external vortex rings, if the outlet is too close to the heat source requiring cooling, it will prevent the formation of good vortex rings, resulting in a decrease in jet performance. The optimal distance is to maintain the formation of external vortex rings while minimizing airflow attenuation.

[0072] In response to the above situation, such as Figure 1 As shown, one embodiment of the present invention provides a display device, including a display panel, a heat dissipation unit, and heat dissipation holes disposed on the housing of the display device, wherein...

[0073] The display panel includes a display screen and a heat-conducting sheet disposed on one side of the display screen for dissipating heat;

[0074] The heat dissipation section includes multiple piezoelectric jet heat dissipation devices arranged in an array, and each piezoelectric jet heat dissipation device includes an air outlet facing the heat-conducting plate.

[0075] In this embodiment, addressing the internal space and structural design of the display device, as well as its heat dissipation, the display device utilizes multiple piezoelectric jet heat dissipation devices installed in the heat dissipation section. The air outlets of these devices are directed towards the heat-conducting sheet of the display panel, allowing heat exchange to occur at the heat-conducting sheet location. This effectively improves the heat dissipation performance of the display device, optimizes space utilization, and enhances the appearance and user experience. The display device can be any product or component with a display function, such as a smartphone, tablet, television, monitor, laptop, digital photo frame, or navigator.

[0076] In a specific embodiment, such as Figures 2a-2bAs shown, the display device 1000 includes a heat dissipation unit 1100 and a display panel 1200. The display panel 1200 includes a control unit 1202 disposed on the display screen 1201 away from the light-emitting side, and a heat pipe 1203 for conducting the heat generated by the control unit 1202 to the heat-conducting sheet 1204.

[0077] In a direction perpendicular to the light emission direction of the display screen 1201, the heat-conducting sheet 1204 is disposed on one side of the display screen 1201, and the heat dissipation part 1100 is disposed on the side of the heat-conducting sheet 1204 away from the control unit 1202. The lateral width of the heat dissipation part 1100 is greater than the thickness of the display screen 1201 and the lateral width of the heat dissipation part 1100 is greater than the thickness of the control unit 1202. The lateral width of the heat dissipation part 1100 is less than or equal to the thickness of the display panel 1200.

[0078] The heat dissipation unit 1100 and the display panel 1200 are integrated into one unit.

[0079] In this embodiment, Figure 2a This is a top view of the display device 1000. The dashed lines represent components that cannot be directly seen from above. For example, the display screen 1201 of the display panel 1100 is a directly visible component. The control unit 1202, heat pipe 1203, and heat-conducting plate 1204 are located on the side of the display screen 1201 away from the light-emitting side, i.e., they are located on the back of the display screen 1201. The display panel 1200 contains the control unit 1202 for display and calculation. The control unit generates heat during operation and is the main power consumption unit and heat source of the display device. The heat dissipation unit 1100 includes a piezoelectric jet heat dissipation device 1001, which includes heat dissipation holes 1002. Figure 2bThis is a side view of the display device 1000. In this embodiment, the display panel and the heat sink are an integrated structure, meaning they are encapsulated within the housing of the display device. Specifically, considering the structure and space occupancy of the display panel, as well as the size and air outlet position of the piezoelectric jet heat sink, the lateral width of the heat sink is greater than the thickness of the display screen, greater than the thickness of the control unit, and less than or equal to the thickness of the display panel. In other words, the lateral width of the heat sink with the piezoelectric jet heat sink is greater than the thickness of the display screen and the control unit, respectively, but close to the thickness of the display panel. This embodiment places the heat sink at the head or tail of the display device, i.e., on one side of the display panel, and aligns the air outlet of the piezoelectric jet heat sink with the heat-conducting sheet of the display panel. This allows the piezoelectric jet heat sink to blow air directly onto the heat-conducting sheet in a straight line or similar direction, enabling heat exchange on the heat-conducting sheet and discharging the hot air through the heat dissipation holes on the display device housing. This embodiment ensures the heat dissipation performance of the display device by using a piezoelectric jet heat dissipation device, optimizes the space of the display device, and improves the appearance and user experience of the display device.

[0080] Furthermore, such as Figure 15 As shown, the piezoelectric jet heat dissipation device includes:

[0081] Vibrating substrate 121;

[0082] A microcavity structure is disposed on one side of the vibration substrate 121, and the vibration substrate 121 and the microcavity structure enclose a microcavity 123. One side surface of the microcavity structure includes at least one air outlet 124.

[0083] A piezoelectric structure 122 is disposed on the side of the vibrating substrate 121 opposite to the microcavity structure.

[0084] In this embodiment, the piezoelectric jet heat dissipation device includes: a vibrating substrate 121, which has deformation capability and is configured to vibrate under voltage; a microcavity structure disposed on one side of the vibrating substrate 121, including a base plate 1232 and a side plate 1231, wherein the base plate 1232 is disposed opposite to the vibrating substrate 121, the side plate 1231 is disposed between the base plate 1232 and the vibrating substrate 121, and at least one opening 124 is disposed on the base plate 1232 or the side plate 1231. The vibrating substrate 121 and the microcavity structure enclose a microcavity 123. At least one side surface of the microcavity structure includes at least one opening 124. The opening 124 is used to form a high-speed jet to carry away heat and introduce surrounding fluid into the microcavity 123 through the entrainment effect to form a secondary flow, thereby enhancing the heat dissipation effect. The first piezoelectric structure 122 is disposed on the side of the vibrating substrate 121 away from the microcavity structure. The first piezoelectric structure 122 is used to provide a driving voltage to the vibrating substrate 121 to drive the vibrating substrate 121 to vibrate, so that the microcavity structure forms a jet at the opening 124.

