High temperature resistant RFID tag

Abstract

The utility model discloses a kind of high-temperature-resistant RFID labels, including first heat insulation adhesive layer, heat conducting layer, second heat insulation adhesive layer, RFID layer, shielding layer, first adhesive layer, release plastic layer, second adhesive layer and release paper layer;The heat conducting layer is arranged between first heat insulation adhesive layer and second heat insulation adhesive layer;The RFID layer includes chip layer and antenna layer, the chip layer and antenna layer are stacked and placed;The periphery of the chip layer and antenna layer is wrapped by conductive adhesive layer, and the conductive adhesive layer fixes the chip layer on the antenna layer;The antenna layer includes antenna and base material;The shielding layer is arranged between the RFID layer and first adhesive layer, and the first adhesive layer tightly adheres the shielding layer and release plastic layer, and the second adhesive layer tightly adheres release plastic layer and release paper layer.The high-temperature-resistant RFID label proposed in the utility model can improve the high-temperature resistance of RFID label, effectively solve the problem that conventional RFID label will wrinkle, deform and antenna be damaged after sterilization.

Description

Technical Field

[0001] This utility model belongs to the field of RFID tag technology, and relates to an RFID tag, and more particularly to a high-temperature resistant RFID tag. Background Technology

[0002] RFID technology, as an emerging automatic identification technology, has significant advantages such as non-contact operation, long-distance reading, batch identification capability, and large information storage capacity. Currently, many medical consumables have RFID tags affixed to their packaging before entering hospital departments for acceptance, aiming to achieve efficient and accurate management through this technology.

[0003] However, conventional RFID tags often cannot withstand high-temperature steam environments for extended periods, leading to magnetic signal attenuation or even complete damage. This is because the materials and structure of ordinary tags may deform or soften at high temperatures, affecting the internal chip and antenna, thus impacting signal transmission.

[0004] In view of this, there is an urgent need to design a new RFID tag in order to overcome at least some of the aforementioned shortcomings of existing RFID tags. Utility Model Content

[0005] This invention provides a high-temperature resistant RFID tag, which can improve the high-temperature resistance of RFID tags and effectively solve the problems of wrinkles, deformation, and antenna damage that occur in conventional RFID tags after sterilization.

[0006] To solve the above-mentioned technical problems, according to one aspect of this utility model, the following technical solution is adopted:

[0007] A high-temperature resistant RFID tag, the high-temperature resistant RFID tag comprising: a first heat-insulating adhesive layer, a heat-conducting layer, a second heat-insulating adhesive layer, an RFID layer, a shielding layer, a first adhesive layer, a release plastic layer, a second adhesive layer, and a release paper layer;

[0008] The first heat-insulating adhesive layer, the heat-conducting layer, the second heat-insulating adhesive layer, the RFID layer, the shielding layer, the first adhesive layer, the release plastic layer, the second adhesive layer, and the release paper layer are arranged in sequence;

[0009] The thermally conductive layer is disposed between the first thermal insulation layer and the second thermal insulation layer; the RFID layer includes a chip layer and an antenna layer, which are stacked together.

[0010] The chip layer and the antenna layer are surrounded by a conductive adhesive layer, which fixes the chip layer to the antenna layer; the antenna layer includes an antenna and a substrate, and the antenna is disposed on the substrate;

[0011] The shielding layer is disposed between the RFID layer and the first adhesive layer, the first adhesive layer tightly bonding the shielding layer and the release plastic layer, and the second adhesive layer tightly bonding the release plastic layer and the release paper layer.

[0012] In one embodiment of this utility model, a third heat-insulating adhesive layer is provided between the shielding layer and the first adhesive layer.

[0013] As one embodiment of the present invention, the high-temperature resistant RFID tag includes a first region and a second region, and a dividing line is provided between the first region and the second region;

[0014] The first region is located on one side of the second region; the conductive adhesive layer and the shielding layer are located in the first region, while no conductive adhesive layer and shielding layer are located in the second region.

[0015] In one embodiment of this utility model, the conductive adhesive layer is an organic silicone material layer, a phenolic resin adhesive layer, a urea-formaldehyde resin adhesive layer, a heat-resistant epoxy adhesive layer, or a polyimide adhesive layer.

[0016] As one embodiment of the present invention, the high-temperature resistant RFID tag further includes at least one second release material mechanism, the second release material mechanism including a third adhesive layer and a second release paper layer.

