A heat dissipation device, a graphics card and an electronic device
By stacking heat-conducting and heat-dissipating components, the problem of insufficient heat dissipation performance of a single aluminum extrusion structure heat sink under high power consumption conditions is solved, achieving efficient heat conduction and dissipation, and improving heat dissipation capacity and equipment stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN BITLAND INFORMATION TECH CO LTD
- Filing Date
- 2025-07-18
- Publication Date
- 2026-07-21
AI Technical Summary
Existing single-aluminum extrusion heat sinks have insufficient heat dissipation performance under high power consumption conditions, making it difficult to effectively control device temperature and affecting equipment performance and user experience.
The design employs a stacked structure of heat-conducting and heat-dissipating components with a higher thermal conductivity than the heat dissipation components. The heat-conducting and heat-dissipating components are connected by welding. The heat-conducting components are used to quickly conduct heat, while the heat dissipating components are used to efficiently dissipate heat, forming a heat conduction path with a clear division of functions.
It significantly improves heat dissipation capacity, increasing it from 20 watts in the traditional single aluminum extrusion structure to over 40-50 watts, improving heat conduction efficiency, and controlling manufacturing costs and space occupation while ensuring performance.
Smart Images
Figure CN224536456U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation device and a heat dissipation equipment. Background Technology
[0002] As a key thermal management component of graphics processing units (GPUs), the performance of the heatsink directly affects the stable operation and lifespan of the cooling system. With the continuous development of graphics processing technology, the power consumption of cooling systems is constantly increasing, placing higher demands on cooling systems. Currently, most cooling systems on the market use single-extrusion aluminum heatsinks. Single-extrusion aluminum heatsinks are manufactured using an aluminum extrusion process, offering advantages such as high production efficiency and low manufacturing costs, thus finding widespread use in entry-level products. Single-extrusion aluminum heatsinks provide basic cooling functions, meeting the thermal management needs of low-power cooling devices.
[0003] During the implementation of this application, the inventors discovered that existing single-aluminum-extruded heat sinks have significant limitations in heat dissipation performance. Due to the relatively low thermal conductivity of aluminum, the heat dissipation capacity of a single-aluminum-extruded heat sink is typically only around 20 watts. When the power consumption of the heat dissipation device exceeds this threshold, the single-aluminum-extruded heat sink struggles to effectively control the device temperature, potentially leading to performance degradation or even thermal protection activation, thus impacting the user experience. Utility Model Content
[0004] The main technical problem addressed by the embodiments of this application is to provide a heat dissipation device that can effectively solve the problem of insufficient heat dissipation performance of a single aluminum extrusion structure heat sink.
[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application embodiment is: providing a heat dissipation device, including a heat dissipation component and a fixing component, wherein the heat dissipation component and the heat conduction component are stacked and welded together, the thermal conductivity of the heat conduction component is greater than that of the heat dissipation component, the surface of the heat conduction component facing away from the heat dissipation component is used to attach a heating device, the heat conduction component is used to conduct the heat of the heating device to the heat dissipation component, the heat dissipation component is used to dissipate the received heat outward, and the fixing component is used to fix the heat dissipation component to the heating device.
[0006] Optionally, the heat dissipation component includes a heat dissipation body and a plurality of heat dissipation fins, the plurality of heat dissipation fins being disposed on the heat dissipation body and spaced apart, and the heat-conducting component being welded to the surface of the heat dissipation body opposite to the plurality of heat dissipation fins.
[0007] Optionally, the heat dissipation body has a mounting post on its surface away from the plurality of heat dissipation fins; the heat-conducting component has a mounting hole, and one of the mounting posts is inserted into one of the mounting holes.
[0008] Optionally, the end of the mounting post away from the heat dissipation body is provided with a screw hole; the fixing assembly includes a bolt and an elastic element, the bolt's shank is used to pass through the motherboard carrying the heat dissipation device and then screw into the screw hole, the elastic element is sleeved on the bolt's shank, and one end of the elastic element abuts against the back of the body away from the heat dissipation device, and the other end of the elastic element abuts against the bolt's nut.
[0009] Optionally, the fixing component further includes a washer, which is sleeved on the thread of the bolt and is used to attach to the back of the motherboard away from the heat-generating device. One end of the elastic member is used to abut against the washer.
