Hard disk cooling device

Abstract

The utility model provides a kind of hard disk heat dissipation device.The hard disk heat dissipation device includes: shell, the shell includes base and cover, the cover is sealingly connected on the base, the cover and the base form accommodating space;And hard disk assembly, it is set in the accommodating space, the hard disk assembly includes the hard disk and the interface connector electrically connected with the hard disk;Wherein, the cover is additionally provided with heat dissipation gasket corresponding to the hard disk, the heat dissipation gasket is thermally conductive connection with hard disk, the outside of the cover is provided with first heat dissipation fin.The hard disk heat dissipation device of the application can improve hard disk heat dissipation.

Description

[0001] This application is a divisional application of Chinese patent application No. 2025209996948, filed on May 20, 2025, entitled "Hard Disk Reinforcement Device". Technical Field

[0002] This utility model relates to the field of hard disk technology, and in particular to a hard disk heat dissipation device. Background Technology

[0003] With the rapid development of storage technologies, such as solid-state drives (SSDs), which offer advantages like high-speed read / write speeds, low power consumption, and shock resistance, SSDs have expanded from traditional data center server rooms to diverse applications including industrial control, automotive electronics, and outdoor monitoring. However, current commercially available storage products are primarily designed for server room environments with controllable temperature and humidity and minimal vibration, and their protective performance is insufficient to meet the reliability requirements under special operating conditions. Existing storage products lack sufficient waterproof and dustproof capabilities, allowing dust and moisture to easily penetrate internal circuits, making them unsuitable for scenarios such as vehicle immersion in water or industrial dust, potentially leading to short circuits, data loss, or even hardware damage.

[0004] Therefore, a new design is urgently needed to solve the above problems and meet the needs of diverse application scenarios. Utility Model Content

[0005] To improve upon at least some of the above-mentioned shortcomings or deficiencies, embodiments of this utility model provide a hard disk heat dissipation device, comprising: a housing, the housing including a base and a cover, the cover being sealed to the base, the cover and the base forming an accommodating space; and a hard disk assembly disposed within the accommodating space, the hard disk assembly including a hard disk and an interface connector electrically connected to the hard disk; wherein, a heat dissipation pad is further disposed within the cover corresponding to the hard disk, the heat dissipation pad being thermally connected to the hard disk, and a first heat dissipation fin is disposed on the outer side of the cover.

[0006] In one embodiment of the present invention, the base has a bottom wall, on which heat dissipation and shock absorption pads corresponding to the hard drive are provided. The heat dissipation and shock absorption pads are multiple strip-shaped pads arranged on the bottom wall of the base.

[0007] In one embodiment of this utility model, the thickness of the heat dissipation and shock absorption pad is in the range of 3~8mm.

[0008] In one embodiment of this utility model, the thickness of the heat dissipation and shock absorption pad is 5 mm.

[0009] In one embodiment of the present invention, a second heat dissipation fin is provided at the bottom of the base away from the cover.

[0010] In one embodiment of this utility model, the number of the second heat dissipation fins is less than the number of the first heat dissipation fins.

[0011] In one embodiment of this utility model, the heat dissipation pad is a plurality of strip-shaped pads arranged on the inner side of the cover.

[0012] In one embodiment of this utility model, the strip-shaped pads are arranged in the same direction as the fins of the first heat dissipation fins.

[0013] In one embodiment of this utility model, the spacing between the first heat dissipation fins is 1~3mm.

[0014] In one embodiment of this utility model, the hard disk assembly further includes a circuit board and a hard disk connector. The interface connector and the hard disk connector are respectively disposed on the circuit board. The encapsulating adhesive completely or partially covers the circuit board, the hard disk connector, the hard disk and / or the interface connector. The encapsulating adhesive is a high thermal conductivity potting compound.

[0015] As can be seen from the above, the technical features of this utility model can improve the heat dissipation effect of the hard drive and prevent water vapor, dust and other contaminants from entering the storage space, thereby avoiding damage to the internal circuitry of the hard drive. This makes the hard drive heat dissipation device have good waterproof and dustproof capabilities, and can cope with scenarios such as vehicle wading and industrial dust, meeting diverse application scenarios. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of a hard disk heat dissipation device provided in an embodiment of the present invention.

