Metal smart chip card packaging structure

Abstract

The utility model discloses a kind of metal intelligent chip card packaging structures, including card base and chip module connected on card base, the card base at least includes upper structural layer, antenna layer and lower structural layer which are thin sheet and are sequentially laminated, the antenna layer is equipped with radio frequency antenna, the radio frequency antenna has at least two conductive contact parts, the card base is equipped with the mounting groove for accommodating chip module in the upper of conductive contact part, the mounting groove groove bottom is equipped with the conductive connection groove extending to conductive contact part downwards, the chip module bottom has the chip contact exposed after packaging, the conductive connection groove is equipped with the conductive material column in the lower part and conductive contact part conductive connection, upper part protrudes upwards and is connected with chip contact conductive connection, the utility model aims at overcoming the deficiency of prior art, provide a kind of metal intelligent chip card packaging structure with compact structure, strong stability.

Description

Technical Field

[0001] This utility model specifically relates to a metal smart chip card packaging structure. Background Technology

[0002] With the continuous development of smart card technology, metal materials are increasingly being used in the field of smart chip cards due to their excellent appearance, structural strength, and anti-counterfeiting performance. However, due to the inherent conductivity of metal materials, achieving a stable electrical connection between the chip and the radio frequency antenna in a metal card has become a major technical challenge. Currently, existing metal smart chip cards have many problems in chip packaging and conductive connection. First, traditional metal card chip packaging processes typically use methods such as soldering and wire bonding to achieve the electrical connection between the chip and the antenna. These processes are not only complex and difficult to operate, but also require high precision equipment and skilled operators, resulting in low overall production efficiency and high manufacturing costs. In addition, due to problems such as unstable temperature control and small contact area of ​​solder joints during the soldering process, quality defects such as incomplete soldering, solder joint detachment, and high contact resistance are prone to occur, which in turn affect the conductive stability between the chip and the antenna and reduce product reliability. Second, since metal cards generally contain a metal layer (such as stainless steel, copper, aluminum, etc.), its excellent conductivity makes the chip's gold wires or conductive connection parts extremely prone to short circuits with the metal layer. Especially when exposed wires or conductive adhesive layers exist between the chip and the antenna, without effective isolation or structural protection, short circuits can easily occur, causing the chip to malfunction or even the entire card to fail, severely impacting product yield and performance. Furthermore, while conductive adhesives offer advantages such as simple connection processes and high adaptability in traditional solutions, their fluidity before curing makes them prone to overflowing near the metal layer during dispensing or hot pressing, posing a short circuit risk. Therefore, the application of conductive adhesives in metal card chip connections has been limited, considered an uncontrollable connection method, restricting its promotion and application in the field of metal smart cards.

[0003] To address these issues, some improved solutions have emerged in existing technologies, such as using a dual-coupling method to achieve a contactless connection between the chip and the antenna. However, while this solution avoids short-circuit problems, it results in higher chip costs and poorer contactless performance, making it difficult to meet the application requirements of high-frequency, long-distance card reading. Another solution is to use a continuous wire connection method. Although this can achieve stable conductivity, its manufacturing process is complex, and the wires are prone to breakage or short-circuiting with the metal layer, leading to low product yield and making large-scale mass production difficult.

[0004] This utility model was developed precisely because of the aforementioned shortcomings. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a compact and highly stable metal smart chip card packaging structure.

[0006] This utility model is achieved through the following technical solution:

[0007] This utility model provides a metal smart chip card packaging structure, including a card base and a chip module connected to the card base. The card base includes at least an upper structural layer, an antenna layer, and a lower structural layer that are thin-film-shaped and stacked sequentially. The antenna layer contains a radio frequency antenna with at least two conductive contact portions. The card base has a mounting groove located above the conductive contact portions for accommodating the chip module. The bottom of the mounting groove has a conductive connection groove extending downward to the conductive contact portions. The bottom of the chip module has exposed chip contacts after packaging. The conductive connection groove contains conductive material pillars whose lower part is conductively connected to the conductive contact portions and whose upper part protrudes upward and is conductively connected to the chip contacts.

