Graphene heat dissipation high-density display module
By combining graphene and copper thermal conductivity mechanisms, the heat dissipation problem of high-density display modules is solved, achieving rapid and effective heat conduction and dissipation, and improving display stability and effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ANHUI SAI SHIDA DISPLAY TECH CO LTD
- Filing Date
- 2025-10-28
- Publication Date
- 2026-07-21
AI Technical Summary
The heat generated by the high-density display module during operation cannot be dissipated effectively and in a timely manner, resulting in an increase in internal temperature and affecting display performance and stability.
It combines a graphene heat dissipation mechanism with a copper heat conduction mechanism, taking advantage of the high thermal conductivity of graphene and the excellent thermal conductivity of copper. Heat is quickly conducted to the heat dissipation fins through an infrared reflection layer, and rapid heat dissipation is achieved through the design of air vents and copper slots.
It improves heat dissipation efficiency, reduces the internal temperature of the display module, ensures the working stability and display effect of the display panel, and extends the screen's lifespan.
Smart Images
Figure CN224536643U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of display modules, specifically a graphene heat dissipation high-density display module. Background Technology
[0002] With the continuous development of display technology, display modules are rapidly moving towards higher density and higher resolution. High-density display modules integrate more pixel units per unit area, which can present clearer and more delicate image effects and are widely used in smartphones, tablets, laptops, monitors, televisions and various professional display devices.
[0003] However, while high-density display modules offer superior display performance, they also face significant heat dissipation challenges. Due to the high integration of pixel units, the heat generated per unit area increases substantially during operation. If this heat cannot be dissipated effectively and promptly, it will cause the internal temperature of the display module to rise, leading to a series of problems.
[0004] Traditional heat dissipation methods involve static heat dissipation through ventilation holes. However, when using this method, the heat dissipates naturally, but the dissipation rate is slow and the heat dissipation effect is poor. Therefore, a graphene heat dissipation high-density display module is proposed to address the above problems. Utility Model Content
[0005] In order to overcome the shortcomings of the existing technology and solve at least one of the technical problems mentioned in the background technology, this utility model proposes a graphene heat dissipation high-density display module.
[0006] The technical solution adopted by this utility model to solve its technical problem is: a graphene heat dissipation high-density display module, including a mounting back plate and a display component. The display component includes a display panel. A driving circuit layer is fixedly disposed on the lower surface of the display panel. The driving circuit layer is electrically connected to the display panel. A graphene heat dissipation mechanism and a copper body heat conduction mechanism are fixedly disposed below the driving circuit layer. The copper body heat conduction mechanism is located below the graphene heat dissipation mechanism. The graphene heat dissipation mechanism includes a graphene heat conduction layer. An infrared reflection layer is fixedly disposed on the front side of the graphene heat conduction layer. The infrared reflection layer is attached to the rear side of the driving circuit layer. Graphene heat dissipation fins are disposed on the rear side of the graphene heat conduction layer. The copper body heat conduction mechanism includes a heat-conducting copper plate attached to the lower side of the graphene heat dissipation fins. Multiple linear copper grooves are uniformly opened in the heat-conducting copper plate. An encapsulation support frame is fixedly disposed on the mounting back plate. The frame of the display component is fixedly connected to the inner side of the encapsulation support frame. A heat dissipation mechanism is disposed on the encapsulation support frame.
[0007] Preferably, the graphene heat dissipation fins are integrally formed with the graphene thermal conductive layer, and the graphene heat dissipation fins are evenly spaced along the length of the graphene thermal conductive layer.
[0008] Preferably, a plurality of heat dissipation holes are uniformly formed on the rear side of the heat-conducting copper plate, and the heat dissipation holes are connected to the linear copper groove.
[0009] Preferably, a plurality of copper plate heat dissipation fins are provided behind the heat-conducting copper plate, and the copper plate heat dissipation fins are integrally formed with the heat-conducting copper plate.
[0010] Preferably, the heat dissipation mechanism includes a groove on one side of the encapsulation support frame and a heat dissipation slot on the other side of the encapsulation support frame. An air duct is embedded in the groove, and a flow guide shell is fixedly installed on the air duct. The slot of the flow guide shell corresponds to one side of the graphene heat dissipation fins and the linear copper slot.