[0010] Optionally, there are multiple mounting posts and mounting holes, with multiple mounting holes respectively located at the corners of the heat-conducting component, and one mounting post inserted into one mounting hole; there are multiple fixing components, with a bolt of one fixing component used to pass through the main board carrying the heating device and then screwed into the threaded hole of one mounting post.
[0011] Optionally, the heat dissipation assembly further includes a fan, which is disposed on the other surface of the heat dissipation component opposite to the heat-conducting component, and the plurality of heat dissipation fins are arranged around the fan.
[0012] Optionally, the heat-conducting component is a copper sheet; the heat-dissipating component is made of aluminum.
[0013] To solve the above-mentioned technical problems, another technical solution adopted in this application embodiment is: to provide a graphics card, including a motherboard, a heat-generating device and the components described in the above claims, wherein the heat-generating device is disposed on the motherboard, and the fixing component is used to fix the heat dissipation component to the heat-generating device.
[0014] To solve the above-mentioned technical problems, another technical solution adopted in the embodiments of this application is to provide an electronic device, including the above-mentioned heat dissipation device, or a graphics card.
[0015] This application provides a heat dissipation device, including a heat dissipation component and a fixing component. The heat dissipation component includes a heat-conducting component and a heat dissipation component, which are stacked and welded together. The thermal conductivity of the heat-conducting component is greater than that of the heat dissipation component. The surface of the heat-conducting component facing away from the heat dissipation component is used to attach a heat-generating device. The heat-conducting component conducts heat from the heat-generating device to the heat dissipation component, and the heat dissipation component dissipates the received heat outward. The fixing component fixes the heat dissipation component to the heat-generating device. Through the stacked design of the heat-conducting component and the heat dissipation component, the problem of insufficient heat dissipation performance of a single aluminum extrusion structure heat sink is effectively solved. The heat-conducting component is used for rapid heat collection and conduction, while the heat dissipation component is used for efficient heat dissipation, forming a heat conduction path with clear functional division. Furthermore, the stacked structure design of the heat dissipation component improves the heat conduction efficiency. The direct contact between the heat-conducting component and the heat-generating device ensures that heat can be quickly transferred from the heat source to the heat dissipation system. The design arrangement of the heat dissipation component receiving conducted heat and dissipating it outward achieves efficient heat release by increasing the heat dissipation surface area. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.
[0017] Figure 1 This is a schematic diagram of the heat dissipation device according to an embodiment of this application; Figure 2 This is an exploded view of the heat dissipation device according to an embodiment of this application; Figure 3 This is another exploded view of the heat dissipation device according to an embodiment of this application; Figure 4 This is another exploded view of the heat dissipation device according to an embodiment of this application; Figure 5 This is a schematic diagram of the heat dissipation device according to an embodiment of this application from another perspective.
[0018] The reference numerals in the detailed embodiments are as follows: 100, heat dissipation device; 10, heat dissipation component; 11, heat-conducting component; 111, mounting hole; 12, heat dissipation component; 121, heat dissipation body; 122, heat dissipation fins; 123, mounting post; 20, fixing component; 21, bolt; 22, elastic element; 23, washer; 125, fan. Detailed Implementation
[0019] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "upper," "lower," "inner," "outer," "vertical," "horizontal," etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0020] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.
[0021] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.
[0022] Please see Figure 1 The heat dissipation device 100 includes a heat dissipation component 10 and a fixing component 20.
[0023] Please see further. Figure 2The heat dissipation assembly includes a heat-conducting component 11 and a heat-dissipating component 12. The heat-dissipating component 12 and the heat-conducting component 11 are stacked and firmly connected by welding. Preferably, the heat-conducting component 11 is made of copper, which has a high thermal conductivity, and the heat-dissipating component 12 is made of aluminum through an extrusion process. The heat-conducting component 11 is designed as a flat plate, with a smooth attachment surface on its surface facing away from the heat-dissipating component 12 for direct contact with the heat-generating device. The thermal conductivity of the heat-conducting component 11 is greater than that of the heat-dissipating component 12. The surface of the heat-conducting component 11 facing away from the heat-dissipating component 12 is used to attach the heat-generating device. The heat-conducting component 11 conducts heat from the heat-generating device to the heat-dissipating component 12, and the heat-dissipating component 12 dissipates the received heat outwards. The heat-dissipating component 12 is manufactured using an aluminum extrusion process and has a good heat dissipation surface area. Although the thermal conductivity of aluminum is lower than that of copper, its lightweight, low cost, and ease of processing make it an ideal choice for the heat-dissipating component 12. The heat dissipation component 12 and the heat conduction component 11 are welded using an appropriate welding process to ensure a good heat conduction path between them. The fixing component 20 is used to fix the heat dissipation component 10 to the heat-generating device.
