Pressure detection module and electronic device

Abstract

Embodiments of the present application provide a pressure detection module and an electronic device. The pressure detection module comprises a recognition unit, a flexible circuit board and a pressure detection unit. A second surface of the recognition unit is electrically connected to a first surface of the flexible circuit board, and the pressure detection unit is opposite to the second surface of the recognition unit. The recognition unit generates a sensing signal when a detection object presses on a recognition area, and the sensing signal is used for feature recognition. The pressure detection unit emits a pressure detection signal in the direction of the recognition unit when the detection object presses on the recognition area, and generates a recognition signal according to a reflected signal reflected back, and the recognition signal is used for pressing force detection. The pressure detection module provided by the embodiments of the present application can perform pressing force detection while performing feature recognition, and can set multiple custom functions for different pressing forces, thereby improving user experience.

Description

Technical Field

[0001] This application relates to the field of pressure detection technology, and more particularly to a pressure detection module and electronic device. Background Technology

[0002] Touch technology is a human-computer interaction method. Users interact with electronic devices by touching or gesturing on the touch area of ​​the device. With the development of smart devices, touch technology has become the mainstream operating method for mobile phones and other electronic devices. Mobile phones and other electronic devices receive touch commands input by users on the touch area and recognize the corresponding touch operations based on the touch commands.

[0003] Currently, touch detection technology is integrated into various devices such as mobile phones and other terminal devices, in-vehicle touch buttons, and sensing devices such as headphones.

[0004] However, existing touch detection modules are limited in function, only able to detect user touch operations and unable to expand functionality based on different pressure levels applied by the user. Utility Model Content

[0005] In view of this, embodiments of this application provide a pressure detection module and an electronic device to at least partially solve the above-mentioned problems.

[0006] According to a first aspect of the present application, a pressure detection module is provided for use in an electronic device. The pressure detection module includes: an identification unit, a flexible circuit board, and a pressure detection unit; a second surface of the identification unit is electrically connected to a first surface of the flexible circuit board, and the pressure detection unit is opposite to the second surface of the identification unit; the identification unit is configured to generate a sensing signal when a detection object is pressed on an identification area, the sensing signal being used for feature recognition; the pressure detection unit is configured to emit a pressure detection signal in the direction of the identification unit when the detection object is pressed on the identification area, and generate an identification signal based on the reflected signal, the identification signal being used for pressure intensity detection.

[0007] In one possible implementation, the pressure detection module further includes a first reinforcing plate and at least one support member; the first reinforcing plate is attached to a second surface on the flexible circuit board opposite to a first surface on which the identification unit is disposed, such that the first reinforcing plate is located between the identification unit and the pressure detection unit, and the at least one support member is disposed between the first reinforcing plate and the electronic device; the first reinforcing plate and / or the at least one support member are configured to deform when the detection object is pressed on the identification area, thereby changing the distance between the first reinforcing plate and the pressure detection unit; the pressure detection unit is configured to transmit the pressure detection signal to the first reinforcing plate when the detection object is pressed on the identification area, and generate the identification signal based on the reflected signal reflected back by the first reinforcing plate.

[0008] In one possible implementation, the at least one support member is made of a rigid material; the first reinforcing plate is configured to deform when the object being detected is pressed against the recognition area, thereby changing the distance between the first reinforcing plate and the pressure detection unit; or, the at least one support member is made of a soft material; the at least one support member is configured to deform when the object being detected is pressed against the recognition area, thereby changing the distance between the first reinforcing plate and the pressure detection unit.

[0009] In one possible implementation, the pressure detection module further includes: a second reinforcing plate; a first surface of the second reinforcing plate is opposite to the first reinforcing plate, the second reinforcing plate includes a through hole, the pressure detection unit is disposed in the through hole, and the at least one support member is disposed between the first reinforcing plate and the second reinforcing plate.

[0010] In one possible implementation, the pressure detection module further includes a protective layer; the protective layer is disposed on the first surface of the second reinforcing plate and covers the through hole, such that the pressure detection unit is disposed between the protective layer and the flexible circuit board.

[0011] In one possible implementation, the pressure detection signal and the reflection signal include optical signals, and the protective layer includes a light-diffusing plate.

[0012] In one possible implementation, the pressure detection unit is electrically connected to the flexible circuit board via conductive adhesive, or the pressure detection unit is electrically connected to the flexible circuit board via an electrical connection wire.

[0013] In one possible implementation, the pressure detection module further includes: a first filler adhesive; the first filler adhesive is disposed within the through hole, and the pressure detection unit is located within the first filler adhesive; when the pressure detection unit is electrically connected to the flexible circuit board via an electrical connection wire, the electrical connection wire is located within the first filler adhesive.

[0014] In one possible implementation, the pressure detection module further includes a third reinforcing plate; the third reinforcing plate is disposed between the pressure detection module and the electronic device; the third reinforcing plate is used to provide rigid support for the pressure detection module.

[0015] In one possible implementation, the pressure detection module further includes: a second filler adhesive; the second surface of the identification unit is soldered to the first surface of the flexible circuit board, the second filler adhesive is disposed between the second surface of the identification unit and the first surface of the flexible circuit board, and the second filler adhesive is in contact with the second surface of the identification unit and the first surface of the flexible circuit board.

[0016] In one possible implementation, the pressure detection module further includes: a physical button; the physical button is electrically connected to the flexible circuit board and is located between the pressure detection module and the electronic device; the physical button is at least used to generate button feedback when the detected object presses on the recognition area.

[0017] In one possible implementation, the pressure detection unit includes a signal transmitting subunit and a signal receiving subunit; the signal transmitting subunit is used to transmit the pressure detection signal; the signal receiving subunit is used to receive the reflected signal and generate an identification signal based on the reflected signal.

[0018] In one possible implementation, the pressure detection signal is an optical signal, the signal transmitting subunit includes a light-emitting diode, and the signal receiving subunit includes a photodiode.