[0011] Preferably, dustproof nets are fixedly installed on both the embedded groove and the heat dissipation groove, and the embedded groove and the heat dissipation groove are positioned correspondingly.
[0012] Preferably, a tempered glass is fixedly disposed on the front side of the display panel, and the tempered glass is provided with a fingerprint-resistant coating.
[0013] The advantages of this utility model are:
[0014] This invention utilizes a graphene heat dissipation mechanism. The infrared reflective layer rapidly reflects heat from the driving circuit layer to the graphene heat-conducting layer, dispersing the screen temperature across the graphene heat-conducting layer. Through this structural design, the extremely high thermal conductivity of graphene is leveraged to quickly conduct heat generated by the driving circuit layer and the display panel to the graphene heat dissipation fins. The graphene heat dissipation fins increase the heat dissipation area, improve heat dissipation efficiency, effectively reduce the internal temperature of the display module, and ensure the operational stability and display effect of the display panel.
[0015] This invention utilizes the excellent thermal conductivity of copper to conduct heat from the graphene heat dissipation fins through the structure of the copper body heat conduction mechanism, thereby increasing the heat dissipation area.
[0016] This invention, through the structural design of the heat dissipation mechanism, controls the operation of the air vent, directing air through the guide shell to the channel formed by the graphene heat dissipation fins and the thermally conductive copper plate, and can also direct air to the linear copper groove, thereby rapidly dissipating heat from the thermally conductive copper plate and the graphene heat dissipation fins, and expelling hot air through the heat dissipation groove. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of the structure of this utility model;
[0019] Figure 2 A structural diagram showing the installation of the backplate and the encapsulation support frame;
[0020] Figure 3 for Figure 2 Enlarged view of point A in the middle;
[0021] Figure 4 This is a schematic diagram of the display components, graphene heat dissipation mechanism, and copper body heat conduction mechanism.
[0022] Figure 5 for Figure 4 Enlarged view of point B in the middle;
[0023] Figure 6 This is a schematic diagram of the heat conduction mechanism of the copper body.
[0024] In the diagram: 1. Mounting backplate; 2. Display panel; 3. Driver circuit layer; 4. Graphene thermal conductive layer; 5. Infrared reflective layer; 6. Graphene heat dissipation fins; 7. Thermally conductive copper plate; 8. Linear copper channel; 9. Encapsulation support frame; 10. Copper plate heat dissipation holes; 11. Copper plate heat dissipation fins; 12. Embedded slot; 13. Heat dissipation slot; 14. Air vent; 15. Drainage shell; 16. Dustproof mesh; 17. Tempered glass. Detailed Implementation
[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.
[0026] The following is in conjunction with the appendix Figure 1-6 This application will be described in further detail.
[0027] This application discloses a graphene heat dissipation high-density display module:
[0028] Reference Figures 1-5A graphene-heat-dissipating high-density display module includes a mounting backplate 1 and a display assembly. The display assembly includes a display panel 2. A driving circuit layer 3 is fixedly disposed on the lower surface of the display panel 2. An integrated circuit for controlling the display assembly is etched on the driving circuit layer 3 and is electrically connected to electrical components on the display panel 2. The display panel 2 is a high-density pixel display panel with a pixel density of not less than 500 PPI. The driving circuit layer 3 is used to drive the display panel 2 to display images and is electrically connected to the display panel 2. A graphene heat dissipation layer is fixedly disposed below the driving circuit layer 3. The system includes a thermal mechanism and a copper heat-conducting mechanism. The copper heat-conducting mechanism is located below the graphene heat dissipation mechanism. The graphene heat dissipation mechanism utilizes the extremely high thermal conductivity of graphene to quickly conduct the heat generated by the driving circuit layer 3 and the display panel 2 to the graphene heat dissipation fins 6. The graphene heat dissipation fins 6 increase the heat dissipation area, improve heat dissipation efficiency, effectively reduce the internal temperature of the display module, and ensure the working stability and display effect of the display panel 2. Through the structural design of the copper heat-conducting mechanism, the excellent thermal conductivity of copper is used to conduct the heat on the graphene heat dissipation fins 6, thereby increasing the heat dissipation area.