[0008] As described above, in the metal smart chip card packaging structure, the upper structural layer includes a stacked metal layer and a shielding layer, the shielding layer is sandwiched between the metal layer and the antenna layer, and the mounting groove penetrates through the metal layer and the shielding layer.

[0009] As described above, in the metal smart chip card packaging structure, the upper structural layer includes an upper coating layer and an upper plastic layer stacked together. The upper coating layer covers the upper surface of the upper plastic layer. The mounting groove penetrates the upper coating layer and the upper plastic layer. A metal sheet is embedded in the antenna layer.

[0010] As described above, in the metal smart chip card packaging structure, the lower structural layer includes a lower plastic layer and a lower cover layer stacked together, and a magnetic strip for storing information is connected to the lower surface of the lower cover layer.

[0011] As described above, in the metal smart chip card packaging structure, the conductive contact portion is a coiled serpentine structure, which is composed of several straight segments and curved segments connected together, wherein at least two straight segments are exposed in the conductive connection groove.

[0012] In the metal smart chip card packaging structure described above, three straight segments are exposed in the conductive connection groove. The conductive connection groove is circular with a diameter of D1, where 1.0mm ≤ D1 ≤ 2.0mm. The diameter of each straight segment is d2, where 0.07mm ≤ d2 ≤ 0.15mm. The spacing between adjacent straight segments is L1, where 0.1mm ≤ L1 ≤ 0.25mm.

[0013] In the metal smart chip card packaging structure described above, the minimum distance between the wall of the conductive connection groove and the wall of the mounting groove is L2.

[0014] In the metal smart chip card packaging structure described above, the conductive material pillars are conductive adhesive, solder paste, or solder balls.

[0015] In the metal smart chip card packaging structure described above, the conductive material pillar is a conductive adhesive, which is a mixture of epoxy resin and filler, wherein the filler is metal particles or conductive carbon particles.

[0016] Compared with the prior art, the present invention has the following advantages:

[0017] 1. Effectively solves the short-circuit risk problem between the metal layer and the chip contacts. By setting a mounting groove that penetrates the metal layer and the shielding layer in the card base, and opening a conductive connection groove at the bottom of the groove, the chip module and the RF antenna are connected by conductive adhesive. This avoids the short-circuit problem between the metal layer and the conductive line in traditional soldering or wire bonding methods, and significantly improves product reliability.

[0018] 2. To achieve stable application of conductive adhesive on metal cards and simplify the packaging process, this solution uses structural optimization design (such as size control of conductive connection grooves and safe spacing with metal layers) to enable the conductive adhesive, which originally had the risk of short circuit, to be used safely in metal cards. This not only achieves stable connection between chip modules and antennas, but also eliminates traditional soldering processes, greatly simplifies the manufacturing process, and improves production efficiency and yield.

[0019] 3. Improved connection stability and process tolerance, suitable for mass production. Through the serpentine conductive contact structure design, multi-point contact method and parameter optimization (such as copper wire width, spacing, conductive groove size, etc.), the stability and tolerance of conductive connection are effectively enhanced. Even if there are slight deviations in the processing, reliable connection between chip and antenna can be ensured. It is suitable for high-precision high-end products and large-scale industrial production needs. Attached Figure Description

[0020] Figure 1 This is an exploded structural diagram of Embodiment 1 of this utility model;

[0021] Figure 2 This is a cross-sectional structural schematic diagram of Embodiment 1 of this utility model;

[0022] Figure 3 This is a schematic diagram of the planar structure of the upper structural layer in Embodiment 1 of this utility model;

[0023] Figure 4This is a schematic diagram of the planar structure of the antenna layer in Embodiment 1 of this utility model;

[0024] Figure 5 This is a top view schematic diagram of the chip module according to Embodiment 1 of this utility model;

[0025] Figure 6 This is a side view of the chip module according to Embodiment 1 of this utility model;