[0018] Figure 2 for Figure 1 Exploded view of the hard drive cooling system.

[0019] Figure 3 for Figure 2 A schematic diagram of the interface connector.

[0020] Figure 4 for Figure 1 A schematic diagram of the cross-sectional structure of the hard drive cooling device along the A-A' cutting line.

[0021] Figure 5 for Figure 2A schematic diagram of the structure of the central base.

[0022] Figure 6 This is a schematic diagram of the hard drive assembly located inside the base.

[0023] Figure 7 for Figure 6 A partial structural diagram of the hard disk component.

[0024] Figure 8 for Figure 6 A schematic diagram of the structure of a hard disk.

[0025] Figure 9 for Figure 6 A schematic diagram of the structure of the hard drive and the connecting bracket.

[0026] Figure 10 Figure 9 A magnified view of a portion of region A in the middle.

[0027] Figure 11 for Figure 2 A schematic diagram of the structure of the middle cover.

[0028] Figure 12 This is a schematic diagram of the structure of a heat dissipation pad. Detailed Implementation

[0029] The following detailed description refers to the accompanying drawings, which illustrate, by way of illustration, specific details and aspects in which this disclosure may be practiced. These aspects are described in sufficient detail to enable those skilled in the art to practice this disclosure. Other aspects may be utilized, and structural, logical, and electrical changes may be made without departing from the scope of this disclosure. The various aspects are not necessarily mutually exclusive, as some aspects may be combined with one or more other aspects to form new aspects. The various aspects are described in conjunction with methods, and the various aspects are described in conjunction with devices. However, it is understood that aspects described in conjunction with methods can be similarly applied to devices, and vice versa.

[0030] The terms "at least one" and "one or more" can be understood to include any integer greater than or equal to one, i.e., one, two, three, four [...], etc. The term "multiple" can be understood to include any integer greater than or equal to two, i.e., two, three, four, five [...], etc.

[0031] The phrase “at least one” regarding a group of elements may be used herein to mean at least one element from a group of elements. For example, the phrase “at least one” regarding a group of elements may be used herein to mean a choice of: one of the listed elements, one of the plural listed elements, a plural of individual listed elements, or a plural of multiple listed elements.

[0032] The terms "plural" and "multiple" in the specification and claims explicitly refer to a quantity greater than one. Therefore, any phrase explicitly using the aforementioned words to refer to a certain quantity of objects explicitly refers to more than one of the objects.

[0033] Although the terms first, second, third, etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, and / or part from another. Unless the context clearly indicates otherwise, terms such as “first,” “second,” and other numerical terms, when used herein, do not imply sequence or order. Therefore, without departing from the teachings of the examples, the first element, component, region, layer, or part discussed below may be referred to as the second element, component, region, layer, or part.

[0034] As used herein, the terms “memory,” “memory device,” etc., are understood to refer to a non-transitory computer-readable medium in which data or information can be stored for retrieval. Therefore, the reference to “memory” as used herein is understood to refer to volatile or non-volatile memory, including random access memory (RAM), read-only memory (ROM), flash memory, solid-state storage devices, magnetic tape, hard disk drives, optical drives, 3D XPoint™ technology, etc., or any combination thereof. Furthermore, it should be recognized that registers, shift registers, processor registers, data buffers, etc., are also included herein by the term memory. It should be understood that a single component referred to as “memory” or “a memory” can consist of more than one different type of memory, and therefore can refer to a collective component including one or more types of memory. It is readily understood that any single memory component can be divided into multiple collectively equivalent memory components, and vice versa. Furthermore, while memory may be depicted as separate from one or more other components (e.g., in the figures), it should be understood that memory can be integrated within another component, for example, on a common integrated chip.

[0035] See Figure 1 and Figure 2 The present invention provides a hard disk heat dissipation device 10, which may specifically include, for example, a housing 100 and a hard disk assembly 200.

