Industrial computer with heat dissipation air guide structure

By installing fan components and heat dissipation components inside the air guide shroud of the industrial computer, efficient heat conduction and natural heat dissipation are achieved, solving the problems of low efficiency, large size and unsightly appearance of existing industrial computer heat dissipation methods, improving heat dissipation efficiency and preventing system crashes.

CN224536457UActive Publication Date: 2026-07-21SHENZHEN JIHECHENG TECH DEV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN JIHECHENG TECH DEV
Filing Date
2025-07-22
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

Existing industrial computer cooling methods suffer from low efficiency, large size, unsightly appearance, and safety issues, especially under high load and extreme environments, which can easily lead to system crashes or hardware damage.

Method used

The design incorporates a fan assembly and heat dissipation components within the air guide shroud. Air is delivered through the fan assembly inside the shroud, and combined with heat exchange from the heat dissipation components, heat is conducted from the lower cavity to the upper cavity. Heat is then naturally dissipated through the air vents on the air guide shroud. This design avoids external fan assembly placement, maintaining aesthetics while improving heat dissipation efficiency.

Benefits of technology

It effectively improves heat dissipation, avoids the size and aesthetic issues caused by external fan assembly, and enhances heat dissipation efficiency to prevent system crashes and hardware damage.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model discloses an industrial control computer with a heat dissipation and airflow guiding structure, including an airflow guide shroud with an internal cavity, a heat dissipation component disposed in the cavity and dividing the cavity into an upper cavity and a lower cavity, a heat source disposed in the lower cavity, and a fan assembly disposed in the upper cavity but not on the heat dissipation component. The cavity is connected to the outside of the airflow guide shroud through air vents. The heat dissipation component is used to exchange heat dissipated by the heat source to the upper cavity, and the fan assembly is used to blow air into the upper cavity, so that the cold air outside the airflow guide shroud flows through the upper cavity and then flows out to the outside of the airflow guide shroud. This utility model, by placing the fan assembly and the heat dissipation component inside the airflow guide shroud, blows the cold air outside onto the heat dissipation component for heat exchange. The hot airflow formed by the heat exchange flows out through the air vents of the airflow guide shroud located in the upper cavity. It eliminates the need to place the fan assembly on the outside of the industrial control computer, resulting in better aesthetics. Furthermore, since the fan assembly is not placed on the heat dissipation component, it does not obstruct the flow of cold air on the heat dissipation component, effectively improving the heat dissipation effect.
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Description

Technical Field

[0001] This utility model relates to the field of industrial control computer heat dissipation technology, and in particular to an industrial control computer with a heat dissipation airflow structure. Background Technology

[0002] Industrial PCs typically operate under high loads, extreme high or low temperatures, such as on highways, production lines, data centers, or environmental monitoring equipment. Overheating, whether caused by environmental or machine heat, can have a significant impact on the machine. Therefore, the design must consider system crashes or hardware damage caused by machine overheating, making thermal management crucial.

[0003] The most common heat dissipation methods for industrial control computers are natural cooling and fan cooling. Natural cooling involves the heat source conducting heat to the heat sink casing, which is usually made of aluminum with a very large surface area in contact with the air. The heat is naturally dissipated into the air through the surface of the heat sink casing in contact with the air. However, this type of heat dissipation is relatively slow and is not suitable for high-power, small-sized industrial control computers that generate a lot of heat.

[0004] Fan cooling involves adding a fan to the outside of the existing heatsink casing. This installation method results in a larger overall size, which is not aesthetically pleasing and is also unsafe because the fan is outside the heatsink casing. Some cooling fans are made by cutting off part of the heatsink casing's cooling blades to create a groove for embedding the cooling fan. However, in this design, the uncut parts of the cooling blades will obstruct the airflow and affect the cooling effect. Utility Model Content

[0005] The purpose of this invention is to provide an industrial control computer with a heat dissipation and airflow structure, aiming to solve at least one of the above-mentioned technical problems.

[0006] To solve the above-mentioned technical problems, the purpose of this utility model is achieved through the following technical solution: providing an industrial control computer with a heat dissipation and airflow guiding structure, comprising:

[0007] An air guide cover has an internal cavity, which is connected to the outside of the air guide cover through air holes;

[0008] A heat dissipation component is disposed in the cavity and divides the cavity into an upper cavity and a lower cavity. The heat dissipation component includes an upper surface located in the upper cavity and a lower surface located in the lower cavity.

[0009] A heat source is disposed in the lower cavity, and the heat dissipation component is used to exchange the heat emitted by the heat source to the upper cavity;

[0010] A fan assembly is disposed in the upper cavity and is used to supply air to the upper cavity, so that the cold air outside the air guide shroud flows through the upper cavity and then flows out to the outside of the air guide shroud, and the fan assembly is not disposed on the heat dissipation component.

[0011] Furthermore, the air guide shroud includes a top plate and at least one side plate, the top plate, the heat dissipation component, and the at least one side plate constitute the upper cavity, and the fan assembly is disposed on the top plate.

[0012] Furthermore, the air vent includes at least one side air vent disposed on the at least one side plate.