[0085] When the piezoelectric jet heat dissipation device of this embodiment is working, an airflow of more than 10 m / s is continuously generated at the opening 124. After the airflow flows out, it entrains the surrounding fluid, forming a highly efficient heat dissipation effect. While the jet is continuously output, external fluid is continuously replenished into the microcavity from the side of the orifice. That is, the piezoelectric jet heat dissipation device induces a series of vortex rings or vortex pairs outside the opening by periodically blowing out and sucking the airflow into the microcavity. During the formation of the vortex rings or vortex pairs and their downstream convection, they continuously entrain the surrounding fluid through induction, thereby controlling the flow field. Because the net mass flow rate delivered to the external flow field in this embodiment is zero throughout the entire working cycle, the piezoelectric jet heat dissipation device is also called a zero-mass jet.

[0086] In a specific embodiment, such as Figure 2a As shown, the distance between the air outlet 1002 of the piezoelectric jet heat dissipation device 1001 and the heat-conducting plate 1204 is greater than or equal to the third threshold.

[0087] In this embodiment, considering the placement of the piezoelectric jet heat sink, the positions of the air outlet and the heat-conducting plate, and the airflow mechanism of the piezoelectric jet heat sink, the distance between the air outlet and the heat-conducting plate is limited to achieve optimal heat dissipation. Specifically, to ensure the piezoelectric jet heat sink has optimal jetting effect and can form an ideal vortex ring, the distance d between the heat-conducting plate and the air outlet of the piezoelectric jet heat sink is set to be greater than or equal to 5mm, thereby effectively avoiding airflow attenuation.

[0088] In another alternative embodiment, such as Figures 3a-3bAs shown, the display device 1000 includes a heat dissipation unit 1100 and a display panel 1200. The display device also includes a connecting shaft 1300 connecting the display panel 1200 and the heat dissipation unit 1100.

[0089] The display panel 1200 includes a control unit 1202 disposed on the display screen 1201 away from the light-emitting side, a heat pipe 1203 for conducting the heat generated by the control unit 1202 to the heat-conducting sheet 1204, and an air inlet (not shown in the figure) disposed on the housing of the display panel 1200 corresponding to the heat-conducting sheet 1204.

[0090] The heat dissipation unit 1100 is located on the side of the heat-conducting plate 1204 away from the control unit, and the heat dissipation unit 1100 and the display panel 1200 are separate units.

[0091] In this embodiment, Figure 3a This is a top view of the display device 1000. The dashed lines represent components that cannot be directly seen from above. For example, the display screen 1201 of the display panel 1100 is a directly visible component. The control unit 1202, heat pipe 1203, and heat-conducting plate 1204 are located on the side of the display screen 1201 away from the light-emitting side, i.e., they are located on the back of the display screen 1201. The display panel 1200 contains the control unit 1202 for display and calculation. The control unit generates heat during operation and is the main power consumption unit and heat source of the display device. The heat dissipation unit 1100 includes a piezoelectric jet heat dissipation device 1001, which includes heat dissipation holes 1002. Figure 3b This is a side view of the display device 1000. In this embodiment, the display panel and the heat sink are separate structures; that is, the display panel and the heat sink are two independent components whose positions change via a connecting shaft 1300. One end of the connecting shaft is fixed to the display panel, and the other end is fixed to the heat sink. The heat sink is driven by the connecting shaft and moves within a certain range around the display panel. This embodiment addresses the structure and space occupancy of the display panel, as well as the size and outlet position of the piezoelectric jet heat sink. By placing the heat sink at the head or tail of one side of the display panel and aligning the outlet of the piezoelectric jet heat sink with the heat-conducting sheet of the display panel, the piezoelectric jet heat sink directs air from the outlet in a straight line or similar direction onto the heat-conducting sheet, enabling heat exchange on the sheet. The resulting hot air is then discharged through the heat dissipation holes on the display panel housing. This embodiment ensures the heat dissipation performance of the display device by employing a piezoelectric jet heat sink, optimizes the space of the display device, and improves the appearance and user experience of the display device.

[0092] The structure of the piezoelectric jet heat sink in this embodiment is as follows: Figure 15As shown, the specific structure and working principle are described in the aforementioned embodiments and will not be repeated here.

[0093] In a specific embodiment, such as Figure 3a As shown, the distance between the air outlet 1002 of the piezoelectric jet heat dissipation device 1001 and the heat-conducting plate 1204 is greater than or equal to the third threshold.

[0094] In this embodiment, considering the placement of the piezoelectric jet heat sink, the positions of the air outlet and the heat-conducting plate, and the airflow mechanism of the piezoelectric jet heat sink, the distance between the air outlet and the heat-conducting plate is limited to achieve optimal heat dissipation. Specifically, to ensure the piezoelectric jet heat sink has optimal jetting effect and can form an ideal vortex ring, the distance d between the heat-conducting plate and the air outlet of the piezoelectric jet heat sink is set to be greater than or equal to 5mm, thereby effectively avoiding airflow attenuation.