[0024] When the heat-generating device operates, the generated heat is first transferred to the attachment surface of the heat-conducting component 11. Because the heat-conducting component 11 is made of copper with a high thermal conductivity, heat can be quickly conducted from the heat-generating device to the entire heat-conducting component 11. Subsequently, the heat is conducted to the heat dissipation component 12 through the solder interface, and the heat dissipation component 12 dissipates the received heat to the surrounding environment. This layered heat conduction design achieves functional division of labor: the heat-conducting component 11 focuses on the rapid collection and conduction of heat, while the heat dissipation component 12 focuses on the efficient dissipation of heat. Compared with traditional single aluminum extrusion heat sinks, this structure can significantly improve heat conduction efficiency.
[0025] In this embodiment, the heat dissipation capacity is increased from 20 watts in the traditional single aluminum extrusion structure to 40-50 watts through a copper-aluminum composite structure, more than doubling the heat dissipation performance. Secondly, compared to a pure copper heat dissipation solution, this embodiment effectively controls manufacturing costs while ensuring heat dissipation performance, achieving a smaller size with the same heat dissipation capacity, saving valuable installation space.
[0026] In this embodiment, the heat-conducting component 11 is a copper sheet, fully utilizing the excellent thermal conductivity of copper to achieve efficient heat conduction. The thermal conductivity of the copper sheet is approximately 400 Kelvin per meter, far exceeding that of aluminum, enabling rapid conduction of heat generated by the heat-generating device to the heat dissipation component 12. The heat dissipation component 12 is made of aluminum, employing an aluminum extrusion process to manufacture an integrated structure of the heat dissipation body 121 and the heat dissipation fins 122. Aluminum has excellent extrusion molding properties, allowing for the manufacture of complex geometries for the heat dissipation fins 122. The density of aluminum is approximately one-third that of copper, significantly reducing the overall weight of the heat dissipation device 100. Furthermore, the cost of aluminum is far lower than that of copper, effectively controlling manufacturing costs by using an aluminum heat dissipation component 12. The surface of the aluminum can be anodized to improve surface hardness and corrosion resistance, while also increasing surface radiative heat dissipation capacity.
[0027] Please see Figure 3 The heat dissipation component 12 consists of a heat dissipation body 121 and multiple heat dissipation fins 122. The heat dissipation body 121 serves as the main structure of the heat dissipation component 12, supporting the heat dissipation fins 122 and being welded to the heat-conducting component 11. The heat dissipation body 121 is manufactured using an aluminum extrusion process to form a substrate structure of a certain thickness, providing a stable mounting base for the heat dissipation fins 122. Multiple heat dissipation fins 122 are disposed on the heat dissipation body 121, and the heat dissipation fins 122 are arranged in a spaced-apart layout. The spacing between the heat dissipation fins 122 is designed to ensure both sufficient heat dissipation surface area and smooth airflow. Furthermore, the heat dissipation fins 122 are integrally formed with the heat dissipation body 121, directly extruded using an aluminum extrusion process. The heat dissipation fins 122 extend perpendicularly to the surface of the heat dissipation body 121, forming a large number of heat dissipation surfaces. The heat-conducting component 11 is welded to the surface of the heat sink body 121 away from the surface of the multiple heat sink fins 122. The surface of the heat sink body 121 away from the heat sink fins 122 forms a flat welding base surface, and the heat-conducting component 11 is firmly connected to this base surface through a welding process. The quality of the welding interface directly affects the heat transfer efficiency, so the contact surface needs to be properly surface-treated before welding to ensure welding quality.
[0028] Preferably, the welding process can employ brazing or other suitable metal joining techniques. Temperature and time need to be controlled during welding to avoid overheating that could degrade material properties. After welding, the heat-conducting component 11 and the heat-dissipating body 121 form a reliable heat conduction path, allowing heat to be efficiently transferred from the heat-conducting component 11 to the heat-dissipating body 121, and then dissipated outwards through the heat dissipation fins 122.