[0013] Furthermore, the upper surface of the heat dissipation component is provided with heat dissipation fins.

[0014] Furthermore, the heat dissipation fins are provided with recesses, and when viewed along the airflow direction of the fan assembly, the recesses at least partially overlap with the fan assembly.

[0015] Furthermore, when viewed along the airflow direction, the recess completely overlaps with the fan assembly, and the extension direction of the heat dissipation fins is perpendicular to the airflow direction.

[0016] Furthermore, the concave portion is circular in shape.

[0017] Furthermore, it also includes a thermally conductive component, which is in close contact with the lower surface of the heat dissipation component via thermally conductive silicone grease, and the heat source is thermally conducted to the thermally conductive component via the thermally conductive silicone grease.

[0018] Furthermore, the heat-conducting component is a heat-conducting copper block or heat-conducting silicone.

[0019] Furthermore, the air vent includes an upper air vent disposed on the top plate.

[0020] This utility model provides an industrial control computer with a heat dissipation and airflow guiding structure. By placing the fan assembly and heat dissipation component inside the airflow guide cover, the heat source can be conducted to the upper cavity through the heat exchange effect of the heat dissipation component, and then naturally dissipated to the outside through the air vents on the airflow guide cover. At the same time, by activating the fan assembly, external cold air can be blown onto the heat dissipation component for heat exchange. The hot airflow generated by the heat exchange flows out through the air vents located in the upper cavity of the airflow guide cover. This eliminates the need to install the fan assembly on the outside of the industrial control computer, resulting in better aesthetics. Furthermore, since the fan assembly is not located on the heat dissipation component, it does not obstruct the flow of cold air on the heat dissipation component, effectively improving the heat dissipation effect. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the overall structure of the industrial control computer provided in an embodiment of the present utility model;

[0023] Figure 2 A cross-sectional structural schematic diagram of an industrial control computer provided in an embodiment of this utility model;

[0024] Figure 3 A schematic diagram of the heat dissipation component provided in an embodiment of this utility model.

[0025] Explanation of the markings in the image:

[0026] 1. Air guide hood; 11. Upper cavity; 12. Lower cavity; 13. Top plate; 14. Side plate; 15. Side air vent;

[0027] 2. Fan assembly;

[0028] 3. Heat dissipation components; 31. Heat dissipation fins; 32. Recess;

[0029] 4. Thermally conductive components;

[0030] 5. Heat source. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0032] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0033] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0034] It should also be further understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0035] Please see Figures 1 to 3 This embodiment provides an industrial control computer with a heat dissipation and airflow guiding structure, which includes an airflow guide shroud 1, a heat dissipation component 3, a heat source 5, and a fan assembly 2. Among them,

[0036] The air guide shroud 1 has an internal cavity, which is connected to the outside of the air guide shroud 1 through air holes;

[0037] A heat dissipation component 3 is disposed in the cavity and divides the cavity into an upper cavity 11 and a lower cavity 12. The heat dissipation component 3 includes an upper surface located in the upper cavity 11 and a lower surface located in the lower cavity 12.

[0038] The heat source 5 is disposed in the lower cavity 12, and the heat dissipation component 3 is used to exchange the heat emitted by the heat source 5 to the upper cavity 11.

[0039] The fan assembly 2 is disposed in the upper cavity 11 and is used to supply air to the upper cavity 11, so that the cold air outside the air guide shroud 1 flows through the upper cavity 11 and then flows out to the outside of the air guide shroud 1, and the fan assembly 2 is not disposed on the heat dissipation component 3.

[0040] It should be clarified that in this embodiment, the air guide shroud 1 is usually the outer shell of the industrial control computer, the fan assembly 2 is a commonly used cooling fan in the art, and the heat source 5 is a heat-generating component of the industrial control computer, which will not be described in detail here.

[0041] Therefore, in this embodiment, by placing the fan assembly 2 and the heat dissipation component 3 inside the air guide shroud 1, the heat source 5 can conduct heat to the upper cavity 11 through the heat exchange effect of the heat dissipation component 3, and then naturally dissipate heat outward through the air holes on the air guide shroud 1. At the same time, by activating the fan assembly 2, external cold air can be blown onto the heat dissipation component 3 for heat exchange. The hot airflow formed by the heat exchange flows out through the air holes on the air guide shroud 1 located in the upper cavity 11. In this way, the fan assembly 2 does not need to be placed outside the industrial control computer, which is more aesthetically pleasing. Since the fan assembly 2 is not placed on the heat dissipation component 3, it will not obstruct the flow of cold air on the heat dissipation component 3, thus effectively improving the heat dissipation effect.

[0042] In a further embodiment, the air guide shroud 1 includes a top plate 13 and at least one side plate 14. The top plate 13, the heat dissipation component 3, and the at least one side plate 14 constitute the upper cavity 11. The fan assembly 2 is disposed on the inner top surface of the top plate 13 for supplying air to the upper cavity 11 and directing the airflow toward the heat dissipation component 3. Of course, the fan assembly 2 can also be disposed on the side plate 14.