[0017] As one embodiment of this utility model, the high-temperature resistant RFID tag includes multiple high-temperature resistant RFID tag units, which are sold in rolls, and the release paper layer of each high-temperature resistant RFID tag unit is integrated.

[0018] The beneficial effects of this utility model are as follows: The high-temperature resistant RFID tag proposed in this utility model can improve the high-temperature resistance of RFID tags and effectively solve the problems of wrinkles, deformation and antenna damage that occur in conventional RFID tags after sterilization.

[0019] In one application scenario of this utility model, the RFID electronic part is wrapped with a high-temperature resistant adhesive layer. This adhesive layer can protect the RFID chip from loosening due to heat and pressure during the injection molding process, thereby ensuring that the RFID tag has stable radio frequency read and write performance. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a high-temperature resistant RFID tag in one embodiment of the present invention.

[0021] Figure 2 This is a schematic diagram of the structure of a high-temperature resistant RFID tag in one embodiment of the present invention.

[0022] Figure 3 This is a schematic diagram of the structure of a high-temperature resistant RFID tag in another embodiment of the present invention. Detailed Implementation

[0023] The preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings.

[0024] To further understand this utility model, preferred embodiments of this utility model are described below in conjunction with examples. However, it should be understood that these descriptions are only for further illustrating the features and advantages of this utility model, and not for limiting the scope of the claims of this utility model.

[0025] The description in this section pertains to only a few typical embodiments, and this utility model is not limited to the scope of the embodiments described. Substitution of identical or similar prior art methods with some technical features in the embodiments is also within the scope of this utility model's description and protection.

[0026] The term "connection" in the instruction manual includes both direct and indirect connections.

[0027] This utility model discloses a high-temperature resistant RFID tag. Figure 1 , Figure 2 This is a schematic diagram of the structure of a high-temperature resistant RFID tag in one embodiment of this utility model; please refer to [link / reference]. Figure 1 , Figure 2 The high-temperature resistant RFID tag includes: a first heat-insulating adhesive layer 1, a heat-conducting layer 2, a second heat-insulating adhesive layer 3, an RFID layer 4, a shielding layer 5, a first adhesive layer 6, a release plastic layer 7, a second adhesive layer 8, and a release paper layer 9; the first heat-insulating adhesive layer 1, the heat-conducting layer 2, the second heat-insulating adhesive layer 3, the RFID layer 4, the shielding layer 5, the first adhesive layer 6, the release plastic layer 7, the second adhesive layer 8, and the release paper layer 9 are arranged sequentially. In one embodiment, multiple high-temperature resistant RFID tags can be sold in rolls, that is, the release paper layer 9 of each high-temperature resistant RFID tag can be designed as an integrated unit.

[0028] The thermally conductive layer 2 is disposed between the first thermally insulating adhesive layer 1 and the second thermally insulating adhesive layer 3; the RFID layer 4 includes a chip layer 41 and an antenna layer 42, which are stacked together; Figure 2 As shown, chip layer 41 can be disposed above antenna layer 42. The chip layer 41 and antenna layer 42 are surrounded by conductive adhesive layer 43, which fixes the chip layer 41 to the antenna layer 42. Antenna layer 42 includes an antenna and a substrate, with the antenna disposed on the substrate. In one embodiment, the conductive adhesive layer 43 is an organic silicone material layer, a phenolic resin material layer, a urea-formaldehyde resin material layer, a heat-resistant epoxy material layer, or a polyimide material layer.

[0029] The shielding layer 5 is disposed between the RFID layer 4 and the first adhesive layer 6. The first adhesive layer 6 tightly adheres the shielding layer 5 to the release plastic layer 7, and the second adhesive layer 8 tightly adheres the release plastic layer 7 to the release paper layer 9.

[0030] Figure 3 This is a schematic diagram of the structure of a high-temperature resistant RFID tag in another embodiment of the present invention. In this embodiment of the present invention, a third heat-insulating adhesive layer 10 can be provided between the shielding layer 5 and the first adhesive layer 6 to achieve a better heat insulation effect.

[0031] To further avoid signal interference, the high-temperature resistant RFID tag includes a first area and a second area, with a dividing line between them; the first area is located on one side of the second area; the conductive adhesive layer and shielding layer are located in the first area, while the second area does not have these layers. In use, the second area can be attached to a metal surface to minimize signal interference to the RFID component.

