A straight tower type double-tower CPU radiator convenient to disassemble

Abstract

The utility model discloses a convenient dismounting's straight tower type double -tower CPU radiator, including with CPU surface adhesion's heat conduction subassembly, be equipped with the cooling assembly and second fan for promoting air circulation on it, be equipped with the top cap on second fan, the tool -free dismounting of first fan and heat dissipation fin group is connected through the buckle type fastener, need not manually break down fragile component, and the operation threshold is low, and the novice can also easily complete, and the tool dependence and component damage risk are avoided simultaneously, first fan supports the height adjustment of multiple gears up and down, can be according to the height flexible adaptation of memory stick etc. peripheral hardware, need not because hardware size conflict adjusts the overall structure of this CPU radiator, adapts different computer hardware configuration scene, when replacing or installing memory etc. hardware, need not to dismount heat conduction subassembly, just need to adjust first fan to be able to vacate operation space, and the maintenance time is greatly shortened, and the maintenance difficulty is reduced.

Description

Technical Field

[0001] This utility model relates to the field of CPU heat sink technology, and in particular to a straight-tower dual-tower CPU heat sink that is easy to disassemble and assemble. Background Technology

[0002] CPUs generate a lot of heat during operation. If the heat cannot be dissipated in a timely and effective manner, it can easily lead to instability in the computer system, or even cause crashes and hardware damage. Therefore, high-performance CPU coolers have become a key component in computer hardware configurations.

[0003] For example, patent document CN222105917U discloses a novel CPU cooler that employs a dual-tower heatsink structure. In this dual-tower heatsink, both heat pipes on a single heat pipe are located on the same fin module. Utilizing the bending characteristics of the heat pipes, the bending radius and number of bends are minimized. Furthermore, the heat pipes are arranged within the optimal airflow area for the fan, improving not only cooling performance but also motherboard installation compatibility and preventing obstruction of memory lighting effects. The installation utilizes a mounting bracket assembly, making installation simple, convenient, and secure.

[0004] However, the CPU cooler fan is fixed to the heatsink fins of the fin assembly by wire clips. When disassembling and assembling, the wires must be pried open by hand, which is difficult for beginners and can easily damage the wire clips. Furthermore, some space is required when dealing with the fan and wire clips, which is inconvenient when the internal space of the case is small.

[0005] To address this, a convenient vertical dual-tower CPU cooler is proposed. Utility Model Content

[0006] The purpose of this invention is to provide a convenient vertical dual-tower CPU cooler to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the main technical solutions adopted by this utility model include:

[0008] A conveniently detachable dual-tower CPU cooler includes a heat-conducting component that adheres to the CPU surface, a cooling component for promoting airflow, and a second fan. The second fan has a top cover.

[0009] The cooling component is slidably snapped to the side of the heat-conducting component. The second fan is located at the center of the heat-conducting component and is fixedly connected to the bottom of the top cover by screws. The top cover is detachably connected to the top of the heat-conducting component.

[0010] The cooling component includes a first fan located on the outer surface of the heat-conducting component, and two fasteners arranged symmetrically on one side of the first fan.

[0011] The fastener includes a connecting plate that is fixedly connected to the side of the first fan facing the heat conduction component by screws. A side plate is integrally formed on the connecting plate, and a hook is integrally formed on the side of the side plate away from the connecting plate. The heat conduction component is provided with a slot that matches the hook. The hook is engaged in the slot and is slidably connected to the inner wall of the slot.

[0012] As a preferred technical solution, the heat conduction component includes a base that is attached to the surface of the CPU. A set of heat conduction pipes is fixedly connected to both sides of the base. Each set of heat conduction pipes has multiple components. Each set of heat conduction pipes is equipped with a heat dissipation fin group. A top plate is installed on the top of the two heat dissipation fin groups. The top cover is fastened to the top of the top plate.

