A heat dissipation structure of a compact cloud desktop terminal

Abstract

The utility model relates to compact cloud desktop terminal heat dissipation technical field especially relates to a kind of heat dissipation structure of compact cloud desktop terminal, including compact cloud desktop terminal ontology, the access hole at the bottom of compact cloud desktop terminal ontology is provided with the bottom plate of adaptation, short stud for terminal box stable placement is fixedly arranged in the four corners of bottom plate bottom, the outer wall of compact cloud desktop terminal ontology is fixedly provided with cover, the top of cover integrally formed has a row of top heat dissipation fins, the side wall around cover is integrally formed with corresponding one row of side heat dissipation fins;Cover is composed of high thermal conductivity base material, pretreatment layer for improving surface roughness and corrosion-resistant oxidation layer from inside to outside in turn.The utility model is through the composite design of high thermal conductivity base material, three-dimensional fin and double coating, 6061T6 aluminum alloy base material guarantees heat rapid conduction, fin and sandblasting layer enlarge heat exchange area, anodic oxidation layer gives consideration to heat dissipation and protection, improves terminal long-term operation stability.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for compact cloud desktop terminals, and in particular to a heat dissipation structure for a compact cloud desktop terminal. Background Technology

[0002] Compact cloud desktop terminals are commonly used in office and light data processing scenarios. These terminals have high requirements for dust protection in their operating environment to prevent dust from entering and affecting the normal operation of chips and circuit boards. Currently, to meet dust protection requirements, most compact cloud desktop terminals adopt an all-metal enclosed chassis, and some even use seamless welding technology to further improve the chassis's sealing performance and reduce the possibility of dust ingress.

[0003] However, this all-metal enclosed structure makes it difficult for the heat generated inside the terminal to dissipate outwards. The heat generated by components such as the CPU, memory, and interface control chips during operation is prone to accumulate inside the device. When the temperature rises, it can cause the terminal to lag, reduce its performance frequency, and in severe cases, even crash, affecting the normal use of the terminal.

[0004] To address the aforementioned issues, this utility model document proposes a heat dissipation structure for a compact cloud desktop terminal. Utility Model Content

[0005] This invention provides a heat dissipation structure for a compact cloud desktop terminal, which solves the problem of insufficient heat dissipation in the existing all-metal enclosed body.

[0006] This utility model provides the following technical solution: A heat dissipation structure for a compact cloud desktop terminal includes a compact cloud desktop terminal body, a matching base plate provided at the inspection port at the bottom of the compact cloud desktop terminal body, short studs for stable placement of the terminal box fixedly provided at the four corners of the bottom of the base plate, a cover fixedly provided on the outer wall of the compact cloud desktop terminal body, a row of top heat dissipation fins integrally formed on the top of the cover, and a corresponding row of side heat dissipation fins integrally formed on the side walls around the cover. The casing is composed of a high thermal conductivity substrate, a pretreatment layer for improving surface roughness, and a corrosion-resistant oxide layer from the inside out.

[0007] Preferably, the base plate is fixedly connected to the bottom of the compact cloud desktop terminal body by cross screws that pass through the four corners, and hollow support blocks are threadedly connected to the short studs, with the bottoms of the four hollow support blocks in stable contact with the support surface.

[0008] Preferably, the side wall of the compact cloud desktop terminal body is provided with various interfaces for use, and the four side walls of the cover are provided with notches to avoid affecting the use of the corresponding interfaces.

[0009] Preferably, the high thermal conductivity substrate is made of 6061T6 aluminum alloy.

[0010] Preferably, the pretreatment layer is a sandblasting layer.

[0011] Preferably, the corrosion-resistant oxide layer is a porous oxide film formed by a sulfuric acid anodizing process.

[0012] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit the present invention.

[0013] The working principle and usage process of this technical solution are as follows: When the compact cloud desktop terminal is powered on, its internal core components, such as the CPU, memory, and interface control chip, generate heat due to power consumption. Since the outer wall of the compact cloud desktop terminal is fixedly connected to the casing, the heat is first transferred to the high thermal conductivity substrate of the casing, 6061T6 aluminum alloy, through direct thermal conduction. This substrate, with its excellent thermal conductivity, quickly diffuses the locally concentrated heat to the entire casing, preventing heat from accumulating inside the terminal. The one-piece top heat dissipation fins on the top of the casing and the side heat dissipation fins around the perimeter significantly increase the contact area between the casing and the air. Through natural convection, the heat on the surface of the casing is transferred to the surrounding air. At the same time, the three-dimensional layout of the fins guides the hot air to rise along the gaps between the fins, forming a directional airflow to accelerate heat dissipation. The sandblasting pretreatment layer of the casing further expands the heat radiation area, making it easier for heat to be released through heat radiation. The outer sulfuric acid anodized corrosion-resistant oxide layer (a porous oxide film less than 25μm) ensures that the casing is resistant to acids and alkalis and prevents oxidation. Its porous structure can enhance the heat exchange efficiency with the air, achieving dual heat dissipation enhancement through radiation and convection. The short studs at the bottom of the base plate work in conjunction with the hollow support block to create a gap between the bottom of the compact cloud desktop terminal and the supporting surface (such as a desktop or rack tray). This prevents heat buildup caused by direct contact between the bottom and the terminal. The gap also allows for a weak airflow circulation, aiding in bottom heat dissipation and further reducing the overall temperature of the terminal. The notches on the side walls of the casing precisely match the various interfaces of the compact cloud desktop terminal. Without affecting the normal use of interfaces such as USB and Ethernet ports, the notches create local airflow channels, balancing the micro-pressure inside and outside the casing and preventing airflow stagnation caused by the closed structure. This indirectly improves heat dissipation stability. When the terminal needs maintenance, the bottom access port can be opened by removing the Phillips head screws at the four corners of the base plate without disassembling the casing. This ensures the integrity of the heat dissipation structure and reduces maintenance difficulty.