[0019] According to a second aspect of the present application, an electronic device is provided, including: a pressure detection module as described in the first aspect of the present application.

[0020] In one possible implementation, the pressure detection module is disposed in an opening in the middle frame of the electronic device.

[0021] In one possible implementation, the electronic device further includes: a cover layer; a second surface of the cover layer is attached to the pressure detection module, and a first surface of the cover layer is used to provide an identification area, wherein the first surface of the cover layer is opposite to the second surface of the protective layer.

[0022] In one possible implementation, the thickness of the covering layer is less than or equal to 30 μm.

[0023] In one possible implementation, the electronic device further includes: a cover plate; a second surface of the cover plate is attached to the pressure detection module, and a first surface of the cover plate is used to provide an identification area, wherein the first surface of the cover plate is opposite to the second surface of the cover plate.

[0024] In one possible implementation, the thickness of the cover plate ranges from [0.15mm, 2mm].

[0025] According to the pressure detection module provided in this application embodiment, the pressure detection module includes an identification unit, a flexible circuit board, and a pressure detection unit. The identification unit is disposed on a first surface of the flexible circuit board, and the pressure detection unit is opposite to a second surface of the identification unit. The identification unit can generate a sensing signal when the object is pressed on the identification area, and the pressure detection unit can generate an identification signal when the object is pressed on the identification area. The module can perform feature identification on the object based on the sensing signal, and can detect the pressure intensity of the object based on the identification signal. This pressure detection module can detect the pressure intensity of the object while realizing feature identification functions (touch recognition, fingerprint recognition, etc.). Thus, different functions can be realized according to different pressure intensities. Compared with existing fingerprint modules or touch detection modules, multiple custom functions can be set for different pressure intensities, which has higher functional scalability and improves user experience. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0027] Figure 1 This is a cross-sectional schematic diagram of a pressure detection module provided in an embodiment of this application;

[0028] Figure 2 This is a cross-sectional schematic diagram of a pressure detection module including a first reinforcing plate provided in an embodiment of this application;

[0029] Figure 3 This is a cross-sectional schematic diagram of a pressure detection module including a second reinforcing plate provided in an embodiment of this application;

[0030] Figure 4 This is a cross-sectional schematic diagram of a pressure detection module including a protective layer provided in an embodiment of this application;

[0031] Figure 5 This is a cross-sectional schematic diagram of a pressure detection unit provided in an embodiment of this application;

[0032] Figure 6 This is a cross-sectional schematic diagram of a pressure detection module including a first filler adhesive provided in an embodiment of this application;

[0033] Figure 7 This is a cross-sectional schematic diagram of a pressure detection module including a third reinforcing plate provided in an embodiment of this application;

[0034] Figure 8 This is a cross-sectional schematic diagram of a pressure detection module including a second filler adhesive provided in an embodiment of this application;

[0035] Figure 9 This is a cross-sectional schematic diagram of a pressure detection module including physical buttons provided in an embodiment of this application;

[0036] Figure 10 This is a cross-sectional schematic diagram of another pressure detection unit provided in an embodiment of this application;

[0037] Figure 11 This is a schematic diagram of an electronic device provided in an embodiment of this application;

[0038] Figure 12 This is a schematic diagram of another electronic device provided in an embodiment of this application;

[0039] Figure 13 This is a cross-sectional schematic diagram of a pressure detection module including a cover layer provided in an embodiment of this application;

[0040] Figure 14 This is a cross-sectional schematic diagram of a pressure detection module including a cover plate provided in an embodiment of this application. Detailed Implementation

[0041] To enable those skilled in the art to better understand the technical solutions in the embodiments of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art should fall within the protection scope of the embodiments of this application.

[0042] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0043] It should be understood that although the terms first, second, third, etc., may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0044] The pressure detection module and electronic device provided in this application are illustrated below through examples.

[0045] Figure 1 This is a cross-sectional schematic diagram of a pressure detection module 100 provided in an embodiment of this application. The pressure detection module 100 is applied to electronic devices, such as... Figure 1 As shown, the pressure detection module 100 includes an identification unit 101, a flexible circuit board 102, and a pressure detection unit 103. The second surface of the identification unit 101 is electrically connected to the first surface of the flexible circuit board 102. The pressure detection unit 103 is opposite to the second surface of the identification unit 101. The flexible circuit board 102 is electrically connected to the processing unit of the electronic device.

[0046] The recognition unit 101 can generate a sensing signal when the object is pressed into the recognition area, and the sensing signal is used for feature recognition. The pressure detection unit 103 can emit a pressure detection signal in the direction of the recognition unit 101 when the object is pressed into the recognition area, and generate a recognition signal based on the reflected signal, which is used for pressure intensity detection.

[0047] The identification unit 101 is disposed on the first surface of the flexible printed circuit (FPC) 102. Optionally, the pressure detection unit 103 can be disposed on the second surface of the flexible printed circuit 102. Since the flexible printed circuit 102 can be bent, such as Figure 1As shown, after the flexible circuit board 102 is partially bent, the second surface of the flexible circuit board 102 that is opposite to the first surface of the identification unit 101 is opposite to the second surface of the flexible circuit board 102 that is opposite to the second surface of the pressure detection unit 103, so that the pressure detection unit 103 is opposite to the second surface of the identification unit 101 after the flexible circuit board 102 is partially bent.

[0048] The pressure detection unit 103 can emit a pressure detection signal in the direction of the identification unit 101. The pressure detection signal can be an optical signal (e.g., infrared), an ultrasonic signal, etc. After the pressure detection signal is reflected by a part of the structure in the pressure detection module 100, a reflected signal is formed. The pressure detection unit 103 receives the reflected signal and generates an identification signal based on the reflected signal. Optionally, when the pressure detection signal is an optical signal, the reflected signal is also an optical signal. The pressure detection unit 103 can convert the optical signal into a current signal (identification signal).