[0095] Meanwhile, to ensure the heat dissipation effect of the display device, in an optional embodiment, the heat dissipation part is driven by the connecting shaft, and the angle formed between the connecting shaft and the display panel is greater than or equal to a first threshold.

[0096] In this embodiment, as Figure 3b As shown, the heat sink is driven by a connecting shaft and moves relative to the display panel. To ensure that the airflow from the piezoelectric jet heat sink blows directly onto the heat-conducting fins of the display panel, the heat sink and the display panel are limited to a vertical or nearly vertical position, meaning the angle θ formed between the connecting shaft and the display panel is greater than or equal to 75 degrees. Figure 3b The angle between the piezoelectric jet heat sink and the right side is greater than or equal to 75 degrees, and the angle between the piezoelectric jet heat sink and the left side is also greater than or equal to 75 degrees. That is, it moves at ±15 degrees in the vertical direction to ensure that the piezoelectric jet heat sink is in the best heat dissipation position.

[0097] In the laptop industry, heat dissipation is typically achieved using the space on the keyboard side. However, natural convection heat transfer has low efficiency, and conventional fans are limited by size and noise. With the market's increasing demand for thinner and lighter laptops, how to save space and improve heat dissipation performance has become a research hotspot for those skilled in the art. Figure 4 The image shown is a top view of a laptop keyboard section in the related art, including a hinge 030 and a keyboard section 020. The keyboard section 020 includes a keyboard 021 and a touch area 022. A cooling fan is provided on the back of the keyboard section, such as the cooling fan 023 shown in the dashed box. Specifically, in this embodiment, the size of the cooling fan is 50mm×30mm×5mm to 70mm×40mm×8mm, with a volume of about 15-22 cubic centimeters, while the volume of the keyboard housing (including the keyboard and the supporting structure below) is generally 800-1500 cubic centimeters, and the fan volume accounts for about 1.5%-3%.

[0098] In one related technology, heat exchange performance is improved by changing the airflow direction. For example, the air inlet enters from above, and micro-cantilever beams are used to push the airflow downwards, creating localized high-pressure gas. This gas is then blown downwards onto the bottom copper plate through narrow slits. The overall flow channel at the bottom collects the downward-blown gas from multiple micro-cantilever beams and micro-cavities, and then directs this airflow from one side, ultimately achieving an effect of top inlet and side outlet. In fact, the main heat exchange in this solution occurs in the stage where the airflow directly blows onto the copper plate at the bottom. The airflow exiting the copper plate has already undergone heat exchange, and fins can be added at the rear end to enhance heat exchange, or they can be omitted.

[0099] In response to the above situation, such as Figures 5-7 As shown, one embodiment of the present invention provides a laptop computer, including a display enclosure 10 and a main unit enclosure 20 connected to the display enclosure 10 via a hinge 30, wherein:

[0100] The display cabinet 10 includes a display screen 11 and a plurality of heat dissipation devices 12 arranged in an array on the edge of the display screen 11 near the rotating shaft 30.

[0101] The main unit chassis 20 includes a keyboard front and a back side arranged opposite to each other, four opposite sides connecting the keyboard front and the back side, and heat dissipation fins 27 disposed therein;

[0102] The heat dissipation device 12 includes an air outlet 13 facing the heat dissipation fins 27, and the first side of the four sides closest to the air outlet includes an air inlet 27 corresponding to the air outlet 13. The main unit chassis also includes a heat dissipation outlet.

[0103] In this embodiment, the laptop computer has multiple heat dissipation devices 12 positioned near the edge of the display screen 11 on the display housing 10, close to the hinge 30. The air outlets 13 of these heat dissipation devices 12 face the heat dissipation fins 27 located in the main unit housing 20. Air is transmitted from the heat dissipation devices 12 to the heat dissipation fins 27 via air inlets 25 on the main unit housing 20 corresponding to the air outlets 13. Heat exchange occurs at the heat dissipation fins 27, and the resulting hot air is exhausted through the heat dissipation outlets on the main unit housing 20, effectively improving the laptop's heat dissipation performance. Compared to... Figure 4 In the laptop shown, this embodiment places the heat dissipation device at the lower edge of the display screen in the display cabinet 10, which utilizes some of the free space in the display cabinet and occupies relatively little additional space. No heat dissipation device is set inside the host cabinet 20, which effectively optimizes the host cabinet structure, improves the overall thinness and lightness of the laptop, and enhances the user experience.