[0013] As a preferred technical solution, the second fan is placed between two heat dissipation fin groups, and a through hole is provided on the top plate for the second fan to pass through. The first fan is located on the side of the heat dissipation fin group, and the inner side of the side plate is in contact with the adjacent heat dissipation fin group.

[0014] As a preferred technical solution, the top cover and the top plate are disassembled and installed using magnetic attachments.

[0015] As a preferred technical solution, the card slots are provided on the front and rear sides of the heat dissipation fin assembly, and each set of card slots has two slots arranged symmetrically on the left and right, with the hooks engaging with the inner cavity of the adjacent card slots.

[0016] As a preferred technical solution, a set of protrusions is integrally formed on both sides of the top plate, and a set of grooves adapted to the protrusions are opened on the side of the connecting plate facing the top plate. Each set of grooves is arranged in a one-to-one correspondence with each set of protrusions, and the protrusions are engaged in the inner cavity of the corresponding grooves.

[0017] As a preferred technical solution, each group of protrusions has two symmetrically arranged along the front-back direction, and the grooves have at least three arranged along the up-down direction. The cross-sections of both the protrusions and the grooves are semi-circular.

[0018] As a preferred technical solution, the included angle between the hook and the side plate is less than 90°.

[0019] As a preferred technical solution, the second fan and the top cover are powered by a contact-type power supply.

[0020] This utility model has at least the following beneficial effects:

[0021] This application utilizes a tool-free assembly and disassembly method that connects the first fan and the heatsink fin assembly via snap-fit ​​fasteners. This eliminates the need to manually manipulate fragile components, making it easy for even beginners to operate and avoiding reliance on tools and the risk of component damage. The first fan supports multiple height adjustments, allowing for flexible adaptation to the height of peripheral hardware such as memory modules. This eliminates the need to adjust the overall structure of the CPU cooler due to hardware size conflicts, adapting to various computer hardware configurations. When replacing or installing hardware such as memory, there is no need to disassemble the heat-conducting components; simply adjusting the first fan creates operating space, significantly reducing maintenance time and difficulty. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of this utility model;

[0023] Figure 2 This is an exploded view of the structure of this utility model;

[0024] Figure 3 This is an exploded view of the CPU and heat-conducting components of this utility model.

[0025] Figure 4 This is an exploded view of the cooling component of this utility model;

[0026] Figure 5 This is a top view schematic diagram of the cooling component and heat dissipation fin assembly of this utility model;

[0027] Figure 6 For the present utility model Figure 2 Enlarged structural diagram at point A in the middle;

[0028] Figure 7 For the present utility model Figure 5 Enlarged structural diagram at point B.

[0029] In the diagram: 1. CPU; 100. Heat dissipation component; 110. Base; 120. Heat pipe; 130. Heat sink fin assembly; 131. Slot; 140. Top plate; 141. Protrusion; 200. Cooling component; 210. First fan; 220. Fastener; 221. Connecting plate; 2211. Groove; 222. Side plate; 2221. Hook; 300. Second fan; 400. Top cover. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] Please see Figures 1-7 This utility model provides a conveniently detachable dual-tower CPU cooler, including a heat-conducting component 100 that is attached to the surface of the CPU 1, a cooling component 200 and a second fan 300 for promoting airflow, and a top cover 400. The cooling component 200 and the second fan 300 are both mounted on the heat-conducting component 100, and the top cover 400 is mounted on the second fan 300. The cooling component 200 is slidably snapped to the side of the heat-conducting component 100. The second fan 300 is positioned at the center of the heat-conducting component 100 and is fixedly connected to the bottom of the top cover 400 by screws. The top cover 400 is detachably connected to the top of the heat-conducting component 100. The screw fixing of the second fan 300 to the top cover 400 and the detachable connection of the top cover 400 to the heat-conducting component 100 ensure the stable installation of the second fan 300 and facilitate subsequent installation of the second fan 300. The system provides convenience for inspection and maintenance. The cooling component 200 includes a first fan 210 located on the outer surface of the heat conduction component 100. Two fasteners 220 are symmetrically arranged on one side of the first fan 210. The fasteners 220 include a connecting plate 221 fixedly connected to the side of the first fan 210 facing the heat conduction component 100 by screws. A side plate 222 is integrally formed on the connecting plate 221. A hook 2221 is integrally formed on the side of the side plate 222 away from the connecting plate 221. The heat conduction component 100 is provided with a slot 131 that matches the hook 2221. The hook 2221 is fastened in the slot 131 and slidably connected to the inner wall of the slot 131. The snap-fit ​​fasteners that match the hook 2221 with the slot 131 replace the traditional wire fasteners, making it easy to assemble and disassemble the cooling component 200 and the heat conduction component 100 and reducing the difficulty of operation.