[0049] Optionally, the feature recognition can be fingerprint recognition, touch recognition, etc. That is, the recognition unit 101 can be a fingerprint module, a touch detection module, etc. Depending on the recognition unit 101, the sensing signal can be a fingerprint sensing signal, a touch sensing signal, etc. Specifically, when the recognition unit 101 is a fingerprint module, after the detected object presses on the recognition area, the fingerprint module can collect the fingerprint information of the detected object and generate a fingerprint sensing signal based on the fingerprint information. The fingerprint sensing signal is used for fingerprint recognition. When the recognition unit 101 is a touch detection module, after the detected object presses on the recognition area, it can recognize the user's touch operation (e.g., pressing, swiping, etc.) and generate a touch sensing signal based on the user's touch operation. The touch sensing signal is used for touch recognition.

[0050] Optionally, the identification unit 101 may integrate a feature recognition chip and a pressure detection chip. When the identification unit 101 generates a sensing signal, the feature recognition chip integrated in the identification unit 101 can determine the feature recognition result based on the sensing signal. For example, the identification unit 101 may integrate a fingerprint chip, which can perform fingerprint recognition based on the fingerprint sensing signal to determine the fingerprint recognition result. Alternatively, the identification unit 101 may integrate a touch chip, which can perform touch recognition based on the touch sensing signal to determine the touch recognition result. When the pressure detection unit 103 generates an identification signal based on the reflected signal, it can send the identification signal to the pressure detection chip in the identification unit 101 through the flexible circuit board 102. The pressure detection chip can determine the pressure detection result based on the identification signal. After determining the feature recognition result and the pressure detection result, they can be sent to the processing unit of the electronic device through the flexible circuit board 102. The processing unit is a chip with processing functions in the electronic device, such as the processor of the electronic device. The processing unit can perform corresponding functions based on the feature recognition results, such as fingerprint unlocking, touch swiping, etc., and can also perform corresponding functions based on the pressure detection results. For example, taking the photo function as an example, it can achieve the focusing function when the pressure is light and the shutter function when the pressure is heavy. Taking the menu function as an example, it can achieve the pop-up of the first-level menu when the pressure is light and the pop-up of the second-level menu when the pressure is heavy.

[0051] Optionally, when the pressure detection module 100 does not integrate a feature recognition chip and a pressure detection chip, the pressure detection module 100 can transmit the sensing signal and the recognition signal to the processing unit in the electronic device through the flexible circuit board 102, or to the feature recognition chip or pressure detection chip set in the electronic device. The processing unit or specific chip in the electronic device can perform corresponding detection based on the sensing signal and the recognition signal, and execute corresponding functions.

[0052] In this embodiment, the pressure detection module 100 includes an identification unit 101, a flexible circuit board 102, and a pressure detection unit 103. The identification unit 101 is disposed on the first surface of the flexible circuit board 102, and the pressure detection unit 103 is opposite to the second surface of the identification unit 101. The identification unit 101 can generate a sensing signal when the object is pressed on the identification area, and the pressure detection unit 103 can generate an identification signal when the object is pressed on the identification area. The module can perform feature recognition on the object based on the sensing signal and detect the pressure intensity of the object based on the identification signal. The pressure detection module 100 can detect the pressure intensity of the object while realizing feature recognition functions (touch recognition, fingerprint recognition, etc.). Thus, different functions can be realized according to different pressure intensities. Compared with existing fingerprint modules or touch detection modules, multiple custom functions can be set for different pressure intensities, which has high functional scalability and improves user experience.

[0053] Figure 2 This is a cross-sectional schematic diagram of a pressure detection module including a first reinforcing plate provided in an embodiment of this application, as shown below. Figure 2 As shown, the pressure detection module 100 also includes a first reinforcing plate 104 and at least one support member 105. The first reinforcing plate 104 is attached to the second surface of the flexible circuit board 102 opposite to the first surface on which the identification unit 101 is disposed, so that the first reinforcing plate 104 is located between the identification unit 101 and the pressure detection unit 103. At least one support member 105 is disposed between the first reinforcing plate 104 and the electronic device.

[0054] The first reinforcing plate 104 and / or at least one support member 105 can deform when the object being detected is pressed into the recognition area, causing a change in the distance between the first reinforcing plate 104 and the pressure detection unit 103. The pressure detection unit 103 can transmit a pressure detection signal to the first reinforcing plate 104 when the object being detected is pressed into the recognition area, and generate a recognition signal based on the reflected signal reflected back by the first reinforcing plate 104.

[0055] Taking the pressure detection signal emitted by the pressure detection unit 103 as an infrared signal as an example, when the object being detected is not pressed on the recognition area, the distance between the first reinforcing plate 104 and the pressure detection unit 103 is fixed. When the object being detected is pressed on the recognition area, at least one of the first reinforcing plate 104 and at least one support member 105 deforms, causing the distance between the first reinforcing plate 104 and the pressure detection unit 103 to change. The pressure detection unit 103 emits an infrared signal (pressure detection signal) to the first reinforcing plate 104 and receives an infrared signal (reflected signal) reflected by the first reinforcing plate 104. An recognition signal is generated based on the reflected infrared signal. The distance between the pressure detection unit 103 and the first reinforcing plate 104 can be determined based on the signal intensity of the recognition signal. Thus, the pressure intensity of the object being detected can be determined based on the distance. In one example, a correspondence between distance and pressure intensity can be set, with different distances corresponding to different pressure intensities of the object being detected. Thus, the pressure intensity of the object being detected can be determined based on the distance.

[0056] Optionally, such as Figure 2 As shown, at least one support member 105 can be disposed between the first reinforcing plate 104 and the second surface on the flexible circuit board 102 on which the pressure detection unit 103 is disposed. The first reinforcing plate 104 and / or at least one support member 105 can deform when the detection object is pressed on the identification area, so that the distance between the first reinforcing plate 104 and the pressure detection unit 103 changes.