[0036] The housing 100 has a receiving space 101 for accommodating the hard disk assembly 200. The housing 100 also has a connecting hole 112 communicating with the receiving space 101. The housing 100 may be, for example, a box structure, and its shape may be, for example, square. However, this embodiment is not limited to this, and the housing 100 may also have other shapes. The hard disk assembly 200 is disposed within the receiving space 101. The hard disk assembly 200 may include, for example, an interface connector 210 and a hard disk 220, which are electrically connected. The interface connector 210 can be, for example, a connector with a USB 3.0 / 3.2, Type-C, Thunderbolt, M.2, or M.12 interface. The hard drive 220 can be, for example, an SSD, HDD, SSHD, SMR (Shingled Magnetic Recording) HDD, CMR (Conventional Magnetic Recording) HDD, Optane HDD, etc., and can be used in external portable hard drives, enterprise-grade hard drives, industrial-grade hard drives, or other application hard drives. The interface connector 210 passes through the connection hole 112 and protrudes from the housing 100 to facilitate the connection of the interface connector 210 to external devices, and the interface connector 210 is sealed to the connection hole 112 to form a sealed receiving space.

[0037] The hard disk cooling device 10 provided in this embodiment is provided with a housing 100 and a hard disk assembly 200. The hard disk assembly 200 includes a hard disk 220 and an interface connector 210. The hard disk assembly 200 is disposed in the accommodating space 101 inside the housing 100. The interface connector 210 is sealed to the connection hole 112 of the housing 100 to form a sealed accommodating space 101, thereby preventing moisture, dust and other substances from entering the accommodating space 101 and thus avoiding damage to the internal circuitry of the hard disk 220. This gives the hard disk cooling device 10 good waterproof and dustproof capabilities, which can cope with scenarios such as vehicle wading and industrial dust, and meet diverse application scenarios.

[0038] However, it is not limited to this. The hard disk heat dissipation device 10 of this application can also have good shock resistance and heat dissipation.

[0039] See Figure 3In one embodiment of this invention, an O-ring 211 is provided on the interface connector 210, which seals the interface connector 210 and the connection hole 112. The O-ring 211 can, for example, be fitted onto the connection between the interface connector 210 and the connection hole 112. By providing the O-ring 211, the interface connector 210 and the connection hole 112 can be sealed together, thereby preventing moisture, dust, etc., from entering the accommodating space 101 from between the interface connector 210 and the connection hole 112. In another embodiment of this invention, the interface connector 210 and the connection hole 112 can also be sealed together, for example, by sealant, gasket, or hot melt adhesive.

[0040] See Figure 2 and Figure 4 The housing 100 may include, for example, a base 110 and a cover 120. The cover 120 is sealed to the base 110, and the cover 120 and the base 110 form an accommodating space 101. The base 110 may be, for example, a box with an opening, and the cover 120 covers the opening of the base 110. For example, a plurality of fixing holes 102 may be provided on the side of the base 110 near the cover 120. The fixing holes 102 do not penetrate the side wall of the base 110, and the cover 120 can be fixedly connected to the fixing holes 102 by screws or other fasteners, thereby fixing it to the base 110. Since the fixing holes 102 do not penetrate the side wall of the base 110, the sealing of the accommodating space 101 can be further ensured. In this embodiment, the base 110 may be, for example, a one-piece molded structure, and the cover 120 may also be, for example, a one-piece molded structure. Furthermore, a connecting groove 113 is provided on the side of the base 110 near the cover 120 surrounding the accommodating space 101, and a sealing ring 114 is provided in the connecting groove 113. The cover 120 and the base 110 are sealed together by the sealing ring 114. By providing the sealing ring 114, the cover 120 and the base 110 can be sealed together, thereby preventing gaps between the cover 120 and the base 110, and thus preventing moisture, dust, etc. from entering the accommodating space 101 from between the cover 120 and the base 110.

[0041] See Figure 5 Furthermore, a waterproof platform 115 is provided on the side of the base 110 near the cover 120 surrounding the accommodating space 101. The waterproof platform 115 may be, for example, a protruding structure surrounding the accommodating space 101, and the sealing ring 114 is located on the side of the waterproof platform 115 opposite to the accommodating space 101. See also Figure 11The cover 120 is also provided with a receiving groove 123 corresponding to the waterproof platform 115, and the waterproof platform 115 can be accommodated in the groove 123. By providing the waterproof platform 115, moisture and dust can be further prevented from entering the receiving space 101 through the gap between the base 110 and the cover 120, thereby further improving the sealing of the receiving space 101 and improving the waterproof and dustproof performance of the hard drive heat dissipation device 10.