[0104] In a specific example, such as Figure 5The diagram shown is a structural schematic of a laptop computer in its unfolded state. Figure 6 The image shown is a side view of the laptop in its unfolded state. Figure 7 The diagram shown is a top view of a laptop computer in a 180-degree open state. The display housing 10 includes a display screen 11 and multiple heat dissipation components 12 disposed inside the display housing and below the display screen 11. The heat dissipation components 12 are arranged in an array, for example... Figure 5 The diagram shows multiple heat dissipation components 12 arranged at horizontal intervals, arrayed according to their structural dimensions and the thickness of the main unit chassis 20. The main unit chassis 20 includes a keyboard front and a rear side opposite to it. One side of the keyboard front includes a keyboard 21 and a touch area 22. Heat dissipation fins 27 are disposed inside the main unit chassis, and an air inlet 25 is located on the side of the main unit chassis near the hinge. The display cabinet 10 and the main unit chassis 20 are connected by a hinge 30, allowing them to fold and unfold. In this embodiment, the air outlet 13 of the heat dissipation component 12 is aligned with the air inlet 25 of the main unit chassis 20, ensuring that the exhaust air from the heat dissipation component 12 directly blows into the main unit chassis 20. In this embodiment, by adjusting the structure of the display cabinet, the space below the display screen is used to place the heat dissipation device. The air outlet of the heat dissipation device is aligned with the air inlet on the rear side of the main unit cabinet, which is the side between the keyboard and the back, close to the display cabinet. This allows the air from the heat dissipation device to enter the main unit cabinet through the air outlet and air inlet, directly blowing onto the heat dissipation fins of the main unit cabinet. Heat exchange occurs at the heat dissipation fins, forming hot air that carries away the heat from the main unit. The hot air is then discharged from the heat dissipation outlet on the main unit cabinet, thus forming a heat dissipation architecture based on heat dissipation device—air outlet—air inlet—heat dissipation fins. This ensures heat dissipation performance while saving internal space in the laptop, especially saving space on both sides of the keyboard in the main unit cabinet, thus optimizing the internal space of the laptop and effectively improving product performance and user experience.

[0105] In an optional embodiment, the heat dissipation device is a blade fan.

[0106] In this embodiment, the heat dissipation device is a device capable of heat dissipation. Based on the space dimensions below the display screen inside the laptop's display case, the heat dissipation device can be a fan with blades, such as a centrifugal fan. The centrifugal fan utilizes the rotation of the fan in conjunction with the fins. On one hand, the fins expand the heat dissipation area, and on the other hand, the centrifugal fan allows the external airflow to exchange heat with the heat dissipation fins inside the host case. The heat is then dissipated through the heat dissipation vents set on the host case. Thus, while ensuring heat dissipation performance, the internal space of the laptop is optimized, saving internal space, especially the space on both sides of the keyboard.

[0107] In another alternative embodiment, the heat dissipation device is a piezoelectric fan.

[0108] In this embodiment, the piezoelectric fan employs piezoelectric jet technology. Utilizing the inverse piezoelectric effect of piezoelectric materials, high-frequency alternating current causes the piezoelectric material to reciprocate with the substrate, periodically compressing the air within the lower microcavity and generating periodic high pressure. This high-pressure gas is then discharged through an outlet orifice, forming a jet. Due to the high velocity of the jet, turbulence is created in the flow area, thinning the boundary layer and significantly increasing heat transfer. Therefore, at the same flow rate, jet cooling is superior to the laminar flow effect of traditional bladed fans. For example, compared to centrifugal fans that generate airflow through fan rotation, the piezoelectric fan's airflow mechanism based on the inverse piezoelectric effect further reduces space occupation. That is, the piezoelectric fan is a planar heat dissipation device, converting electrical energy into mechanical energy and effectively compressing the volume of the heat dissipation device.

[0109] In a specific example, such as Figure 15 As shown, the piezoelectric fan is a piezoelectric jet heat dissipation device, comprising:

[0110] Vibrating substrate 121;

[0111] A microcavity structure is disposed on one side of the vibration substrate 121, and the vibration substrate 121 and the microcavity structure enclose a microcavity 123. One side surface of the microcavity structure includes at least one air outlet 124.

[0112] A piezoelectric structure 122 is disposed on the side of the vibrating substrate 121 opposite to the microcavity structure.

[0113] In this embodiment, the piezoelectric jet heat dissipation device includes: a vibrating substrate 121, which has deformation capability and is configured to vibrate under voltage; a microcavity structure disposed on one side of the vibrating substrate 121, including a base plate 1232 and a side plate 1231, wherein the base plate 1232 is disposed opposite to the vibrating substrate 121, the side plate 1231 is disposed between the base plate 1232 and the vibrating substrate 121, and at least one opening 124 is disposed on the base plate 1232 or the side plate 1231. The vibrating substrate 121 and the microcavity structure enclose a microcavity 123. At least one side surface of the microcavity structure includes at least one opening 124. The opening 124 is used to form a high-speed jet to carry away heat and introduce surrounding fluid into the microcavity 123 through the entrainment effect to form a secondary flow, thereby enhancing the heat dissipation effect. The first piezoelectric structure 122 is disposed on the side of the vibrating substrate 121 away from the microcavity structure. The first piezoelectric structure 122 is used to provide a driving voltage to the vibrating substrate 121 to drive the vibrating substrate 121 to vibrate, so that the microcavity structure forms a jet at the opening 124.