[0029] The graphene heat dissipation mechanism includes a graphene heat-conducting layer 4, an infrared reflective layer 5 fixedly disposed on the front side of the graphene heat-conducting layer 4, the infrared reflective layer 5 being attached to the rear side of the driving circuit layer 3, and graphene heat dissipation fins 6 disposed on the rear side of the graphene heat-conducting layer 4. The infrared reflective layer 5 rapidly reflects the heat from the driving circuit layer 3 to the graphene heat-conducting layer 4, dispersing the screen temperature on the graphene heat-conducting layer 4, greatly reducing the overall temperature of the display components and extending the screen's lifespan.
[0030] The copper body heat conduction mechanism includes a heat-conducting copper plate 7 that is attached to the lower side of the graphene heat dissipation fins 6. Multiple linear copper grooves 8 are evenly opened in the heat-conducting copper plate 7. An encapsulation support frame 9 is fixedly installed on the mounting back plate 1. The frame of the display component is fixedly connected to the inner side of the encapsulation support frame 9. A heat dissipation mechanism is provided on the encapsulation support frame 9. The heat dissipation effect of the display component is improved through the structural design of the heat dissipation mechanism.
[0031] Reference Figure 4 and Figure 5 The graphene heat dissipation fins 6 and the graphene thermal conductive layer 4 are integrally formed, and the graphene heat dissipation fins 6 are evenly distributed at intervals along the length of the graphene thermal conductive layer 4. The integrally formed structure of the graphene heat dissipation fins 6 and the graphene thermal conductive layer 4 not only simplifies the production process and reduces the production cost, but also improves the overall thermal conductivity of the heat dissipation layer and avoids the problem of decreased thermal conductivity caused by assembly gaps.
[0032] Reference Figure 4 and Figure 6Multiple heat dissipation holes 10 are evenly provided on the rear side of the heat-conducting copper plate 7. The heat dissipation holes 10 are connected to the linear copper groove 8. This structure facilitates the airflow on the heat-conducting copper plate 7, thereby facilitating the dissipation of heat from the heat-conducting copper plate 7.
[0033] Reference Figure 6 Multiple copper heat dissipation fins 11 are provided behind the heat-conducting copper plate 7. The copper heat dissipation fins 11 and the heat-conducting copper plate 7 are integrally formed. This structure improves the stability of the overall structure of the heat-conducting copper plate 7 and the copper heat dissipation fins 11, and enhances the thermal conductivity.
[0034] Reference Figure 2 and Figure 4 The heat dissipation mechanism includes a groove 12 on one side of the encapsulation support frame 9 and a heat dissipation groove 13 on the other side of the encapsulation support frame 9. An air duct 14 is embedded in the groove 12. A flow-guiding shell 15 is fixedly installed on the air duct 14. The slot of the flow-guiding shell 15 corresponds to one side of the graphene heat dissipation fins 6 and the linear copper groove 8. By controlling the operation of the air duct 14, air is blown through the flow-guiding shell 15 to the channel formed by the graphene heat dissipation fins 6 and the heat-conducting copper plate 7, and air can also be blown to the linear copper groove 8, thereby rapidly dissipating heat from the heat-conducting copper plate 7 and the graphene heat dissipation fins 6.
[0035] Reference Figure 2 Dustproof mesh 16 is fixedly installed on both the recess 12 and the heat dissipation groove 13. The recess 12 and the heat dissipation groove 13 are in corresponding positions. The dustproof mesh 16 is made of stainless steel mesh, which improves the service life of the dustproof mesh 16 and prevents external dust from entering the interior of the encapsulation support frame 9.
[0036] Reference Figure 1 A tempered glass 17 is fixedly installed on the front side of the display panel 2. The tempered glass 17 is provided with a fingerprint-resistant coating. The tempered glass 17 protects the display panel 2, and the fingerprint-resistant coating prevents fingerprints from adhering to the tempered glass 17.