[0042] In some embodiments, the waterproof platform 115 may have a stepped structure, and the groove 123 of the cover 120 may also have a structure that matches the waterproof platform 115, so as to further improve the waterproof and dustproof performance of the hard drive heat dissipation device 10. However, it is not limited to this. In other embodiments, the waterproof platform 115 may have a serrated structure or other shaped structure, and the groove 123 of the cover 120 may also have a structure that matches the waterproof platform 115.

[0043] See Figure 2 , Figure 6 , Figure 7 and Figure 8 The hard disk assembly 200 also includes a circuit board 230 and a hard disk connector 240. The interface connector 210 and the hard disk connector 240 are respectively disposed on the circuit board 230. Specifically, for example, the interface connector 210 and the hard disk connector 240 can be disposed at opposite ends of the circuit board 230. The interface connector 210 and the hard disk connector 240 are electrically connected to the circuit board 230. The hard disk 220 can be electrically connected to the hard disk connector 240 by plugging in the connecting part 221, for example. The circuit board 230 and the hard disk 220 can be disposed adjacent to each other, for example. The circuit board 230 and the hard disk 220 are fixedly connected to the housing 100. The circuit board 230 and the hard disk 220 can be fixedly connected to the connecting post 103 on the housing 100 by screws or other fasteners. Of course, this embodiment is not limited thereto.

[0044] In some embodiments, encapsulating adhesive (not shown, such as epoxy resin) can be applied to electronic components (e.g., NAND chips and controllers) encapsulated on circuit board 230 to prevent components from falling off under vibration and to improve dust and water resistance. In one embodiment, encapsulating adhesive (not shown, such as epoxy resin) can also be used to completely or partially cover circuit board 230, hard disk connector 240, hard disk 220, and / or interface connector 210 to improve dust and water resistance. In some embodiments, the encapsulating adhesive can be a high thermal conductivity potting compound to improve heat dissipation.

[0045] In some embodiments, a hydrophobic material (e.g., a fluoropolymer) can be sprayed onto the circuit board 230, hard disk connector 240, hard disk 220, and / or interface connector 210 to form a surface hydrophobic protective film on the circuit board 230, hard disk connector 240, hard disk 220, and / or interface connector 210, thereby further improving the internal waterproofing of the hard disk.

[0046] In some embodiments, a water-absorbing material (such as a water-absorbing silicone bag) can be placed inside the hard drive to absorb any trace amounts of moisture that seep in, further improving the hard drive's internal waterproofing.

[0047] See Figure 9 and Figure 10 The hard drive 220 has connecting brackets 250 on opposite sides. Each connecting bracket 250 may have a shock-absorbing ring 261. The connecting brackets 250 are fixedly connected to the base 110 via shock-absorbing pins 262. The shock-absorbing rings 261 and shock-absorbing pins 262 further enhance shock absorption performance. In one embodiment, a soft pad (not shown) may be placed between the connecting bracket 250 and the base 110 to further absorb vibration. In one embodiment, the connecting bracket 250 may be, for example, a silicone bracket to increase shock resistance. In one embodiment, the shock-absorbing pins 262 may be, for example, piezoelectric material shock-absorbing pins, which can detect vibration in real time and counteract it.

[0048] In one embodiment, the shock-absorbing ring is, for example, a fluororubber annular pad, and the shock-absorbing nail is, for example, a metal and silicone composite nail.

[0049] In one embodiment, the number of shock-absorbing pins is 4 to 8, and they are symmetrically distributed at the four corners of the hard drive or near the spindle.

[0050] In one embodiment, the thickness of the damping ring is 1-3 mm. An excessively thick damping ring will affect heat dissipation, while an excessively thin damping ring will result in insufficient vibration damping.

[0051] In one embodiment, the housing 100 may be made of a corrosion-resistant material, and the outer surface of the housing 100 has a painted layer. The thickness of the outer wall of the housing 100 ranges from 4 to 8 mm. This can increase the corrosion resistance and aesthetics of the hard drive heat dissipation device 10, and also improve the strength of the housing 100 to meet certain impact requirements.

