High reliability ferroelectric memory read / write interface

Abstract

The utility model belongs to ferroelectric memory technical field, specifically disclose a kind of high reliability ferroelectric memory read-write interface, including pin body, the connecting end bottom of pin body is fixedly connected with rubber pad, the bottom of rubber pad is provided with multiple semicircular convex for improving friction and buffering effect;Stiffening plate is set to one end of rubber pad, for enhancing the structural strength of pin body, pin body is provided with the positioning hole for realizing assembly positioning, one end of pin body is equipped with pin middle section, pin middle section is between the connecting end and the welding end of pin body, the connecting end bottom of pin body is fixedly connected with stiffening plate, one end of stiffening plate is fixedly connected with pin middle section, the utility model is set through stiffening plate, both can enhance the bending strength of pin body, prevent its assembly or vehicle vibration deformation, also can limit the relative displacement of chip and pin body, offset the transverse shear stress generated by temperature cycle, avoid the crack of both connection welding point.

Description

Technical Field

[0001] This application relates to the field of ferroelectric memory technology, and more specifically, to a high-reliability ferroelectric memory read / write interface. Background Technology

[0002] Ferroelectric memories, leveraging the polarization properties of ferroelectric materials, possess the triple advantages of non-volatility, high-speed read / write, and long lifespan, making them a core solution for filling the aforementioned technological gaps. The read / write interface of ferroelectric memories, acting as the interaction bridge between the external control unit and the storage unit, directly determines the implementation of storage performance. Currently, the mainstream interface types are serial interfaces and parallel interfaces.

[0003] In environments with severe vibrations and frequent temperature cycles, such as automotive and construction machinery, the pin solder joints of the SPI / I2C interface are prone to continuous thermal stress due to the difference in thermal expansion coefficients between the PCB and the chip package. This stress, combined with fatigue impacts caused by vibration, can easily lead to annular cracks in the solder joints, causing communication interruptions and data transmission errors. Utility Model Content

[0004] To address the aforementioned issues, this application provides a highly reliable ferroelectric memory read / write interface.

[0005] This application provides a high-reliability ferroelectric memory read / write interface using the following technical solution: A high-reliability ferroelectric memory read / write interface includes a pin body, with a rubber pad fixedly connected to the bottom of the pin body's connection end. The bottom surface of the rubber pad is provided with multiple semi-circular protrusions to improve friction and buffering effect. A reinforcing plate, located at one end of the rubber pad, is used to enhance the structural strength of the pin body.

[0006] Through the above technical solution, the reinforcing plate can not only enhance the bending strength of the pin body and prevent it from deforming due to assembly or vehicle vibration, but also limit the relative displacement between the chip and the pin body, offset the transverse shear stress generated by temperature cycling, and avoid cracks at the connection solder joint.

[0007] Furthermore, the pin body is provided with positioning holes for assembly positioning.

[0008] Furthermore, one end of the pin body is provided with a pin middle section, which is located between the connection end and the soldering end of the pin body.

[0009] Furthermore, the bottom of the pin body's connection end is fixedly connected to the reinforcing plate, and one end of the reinforcing plate is fixedly connected to the middle section of the pin.

[0010] Furthermore, the soldering end of the pin body is provided with an annular boss, and the outer wall of the annular boss is provided with a surface plating layer.

[0011] Through the above technical solution, the annular solder joint formed by the annular boss at the welding end can disperse the local stress caused by the thermal expansion difference between the PCB and the pin, reduce the risk of solder joint cracking, and the outer wall surface plating can prevent the boss from oxidizing, improve the solder wettability, and ensure reliable connection between the pin and the pad.

[0012] Furthermore, a ferroelectric memory chip is provided on one side of the pin body, and the pin body is electrically connected to the ferroelectric memory chip through its connection terminal.

[0013] Furthermore, the reinforcing plate is configured to contact the outside of the ferroelectric memory chip to provide lateral support when the pin body is connected to the ferroelectric memory chip.

[0014] In summary, this application includes at least one of the following beneficial technical effects: (1) By setting the reinforcing plate, this utility model can not only enhance the bending strength of the pin body and prevent it from deforming due to assembly or vehicle vibration, but also limit the relative displacement between the core and the pin body, offset the transverse shear stress generated by temperature cycling, and avoid cracks at the connection solder joint. (2) The rubber pad and the semi-circular protrusion on the bottom surface of this utility model increase the contact friction force, further restrict the longitudinal shaking of the pin connection end, and help alleviate the impact of vibration on the solder joint; (3) The annular solder joint formed by the annular boss at the welding end of this utility model can disperse the local stress caused by the thermal expansion difference between the PCB and the pin, reduce the risk of solder joint cracking, and the outer wall surface plating can prevent the boss from oxidizing, improve the solder wettability, and ensure reliable connection between the pin and the pad. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a side view of the present invention; Figure 3 This is a schematic diagram of the connection structure between the ferroelectric memory chip and the pin body of this utility model; Figure 4 This is a plan view of the present invention; Figure 5 For the present utility model Figure 4 Enlarged view of the structure at point A in the middle.

[0016] Explanation of reference numerals in the attached diagram: 1. Pin body; 2. Positioning hole; 3. Annular boss; 4. Rubber pad; 5. Semi-circular protrusion; 6. Reinforcing plate; 7. Pin middle section; 8. Surface plating; 9. Ferroelectric memory chip. Detailed Implementation

[0017] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0018] Reference Figures 1-5 A high-reliability ferroelectric memory read / write interface includes a pin body 1, a rubber pad 4 is fixedly connected to the bottom of the connection end of the pin body 1, and the bottom surface of the rubber pad 4 is provided with multiple semi-circular protrusions 5 for improving friction and buffering effect. The reinforcing plate 6 is located at one end of the rubber pad 4 and is used to enhance the structural strength of the pin body 1.