[0057] It should be noted that the above examples are merely illustrative examples and should not be construed as limiting the present application. For example, the pressure detection signal emitted by the pressure detection unit 103 may also be an ultrasonic signal. For another example, a distance detection signal may be emitted when the object is not pressed into the recognition area, and a pressure detection signal may be emitted when the object is pressed into the recognition area. The distance change between the first reinforcing plate 104 and the pressure detection unit 103 is determined based on the change in the amount of reflected signal before and after the object is pressed into the recognition area. The pressure of the object is determined based on a pre-set correspondence function between the distance change and the pressure intensity.

[0058] In this embodiment, the pressure detection module 100 further includes a first reinforcing plate 104 and at least one support member 105. The first reinforcing plate 104 is attached to a second surface of the flexible circuit board 102 opposite to the first surface on which the identification unit 101 is disposed. The support member 105 is disposed between the first reinforcing plate 104 and the electronic device. When the object being detected is pressed on the identification area, at least one of the first reinforcing plate 104 and at least one support member 105 can deform, causing the distance between the first reinforcing plate 104 and the pressure detection unit 103 to change. Thus, the pressure applied by the object can be determined based on the distance between the first reinforcing plate 104 and the pressure detection unit 103, thereby realizing the pressure detection function.

[0059] In one possible implementation, at least one support member 105 is made of a rigid material, and the first reinforcing plate 104 can deform when the object being detected is pressed on the recognition area, causing a change in the distance between the first reinforcing plate 104 and the pressure detection unit 103. Alternatively, at least one support member 105 is made of a soft material, and at least one support member 105 can deform when the object being detected is pressed on the recognition area, causing a change in the distance between the first reinforcing plate 104 and the pressure detection unit 103.

[0060] The first reinforcing plate 104 can be a steel plate. When at least one support member 105 is made of a rigid material, the at least one support member 105 can be a rigid plastic, metal, or the like. When the object being detected is pressed on the identification area, part of the first reinforcing plate 104 undergoes plastic deformation, causing a change in the distance between the first reinforcing plate 104 and the pressure detection unit 103. When at least one support member 105 is made of a soft material, the at least one support plate can be foam or the like. When the object being detected is pressed on the identification area, at least one support plate undergoes plastic deformation, causing a change in the distance between the first reinforcing plate 104 and the pressure detection unit 103.

[0061] It should be noted that when at least one support member 105 is made of soft material, if the pressure of the object being tested is large, the first reinforcing plate 104 and at least one support member 105 can deform simultaneously, causing the distance between the first reinforcing plate 104 and the pressure detection unit 103 to change.

[0062] In this embodiment, at least one support member 105 is made of a rigid material, and the first reinforcing plate 104 can deform when the object being detected is pressed into the recognition area. Alternatively, at least one support member 105 is made of a soft material, and the object being detected can deform when the object being detected is pressed into the recognition area. Thus, by deforming at least one of the first reinforcing plate 104 and at least one support member 105, the distance between the first reinforcing plate 104 and the pressure detection unit 103 changes. Therefore, the pressure applied by the object being detected can be determined based on the distance between the first reinforcing plate 104 and the pressure detection unit 103, thereby realizing the pressure detection function.

[0063] Figure 3 This is a cross-sectional schematic diagram of a pressure detection module including a second reinforcing plate provided in an embodiment of this application, as shown below. Figure 3 As shown, the pressure detection module 100 also includes a second reinforcing plate 106. The first surface of the second reinforcing plate 106 is opposite to the first reinforcing plate 104. The second reinforcing plate 106 includes a through hole 1061. The pressure detection unit 103 is disposed in the through hole 1061. At least one support member 105 is disposed between the first reinforcing plate 104 and the second reinforcing plate 106.

[0064] Optionally, such as Figure 3 As shown, the second surface of the second reinforcing plate 106 is attached to the second surface of the flexible circuit board 102 on which the pressure detection unit 103 is provided, so that the first surface of the second reinforcing plate 106 is opposite to the first reinforcing plate 104.

[0065] In this embodiment, the pressure detection module 100 further includes a second reinforcing plate 106, which can provide rigid support for the flexible circuit board 102. At least one support member 105 is disposed between the first reinforcing plate 104 and the second reinforcing plate 106. When the object being detected is pressed on the recognition area, the second reinforcing plate 106 can support at least one support member 105, causing at least one of the first reinforcing plate 104 and the at least one support member 105 to deform under the pressure of the object being detected and the support of the second reinforcing plate 106. This causes a change in the distance between the first reinforcing plate 104 and the pressure detection unit 103, thereby determining the pressure applied by the object based on the distance between the first reinforcing plate 104 and the pressure detection unit 103, thus realizing the pressure detection function.

[0066] Figure 4 This is a cross-sectional schematic diagram of a pressure detection module including a protective layer provided in an embodiment of this application, as shown below. Figure 4As shown, the pressure detection module 100 also includes a protective layer 107, which is disposed on the first surface of the second reinforcing plate 106 and covers the through hole 1061, so that the pressure detection unit 103 is disposed between the protective layer 107 and the flexible circuit board 102.

[0067] Since the pressure detection unit 103 is disposed in the through hole 1061 of the second reinforcing plate 106, a protective layer 107 can be provided to prevent the external environment from affecting the pressure detection unit 103. Optionally, when the pressure detection signal emitted by the pressure detection unit 103 is an optical signal, the protective layer 107 can be made of a light-transmitting material. Optionally, when the pressure detection signal and the reflected signal are optical signals, the protective layer 107 includes a light-diffusing plate.

[0068] In this embodiment, the pressure detection module 100 further includes a protective layer 107. The protective layer 107 is disposed on the first surface of the second reinforcing plate 106 and covers the through hole 1061, so that the pressure detection unit 103 is disposed between the protective layer 107 and the flexible circuit board 102. This can isolate the pressure detection unit 103 from the external environment, prevent the external environment from affecting the pressure detection unit 103, and improve the reliability of the pressure detection module 100.