[0032] This invention, by setting a first heat-insulating adhesive layer 1, a heat-conducting layer 2, and a second heat-insulating adhesive layer 3, can better insulate and conduct heat, disperse external heat, reduce the heating temperature of the RFID layer 4, and improve the service life of the RFID tag.

[0033] Meanwhile, by setting two release material layers, namely the release plastic layer 7 and the release paper layer 9, when the position of the RFID tag needs to be adjusted, the release plastic layer 7 can be peeled off, and the first adhesive layer 6 can be used to re-attach it. In addition, the high-temperature resistant RFID tag may also include at least one second release material mechanism, which includes a third adhesive layer and a second release paper layer; thereby further increasing the number of times the RFID tag can be used.

[0034] Furthermore, in one application scenario of this utility model, the RFID tag can be pasted onto a structure such as a metal material through a second area, thereby avoiding external interference to the RFID tag.

[0035] In summary, the high-temperature resistant RFID tag proposed in this invention improves the high-temperature resistance of RFID tags and effectively solves the problems of wrinkling, deformation, and antenna damage that occur in conventional RFID tags after sterilization. In one application scenario of this invention, the RFID electronic components are encapsulated in a layer of high-temperature resistant adhesive. This adhesive layer protects the RFID chip from loosening due to heat and pressure during injection molding, thereby ensuring stable radio frequency read / write performance of the RFID tag.

[0036] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0037] The description and application of this utility model herein are illustrative and not intended to limit the scope of the utility model to the above embodiments. The effects or advantages involved in the embodiments may not be manifested in the embodiments due to various factors, and the description of effects or advantages is not intended to limit the embodiments. Variations and modifications of the embodiments disclosed herein are possible, and various substitutions and equivalents of the components in the embodiments are well known to those skilled in the art. It should be clear to those skilled in the art that this utility model can be implemented in other forms, structures, arrangements, proportions, and with other components, materials, and parts without departing from the spirit or essential characteristics of this utility model. Other variations and modifications can be made to the embodiments disclosed herein without departing from the scope and spirit of this utility model.

Claims

1. A high-temperature resistant RFID tag, characterized in that, The high-temperature resistant RFID tag includes: a first heat-insulating adhesive layer, a heat-conducting layer, a second heat-insulating adhesive layer, an RFID layer, a shielding layer, a first adhesive layer, a release plastic layer, a second adhesive layer, and a release paper layer; The first heat-insulating adhesive layer, the heat-conducting layer, the second heat-insulating adhesive layer, the RFID layer, the shielding layer, the first adhesive layer, the release plastic layer, the second adhesive layer, and the release paper layer are arranged in sequence; The thermally conductive layer is disposed between the first thermal insulation layer and the second thermal insulation layer; the RFID layer includes a chip layer and an antenna layer, which are stacked together. The chip layer and the antenna layer are surrounded by a conductive adhesive layer, which fixes the chip layer to the antenna layer; the antenna layer includes an antenna and a substrate, and the antenna is disposed on the substrate; The shielding layer is disposed between the RFID layer and the first adhesive layer, the first adhesive layer tightly bonding the shielding layer and the release plastic layer, and the second adhesive layer tightly bonding the release plastic layer and the release paper layer.

2. The high-temperature resistant RFID tag according to claim 1, characterized in that: A third heat-insulating adhesive layer is provided between the shielding layer and the first adhesive layer.

3. The high-temperature resistant RFID tag according to claim 1, characterized in that: The high-temperature resistant RFID tag includes a first area and a second area, with a dividing line between the first area and the second area.

4. The high-temperature resistant RFID tag according to claim 3, characterized in that: The first region is located on one side of the second region; the conductive adhesive layer and the shielding layer are located in the first region, while no conductive adhesive layer and shielding layer are located in the second region.

5. The high-temperature resistant RFID tag according to claim 1, characterized in that: The conductive adhesive layer is an organic silicone material layer, a phenolic resin material layer, a urea-formaldehyde resin material layer, a heat-resistant epoxy adhesive layer, or a polyimide adhesive layer.

6. The high-temperature resistant RFID tag according to claim 1, characterized in that: The high-temperature resistant RFID tag further includes at least one second release material mechanism, which includes a third adhesive layer and a second release paper layer.

7. The high-temperature resistant RFID tag according to claim 1, characterized in that: The high-temperature resistant RFID tag includes multiple high-temperature resistant RFID tag units, which are sold in rolls.

8. The high-temperature resistant RFID tag according to claim 7, characterized in that: The release paper layer of each high-temperature resistant RFID tag unit is integrated into a single design.

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