[0029] In this embodiment, the heat dissipation fins 122 increase the total heat dissipation surface area of the heat dissipation device 100. After heat is transferred from the heat-conducting component 11 to the heat dissipation body 121, it quickly diffuses to each heat dissipation fin 122. The heat dissipation fins 122 transfer heat to the surrounding air through both convection and radiation heat transfer. The spacing channels between the heat dissipation fins 122 form natural convection channels, promoting the rise of hot air and the replenishment of cold air, thereby improving the convective heat transfer efficiency. In this embodiment, the heat dissipation fins 122 can provide a larger heat dissipation surface area within the same volume, significantly improving heat dissipation efficiency. At the same time, the vertical arrangement of the heat dissipation fins 122 fully utilizes natural convection, achieving good heat dissipation without additional power.
[0030] Please see Figure 4 The heat dissipation body 121 has mounting posts 123 disposed on its surface opposite to the plurality of heat dissipation fins 122. The mounting posts 123 extend vertically from the welding base surface of the heat dissipation body 121, forming a cylindrical shape or other suitable geometric shape. Preferably, the mounting posts 123 are integrally formed with the heat dissipation body 121, manufactured through aluminum extrusion or subsequent machining. The mounting posts 123 provide stable support and precise positioning for the heat-conducting component 11. The material of the mounting posts 123 is the same as that of the heat dissipation body 121, both made of aluminum, ensuring the integrity of the structure and the consistency of the coefficient of thermal expansion. The heat-conducting component 11 has mounting holes 111 corresponding to the mounting posts 123. One mounting post 123 is inserted into one mounting hole 111, and the position of the mounting hole 111 corresponds to the position of the mounting post 123, ensuring smooth insertion during assembly. During assembly, the mounting holes 111 of the heat-conducting component 11 are aligned with the mounting posts 123 on the heat dissipation body 121, and positioning is completed by axial insertion. The plug-in connection employs a clearance fit or a transition fit, ensuring both ease of assembly and connection stability. The plug-in positioning resolves the relative position issue between the heat-conducting component 11 and the heat sink body 121, preventing displacement or misalignment that may occur during welding. The mounting post 123 bears the weight and external forces of the heat-conducting component 11, reducing the mechanical load on the welded joint and improving connection reliability.
[0031] Please see Figure 5The mounting post 123 has a threaded hole (not shown) at the end furthest from the heat sink 121. The fixing assembly 20 includes a bolt 21 and an elastic element 22. The bolt 21's threaded shaft passes through the motherboard supporting the heat-generating device and is screwed into the threaded hole. The bolt 21 uses a standard thread specification, and the material selection considers strength requirements and corrosion resistance, typically using stainless steel or surface-treated carbon steel. The bolt 21 head is designed with an internal hexagonal or Phillips head for easy installation and removal using tools. The elastic element 22 is fitted onto the threaded shaft of the bolt 21, providing elastic pressure and compensating for thermal expansion. The elastic element 22 is typically a compression spring structure made of spring steel, and the spring's stiffness and compression are calculated based on the fixing force requirements and thermal expansion. One end of the elastic element 22 abuts against the back of the motherboard away from the heat-generating device, and the other end abuts against the nut of the bolt 21. During assembly, the bolt 21 passes through the mounting hole 111 on the back of the motherboard, continues through the elastic element 22, and finally screws into the threaded hole 124 of the mounting post 123. When the bolt 21 is tightened, the head of the bolt 21 moves towards the mounting post 123, compressing the elastic element 22 through the nut. The elastic force generated by the elastic element 22 is transmitted to the mounting post 123 through the bolt 21, thereby pressing the heat dissipation assembly 10 tightly against the surface of the heat-generating device. The amount of compression of the elastic element 22 controls the magnitude of the fixing force, ensuring that the heat-conducting component 11 and the heat-generating device maintain appropriate contact pressure. The elastic fixing method can compensate for dimensional changes caused by thermal expansion and avoid loosening of the connection or excessive stress caused by temperature changes.
[0032] Furthermore, the fixing component 20 also includes a washer 23, which is fitted onto the threaded part of the bolt 21. The washer 23 is designed as a flat washer with an outer diameter larger than the head diameter of the bolt 21, which can distribute the pressure acting on the motherboard. The washer 23 is made of a polymer material or metal material with certain elasticity and wear resistance, which can both protect the motherboard surface and withstand the fixing force. The washer 23 is used to attach to the back of the motherboard away from the heat-generating components, forming a buffer and protective layer between the motherboard and the elastic element 22. The surface of the washer 23 is smooth to avoid scratching or other damage to the motherboard surface.