[0069] In one possible implementation, the pressure detection signal and the reflected signal include an optical signal.

[0070] Optionally, the pressure detection signal can be an infrared signal.

[0071] In this embodiment, the pressure detection unit 103 emits a light signal. The pressure detection unit 103 emits the light signal in the direction of the identification unit 101 and receives the reflected light signal, thereby generating an identification signal based on the reflected light signal. The pressure intensity can then be detected based on the identification signal. Since the light signal emission and reception structures are relatively simple, using a light signal as the pressure detection signal can simplify the pressure detection structure and reduce costs.

[0072] Figure 5 This is a cross-sectional schematic diagram of a pressure detection unit provided in an embodiment of this application, as shown below. Figure 5 As shown, the pressure detection unit 103 is electrically connected to the flexible circuit board 102 via conductive adhesive 201, or the pressure detection unit 103 is electrically connected to the flexible circuit board 102 via electrical connection wire 202.

[0073] Figure 5Image (a) shows the pressure detection unit 103 electrically connected to the flexible circuit board 102 via conductive adhesive 201. In one example, the conductive adhesive 201 can be conductive silver paste or anisotropic conductive film (ACF). Figure 5 (b) shows that the pressure detection unit 103 is electrically connected to the flexible circuit board 102 via an electrical connection line 202. In one example, the electrical connection line 202 may be a bonding wire.

[0074] In this embodiment, the pressure detection unit 103 is electrically connected to the flexible circuit board 102 via conductive adhesive 201, or the pressure detection unit 103 is electrically connected to the flexible circuit board 102 via electrical connection wire 202. This realizes the electrical connection between the pressure detection unit 103 and the flexible circuit board 102, enabling the pressure detection unit 103 to emit a pressure detection signal under the drive signal transmitted by the flexible circuit board 102, and to transmit the identification signal to the processing unit through the flexible circuit board 102.

[0075] Figure 6 This is a cross-sectional schematic diagram of a pressure detection module including a first filler adhesive provided in an embodiment of this application, as shown below. Figure 6 As shown, the pressure detection module 100 also includes a first filler 1062, which is disposed in the through hole 1061. The pressure detection unit 103 is located in the first filler 1062. When the pressure detection unit 103 is electrically connected to the flexible circuit board 102 through the electrical connection line 202, the electrical connection line 202 is located in the first filler 1062.

[0076] It should be noted that when the pressure detection unit 103 is electrically connected to the flexible circuit board 102 through the conductive adhesive 201, since the pressure detection unit 103 is located inside the first filler adhesive 1062, the conductive adhesive 201 disposed between the pressure detection unit 103 and the flexible circuit board 102 is also located inside the first filler adhesive 1062.

[0077] In this embodiment, the pressure detection module 100 further includes a first filler adhesive 1062, which is disposed within the through hole 1061 of the second reinforcing plate 106. The pressure detection unit 103 is located within the first filler adhesive 1062. When the pressure detection unit 103 is electrically connected to the flexible circuit board 102 via the electrical connection line 202, the electrical connection line 202 is located within the first filler adhesive 1062. Thus, the pressure detection unit 103 can be protected by the first protective adhesive, preventing the pressure detection unit 103 from being oxidized and preventing the pressure detection unit 103 from losing its electrical connection with the flexible circuit board 102, thereby improving the reliability of the pressure detection module 100.

[0078] Figure 7This is a cross-sectional schematic diagram of a pressure detection module including a third reinforcing plate provided in an embodiment of this application, as shown below. Figure 7 As shown, the pressure detection module 100 also includes a third reinforcing plate 108, which is disposed between the pressure detection module 100 and the electronic device. The third reinforcing plate 108 can provide rigid support for the pressure detection module 100.

[0079] Optionally, such as Figure 7 As shown, the third reinforcing plate 108 is attached to the first surface of the flexible circuit board 102 opposite to the second surface on which the pressure detection unit 103 is provided, and the third reinforcing plate 108 can provide rigid support for the flexible circuit board 102.

[0080] In this embodiment, the pressure detection module 100 further includes a third reinforcing plate 108. When the pressure detection module 100 is mounted on an electronic device, the third reinforcing plate 108 is located between the pressure detection module 100 and the electronic device, and can provide rigid support for the flexible circuit board 102 and the pressure detection module 100.

[0081] Figure 8 This is a cross-sectional schematic diagram of a pressure detection module including a second filler adhesive provided in an embodiment of this application, as shown below. Figure 8 As shown, the pressure detection module 100 also includes a second filler 109. The second surface of the identification unit 101 is electrically connected to the first surface of the flexible circuit board 102 by soldering. The second filler 109 is disposed between the second surface of the identification unit 101 and the first surface of the flexible circuit board 102, and the second filler 109 is in contact with the second surface of the identification unit 101 and the first surface of the flexible circuit board 102.

[0082] In one example, when the second filler 109 is filled between the second surface of the identification unit 101 and the first surface of the flexible circuit board 102, the second filler 109 extends beyond the edge of the identification unit 101. That is, in the direction perpendicular to the second filler 109, the projection of the identification unit 101 on the second filler 109 is located within the edge of the second filler 109.

[0083] Optionally, such as Figure 8 As shown, when the second filler 109 is filled between the second surface of the identification unit 101 and the first surface of the flexible circuit board 102, the solder of the solder joint between the identification unit 101 and the flexible circuit board 102 is located within the second filler 109.