[0026] Figure 7 This is a bottom view schematic diagram of the chip module according to Embodiment 1 of this utility model;

[0027] Figure 8 This is an exploded structural diagram of Embodiment 2 of this utility model;

[0028] Figure 9 This is a cross-sectional structural schematic diagram of Embodiment 2 of this utility model;

[0029] Figure 10 This is a schematic diagram of the planar structure of the antenna layer in Embodiment 2 of this utility model;

[0030] Figure 11 This is a schematic diagram of the planar structure of the antenna layer in Embodiment 3 of this utility model. Detailed Implementation

[0031] The utility model will be further described below with reference to the accompanying drawings:

[0032] The orientations described in this utility model specification, such as "up," "down," "left," "right," "front," and "back," are based on the orientations in the accompanying drawings and are intended to facilitate the description of the relationships between the various components. They do not indicate the unique or absolute positional relationships between the various components, but are merely one embodiment of the utility model and are not a limitation on its implementation.

[0033] Example 1

[0034] This embodiment introduces a metal smart chip card packaging structure, including a card base 1 and a chip module 11 connected to the card base 1. The card base 1 consists of an upper structural layer 12, an antenna layer 13, and a lower structural layer 14. Typically, the lower structural layer 14 consists of a lower plastic layer 141 and a lower coating layer 142, which supports the overall structure and provides a certain degree of flexibility and printability. The magnetic stripe 18 for information storage is generally attached to the lower surface of the lower coating layer 142 for compatibility with traditional magnetic card reader / writer devices. The upper structural layer 12 consists of a metal layer 121 and a shielding layer 122. The shielding layer 122 is typically made of magnetically conductive materials such as ferrite, which enhances the surrounding magnetic field and improves the efficiency of radio frequency identification. It also effectively shields external electromagnetic interference. Its shielding function refers to shielding the signal from the metal layer 121, ensuring the stability and reliability of chip communication. Furthermore, functional structures such as a printed layer and a protective printed layer can be provided on the upper surface of the metal layer 121 to meet the needs of appearance design, brand identification, and anti-counterfeiting identification; similarly, a printed layer or a protective layer can also be added to the lower structural layer 14 as needed. Overall, both the upper structural layer 12 and the lower structural layer 14 are composed of two or more layers, forming a composite card base structure that integrates functionality, structure, and aesthetics. Figures 1 to 7As shown, in this embodiment, the card base 1 includes at least a thin sheet-like metal layer 121, a shielding layer 122, an antenna layer 13, a lower plastic layer 141, and a lower coating layer 142 stacked sequentially from top to bottom. The antenna layer 13 houses a radio frequency antenna 15, which has at least two conductive contact portions 150 for electrical connection with the chip module 11. The card base 1 has a mounting groove 16 located above the conductive contact portions 150 and used to accommodate the chip module 11. The mounting groove 16 penetrates the metal layer 121 and the shielding layer 122, forming a transparent mounting cavity. A conductive connection groove 160 extending downwards to the conductive contact portions 150 is formed at the bottom of the mounting groove 16, exposing the conductive contact portions 150 within the conductive connection groove 160. A conductive material pillar 17 is provided in the conductive connection groove 160, its lower part being electrically connected to the conductive contact portions 150, and its upper part protruding upwards to form a contact end with the chip module 11. The chip module 11 has exposed chip contacts 111 after encapsulation, which are electrically connected to the top of the conductive material pillar 17 after being installed in the mounting groove 16. The chip module 11 employs a novel encapsulation process, retaining only the chip contacts 111, while the rest is encapsulated and protected. The number of chip contacts 111 is generally two, but can be designed to be multiple depending on functional requirements, ensuring stable communication with the RF antenna 15. Through the above structural design, the connection between the chip module 11 and the RF antenna 15 is achieved using a gel-like conductive material, eliminating the complex processes of traditional wire picking and bonding, significantly simplifying the manufacturing process, and effectively avoiding common problems such as short circuits and poor soldering. The gel-like conductive material can be selected from, but is not limited to, conductive adhesive, solder paste, and solder balls. Among these materials, conductive adhesive solidifies after melting to form a stable connection, solder paste does not require solidification, and solder balls are attached using AFC tape. The conductive adhesive is a mixture of epoxy resin and fillers such as metal particles or conductive carbon particles, possessing good conductivity and adhesion, as well as a certain degree of deformation adaptability, suitable for connection requirements with small gaps. By combining the above structure and process, not only is a high-integration design of metal smart chip cards achieved, but their structural compactness, connection stability and manufacturing efficiency are also significantly improved, which has broad application prospects.