[0114] When the piezoelectric jet heat dissipation device of this embodiment is working, an airflow of more than 10 m / s is continuously generated at the opening 124. After the airflow flows out, it entrains the surrounding fluid, forming a highly efficient heat dissipation effect. While the jet is continuously output, external fluid is continuously replenished into the microcavity from the side of the orifice. That is, the piezoelectric jet heat dissipation device induces a series of vortex rings or vortex pairs outside the opening by periodically blowing out and sucking the airflow into the microcavity. During the formation of the vortex rings or vortex pairs and their downstream convection, they continuously entrain the surrounding fluid through induction, thereby controlling the flow field. Because the net mass flow rate delivered to the external flow field in this embodiment is zero throughout the entire working cycle, the piezoelectric jet heat dissipation device is also called a zero-mass jet.

[0115] In a specific embodiment, such as Figure 7 As shown, the heat dissipation fins 27 are disposed on the side of the main unit housing 20 near the air inlet 25, and the distance between the air outlet 13 of the piezoelectric jet heat dissipation device 12 and the heat dissipation fins 27 is greater than or equal to the third threshold.

[0116] In this embodiment, considering the placement of the heat dissipation device, as well as the positions of its exhaust port and the main unit's intake port, to improve heat dissipation performance, the heat dissipation fins inside the main unit's housing are positioned corresponding to the intake port. Furthermore, considering the airflow mechanism of the piezoelectric jet heat dissipation device, the distance between the exhaust port and the heat dissipation fins is limited to achieve optimal heat dissipation. Specifically, to ensure the piezoelectric jet heat dissipation device achieves optimal jet flow and forms ideal vortex rings, the heat dissipation fins are positioned 5mm away from the exhaust port, effectively preventing airflow attenuation.

[0117] In a specific embodiment, such as Figure 9 As shown, the air inlet 25 is a grid-shaped opening, including a plurality of first grid bars and a first opening formed by each first grid bar;

[0118] When the display cabinet and the main unit cabinet are folded, the orthographic projection of the air outlet on the first side falls into the orthographic projection of the first opening on the first side.

[0119] In this embodiment, a first opening formed by multiple first grilles is used. On one hand, the first grilles provide support, increasing the overall stability of the laptop. On the other hand, considering that the air inlet is located within the airflow field formed by the piezoelectric jet heat dissipation device, to avoid the first grilles obstructing the airflow from the outlet and preventing airflow attenuation from affecting the jet effect, the size of the first opening is limited according to the outlet size, with the design principle being that the first grilles will not obstruct the outlet. Specifically, when the laptop is fully folded, i.e., when the hinge-driven display cabinet and main unit cabinet form the minimum angle, i.e., when the display cabinet and main unit cabinet are folded, the projection of the outlet onto the first side surface falls within the projection of the first opening onto the first side surface. In other words, the first grilles between two adjacent outlets do not obstruct the airflow generated by the outlet, thereby enabling the piezoelectric jet heat dissipation device to achieve optimal jet effect and further improve the laptop's heat dissipation performance.

[0120] Considering that the piezoelectric jet heat dissipation device in this embodiment has vibration-induced noise, in an optional embodiment, the display cabinet further includes a sound-absorbing sponge disposed on one side of the air outlet.

[0121] In this embodiment, to improve user experience, sound-absorbing sponge is placed in the area of ​​the display cabinet corresponding to the heat dissipation device to reduce noise caused by the piezoelectric jet heat dissipation device. This application does not specifically limit the area where the sound-absorbing sponge is placed; those skilled in the art should select an appropriate area to lay the sound-absorbing sponge based on the actual application, which will not be elaborated further here.

[0122] In an optional embodiment, such as Figure 10 and Figure 11 As shown, the main unit housing also includes a main unit 29 and a heat pipe 291. The heat pipe 291 is used to conduct the heat of the main unit 29 to the heat dissipation fins 27.

[0123] The heat dissipation outlet includes a first heat dissipation outlet 26 disposed on the back side and arranged in an array, the first heat dissipation outlet 26 being disposed on the side of the heat dissipation fins 27 away from the air inlet 25.

[0124] In this embodiment, the hot airflow generated by heat exchange at the location of the heat dissipation fins 27 is guided out of the main unit chassis through the first heat dissipation outlet 26 located on the back of the main unit chassis 20, thereby dissipating the heat inside the main unit chassis. The first heat dissipation outlet can be a grid-like opening or multiple openings arranged in an array.

[0125] In an optional embodiment, such as Figure 8As shown, the four sides also include a second side and a third side disposed opposite to each other, and the heat dissipation outlets also include second heat dissipation outlets 23 disposed on the second side and the third side.

[0126] The second heat dissipation outlet 23 is a grid-shaped opening, including multiple second grid bars and a second opening formed by each second grid bar.

[0127] In this embodiment, considering that the second heat dissipation outlet is located on the side of the main unit chassis, a grille-like opening is used. On the one hand, the second grille provides support to improve the overall stability of the laptop, and on the other hand, it facilitates the exhaust of hot air, thereby improving heat dissipation performance. The second and third sides, as the side walls of the laptop, are typically equipped with interfaces 24, such as power interfaces, mouse interfaces, audio interfaces, etc. The interfaces 24 and the second heat dissipation outlet are spaced apart on the sides.

[0128] In an optional embodiment, such as Figure 16 As shown, the keyboard surface includes a keyboard 21, and the heat dissipation outlet also includes a third heat dissipation outlet 28 disposed on the keyboard surface.