[0084] In this embodiment, the second surface of the identification unit 101 is electrically connected to the first surface of the flexible circuit board 102 by soldering, thereby electrically connecting the identification unit 101 and the flexible circuit board 102. This allows the identification unit 101 to send the sensing signal to the processing unit through the flexible circuit board 102, enabling the processing unit to perform feature recognition (e.g., fingerprint recognition, touch recognition, etc.) on the detected object based on the sensing signal. The pressure detection module 100 also includes a second filler 109, which can protect the electrical connection area between the identification unit 101 and the flexible circuit board 102. This can prevent the identification unit 101 from being affected by the external environment and can also prevent the electrical connection between the identification unit 101 and the flexible circuit board 102 from being lost under the action of external force, thereby improving the reliability of the pressure detection module 100.

[0085] Figure 9 This is a cross-sectional schematic diagram of a pressure detection module including physical buttons provided in an embodiment of this application, as shown below. Figure 9 As shown, the pressure detection module 100 also includes a physical button 110, which is electrically connected to the flexible circuit board 102 and is located between the pressure detection module 100 and the electronic device. The physical button 110 is used to generate button feedback when the object being detected is pressed in the recognition area.

[0086] The pressure detection module 100 may also include a physical button 110, which is electrically connected to the flexible circuit board 102. Optionally, such as Figure 9 As shown, the physical button 110 can be electrically connected to the first surface of the flexible circuit board 102 opposite to the second surface on which the pressure detection unit 103 is disposed, so that the physical button 110 is located between the pressure detection module 100 and the electronic device. In one example, such as... Figure 9 As shown, the physical button 110 is disposed in a through hole on the third reinforcing plate 108, and the physical button 110 is electrically connected to the flexible circuit board 102 by soldering. Optionally, the physical button 110 can be a dome button.

[0087] The physical button 110 can provide button feedback when the detected object presses on the recognition area. Specifically, when the detected object presses on the recognition area, the physical button 110 is triggered, providing button feedback to the detected object so that the detected object feels the touch of the physical button 110. Optionally, the physical button 110 can also realize multi-level pressing functions. For example, taking the photo function as an example, when the pressure detection module 100 detects the detected object pressing on the recognition area, it realizes the focusing function, and when the physical button 110 is triggered, it realizes the shutter function. Taking the menu function as an example, when the pressure detection module 100 detects the detected object pressing on the recognition area, it realizes the pop-up of the first-level menu function, and when the physical button 110 is triggered, it realizes the pop-up of the second-level menu function, and so on. Specific functions can be set as needed.

[0088] In this embodiment, the pressure detection module 100 also includes a physical button 110. The physical button 110 is electrically connected to the flexible circuit board 102 and is located between the pressure detection module 100 and the electronic device. The physical button 110 can provide button feedback to the detection object, which can improve the user experience of using the pressure detection module 100. In addition, the physical button 110 can realize the multi-level pressing function of the pressure detection module 100, which has high functional expandability and can set a variety of custom functions to improve the user experience.

[0089] Figure 10 This is a cross-sectional schematic diagram of another pressure detection unit provided in an embodiment of this application, as shown below. Figure 10 As shown, the pressure detection unit 103 includes a signal transmitting subunit 1031 and a signal receiving subunit 1032. The signal transmitting subunit 1031 is used to transmit a pressure detection signal, and the signal receiving subunit 1032 is used to receive the reflected signal and generate an identification signal based on the reflected signal.

[0090] like Figure 10 As shown, the pressure detection unit 103 in the pressure detection module 100 includes a signal transmitting subunit 1031 and a signal receiving subunit 1032. The signal transmitting subunit 1031 and the signal receiving subunit 1032 are electrically connected to the flexible circuit board 102, respectively. The signal transmitting subunit 1031 can transmit a pressure detection signal in the direction of the identification unit 101, for example: Figure 10 The transmission path is shown by the dashed line. The pressure detection signal is reflected by the first reinforcing plate 104 to form a reflected signal. The signal receiving subunit 1032 receives the reflected signal and generates an identification signal based on the reflected signal. The identification signal is then sent to the processing unit through the flexible circuit board 102, so that the processing unit can detect the pressure intensity based on the identification signal.

[0091] Specifically, such as Figure 10As shown, when the object being detected is pressed into the recognition area, the signal transmitting subunit 1031 can transmit a pressure detection signal in the direction of the recognition unit 101. The pressure detection signal is reflected by the flexible circuit board 102 and / or devices disposed on the flexible circuit board 102, such as the first reinforcing plate 104, the protective layer 107, etc., forming a reflected signal that is injected into the signal receiving subunit 1032. The signal receiving subunit 1032 generates a recognition signal. In one example, the time difference can be determined based on the time when the signal transmitting subunit 1031 transmits the pressure detection signal and the time when the signal receiving subunit 1032 generates the recognition signal. The pressure intensity of the object being detected can be determined based on the relationship table between the time difference and the pressure intensity, or the relationship function between the time difference and the pressure intensity. In another example, the distance between the signal transmitting subunit 1031 and the first reinforcing plate 104 can be determined based on the recognition signal. Thus, the pressure intensity of the object being detected can be determined based on the distance between the transmitting subunit 1031 and the first reinforcing plate 104.

[0092] Optionally, the signal transmitting subunit 1031 can be a light-emitting diode (LED), which can emit infrared signals. The signal receiving subunit 1032 can be a photodiode (PD), which is used to receive infrared signals and generate an identification signal based on the signal strength of the infrared signal. The identification signal can be a current signal.

[0093] In this embodiment, the pressure detection unit 103 includes a signal transmitting subunit 1031 and a signal receiving subunit 1032. The signal transmitting subunit 1031 can transmit a pressure detection signal, and the signal receiving subunit 1032 can receive the reflected signal and generate an identification signal based on the reflected signal to realize the detection of the pressure.

[0094] Figure 11 This is a schematic diagram of an electronic device provided in an embodiment of this application, such as... Figure 11 As shown, the electronic device 300 includes the pressure detection module 100 in any of the above embodiments.