[0052] In one embodiment of this example, see again Figure 5The base 110 has a bottom wall located at the bottom of the accommodating space 101. A heat dissipation and vibration damping pad 116 corresponding to the hard drive 220 is also provided on the bottom wall. The heat dissipation and vibration damping pad 116 can be, for example, a silicone-based thermal conductive pad or a composite thermal conductive pad. The heat dissipation and vibration damping pad 116 is thermally connected to the hard drive 220. The hard drive 220 can be, for example, located on the heat dissipation and vibration damping pad 116, and the hard drive 220 and the heat dissipation and vibration damping pad 116 can, for example, contact or connect to achieve thermal conduction. The thickness of the heat dissipation and vibration damping pad 116 can be, for example, 3~8mm, preferably 5mm. Through the setting of the heat dissipation and vibration damping pad 116, heat dissipation of the hard drive 220 can be achieved. The heat generated by the hard drive 220 can be conducted to the housing 100 and dissipated through the heat dissipation and vibration damping pad 116. Furthermore, the heat dissipation and vibration damping pad 116 also has a vibration damping effect, thus meeting the requirements of vibrations during vehicle driving or drone flight, and satisfying diverse application scenarios.

[0053] In one embodiment, the heat dissipation and shock absorption pad 116 may be a plurality of strip-shaped pads arranged on the bottom wall of the base 110. By arranging the strip-shaped pads 116, heat dissipation channels can be formed between the strip-shaped pads 116 to improve heat dissipation, and shock absorption space can be increased between the strip-shaped pads 116 to help with shock absorption.

[0054] See also Figure 11 A heat dissipation pad 122 is also provided inside the cover 120 corresponding to the hard drive 220, and the heat dissipation pad 122 is thermally connected to the hard drive 220. The heat dissipation pad 122 can be, for example, attached to the inside of the cover 120, and the heat dissipation pad 122 is in contact with or connected to the hard drive 220 to achieve thermal conduction. The heat dissipation pad 122 can be, for example, a silicone-based thermal conductive pad, a composite thermal conductive pad, etc. Through the provision of the heat dissipation pad 122, heat dissipation of the hard drive 220 can be achieved, and the heat generated by the hard drive 220 can be conducted to the housing 100 and dissipated through the heat dissipation pad 122. Further, see... Figure 2 The outer side of the cover 120 is provided with a first heat dissipation fin 121, and the bottom of the base 110 away from the cover 120 is provided with a second heat dissipation fin 111. The arrangement of the first heat dissipation fin 121 and the second heat dissipation fin 111 can further improve the heat dissipation effect. The heat dissipated by the hard drive 220 is conducted to the housing 100 through the heat dissipation and shock absorption pads 116 and 122, and then dissipated through the first heat dissipation fin 121 and the second heat dissipation fin 111. This can ensure the heat dissipation effect of the hard drive 220, and the structure is simple, saving the installation of heat dissipation components such as fans, thus saving costs.

[0055] like Figure 12As shown, in one embodiment, the heat dissipation pad 122 can be a plurality of strip-shaped pads arranged on the inner side of the cover 120. The arrangement of the strip-shaped pads 122 forms heat dissipation channels between them to improve heat dissipation and increases the shock absorption space between them to aid in vibration reduction. The gaps between the strip-shaped pads can form air convection paths, allowing heat to dissipate naturally, for example, hot air can rise along the gaps, and cool air can replenish from the bottom (e.g., in enclosed environments). Furthermore, although the contact area between the strip-shaped pads and the heating element / cover is reduced, localized heat accumulation can be avoided by distributing heat through multiple channels.

[0056] In addition, the arranged strip-shaped pads 122 can form an elastic spatial distribution, and the gaps between the strip-shaped pads allow the material to undergo micro-deformation during vibration, absorbing impact energy. It can also cause stress dispersion, distributing the vibration load across multiple pads and reducing single-point pressure (especially suitable for hard disk drives or automotive equipment).

[0057] In some embodiments, the strip pads 122 may be arranged in the same direction as the fin arrangement of the first heat dissipation fins 121 and / or the second heat dissipation fins 111, so as to further enable heat to be directly conducted from the heat dissipation pads to the heat dissipation fins and improve heat dissipation efficiency. However, this is not the only possibility. In some embodiments, depending on design requirements, the arrangement direction of the strip pads 122 may not be the same as the fin arrangement direction of the first heat dissipation fins 121 and / or the second heat dissipation fins 111.