[0014] This utility model has the following beneficial effects: 1. This utility model improves heat dissipation efficiency through a composite design of high thermal conductivity substrate, three-dimensional fins and double coating. The 6061T6 aluminum alloy substrate ensures rapid heat conduction, the fins and sandblasting layer expand the heat exchange area, and the anodized layer combines heat dissipation and protection, avoiding performance degradation and crashes caused by high temperature, and improving the long-term operational stability of the terminal. 2. The enclosed structure formed by the cover and the base plate in this utility model continues the dustproof performance of the all-metal body, effectively blocking dust, lint and other impurities from entering the terminal, and avoiding the decrease in heat dissipation efficiency caused by dust adhering to the chip and circuit board. The outer sulfuric acid anodized layer can resist slight acid and alkali corrosion in daily use, such as desktop cleaner residue, thereby improving the service life of the cover and reducing the terminal replacement cost. The combination of short studs and hollow support blocks can flexibly adjust the height of the four corners of the terminal to avoid instability and shaking when placed. 3. The core material 6061T6 aluminum alloy in this utility model has both high thermal conductivity and mechanical strength, which can meet the heat dissipation requirements and withstand the slight impact during terminal handling or installation. Sandblasting and sulfuric acid anodizing are both mature industrial processes with low processing costs (significantly reducing costs compared to new materials such as graphene), making them suitable for mass production and facilitating the market promotion of end products. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram provided for an embodiment of the present utility model; Figure 2 This is a schematic diagram of another structural perspective provided for an embodiment of the present utility model; Figure 3 This is a schematic diagram of the separation structure between the cover and the body provided in an embodiment of the present utility model; Figure 4 This is a schematic diagram of the planar structure of the cover in a partial cross-sectional view provided in an embodiment of the present utility model.

[0016] Reference numerals: 1. Compact cloud desktop terminal body; 2. Interface; 3. Base plate; 4. Phillips head screw; 5. Cover; 6. Top heat dissipation fin; 7. Side heat dissipation fin; 8. Notch; 9. High thermal conductivity substrate; 10. Pretreatment layer; 11. Corrosion-resistant oxide layer; 12. Short stud; 13. Hollow support block. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0018] In one embodiment: Please refer to Figures 1-4 A heat dissipation structure includes a compact cloud desktop terminal body 1, which is a cuboid structure. It integrates core working components such as CPU, memory, and interface control chip. A rectangular access port is provided at the bottom of the compact cloud desktop terminal body 1. The size of the access port is adapted to the base plate 3. The base plate 3 is made of 6061T6 aluminum alloy. Through screw holes are provided at the four corners of the base plate 3. After passing through these screw holes, the Phillips head screws 4 engage with the threaded holes at the bottom of the compact cloud desktop terminal body 1 to fix the base plate 3 tightly at the access port. After assembly, the base plate 3 is flush with the bottom outer wall of the compact cloud desktop terminal body 1 without obvious gaps.

[0019] A cover 5 is mounted on the outer wall of the compact cloud desktop terminal body 1. The cover 5 is a detachable structure that is fixed to the outer wall of the compact cloud desktop terminal body 1 by snap-fit, or it can be a non-detachable structure that is fixed by welding. After assembly, the cover 5 completely covers the top and four sides of the compact cloud desktop terminal body 1, except for the bottom plate 3. The cover 5 is divided into three layers from the inside to the outside. The inner layer is a high thermal conductivity substrate 9 made of 6061T6 aluminum alloy sheet, which is formed by die casting. The middle pretreatment layer 10 is formed by sandblasting the outer surface of the high thermal conductivity substrate 9. The abrasive used for sandblasting is alumina, and the surface roughness is controlled at Ra1.6-3.2μm after treatment. The outer corrosion-resistant oxide layer 11 is prepared on the surface of the pretreatment layer 10 by sulfuric acid anodizing. The final porous oxide film has a thickness of 20-25μm, and the surface of the film has micropores with a pore size of 0.1-0.3μm distributed evenly.