[0033] In this embodiment, with the addition of washer 23, one end of the elastic member 22 abuts against washer 23 instead of directly contacting the motherboard surface. The force transmission path changes to: bolt 21 and nut compress the elastic member 22, and the elastic force generated by the compression of the elastic member 22 acts on washer 23, which distributes the force evenly to the motherboard surface. The area of washer 23 is larger than the end face area of elastic member 22, achieving a pressure dispersion effect and reducing local stress on the motherboard. In addition, washer 23 also serves as insulation and protection, preventing electrical interference or mechanical damage that may be caused by direct contact between the metal elastic member 22 and the motherboard.
[0034] This embodiment uses the gasket 23 for protection design, which maintains the fixing strength and heat dissipation performance of the aforementioned embodiment while improving the protection level of key components such as the motherboard, thus meeting the application requirements of high-reliability electronic products.
[0035] Please see Figure 3 The mounting posts 123 and mounting holes 111 are multiple in number. Multiple mounting holes 111 are respectively located at the corners of the heat-conducting component 11. One mounting post 123 is inserted into one mounting hole 111. Multiple mounting posts 123 extend vertically from the surface of the heat sink body 121 away from the heat sink fins 122. The mounting posts 123 are typically located at the four corners of the heat sink body 121, forming a rectangular or square distribution pattern to ensure uniform distribution of fixing force on the heat sink assembly 10. The fixing components 20 are multiple in number. The bolts 21 of one fixing component 20 are used to pass through the motherboard carrying the heat-generating device and then screw into the threaded hole of one mounting post 123. Each fixing component 20 includes a bolt 21 and an elastic element 22. During assembly, all bolts 21 are initially screwed into the threaded holes, and then each bolt 21 is gradually tightened in a diagonal sequence until the specified preload is reached. The multi-point fixing method can evenly distribute the weight and external force of the heat dissipation component 10 to multiple fixing points, reduce the load intensity of a single point, and improve the reliability and durability of the connection.
[0036] In this embodiment, under vibration or impact loads, multiple fixing points share the external force, avoiding stress concentration and connection failure problems that may occur with single-point fixing. Multi-point fixing can also better adapt to thermal expansion deformation. When temperature changes cause changes in the size of the heat dissipation component 10, multiple elastic elements 22 deform in coordination to maintain stable contact pressure.
[0037] Please reconsider. Figure 3In this embodiment, the heat dissipation assembly 10 further includes a fan 125, which is disposed on the other surface of the heat dissipation component 12 opposite to the heat-conducting component 11. Multiple heat dissipation fins 122 are arranged around the fan 125. The installation height of the fan 125 needs to maintain an appropriate distance from the top of the heat dissipation fins 122 to ensure that airflow can fully enter the channels of the heat dissipation fins 122 without causing airflow obstruction. The multiple heat dissipation fins 122 are arranged around the fan 125 in a radial or concentric circular distribution pattern. The layout of the heat dissipation fins 122 fully considers the airflow direction and distribution characteristics generated by the fan 125, ensuring that airflow can efficiently pass through the gaps between the heat dissipation fins 122. The height design of the heat dissipation fins 122 matches the airflow coverage range of the fan 125 blades, avoiding airflow dead zones or turbulence areas. When the fan 125 operates, it generates directional airflow, and air is drawn into the channels of the heat dissipation fins 122, where forced convection heat exchange occurs with the high-temperature surface of the heat dissipation fins 122. The heat transfer coefficient of forced convection is much higher than that of natural convection, significantly improving heat dissipation efficiency. Hot air is quickly expelled from the heat dissipation area by the fan 125, while fresh cold air is constantly replenished, forming a continuous heat exchange cycle.