[0035] As a preferred option, such as Figures 1 to 4As shown, the conductive contact portion 150 has a coiled serpentine structure, consisting of several straight segments 151 and curved segments 152 connected together, typically formed by bending copper wire. This structural design has the following advantages: the serpentine structure increases the length of the conductive contact portion 150, thereby increasing the contact area with the conductive material pillar 17 and enhancing conductivity stability; since there may be positional deviations in the processing of the conductive connecting groove 160, the serpentine structure allows multiple straight segments 151 to be distributed in different positions, ensuring that at least two straight segments 151 can still effectively contact the conductive material pillar 17 even with local deviations; the serpentine design allows for the arrangement of more conductive paths within a limited space, improving overall space utilization.

[0036] Furthermore, in this embodiment, preferably three straight segments 151 are exposed in the conductive connection groove 160. The conductive connection groove 160 is circular with a diameter of D1, satisfying 1.0mm≤D1≤2.0mm; the diameter of the straight segments 151 is d2, satisfying 0.07mm≤d2≤0.15mm; the spacing between adjacent straight segments 151 is L1, satisfying 0.1mm≤L1≤0.25mm. The purpose of the above parameter design is to: ensure connection stability: even with slight deviations in the slot position or copper wire installation position, at least three copper wires can be ensured to be located within the conductive connection groove 160, thereby achieving stable conductivity; optimize connection tolerance: by reasonably controlling the thickness and spacing of the copper wires, the contact area between the conductive adhesive and the copper wires can be increased, while avoiding short circuits caused by excessively small spacing; facilitate manufacturing control: this parameter range is easily achieved under existing process conditions and is suitable for large-scale production.

[0037] Furthermore, the minimum distance between the wall of the conductive connection groove 160 and the wall of the mounting groove 16 is L2, satisfying L2≥D1. This design has the following advantages: preventing conductive adhesive overflow and short circuits: because the conductive adhesive has a certain fluidity when uncured, by setting... The distance effectively limits the spread of conductive adhesive in all directions, preventing it from contacting the metal layer 121 and causing a short circuit; it improves structural reliability: considering that the deformation range of conductive adhesive is usually less than one-fifth of the diameter of the conductive connection groove, this spacing design can completely avoid the risk of accidental contact; it facilitates assembly tolerance control: the reserved space can adapt to different assembly precision requirements and improve the yield.

[0038] The manufacturing method of the above-mentioned metal smart chip card packaging structure includes the following steps:

[0039] A. Chip module 11 is packaged, exposing chip contacts 111 at the bottom. A customized package, including the strip and chip, is encapsulated using a packaging process, leaving only the two chip contacts 111 exposed. This step can employ flip-chip packaging, wire bonding, or other processes, selecting the appropriate packaging method based on the chip's functional requirements.

[0040] B. The various sheet-like material layers are sequentially stacked and pressed together to form the card base 1, consisting of five sheet-like material layers stacked from top to bottom: metal layer 121, shielding layer 122, antenna layer 13, lower plastic layer 141, and lower coating layer 142. Tight bonding between the materials is achieved through processes such as hot pressing and lamination, ensuring the stability and mechanical strength of the overall structure.

[0041] C. A mounting groove 16 matching the shape of the chip module 11 is opened on the upper surface of the card base 1. A cavity matching the shape of the chip module 11 is milled out by a high-precision CNC or a small milling machine. The cavity can be a through groove running from top to bottom or a countersunk groove segmented from top to bottom. The design can be flexible according to actual needs.