[0129] In the horizontal direction of the keyboard 21, the third heat dissipation outlet 28 is disposed on both sides of the keyboard 21.

[0130] In this embodiment, by providing heat dissipation outlets 28 on both sides of the keyboard 21, the overall area of ​​the heat dissipation outlets is further increased, thereby improving heat dissipation performance.

[0131] like Figure 11 The diagram shows the heat dissipation of a laptop computer case. The heat generated by the main power consumption unit inside the case, such as the host 29, is transferred to the heat dissipation fins 27 through the heat pipe 291. When the airflow from the outlet of the piezoelectric jet heat dissipation device enters the interior of the case 20 through the air inlet 25, heat exchange occurs at the heat dissipation fins 27. The hot air passing through the heat dissipation fins 27 is dispersed in different directions from different heat dissipation outlets. For example, it is discharged through the first heat dissipation outlet 26 on the back of the case, through the second heat dissipation outlet 23 on the second and third sides, and through the third heat dissipation outlet (not shown in the figure) on both sides of the keyboard on the keyboard surface. Thus, the hot air is discharged through each heat dissipation outlet.

[0132] In an optional embodiment, the keyboard surface further includes speaker outlets disposed on both sides of the keyboard, the speaker outlets being reused as the third heat dissipation outlets.

[0133] In this embodiment, the speaker outlet located on the keyboard surface is used as a heat dissipation outlet for the keyboard surface, that is, the speaker outlet is reused as a heat dissipation outlet, further optimizing the spatial structure of the laptop computer chassis. Specifically, for the speaker outlets that laptops currently have, the speaker outlets can be arrayed openings or grid-like openings. While transmitting audio sound waves, the speaker outlets also serve as heat dissipation outlets to discharge hot airflow.

[0134] Considering the impact of hot air inside the main unit housing on other components, in an optional embodiment, such as Figure 14 As shown, the main unit housing also includes a main unit 29 and a heat pipe 291. The heat pipe 291 is used to conduct the heat of the main unit 29 to the heat dissipation fins 27.

[0135] The heat dissipation outlet is composed of a fourth heat dissipation outlet 26 arranged in an array on the back side, and the fourth heat dissipation outlet 26 is located on the side of the heat dissipation fin 27 away from the air inlet 25.

[0136] The main unit chassis also includes a heat insulation ring 271 surrounding the fourth heat dissipation outlet 26. One side of the heat insulation ring 271 is connected to the keyboard surface, and the other side of the heat insulation ring 271 is connected to the back surface.

[0137] In this embodiment, the surrounding heat insulation ring 271 blocks the airflow entering from the air inlet 25, the heat exchange fins 27, and the resulting hot air from the heat exchange within the area enclosed by the heat insulation ring. The hot air is then discharged through the fourth heat dissipation vent located on the back of the main unit chassis, thus preventing the hot air from dispersing to other areas of the main unit chassis and affecting other components. This effectively prevents other components from overheating due to the hot air, further improving the overall performance of the laptop. It is worth noting that in this embodiment, the heat insulation ring 271 surrounds the fourth heat dissipation vent 26 on three sides, utilizing the rear side of the main unit chassis and the air inlet 25 to form a closed area, preventing the hot air from flowing to other parts of the main unit chassis. Figure 14 As shown, the positions of the host and heat pipe in this embodiment are only used to illustrate the specific implementation of this application. For example, the heat pipe extends to the heat dissipation fins through the opening on the heat insulation ring. This application does not make specific limitations on this, and those skilled in the art should select appropriate setting positions according to actual application needs. The design principle is to achieve isolation of the hot airflow formed after heat exchange through the heat insulation ring. This will not be elaborated here.

[0138] In an optional embodiment, such as Figure 5 , Figure 7 and Figure 12As shown, the rotating shaft 30 includes a first rotating shaft and a second rotating shaft (not shown in the figure) for connecting the display cabinet 10 and the host cabinet 20. The first rotating shaft and the second rotating shaft are respectively disposed at positions near the edges of the display cabinet 10 and the host cabinet 20 extending in the width direction. The first rotating shaft and the second rotating shaft respectively include a first shaft piece disposed inside the display cabinet and used to drive the display cabinet 10, and a second shaft piece disposed inside the host cabinet 20 and used to drive the host cabinet.

[0139] When the display housing 10 and the main unit housing 20 are folded, the plurality of heat dissipation devices 12 are located between the first shaft plate of the first rotating shaft and the first shaft plate of the second rotating shaft, and the air inlet 25 is located between the second shaft plate of the first rotating shaft and the second shaft plate of the second rotating shaft.

[0140] In this embodiment, considering the structure of the laptop, the heat dissipation devices are positioned between two hinges. These hinges are located at the edges of the laptop's horizontal extension, stably connecting the display enclosure and the main unit enclosure. The first and second hinge plates drive the display enclosure and the main unit enclosure to rotate, respectively. For example, the second hinge plate is a fixed hinge, and the first hinge plate is a movable hinge. The main unit enclosure is fixed relative to the hinges, while the display enclosure rotates relative to the main unit enclosure. This embodiment places multiple heat dissipation devices between the two hinges, with corresponding air inlets positioned between them. While ensuring stable laptop operation, the exhaust air from the heat dissipation devices directly enters the main unit enclosure through the air inlets, exchanging heat with the cooling fins. The resulting hot air is then exhausted through the heat dissipation outlets, directing the exhaust air directly into the laptop's main unit enclosure. This forms a heat dissipation architecture based on heat dissipation devices—air outlets—air inlets—cooling fins, ensuring heat dissipation performance while saving internal space, improving product performance and user experience.