[0043] Furthermore, the air vents include at least one side air vent 15 disposed on at least one side plate 14 and at least one top air vent disposed on the top plate 13. The upper surface of the heat dissipation component 3 is provided with heat dissipation fins 31, and the heat dissipation fins 31 are provided with recesses 32. When viewed along the air delivery direction of the fan assembly 2, the recesses 32 at least partially overlap with the fan assembly 2.

[0044] Specifically, multiple side air vents 15 are provided on each side plate 14. Multiple top air vents are also provided, with some located in the air intake path of the fan assembly 2, specifically on the top plate 13 on the side of the fan assembly 2 facing away from the heat sink 3. The remaining top air vents are located on the top plate 13 in areas other than the fan assembly 2.

[0045] With this configuration, the airflow blown out by the fan assembly 2 can first be blown into the recess 32, and then flow from the recess 32 into the gaps of the heat dissipation fins 31. It then flows along the gaps of the heat dissipation fins 31 to the side air holes 15 on the side plate 14, and flows out of the air guide shroud 1 through the side air holes 15. This makes the airflow path controllable, so that each heat dissipation fin 31 can receive airflow evenly, and can concentrate the airflow to remove the heat from the heat dissipation component 3, thereby enhancing the heat dissipation effect.

[0046] In a further embodiment, the recess 32 is circular in shape, and when viewed along the airflow direction, the recess 32 completely overlaps with the fan assembly 2, and the extending direction of the heat dissipation fins 31 is perpendicular to the airflow direction. This allows the airflow blown by the fan assembly 2 to more fully enter the recess 32 and be evenly distributed to each heat dissipation fin 31.

[0047] In addition, the heat dissipation and airflow structure also includes a heat-conducting component 4. The heat-conducting component 4 is in close contact with the lower surface of the heat dissipation component 3 through thermally conductive silicone grease. The heat source 5 is thermally conducted to the heat-conducting component 4 through the thermally conductive silicone grease. The thermal conductivity of the heat-conducting component 4 is better than that of the heat dissipation component 3. In this embodiment, the heat-conducting component 4 is a thermally conductive copper block. This design can effectively enhance the thermal conductivity and heat dissipation efficiency of the heat dissipation component 3.

[0048] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. An industrial control computer with a heat dissipation and airflow guiding structure, characterized in that, include: The air guide shroud (1) has an internal cavity, and the cavity is connected to the outside of the air guide shroud (1) through air holes; A heat dissipation component (3) is disposed in the cavity and divides the cavity into an upper cavity (11) and a lower cavity (12). The heat dissipation component (3) includes an upper surface located in the upper cavity (11) and a lower surface located in the lower cavity (12). A heat source (5) is disposed in the lower cavity (12), and the heat dissipation component (3) is used to exchange the heat emitted by the heat source (5) to the upper cavity (11); The fan assembly (2) is disposed in the upper cavity (11) and is used to supply air to the upper cavity (11), so that the cold air outside the air guide shroud (1) flows through the upper cavity (11) and then flows out to the outside of the air guide shroud (1), and the fan assembly (2) is not disposed on the heat dissipation component (3).

2. The industrial control computer with a heat dissipation and airflow structure according to claim 1, characterized in that: The air guide shroud (1) includes a top plate (13) and at least one side plate (14). The top plate (13), the heat dissipation component (3), and the at least one side plate (14) constitute the upper cavity (11). The fan assembly (2) is disposed on the top plate (13).

3. The industrial control computer with a heat dissipation and airflow guiding structure according to claim 2, characterized in that: The air vents include at least one side air vent (15) disposed on at least one side plate (14).

4. The industrial control computer with a heat dissipation and airflow guiding structure according to claim 1, characterized in that: The upper surface of the heat dissipation component (3) is provided with heat dissipation fins (31).

5. The industrial control computer with a heat dissipation and airflow guiding structure according to claim 4, characterized in that; The heat dissipation fins (31) are provided with recesses (32), and when viewed along the airflow direction of the fan assembly (2), the recesses (32) at least partially overlap with the fan assembly (2).

6. The industrial control computer with a heat dissipation and airflow guiding structure according to claim 5, characterized in that: When viewed along the airflow direction, the recess (32) completely overlaps with the fan assembly (2), and the extension direction of the heat dissipation fins (31) is perpendicular to the airflow direction.

7. The industrial control computer with a heat dissipation and airflow guiding structure according to claim 5 or 6, characterized in that: The recess (32) is circular in shape.

8. The industrial control computer with a heat dissipation and airflow guiding structure according to claim 1, characterized in that: It also includes a heat-conducting component (4), which is attached to the lower surface of the heat dissipation component (3) by thermal grease, and the heat source (5) is thermally conducted to the heat-conducting component (4) by thermal grease.

9. The industrial control computer with a heat dissipation and airflow guiding structure according to claim 1, characterized in that: The heat-conducting component (4) is a heat-conducting copper block.

10. The industrial control computer with a heat dissipation and airflow guiding structure according to claim 2, characterized in that: The air vents include at least one upper air vent disposed on the top plate (13).