[0020] The top of the cover 5 is formed by an integral die-casting process, with a row of top heat dissipation fins 6. The top heat dissipation fins 6 are arranged along the length of the compact cloud desktop terminal body 1, and the thickness is the same as the base material of the cover 5. The side walls around the cover 5 are also formed by an integral die-casting process, with a corresponding row of side heat dissipation fins 7. The height, spacing and thickness of the side heat dissipation fins 7 are the same as those of the top heat dissipation fins 6.

[0021] The right side wall of the compact cloud desktop terminal body 1 is equipped with various interfaces 2, including a USB 3.0 interface, an RJ45 network port, an HDMI interface, and a power interface. These interfaces 2 all protrude from the side wall surface of the compact cloud desktop terminal body 1. Multiple notches 8 are provided on the four side walls of the cover 5. The positions of the notches 8 correspond to the interfaces 2 on the same side. The edges of the notches 8 are rounded. When assembling the cover 5, the interfaces 2 pass through the corresponding notches 8 and are fully exposed on the outside of the cover 5, without affecting the plugging and unplugging of external data cables.

[0022] When it is necessary to inspect or maintain the components inside the compact cloud desktop terminal body 1, use a Phillips screwdriver to unscrew the Phillips screws 4 at the four corners of the base plate 3, and the base plate 3 can be removed from the bottom of the compact cloud desktop terminal body 1 to expose the inspection port. After the inspection is completed, the base plate 3 is reset and the Phillips screws 4 are screwed back in to complete the assembly. The whole process does not require disassembling the cover 5.

[0023] This application can be used for tea production, or for other fields applicable to this application.

[0024] In another embodiment: A heat dissipation structure for a compact cloud desktop terminal, which is used in the field of heat dissipation for compact cloud desktop terminals; Please refer to Figure 3 The base plate 3 has four short studs 12 fixed to its bottom corners by welding. The short studs 12 are cylindrical and made of stainless steel. The outer surface of the short studs 12 has external threads. The hollow support blocks 13 are cylindrical hollow structures made of engineering plastic. The inner wall has internal threads that match the short studs 12. After the hollow support blocks 13 are screwed onto the short studs 12, the bottoms of the four hollow support blocks 13 simultaneously contact the support surface (such as a desktop or cabinet tray). At this time, a gap is formed between the base plate 3 and the support surface, which allows air to circulate naturally. In daily use, if the terminal is placed on an uneven support surface, the screwing depth of the hollow support blocks 13 on the short studs 12 can be adjusted by rotating them, thereby adjusting the height of the four corners of the terminal to ensure that the terminal is placed stably.

[0025] However, as is well known to those skilled in the art, the working principle and wiring method of the compact cloud desktop terminal body 1 are conventional means or common knowledge, and will not be described in detail here. Those skilled in the art can make any selections according to their needs or convenience.

[0026] The accompanying drawings in this application are for illustrative purposes only. The dimensions and shapes of the components shown are not actual limitations but are merely schematic representations. In actual implementation, the components can be reasonably configured and adjusted according to specific needs and actual conditions.

[0027] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. In the absence of conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A heat dissipation structure for a compact cloud desktop terminal, characterized in that, The device includes a compact cloud desktop terminal body (1), a matching base plate (3) is provided at the inspection port at the bottom of the compact cloud desktop terminal body (1), short studs (12) for stable placement of the terminal box are fixedly provided at the four corners of the bottom of the base plate (3), a cover (5) is fixedly provided on the outer wall of the compact cloud desktop terminal body (1), a row of top heat dissipation fins (6) is integrally formed on the top of the cover (5), and a corresponding row of side heat dissipation fins (7) is integrally formed on the side walls around the cover (5). The cover (5) is composed of a high thermal conductivity substrate (9), a pretreatment layer (10) for improving surface roughness, and a corrosion-resistant oxide layer (11) from the inside to the outside.

2. The heat dissipation structure of a compact cloud desktop terminal according to claim 1, characterized in that, The base plate (3) is fixedly connected to the bottom of the compact cloud desktop terminal body (1) by cross screws (4) that are set through the four corners. The short stud (12) is threaded with hollow support blocks (13), and the bottoms of the four hollow support blocks (13) are in stable contact with the support surface.

3. The heat dissipation structure of a compact cloud desktop terminal according to claim 1, characterized in that, The compact cloud desktop terminal body (1) is provided with various interfaces (2) for use, and the four sides of the cover (5) are provided with notches (8) to avoid affecting the use of the corresponding interfaces (2).

4. The heat dissipation structure of a compact cloud desktop terminal according to claim 1, characterized in that, The high thermal conductivity substrate (9) is made of 6061T6 aluminum alloy.

5. The heat dissipation structure of a compact cloud desktop terminal according to claim 1, characterized in that, The pretreatment layer (10) is a sandblasting layer.

6. The heat dissipation structure of a compact cloud desktop terminal according to claim 1, characterized in that, The corrosion-resistant oxide layer (11) is a porous oxide film formed by sulfuric acid anodizing process.

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