[0141] To maintain optimal heat dissipation performance of the heat dissipation device, in an optional embodiment, such as Figures 13a-13b As shown, the first and second rotating shafts also include a third shaft piece 31 disposed inside the display cabinet, and the maximum unfolding angle between the third shaft piece 31 and the corresponding second shaft piece is less than or equal to a second threshold.

[0142] The display housing 10 also includes a limiting plate (not shown in the figure) disposed on the third shaft plate 31 of the first rotating shaft and the third shaft plate 31 of the second rotating shaft. The plurality of heat dissipation devices are disposed on the limiting plate, and the air outlet is perpendicular to the limiting plate.

[0143] In this embodiment, to ensure that the airflow from the heat dissipation device blows directly into the laptop's main chassis, a third shaft plate is provided on the hinge, and limiting plates are provided on the two third shaft plates of the two hinges. The height of the limiting plates is greater than or equal to the sum of the heights of the arrayed heat dissipation devices. For example, when the heat dissipation devices are arranged in one row, i.e., when the heat dissipation devices are spaced apart in the horizontal direction of the laptop, the height of the limiting plates is greater than or equal to the height of the heat dissipation devices; when the heat dissipation devices are arranged in two rows, i.e., when they are spaced apart in both the vertical and horizontal directions of the laptop during heat dissipation, the height of the limiting plates is greater than or equal to the height of the two rows of heat dissipation devices. The arrayed heat dissipation devices are attached to the limiting plates, and the limiting plates ensure that the angle between the heat dissipation devices and the main chassis is less than or equal to a second threshold when the display cabinet rotates. Specifically, when the angle between the display cabinet and the host cabinet is less than or equal to the second threshold, the third axle plate is synchronized with the corresponding first axle plate. That is, ignoring the thickness of the axle plate, the angle between the third axle plate and the second axle plate is the same as the angle between the first axle plate and the second axle plate. When the angle between the display cabinet and the host cabinet is greater than the second threshold, the third axle plate is not synchronized with the corresponding first axle plate. That is, the angle between the third axle plate and the second axle plate remains at the second threshold to ensure that the exhaust air of the heat dissipation device can directly blow into the interior of the host cabinet, and the display screen of the display cabinet rotates with the first axle plate. In this embodiment, by setting the third axle plate on the pivot and the limiting plate based on the third axle plate, the heat dissipation device ensures that the exhaust air of the heat dissipation device is perpendicular to the limiting plate and can directly blow into the interior of the host cabinet when the display cabinet and the host cabinet are unfolded, thereby ensuring the best heat dissipation effect of the heat dissipation device.

[0144] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating this utility model, and are not intended to limit the implementation of this utility model. For those skilled in the art, other variations or modifications can be made based on the above description. It is impossible to exhaustively list all the implementation methods here. All obvious variations or modifications derived from the technical solutions of this utility model are still within the protection scope of this utility model.

Claims

1. A display device, characterized in that, This includes a display panel, a heat sink, and heat dissipation holes on the display device housing. The display panel includes a display screen and a heat-conducting sheet disposed on one side of the display screen for dissipating heat; The heat dissipation section includes multiple piezoelectric jet heat dissipation devices arranged in an array, and each piezoelectric jet heat dissipation device includes an air outlet facing the heat-conducting plate.

2. The display device according to claim 1, characterized in that, The display panel includes a control unit disposed on the side of the display screen away from the light-emitting side, and a heat pipe for conducting the heat generated by the control unit to the heat-conducting sheet; In a direction perpendicular to the light emission direction of the display screen, the heat-conducting sheet is disposed on one side of the display screen, and the heat dissipation part is disposed on the side of the heat-conducting sheet away from the control unit. The lateral width of the heat dissipation part is greater than the thickness of the display screen, the lateral width of the heat dissipation part is greater than the thickness of the control unit, and the lateral width of the heat dissipation part is less than or equal to the thickness of the display panel. The heat dissipation unit and the display panel are integrated into one unit.

3. The display device according to claim 1, characterized in that, The display device further includes a connecting shaft that connects the display panel and the heat sink. The display panel includes a control unit disposed on the side of the display screen away from the light-emitting side, a heat pipe for conducting the heat generated by the control unit to the heat-conducting sheet, and an air inlet hole disposed on the display panel housing corresponding to the heat-conducting sheet; The heat dissipation unit is located on the side of the heat-conducting plate away from the control unit, and the heat dissipation unit and the display panel are separate units.

4. The display device according to claim 3, characterized in that, The heat dissipation unit is driven by the connecting shaft, and the angle formed between the connecting shaft and the display panel is greater than or equal to a first threshold.