[0032] The heat-conducting component 100 includes a base 110 that is attached to the surface of the CPU1. A set of heat-conducting pipes 120 are fixedly connected to both sides of the base 110. Each set of heat-conducting pipes 120 has multiple heat-conducting pipes, and each set of heat-conducting pipes 120 is equipped with a heat dissipation fin group 130. A top plate 140 is mounted on the top of the two heat dissipation fin groups 130. A top cover 400 is fastened to the top of the top plate 140. The base 110 is directly attached to the CPU1, which can quickly receive the heat generated by the CPU1, laying an efficient foundation for heat conduction. The heat-conducting pipes 120 and the heat dissipation fin groups 130 work together to disperse the heat transferred by the base 110 onto the large-area fins, expanding the contact range between the heat and the air and improving the heat dissipation efficiency. The top plate 140 integrates the two heat dissipation fin groups 130, enhancing the overall structural stability of the heat-conducting component 100, and at the same time providing a reliable mounting carrier for the top cover 140 to prevent the component from becoming loose.

[0033] The base 110 is made of aluminum, and the heat pipe 120 is made of copper. Aluminum and copper have better instantaneous heat absorption capacity than other metals or alloys, which helps the base 110 and heat pipe 120 to quickly absorb heat from the surface of CPU1.

[0034] The second fan 300 is placed between two heat dissipation fin groups 130. A through hole is provided on the top plate 140 for the second fan 300 to pass through. The first fan 210 is located on the side of the heat dissipation fin group 130. The inner side of the side plate 222 is in contact with the adjacent heat dissipation fin group 130. The second fan 300 is located between the two heat dissipation fin groups 130 and can directly drive the air circulation between the two groups of fins, breaking the local hot air accumulation and improving the heat dissipation uniformity. The first fan 210 is set on the side of the heat dissipation fin group 130 to accelerate the side airflow and specifically remove the heat from the fin surface. It forms a three-dimensional heat dissipation airflow between the side and the center with the second fan 300, which enhances the overall heat dissipation effect. The side plate 222 is in contact with the heat dissipation fin group 130, which not only plays a positioning role for the fastener 220 to prevent the first fan 210 from being installed off-center, but also enhances the stability of the first fan 210 during operation and reduces shaking noise.

[0035] The top cover 400 and the top plate 140 are detached and installed using magnetic attachments. The magnetic connection requires no additional tools; the top cover can be detached and installed simply by adsorption and separation. The operation is quick and convenient, which greatly improves the efficiency of the maintenance and replacement of the second fan 300. The magnetic attachments can ensure the fit and stability of the top cover 400 after installation, preventing the top cover 400 from loosening and causing vibration and noise during the operation of the CPU cooler. At the same time, it simplifies the connection structure between the top cover 400 and the heat conduction component 100.

[0036] The slots 131 are provided on the front and rear sides of the heat dissipation fin assembly 130, with two slots 131 arranged symmetrically on the left and right sides. Hooks 2221 are fastened to the inner cavity of the adjacent slots 131. The slots 131 are symmetrically arranged on the front and rear sides of the heat dissipation fin assembly 130. With the symmetrical hooks 2221 of the first fan 210, the fixing points of the first fan 210 on the heat dissipation fin assembly 130 are evenly distributed and the force is balanced. The cooperation of multiple slots 131 and hooks 2221 avoids the shaking and displacement of the first fan 210 due to the force on one side during operation, improves the reliability of the connection between the first fan 210 and the heat dissipation fin assembly 130, and ensures stable heat dissipation airflow.