[0095] Optionally, such as Figure 11As shown, the electronic device 300 also includes a processing unit 301. The processing unit 301 can perform corresponding operations based on the feature recognition results sent by the pressure detection module 100 and the pressure detection results. Alternatively, when the processing unit receives the sensing signal sent by the pressure detection module 100, it can perform feature recognition on the detection object, such as fingerprint recognition or touch recognition of the touch operation of the detection object. When the processing unit receives the recognition signal sent by the pressure detection module 100, it can detect the pressure of the detection object based on the recognition signal. The processing unit is a chip with processing capabilities in the electronic device, such as the processor of the electronic device or the pressure detection chip of the electronic device. The processing unit can detect the pressure of the detection object based on the recognition signal and implement corresponding functions based on the detected pressure. For example, taking the photo function as an example, it can realize the focusing function when the pressure is light and the shutter function when the pressure is heavy. Taking the menu function as an example, it can realize the pop-up of the first-level menu when the pressure is light and the pop-up of the second-level menu when the pressure is heavy.

[0096] It should be noted that the pressure detection module 100 in this application embodiment can be the pressure detection module 100 in any of the above embodiments, and the specific details can be found in the descriptions in the above embodiments.

[0097] In this embodiment, the electronic device 300 includes a pressure detection module 100. Since the pressure detection module 100 detects the pressure of the object being pressed while realizing feature recognition (touch recognition and fingerprint recognition), different functions can be realized according to different pressure of the object being pressed. It has high functional scalability and can set a variety of custom functions for different pressure levels, thereby improving the user experience.

[0098] Figure 12 This is a schematic diagram of another electronic device provided in an embodiment of this application, such as... Figure 12 As shown, the pressure detection module 100 is disposed in the opening of the middle frame 302 of the electronic device 300.

[0099] In this embodiment, the pressure detection module 100 is disposed in the opening of the mid-frame 302 of the electronic device 300, so that the pressure detection module 100 can be disposed in the electronic device 300, allowing the user to press on the recognition area of ​​the pressure detection module 100. The pressure detection module 100 also has high functional expandability (for example, when the electronic device 300 is a mobile phone, the user can realize shutter or zoom functions on the pressure detection module 100 by different pressure levels, and can realize multi-level menu functions on the mobile phone by different pressure levels), which can improve the user experience.

[0100] It should be understood that the embodiments of this application do not limit the electronic devices or the application functions of the pressure detection module. For example, the electronic device can also be a headset, and the pressure detection module can be used to switch songs and switch noise reduction functions according to different pressure levels of the user. The electronic device can also be a vehicle button, and the pressure detection module can be used to realize vehicle control according to different pressure levels of the user, etc.

[0101] Figure 13 This is a cross-sectional schematic diagram of a pressure detection module including a cover layer provided in an embodiment of this application, as shown below. Figure 13 As shown, the electronic device 300 also includes a cover layer 303, the second surface of which is attached to the pressure detection module 100, and the first surface of which is used to provide an identification area, wherein the first surface of the cover layer 303 is opposite to the second surface of the cover layer 303.

[0102] The pressure detection module 100 may be provided with a cover layer 303, which may be provided on the outer surface of the pressure detection module 100. In one example, the cover layer 303 may be an ink layer. Optionally, the cover layer 303 may be set with different colors according to the color of the electronic device 300 to achieve uniformity of appearance.

[0103] In this embodiment, the electronic device 300 further includes a cover layer 303. The second surface of the cover layer 303 is attached to the pressure detection module 100, and the first surface of the cover layer 303 is used to provide an identification area. Thus, the cover layer 303 can protect the pressure detection module 100 and provide an identification area, thereby improving the reliability of the pressure detection module 100. Furthermore, different colors of the cover layer 303 can be set according to the color of the electronic device 300, ensuring the uniformity of the appearance of the electronic device 300.

[0104] In one possible implementation, the thickness of the cover layer 303 is less than or equal to 30 μm.

[0105] In this embodiment, the thickness of the cover layer 303 is less than or equal to 30 μm. This allows the pressure detection module 100 to be protected by the cover layer 303 while preventing the sensing signal generated by the recognition unit in the pressure detection module 100 from being too small when the object is pressed into the recognition area due to the cover layer 303. This can improve the reliability of the pressure detection module 100 without affecting the feature recognition function of the pressure detection module 10.

[0106] Figure 14 This is a cross-sectional schematic diagram of a pressure detection module including a cover plate provided in an embodiment of this application, as shown below. Figure 14As shown, the electronic device 300 also includes a cover plate 304, the second surface of which is attached to the pressure detection module 100, and the first surface of which is used to provide an identification area, wherein the first surface of the cover plate 304 is opposite to the second surface of the cover plate 304.

[0107] The electronic device 300 may also include a cover plate 304, the second surface of which contacts the pressure detection module 100. In one example, the second surface of the cover plate 304 may be bonded to the outer surface of the pressure detection module 100. Optionally, the cover plate 304 may be made of materials such as plastic, glass, and sapphire, and the color of the cover plate 304 may be set as needed.

[0108] In this embodiment of the application, the electronic device 300 may further include a cover plate 304, which can protect the pressure detection module 100 and provide an identification area. Thus, the pressure detection module 100 can be protected by the cover plate, thereby improving the reliability of the pressure detection module 100.

[0109] In one possible implementation, the thickness of the cover plate 304 ranges from [0.15mm, 2mm].

[0110] Preferably, when the cover plate 304 is made of plastic, the thickness of the cover plate 304 is in the range of [1mm, 2mm], and when the cover plate 304 is made of glass and sapphire, the thickness of the cover plate 304 is in the range of [0.15mm, 0.2mm].

[0111] In this embodiment, the thickness of the cover plate 304 is in the range of [0.15mm, 2mm]. This can protect the pressure detection module 100 while preventing the presence of the cover plate 304 from causing a small amount of sensing signal generated by the recognition unit of the pressure detection module 100 when the object being detected is pressed on the recognition area. This can improve the reliability of the pressure detection module 100 without affecting the feature recognition of the pressure detection module 100.