[0042] D. A conductive connection groove 160 is formed at the bottom of the mounting groove 16. The conductive connection groove 160 is formed at the corresponding position of the conductive contact portion 150 of the radio frequency antenna 15 on the antenna layer 13, and the depth is based on the exposure of the conductive contact portion 150. In this step, parameters such as the thickness of the copper wire of the radio frequency antenna 15, the spacing of the bending of the copper wire of the conductive contact portion 150, and the aperture of the conductive connection groove 160 are preset to ensure that at least two copper wires are exposed in the conductive connection groove 160.

[0043] E. Apply conductive adhesive to the conductive connection groove 160 using a dispensing machine. The conductive adhesive is in a gel-like state before curing. Control the amount and shape of the adhesive by the dispensing machine so that the conductive adhesive protrudes upward to form a conductive material pillar 17. The top of the upward protrusion of the conductive material pillar 17 needs to be higher than the position of the chip contact 111 after the chip module 11 is installed. This step requires controlling the dispensing accuracy to ensure that the conductive adhesive is evenly distributed and makes good contact with the copper wire.

[0044] F. Install the chip module 11 in the mounting recess 16, so that the chip contacts 111 of the chip module 11 are in contact with the conductive adhesive. This step should be completed before the conductive adhesive cures to ensure a good conductive connection.

[0045] G. The card base 1 with the chip module 11 installed is hot-pressed to fix the chip module 11 onto the card base 1, forming the finished product. During the hot-pressing process, the temperature, pressure and time need to be controlled to ensure that the conductive adhesive is completely cured without affecting the chip function.

[0046] Subsequent steps may include, but are not limited to, the following processes: coating or printing patterns, text, etc., setting magnetic strip 18, inspection, packaging, etc.

[0047] Example 2

[0048] This embodiment introduces a metal smart chip card packaging structure, which differs from Embodiment 1 in that the upper structural layer 12 has a different composition.

[0049] like Figures 8 to 10As shown, in this embodiment, the upper structural layer 12 includes an upper film layer 123 and an upper plastic layer 124 stacked together. The upper film layer 123 covers the upper surface of the plastic layer, and the mounting groove 16 penetrates the upper film layer 123 and the upper plastic layer 124.

[0050] Furthermore, a metal sheet 131 is embedded in the antenna layer 13. That is, the card base 1 includes at least an upper coating layer 123, an upper plastic layer 124, an antenna layer 13, a lower plastic layer 141, and a lower coating layer 142, all in thin sheet form and stacked sequentially from top to bottom. In this structure, the metal material does not cover the entire antenna layer; instead, it is embedded within the antenna layer through the metal sheet 131. This retains the metal material to increase structural strength while minimizing its impact on the antenna signal.

[0051] As a preferred option, such as Figure 10 As shown, the radio frequency antenna 15 in the antenna layer 13 surrounds the edge region of the antenna layer 13, while the metal sheet 131 is disposed in two regions: one is in the inner region surrounded by the radio frequency antenna 15, used to improve the compressive strength of the central region; the other is in the outer region of the radio frequency antenna 15, forming the perimeter of the antenna layer 13, used to enhance the edge's resistance to deformation. This structure has high resistance to deformation while avoiding the shielding effect of the metal material on the radio frequency signal, representing an optimized design that balances structural strength and communication performance.

[0052] Example 3

[0053] This embodiment introduces a metal smart chip card packaging structure, which differs from Embodiment 2 in that the arrangement of the metal sheet 131 in the antenna layer 13 is different.