[0037] Working principle: Through the structural design of the graphene heat dissipation mechanism, the infrared reflective layer 5 quickly reflects the heat from the driving circuit layer 3 to the graphene heat-conducting layer 4, dispersing the screen temperature on the graphene heat-conducting layer 4. Through the structural design of the graphene heat-conducting layer 4, the heat generated by the driving circuit layer 3 and the display panel 2 is quickly conducted to the graphene heat dissipation fins 6 by utilizing the extremely high thermal conductivity of graphene. The heat dissipation fins of the graphene heat-conducting layer 4 increase the heat dissipation area, improve the heat dissipation efficiency, effectively reduce the internal temperature of the display module, and ensure the working stability and display effect of the display panel 2.
[0038] By utilizing the excellent thermal conductivity of copper, the heat on the graphene heat dissipation fins 6 is conducted through the structure of the copper body heat conduction mechanism, thereby increasing the heat dissipation area.
[0039] By controlling the operation of the exhaust fan 14 through the structure of the heat dissipation mechanism, the air is blown through the air intake shell 15 into the channel formed by the graphene heat dissipation fins 6 and the thermally conductive copper plate 7, and can also be blown into the linear copper groove 8, thereby rapidly dissipating heat from the thermally conductive copper plate 7 and the graphene heat dissipation fins 6, and exhausting the hot air through the heat dissipation groove 13.
[0040] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.
Claims
1. A graphene heat dissipation high-density display module, comprising a mounting backplate (1) and a display assembly, characterized in that: The display component includes a display panel (2), a driving circuit layer (3) is fixedly disposed on the lower surface of the display panel (2), the driving circuit layer (3) is electrically connected to the display panel (2), a graphene heat dissipation mechanism and a copper body heat conduction mechanism are fixedly disposed below the driving circuit layer (3), the copper body heat conduction mechanism is located below the graphene heat dissipation mechanism, the graphene heat dissipation mechanism includes a graphene heat conduction layer (4), an infrared reflection layer (5) is fixedly disposed on the front side of the graphene heat conduction layer (4), and the infrared reflection layer (5) is... The back side of the graphene heat-conducting layer (5) is attached to the back side of the driving circuit layer (3). The back side of the graphene heat-conducting layer (4) is provided with graphene heat dissipation fins (6). The copper body heat-conducting mechanism includes a heat-conducting copper plate (7) attached to the lower side of the graphene heat dissipation fins (6). Multiple linear copper grooves (8) are uniformly opened in the heat-conducting copper plate (7). An encapsulation support frame (9) is fixedly provided on the mounting back plate (1). The frame of the display component is fixedly connected to the inner side of the encapsulation support frame (9). A heat dissipation mechanism is provided on the encapsulation support frame (9).
2. The graphene heat dissipation high-density display module according to claim 1, characterized in that: The graphene heat dissipation fins (6) are integrally formed with the graphene heat-conducting layer (4), and the graphene heat dissipation fins (6) are evenly spaced along the length of the graphene heat-conducting layer (4).
3. The graphene heat dissipation high-density display module according to claim 1, characterized in that: The heat-conducting copper plate (7) has a plurality of copper plate heat dissipation holes (10) evenly opened on the rear side, and the copper plate heat dissipation holes (10) are connected to the linear copper groove (8).
4. The graphene heat dissipation high-density display module according to claim 3, characterized in that: Multiple copper plate heat dissipation fins (11) are provided behind the heat-conducting copper plate (7), and the copper plate heat dissipation fins (11) are integrally formed with the heat-conducting copper plate (7).
5. A graphene heat dissipation high-density display module according to claim 1, characterized in that: The heat dissipation mechanism includes a groove (12) opened on one side of the encapsulation support frame (9), and a heat dissipation groove (13) opened on the other side of the encapsulation support frame (9). A fan (14) is embedded in the groove (12), and a flow guide shell (15) is fixedly installed on the fan (14). The slot of the flow guide shell (15) corresponds to one side of the graphene heat dissipation fin (6) and the linear copper groove (8).
6. A graphene heat dissipation high-density display module according to claim 5, characterized in that: Dustproof nets (16) are fixedly installed on both the groove (12) and the heat dissipation groove (13), and the groove (12) and the heat dissipation groove (13) are in corresponding positions.
7. A graphene heat dissipation high-density display module according to claim 1, characterized in that: The front side of the display panel (2) is fixedly provided with tempered glass (17), and the tempered glass (17) is provided with a fingerprint-resistant coating.