Metal intelligent chip card packaging structure

By setting through mounting grooves and conductive connection grooves in the metal smart chip card, combined with a serpentine conductive contact structure, the problems of short circuits and unstable connections between the chip and the radio frequency antenna are solved, achieving stable connection and efficient production.

CN224536534UActive Publication Date: 2026-07-21ZHONGSHAN JIAQIAO INTELLIGENT TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202521604997.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-07-29
Publication Date
2026-07-21
Estimated Expiration
2035-07-29

AI Technical Summary

Technical Problem

Existing metal smart chip cards suffer from poor stability, high short-circuit risk, and low production efficiency in their electrical connections between the chip and the RF antenna. Traditional welding processes are complex and costly, while non-contact connections are costly and have poor performance, and the application of conductive adhesives is unstable.

Method used

The chip module is connected to the RF antenna by setting a mounting groove that penetrates the metal layer and the shielding layer in the card base, and opening a conductive connection groove at the bottom of the groove. The connection is achieved by using conductive adhesive. Combined with the serpentine conductive contact structure and parameter optimization, stable connection is ensured and the process is simplified.

Benefits of technology

It effectively avoids short-circuit risks, simplifies the manufacturing process, improves production efficiency and yield, is suitable for large-scale mass production, and enhances connection stability and process fault tolerance.

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Abstract

The utility model discloses a metal intelligent chip card packaging structure which comprises a card base and a chip module connected on the card base, the card base at least comprises an upper structure layer, an antenna layer and a lower structure layer which are in a sheet shape and are sequentially stacked, a radio frequency antenna is arranged in the antenna layer, and the chip module is connected with the chip module. The radio frequency antenna is provided with at least two conductive contact parts, the card base is provided with a mounting groove which is positioned above the conductive contact parts and is used for accommodating the chip module, the bottom of the mounting groove is provided with a conductive connecting groove which extends downwards to the conductive contact parts, the bottom of the chip module is provided with a chip contact which is exposed after being packaged, and the chip contact is connected with the chip module through the conductive connecting groove. And a conductive material column of which the lower part is conductively connected with the conductive contact part and the upper part protrudes upwards and is conductively connected with the chip contact is arranged in the conductive connecting groove. The utility model aims to overcome the defects in the prior art, and provides the metal intelligent chip card packaging structure which is compact in structure and strong in stability.
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