[0112] Those skilled in the art will recognize that the units and method steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the embodiments of this application.

[0113] The above embodiments are only used to illustrate the embodiments of this application, and are not intended to limit the embodiments of this application. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the embodiments of this application. Therefore, all equivalent technical solutions also fall within the scope of the embodiments of this application, and the patent protection scope of the embodiments of this application should be defined by the claims.

Claims

1. A pressure detection module, applied to electronic equipment, characterized in that, The pressure detection module includes: an identification unit, a flexible circuit board, and a pressure detection unit; The second surface of the identification unit is electrically connected to the first surface of the flexible circuit board, and the pressure detection unit is opposite to the second surface of the identification unit; The recognition unit is used to generate a sensing signal when the detected object is pressed on the recognition area, and the sensing signal is used for feature recognition. The pressure detection unit is used to emit a pressure detection signal in the direction of the recognition unit when the object being detected presses on the recognition area, and to generate a recognition signal based on the reflected signal, which is used to detect the pressure intensity.

2. The pressure detection module according to claim 1, characterized in that, The pressure detection module also includes a first reinforcing plate and at least one support member; The first reinforcing plate is attached to the second surface of the flexible circuit board opposite to the first surface on which the identification unit is disposed, so that the first reinforcing plate is located between the identification unit and the pressure detection unit, and the at least one support member is disposed between the first reinforcing plate and the electronic device. The first reinforcing plate and / or the at least one support member are configured to deform when the detected object is pressed against the identification area, thereby changing the distance between the first reinforcing plate and the pressure detection unit. The pressure detection unit is used to transmit the pressure detection signal to the first reinforcing plate when the detection object presses on the identification area, and generate the identification signal based on the reflected signal reflected back by the first reinforcing plate.

3. The pressure detection module according to claim 2, characterized in that, The at least one support member is made of a rigid material; The first reinforcing plate is used to deform when the detection object is pressed on the identification area, so that the distance between the first reinforcing plate and the pressure detection unit changes. Alternatively, the at least one support member may be made of a soft material; The at least one support member is used to deform when the object being detected is pressed into the recognition area, thereby changing the distance between the first reinforcing plate and the pressure detection unit.

4. The pressure detection module according to claim 2, characterized in that, The pressure detection module also includes: a second reinforcing plate; The first surface of the second reinforcing plate is opposite to the first reinforcing plate. The second reinforcing plate includes a through hole, the pressure detection unit is disposed in the through hole, and the at least one support member is disposed between the first reinforcing plate and the second reinforcing plate.

5. The pressure detection module according to claim 4, characterized in that, The pressure detection module also includes: a protective layer; The protective layer is disposed on the first surface of the second reinforcing plate and covers the through hole, so that the pressure detection unit is disposed between the protective layer and the flexible circuit board.

6. The pressure detection module according to claim 1, characterized in that, The pressure detection signal and the reflection signal include optical signals.

7. The pressure detection module according to claim 4, characterized in that, The pressure detection unit is electrically connected to the flexible circuit board via conductive adhesive, or the pressure detection unit is electrically connected to the flexible circuit board via an electrical connection wire.

8. The pressure detection module according to claim 7, characterized in that, The pressure detection module further includes: a first filler adhesive; The first filler adhesive is disposed inside the through hole, and the pressure detection unit is located inside the first filler adhesive; When the pressure detection unit is electrically connected to the flexible circuit board via an electrical connection wire, the electrical connection wire is located within the first filler adhesive.

9. The pressure detection module according to claim 1, characterized in that, The pressure detection module also includes: a third reinforcing plate; The third reinforcing plate is disposed between the pressure detection module and the electronic device; The third reinforcing plate is used to provide rigid support for the pressure detection module.

10. The pressure detection module according to claim 1, characterized in that, The pressure detection module further includes: a second filler adhesive; The second surface of the identification unit is electrically connected to the first surface of the flexible circuit board by soldering. The second filler is disposed between the second surface of the identification unit and the first surface of the flexible circuit board, and the second filler is in contact with the second surface of the identification unit and the first surface of the flexible circuit board.

11. The pressure detection module according to claim 1, characterized in that, The pressure detection module also includes: physical buttons; The physical button is electrically connected to the flexible circuit board, and the physical button is located between the pressure detection module and the electronic device; The physical button is used at least to generate button feedback when the detected object presses on the recognition area.

12. The pressure detection module according to any one of claims 1-11, characterized in that, The pressure detection unit includes: a signal transmitting subunit and a signal receiving subunit; The signal transmitting subunit is used to transmit the pressure detection signal; The signal receiving subunit is used to receive the reflected signal and generate the identification signal based on the reflected signal.

13. The pressure detection module according to claim 12, characterized in that, The pressure detection signal is an optical signal, the signal transmitting subunit includes a light-emitting diode, and the signal receiving subunit includes a photodiode.

14. An electronic device, characterized in that, include: The pressure detection module as described in any one of claims 1-13.

15. The electronic device according to claim 14, characterized in that, The pressure detection module is located in an opening in the middle frame of the electronic device.

16. The electronic device according to claim 15, characterized in that, The electronic device further includes: a cover layer; The second surface of the cover layer is attached to the pressure detection module, and the first surface of the cover layer is used to provide an identification area, wherein the first surface of the cover layer is opposite to the second surface of the cover layer.

17. The electronic device according to claim 16, characterized in that, The thickness of the covering layer is less than or equal to 30 μm.

18. The electronic device according to claim 15, characterized in that, The electronic device also includes: a cover plate; The second surface of the cover plate is attached to the pressure detection module, and the first surface of the cover plate is used to provide an identification area, wherein the first surface of the cover plate is opposite to the second surface of the cover plate.

19. The electronic device according to claim 18, characterized in that, The thickness of the cover plate ranges from 0.15mm to 2mm.

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