[0054] like Figure 11 As shown, in this embodiment, the radio frequency antenna 15 in antenna layer 13 also surrounds the edge region of antenna layer 13, while the metal sheet 131 is only disposed in the inner region surrounded by the radio frequency antenna 15. This structural design, while maintaining structural strength, further simplifies the arrangement of the metal sheet, reduces manufacturing complexity, and is suitable for application scenarios with moderate structural strength requirements and high demand for simplified processes. The advantages of this structure include: arranging the metal sheet only inside the radio frequency antenna, reducing material usage and processing steps; simplified process, eliminating the need for metal sheet embedding operations in the edge region, improving production efficiency; low signal interference, avoiding interference to the signal path caused by the metal sheet in the antenna edge region; suitable for mass production: suitable for products such as transportation cards and access control cards where the requirements for metal texture are not high but cost and efficiency are sensitive.

[0055] The above descriptions are merely embodiments of this utility model, and common knowledge regarding specific structures and characteristics is not elaborated upon here. It should be noted that those skilled in the art can make various modifications and improvements without departing from the structure of this utility model, and these should also be considered within the scope of protection of this utility model. These modifications will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application shall be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. A metal smart chip card packaging structure, comprising a card base (1) and a chip module (11) connected to the card base (1), wherein the card base (1) comprises at least an upper structural layer (12), an antenna layer (13), and a lower structural layer (14) arranged in a thin sheet shape and stacked sequentially, characterized in that: The antenna layer (13) is provided with a radio frequency antenna (15), the radio frequency antenna (15) has at least two conductive contact portions (150), the card base (1) has a mounting groove (16) located above the conductive contact portion (150) and used to accommodate the chip module (11), the bottom of the mounting groove (16) has a conductive connection groove (160) extending downward to the conductive contact portion (150), the bottom of the chip module (11) has exposed chip contacts (111) after encapsulation, and the conductive connection groove (160) has a conductive material pillar (17) whose lower part is conductively connected to the conductive contact portion (150) and whose upper part protrudes upward and is conductively connected to the chip contacts (111).

2. The metal smart chip card packaging structure according to claim 1, characterized in that: The upper structural layer (12) includes a metal layer (121) and a shielding layer (122) stacked together. The shielding layer (122) is sandwiched between the metal layer (121) and the antenna layer (13). The mounting groove (16) penetrates the metal layer (121) and the shielding layer (122).

3. The metal smart chip card packaging structure according to claim 1, characterized in that: The upper structural layer (12) includes an upper coating layer (123) and an upper plastic layer (124) stacked together. The upper coating layer (123) covers the upper surface of the upper plastic layer (124). The mounting groove (16) penetrates the upper coating layer (123) and the upper plastic layer (124). A metal sheet (131) is embedded in the antenna layer (13).

4. The metal smart chip card packaging structure according to any one of claims 1-3, characterized in that: The lower structural layer (14) includes a lower plastic layer (141) and a lower film layer (142) stacked together, and a magnetic strip (18) for storing information is connected to the lower surface of the lower film layer (142).

5. The metal smart chip card packaging structure according to any one of claims 1-3, characterized in that: The conductive contact portion (150) is a coiled serpentine structure, which is composed of several straight segments (151) and curved segments (152) connected together, wherein at least two straight segments (151) are exposed in the conductive connection groove (160).

6. The metal smart chip card packaging structure according to claim 5, characterized in that: Three straight segments (151) are exposed in the conductive connection groove (160), which is circular with a diameter of D1, so 1.0mm≤D1≤2.0mm. The diameter of the straight segments (151) is d2, so 0.07mm≤d2≤0.15mm. The spacing between adjacent straight segments (151) is L1, so 0.1mm≤L1≤0.25mm.

7. The metal smart chip card packaging structure according to claim 6, characterized in that: The minimum distance between the wall of the conductive connection groove (160) and the wall of the mounting groove (16) is L2.

8. The metal smart chip card packaging structure according to any one of claims 1-3, characterized in that: The conductive material column (17) is conductive adhesive, solder paste or solder ball.

9. The metal smart chip card packaging structure according to claim 8, characterized in that: The conductive material column (17) is a conductive adhesive, which is a mixture of epoxy resin and filler, wherein the filler is metal particles or conductive carbon particles.

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