[0037] The top plate 140 has a set of protrusions 141 integrally formed on both sides. The connecting plate 221 has a set of grooves 2211 adapted to the protrusions 141 on the side facing the top plate 140. Each set of grooves 2211 is set one-to-one with each set of protrusions 141. The protrusions 141 are engaged with the inner cavity of the corresponding grooves 2211. The one-to-one engagement of the protrusions 141 and the grooves 2211, based on the connection between the hooks 2221 and the slots 131, further restricts the lateral displacement of the connecting plate 221, avoids the first fan 210 from shifting left or right during adjustment or operation, and can also play an auxiliary positioning role, ensuring that the first fan 210 can be accurately aligned with the target position during installation, reducing the impact of installation deviation on the heat dissipation effect.

[0038] Each set of protrusions 141 consists of two symmetrically arranged protrusions along the front-to-back direction, and at least three grooves 2211 are arranged along the vertical direction. The cross-sections of both the protrusions 141 and the grooves 2211 are semi-circular. The multiple grooves 2211 arranged along the vertical direction provide the first fan 210 with multiple height adjustment spaces, which can be flexibly adapted to the height of hardware such as memory modules, solving the compatibility problem of traditional fans with fixed height that cannot be adjusted. The semi-circular cross-section design makes the engagement and disengagement process of the protrusions 141 and the grooves 2211 smoother, reducing the feeling of jamming during adjustment, while avoiding component wear caused by sharp structures and extending the service life of the components.

[0039] The angle between the hook 2221 and the side plate 222 is less than 90°. The angle of less than 90° makes the hook 2221 form a natural guide slope. When the hook 2221 contacts the heat dissipation fin assembly 130, the slope can guide the side plate 222 to deform appropriately, and the fastening can be completed without pressing or prying, which simplifies the installation operation. After fastening, the angle structure of less than 90° can enhance the locking effect between the hook 2221 and the slot 131, prevent the hook 2221 from falling off due to vibration or accidental contact of the first fan 210, and improve the connection stability.

[0040] The second fan 300 and the top cover 400 are connected by a contact power supply method; no additional power supply cables are required. This design not only meets the detachable connection requirements of the top cover 400, such as magnetic detachment, avoiding cable tangling that affects the efficiency of detachment, but also provides stable power supply to the power modules (such as lighting control chips) or lighting components (such as RGB light strips) on the top cover 400, taking into account both convenience and functional requirements.

[0041] The working principle of this utility model is as follows: the heat generated by the CPU during operation is first transferred to the base 110 that is in close contact with it. The base 110 quickly conducts the heat to the heat pipes 120 on both sides. With its efficient heat conduction characteristics, the heat pipes 120 evenly distribute the heat to the heat dissipation fin groups 130 connected to each other. Through the large area structure of the heat dissipation fin group 130, the heat is fully contacted with the air.

[0042] Subsequently, the first fan 210 and the second fan 300 start simultaneously. The first fan 210 accelerates the side airflow, quickly removing heat from the surface of the fins and forming a side cooling airflow. The second fan 300 drives the air circulation between the two heat dissipation fin groups 130, breaking the stagnation of hot air in the central area and further improving the heat dissipation efficiency. The two work together to build a three-dimensional heat dissipation system with side guidance and central circulation.

[0043] The top cover 400 is fixed to the top of the heat conduction component 100 by a detachable connection (such as magnetic attraction). On the one hand, it protects the second fan 300 from dust accumulation or external impact; on the other hand, it helps to regulate the airflow direction and reduce heat loss caused by airflow turbulence.