[0038] This application embodiment provides a heat dissipation device 100, including a heat dissipation assembly 10 and a fixing assembly 20. The heat dissipation assembly 10 includes a heat-conducting component 11 and a heat dissipation component 12. The heat dissipation component 12 is stacked on top of the heat-conducting component 11, and the heat-conducting component 11 and the heat dissipation component 12 are welded together. The thermal conductivity of the heat-conducting component 11 is greater than that of the heat dissipation component 12. The surface of the heat-conducting component 11 facing away from the heat dissipation component 12 is used to attach a heat-generating device. The heat-conducting component 11 is used to conduct the heat from the heat-generating device to the heat dissipation component 12. The heat dissipation component 12 is used to dissipate the received heat outwards. The fixing assembly 20 is used to fix the heat dissipation device 100. The heat dissipation component 10 is fixed to the heat-generating device. Through the stacked design of the heat-conducting component 11 and the heat dissipation component 12, the problem of insufficient heat dissipation performance of a single aluminum extrusion structure heat sink is effectively solved. The heat-conducting component 11 is used for rapid heat collection and conduction, while the heat dissipation component 12 is used for efficient heat dissipation, forming a heat conduction path with clear functional division. Furthermore, the stacked structure design of the heat dissipation component 10 improves the heat conduction efficiency. The direct contact between the heat-conducting component 11 and the heat-generating device ensures that heat can be quickly transferred from the heat source to the heat dissipation system. The design arrangement of the heat dissipation component 12 to receive conducted heat and dissipate heat outwards achieves efficient heat release by increasing the heat dissipation surface area.
[0039] This application also provides an embodiment of a graphics card (not shown), which includes the motherboard, heat-generating device and heat dissipation device 100 described above. The heat-generating device is disposed on the motherboard, and the fixing component 20 is used to fix the heat dissipation component 10 to the heat-generating device.
[0040] This application also provides embodiments of an electronic device (not shown in the figures), which includes the heat dissipation device 100 or a graphics card as described above. For the specific structure and function of the electronic device, please refer to the above embodiments, which will not be repeated here.
[0041] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. A heat dissipation device, characterized in that, include: A heat dissipation assembly includes a heat-conducting component and a heat-dissipating component, wherein the heat-dissipating component is stacked with the heat-conducting component and the heat-conducting component is welded together. The thermal conductivity of the heat-conducting component is greater than that of the heat-dissipating component. The surface of the heat-conducting component facing away from the heat-dissipating component is used to attach a heat-generating device. The heat-conducting component is used to conduct heat from the heat-generating device to the heat-dissipating component, and the heat-dissipating component is used to dissipate the received heat outward. A fixing component is used to fix the heat dissipation component to the heat-generating device.
2. The heat dissipation device according to claim 1, characterized in that, The heat dissipation component includes a heat dissipation body and multiple heat dissipation fins. The multiple heat dissipation fins are disposed on the heat dissipation body and are spaced apart. The heat-conducting component is welded to the surface of the heat dissipation body opposite to the multiple heat dissipation fins.
3. The heat dissipation device according to claim 2, characterized in that, The heat dissipation body has mounting posts on its surface away from the plurality of heat dissipation fins. The heat-conducting component is provided with a mounting hole, and a mounting post is inserted into one of the mounting holes.
4. The heat dissipation device according to claim 3, characterized in that, The end of the mounting post furthest from the heat dissipation body is provided with a screw hole; The fixing assembly includes a bolt and an elastic element. The bolt's shank passes through the main board that carries the heating device and is screwed into the bolt hole. The elastic element is sleeved on the bolt's shank, with one end of the elastic element abutting against the back of the main body away from the heating device, and the other end of the elastic element abutting against the bolt's nut.
5. The heat dissipation device according to claim 4, characterized in that, The fixing component also includes a washer, which is sleeved on the bolt thread and is used to attach to the back of the motherboard away from the heat-generating device. One end of the elastic element is used to abut against the washer.
6. The heat dissipation device according to claim 4, characterized in that, The number of mounting posts and mounting holes is multiple, and the multiple mounting holes are respectively provided at the corners of the heat-conducting component, with one mounting post inserted into one mounting hole; The number of fixing components is multiple, and the bolt of one fixing component is used to pass through the motherboard that carries the heating device and then screw into the screw hole of one of the mounting posts.
7. The heat dissipation device according to claim 2, characterized in that, The heat dissipation assembly also includes a fan, which is disposed on the other surface of the heat dissipation component opposite to the heat conduction component, and the plurality of heat dissipation fins are arranged around the fan.
8. The heat dissipation device according to any one of claims 1-7, characterized in that, The heat-conducting component is a copper sheet; The heat dissipation component is made of aluminum.
9. A graphics card, characterized in that, include: Motherboard; The heating element is mounted on the motherboard; The heat dissipation device according to any one of claims 1-8, wherein the fixing component is used to fix the heat dissipation component to the heat-generating device.
10. An electronic device, characterized in that, It includes the heat dissipation device as described in any one of claims 1-8, or the graphics card as described in claim 9.