[0058] In one embodiment, the number of second heat dissipation fins 111 may be less than the number of first heat dissipation fins 121, that is, the number of second heat dissipation fins 111 at the bottom may be appropriately reduced to mitigate the possibility that the second heat dissipation fins 111 at the bottom may amplify vibration or resonance during vibration. By reducing the number of bottom fins, the structural rigidity can be weakened, avoiding coupling between the hard drive vibration frequency and the natural frequency of the fin array, thereby suppressing the resonance amplification effect. Furthermore, the dense fins at the top of the hard drive (the arrangement spacing of the first heat dissipation fins 121 is, for example, 1~3mm) can maintain heat dissipation, ensuring that the heat from the main heat source (such as the main controller chip, NAND flash memory) is quickly dissipated through the fins. The sparse fins at the bottom of the hard drive (the arrangement spacing of the second heat dissipation fins 111 is, for example, 3~5mm) can increase the elastic deformation space, forming a gradient damping effect.

[0059] In one embodiment, the heat dissipation pad 122 may be, for example, a graphene heat dissipation pad to improve heat dissipation. However, it is not limited to this, and the material of the heat dissipation pad 122 may also be, for example, a silicone-based thermal conductive pad or a metal-based composite material.

[0060] In one embodiment, the hard disk of this application may be a portable storage device used in electronic devices such as computer equipment, mobile smart devices, multimedia and entertainment devices (e.g., vehicle systems), and industrial control equipment.

[0061] Furthermore, it is understood that the foregoing embodiments are merely illustrative examples of this utility model. Provided that the technical features do not conflict, the structure is not contradictory, and the inventive purpose of this utility model is not violated, the technical solutions of the various embodiments can be arbitrarily combined and used.

[0062] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection between devices or units through some interfaces, and may be electrical, mechanical, or other forms.

[0063] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0064] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A hard drive heat dissipation device, characterized in that, include: A housing, the housing comprising a base and a cover, the cover being sealed to the base, the cover and the base forming an accommodating space; as well as A hard disk assembly is disposed within the accommodating space, the hard disk assembly including a hard disk and an interface connector electrically connected to the hard disk; The cover body is provided with a heat dissipation pad corresponding to the hard drive, the heat dissipation pad is thermally connected to the hard drive, and the outer side of the cover body is provided with a first heat dissipation fin.

2. The hard disk cooling device as described in claim 1, characterized in that, The base has a bottom wall, on which heat dissipation and shock absorption pads corresponding to the hard drive are provided. The heat dissipation and shock absorption pads are multiple strip-shaped pads arranged on the bottom wall of the base.

3. The hard disk cooling device as described in claim 2, characterized in that, The thickness of the heat dissipation and shock absorption pads ranges from 3 to 8 mm.

4. The hard disk cooling device as described in claim 3, characterized in that, The thickness of the heat dissipation and shock absorption pad is 5 mm.

5. The hard disk cooling device as described in claim 1, characterized in that, The base has a second heat dissipation fin at its bottom, away from the cover.

6. The hard disk cooling device as described in claim 5, characterized in that, The number of the second heat dissipation fins is less than the number of the first heat dissipation fins.

7. The hard disk cooling device as described in claim 1, characterized in that, The heat dissipation pads are multiple strip-shaped pads arranged on the inner side of the cover.

8. The hard disk cooling device as described in claim 7, characterized in that, The strip-shaped pads are arranged in the same direction as the fins of the first heat dissipation fins.

9. The hard disk cooling device as described in claim 1, characterized in that, The spacing between the first heat dissipation fins is 1~3mm.

10. The hard disk cooling device as described in claim 1, characterized in that, The hard disk assembly also includes a circuit board and a hard disk connector. The interface connector and the hard disk connector are respectively disposed on the circuit board. The encapsulating adhesive completely or partially covers the circuit board, the hard disk connector, the hard disk and / or the interface connector. The encapsulating adhesive is a high thermal conductivity potting compound.

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