[0044] When the first fan 210 needs to be adjusted, no tools are needed. Simply slide the first fan 210 up or down to disengage the protrusion 141 from the current groove 2211 and insert it into the groove 2211 at the target height to achieve precise positioning and adapt to different hardware space requirements.

[0045] All parts not described in this utility model are the same as or can be implemented using existing technology. Although embodiments of this utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this utility model, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A conveniently assembled and disassembled vertical dual-tower CPU cooler, characterized in that, Includes a heat-conducting component (100) attached to the surface of the CPU (1), on which a cooling component (200) for promoting airflow and a second fan (300) are provided, the second fan (300) having a top cover (400), wherein: The cooling component (200) is slidably snapped to the side of the heat conduction component (100), the second fan (300) is placed at the center of the heat conduction component (100) and is fixedly connected to the bottom of the top cover (400) by screws, and the top cover (400) is detachably connected to the top of the heat conduction component (100). The cooling component (200) includes a first fan (210) located on the outer surface of the heat conduction component (100), and two fasteners (220) are provided on one side of the first fan (210) in a symmetrical arrangement. The fastener (220) includes a connecting plate (221) fixedly connected to the side of the first fan (210) facing the heat conduction assembly (100) by screws. A side plate (222) is integrally formed on the connecting plate (221). A hook (2221) is integrally formed on the side of the side plate (222) away from the connecting plate (221). The heat conduction assembly (100) is provided with a slot (131) adapted to the hook (2221). The hook (2221) is fastened in the slot (131) and slidably connected to the inner wall surface of the slot (131).

2. The easily detachable dual-tower CPU cooler according to claim 1, characterized in that: The heat-conducting component (100) includes a base (110) that is attached to the surface of the CPU (1). A set of heat-conducting pipes (120) are fixedly connected to both sides of the base (110). Each set of heat-conducting pipes (120) has multiple components. Each set of heat-conducting pipes (120) is equipped with a heat dissipation fin group (130). A top plate (140) is installed on the top of the two heat dissipation fin groups (130). The top cover (400) is fastened to the top of the top plate (140).

3. The easily detachable dual-tower CPU cooler according to claim 2, characterized in that: The second fan (300) is placed between two heat dissipation fin groups (130). The top plate (140) has a through hole for the second fan (300) to pass through. The first fan (210) is located on the side of the heat dissipation fin group (130). The inner side of the side plate (222) is in contact with the adjacent heat dissipation fin group (130).

4. The easily detachable dual-tower CPU cooler according to claim 2, characterized in that: The top cover (400) and the top plate (140) can be disassembled and installed via magnetic attachment.

5. The easily detachable dual-tower CPU cooler according to claim 2, characterized in that: The slots (131) are provided on the front and rear sides of the heat dissipation fin assembly (130), and each set of slots (131) has two slots arranged symmetrically on the left and right. The hooks (2221) are fastened to the inner cavity of the adjacent slots (131).

6. The easily detachable dual-tower CPU cooler according to claim 2, characterized in that: Both sides of the top plate (140) are integrally formed with a set of protrusions (141). The connecting plate (221) facing the top plate (140) has a set of grooves (2211) that are adapted to the protrusions (141). Each set of grooves (2211) is arranged in a one-to-one correspondence with each set of protrusions (141). The protrusions (141) are engaged in the inner cavity of the corresponding grooves (2211).

7. The easily detachable dual-tower CPU cooler according to claim 6, characterized in that: Each group of protrusions (141) has two symmetrically arranged along the front-to-back direction, and the grooves (2211) have at least three arranged along the up-down direction. The cross-sections of both the protrusions (141) and the grooves (2211) are semi-circular.

8. The easily detachable dual-tower CPU cooler according to claim 1, characterized in that: The included angle between the hook (2221) and the side plate (222) is less than 90°.

9. The easily detachable dual-tower CPU cooler according to any one of claims 1-8, characterized in that: The second fan (300) and the top cover (400) are powered by a contact-type power supply.

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