5. The display device according to any one of claims 1-4, characterized in that, The piezoelectric jet heat dissipation device includes: Vibrating substrate; A microcavity structure is disposed on one side of the vibration substrate, the vibration substrate and the microcavity structure enclose the microcavity to form a microcavity, and one side surface of the microcavity structure includes at least one air outlet hole; A piezoelectric structure is disposed on the side of the vibrating substrate opposite to the microcavity structure.

6. The display device according to claim 5, wherein the distance between the air outlet of the piezoelectric jet heat dissipation device and the heat-conducting sheet is greater than or equal to a third threshold.

7. A laptop computer, characterized in that, Includes a display cabinet and a main unit cabinet connected to the display cabinet via a hinge, wherein: The display cabinet includes a display screen and multiple heat dissipation devices arranged in an array near the edge of the display screen on the side of the rotating shaft. The main unit chassis includes a keyboard front and a back side arranged opposite to each other, four opposite sides connecting the keyboard front and the back side, and heat dissipation fins disposed therein; The heat dissipation device includes an air outlet facing the heat dissipation fins, and the first side of the four sides closest to the air outlet includes an air inlet corresponding to the air outlet. The main unit chassis also includes a heat dissipation outlet.

8. The laptop computer according to claim 7, characterized in that, The pivot includes a first pivot and a second pivot for connecting the display cabinet and the host cabinet. The first pivot and the second pivot are respectively disposed at positions near the edges of the display cabinet and the host cabinet extending in the width direction. The first pivot and the second pivot each include a first shaft piece disposed inside the display cabinet and used to drive the display cabinet, and a second shaft piece disposed inside the host cabinet and used to drive the host cabinet. When the display cabinet and the host cabinet are folded, the plurality of heat dissipation devices are located between the first shaft plate of the first rotating shaft and the first shaft plate of the second rotating shaft, and the air inlet is located between the second shaft plate of the first rotating shaft and the second shaft plate of the second rotating shaft.

9. The laptop computer according to claim 8, characterized in that, The first and second rotating shafts also include a third shaft piece disposed inside the display cabinet, wherein the maximum unfolding angle between the third shaft piece and the corresponding second shaft piece is less than or equal to a second threshold. The display cabinet also includes a limiting plate disposed on the third shaft plate of the first rotating shaft and the third shaft plate of the second rotating shaft, the plurality of heat dissipation devices are disposed on the limiting plate, and the air outlet is perpendicular to the limiting plate.

10. The laptop computer according to claim 7, characterized in that, The heat dissipation device is a blade fan or a piezoelectric fan.

11. The laptop computer according to claim 10, characterized in that, The piezoelectric fan is a piezoelectric jet heat dissipation device, comprising: Vibrating substrate; A microcavity structure is disposed on one side of the vibration substrate, the vibration substrate and the microcavity structure enclose the microcavity to form a microcavity, and one air outlet is included on one side surface of the microcavity structure; A piezoelectric structure is disposed on the side of the vibrating substrate opposite to the microcavity structure.

12. The laptop computer according to claim 11, characterized in that, The heat dissipation fins are disposed on the side of the main unit chassis near the air inlet, and the distance between the air outlet of the piezoelectric jet heat dissipation device and the heat dissipation fins is greater than or equal to a third threshold.

13. The laptop computer according to claim 11, characterized in that, The air inlet is a grid-shaped opening, including multiple first grid bars and a first opening formed by each first grid bar; When the display cabinet and the main unit cabinet are folded, the orthographic projection of the air outlet on the first side falls into the orthographic projection of the first opening on the first side.

14. The laptop computer according to claim 11, characterized in that, The display enclosure also includes sound-absorbing sponge disposed on one side of the air outlet.

15. The laptop computer according to claim 7, characterized in that, The main unit enclosure also includes a main unit and a heat pipe, which is used to conduct the heat of the main unit to the heat dissipation fins; The heat dissipation outlet includes a first heat dissipation outlet disposed on the back side and arranged in an array, the first heat dissipation outlet being disposed on the side of the heat dissipation fins away from the air inlet.

16. The laptop computer according to claim 15, characterized in that, The four sides also include a second side and a third side disposed opposite to each other, and the heat dissipation outlets also include second heat dissipation outlets disposed on the second side and the third side. The second heat dissipation outlet is a grid-shaped opening, including multiple second grid bars and a second opening formed by each second grid bar.

17. The laptop computer according to claim 15, characterized in that, The keyboard surface includes a keyboard, and the heat dissipation outlet further includes a third heat dissipation outlet disposed on the keyboard surface. In the horizontal direction of the keyboard, the third heat dissipation outlet is located on both sides of the keyboard.

18. The laptop computer according to claim 17, characterized in that, The keyboard surface also includes speaker outlets located on both sides of the keyboard. The speaker outlet is reused as the third heat dissipation outlet.

19. The laptop computer according to claim 7, characterized in that, The main unit enclosure also includes a main unit and a heat pipe, which is used to conduct the heat of the main unit to the heat dissipation fins; The heat dissipation outlet is composed of a fourth heat dissipation outlet arranged in an array on the back side, and the fourth heat dissipation outlet is located on the side of the heat dissipation fins away from the air inlet. The main unit chassis also includes a heat insulation ring surrounding the fourth heat dissipation outlet. One side of the heat insulation ring is connected to the keyboard surface, and the other side of the heat insulation ring is connected to the back surface.

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