[0019] The pin body 1, through its pre-set positioning hole 2, mates with the positioning post on the ferroelectric memory chip 9 package. The diameter of the positioning hole 2 matches the size of the positioning post, which restricts the lateral and longitudinal offset of the pin body 1 within the package plane of the ferroelectric memory chip 9, ensuring that the connection end of the pin body 1 is completely aligned with the pin pads of the ferroelectric memory chip 9. After positioning, the connection end of the pin body 1 and the pin pads of the ferroelectric memory chip 9 are soldered and fixed through a reflow soldering process, establishing an electrical path between the internal storage unit of the ferroelectric memory chip 9 and the pin body 1, providing an initial link for read and write signal transmission.

[0020] One end of the reinforcing plate 6 is fixed to the bottom of the connection end of the pin body 1, and the other end extends to the outside of the ferroelectric memory chip 9 and is in close contact with it. At the same time, the middle part of the reinforcing plate 6 is fixedly connected to the middle section of the pin 7. This can enhance the overall bending strength of the pin body 1 and prevent the pin body 1 from deforming due to subsequent assembly or vehicle vibration. The contact between the reinforcing plate 6 and the outside of the ferroelectric memory chip 9 can limit the relative displacement between the ferroelectric memory chip 9 and the pin body 1. When temperature cycling causes the difference in thermal expansion between the chip package and the pin, it can offset some of the transverse shear stress and prevent cracks from appearing at the solder joint between the connection end of the pin body 1 and the ferroelectric memory chip 9.

[0021] Meanwhile, the rubber pad 4 fixed at the bottom of the pin body 1 connection end fits into the pre-fixed area of ​​the ferroelectric memory chip 9 after welding. The multiple semi-circular protrusions 5 on its bottom surface further limit the longitudinal shaking of the pin connection end by increasing the contact friction.

[0022] Reference Figures 2-4 The pin body 1 is provided with positioning holes 2 for assembly positioning. One end of the pin body 1 is provided with a pin middle section 7, which is located between the connection end and the soldering end of the pin body 1.

[0023] Reference Figures 1-2The bottom of the connecting end of the pin body 1 is fixedly connected to the reinforcing plate 6, one end of the reinforcing plate 6 is fixedly connected to the middle section 7 of the pin, and the welding end of the pin body 1 is provided with an annular boss 3, and the outer wall of the annular boss 3 is provided with a surface plating layer 8.

[0024] When the interface is assembled with an external PCB, the annular boss 3 can mate with the corresponding pads on the PCB. During soldering, the solder fully coats the outer wall of the annular boss 3, forming an annular solder joint. Compared with the linear solder joints of traditional sheet leads, the annular structure can distribute the stress of the solder joint to the entire circumference, reducing local stress concentration caused by the thermal expansion difference between the PCB and the lead, and reducing the risk of solder joint cracking. At the same time, the surface plating layer 8 on the outer wall of the annular boss 3 can prevent oxidation of the boss's metal substrate and improve the wettability between the solder and the boss.

[0025] Reference Figures 3-5 A ferroelectric memory chip 9 is provided on one side of the pin body 1. The pin body 1 is electrically connected to the ferroelectric memory chip 9 through its connection terminal. The reinforcing plate 6 is configured to contact the outside of the ferroelectric memory chip 9 to provide lateral support when the pin body 1 is connected to the ferroelectric memory chip 9.

[0026] The read / write commands sent by the external controller are transmitted to the pin soldering end via the PCB, and then transmitted to the connection end through the metal conduction characteristics of the middle section 7 of the pin, and finally input into the internal storage unit of the ferroelectric memory chip 9; the stored data of the ferroelectric memory chip 9 is transmitted back to the external controller through this path to complete one read / write interaction.

[0027] Working principle: First, the pin body 1 is positioned and connected to the ferroelectric memory chip 9. The pin body 1, through its preset positioning hole 2, cooperates with the positioning post on the ferroelectric memory chip 9 package. The diameter of the positioning hole 2 is adapted to the size of the positioning post, which restricts the lateral and longitudinal offset of the pin body 1 within the ferroelectric memory chip 9 package plane, ensuring that the connection end of the pin body 1 is completely aligned with the pin pad of the ferroelectric memory chip 9. After positioning, the connection end of the pin body 1 and the pin pad of the ferroelectric memory chip 9 are welded and fixed by reflow soldering process, establishing an electrical path between the internal storage unit of the ferroelectric memory chip 9 and the pin body 1. At the same time, the reinforcing plate 6 fixed at the bottom of the connection end of the pin body 1 extends to the outside of the ferroelectric memory chip 9 and is in close contact with it. The middle part of the reinforcing plate 6 is also fixed to the pin middle section 7 located between the connection end and the welding end of the pin body 1, forming lateral support and structural reinforcement.

[0028] Next, the interface is assembled and soldered to the external PCB. The annular boss 3 at the soldering end of the pin body 1 is connected to the corresponding pad on the PCB. During soldering, the solder wraps around the outer wall of the annular boss 3 to form an annular solder joint. The annular structure disperses the stress of the solder joint to the entire circumference, reducing the local stress concentration caused by the thermal expansion difference between the PCB and the pin. In addition, the surface plating layer 8 on the outer wall of the annular boss 3 can prevent the metal substrate of the boss from oxidizing and improve the wettability of the solder and the boss.

[0029] Finally, the normal read / write operation phase begins. The read / write commands sent by the external controller are transmitted to the soldering end of pin body 1 via the PCB, and then transmitted to the connection end through the metal conductivity of the pin middle section 7, before being input into the internal storage unit of the ferroelectric memory chip 9. The stored data of the ferroelectric memory chip 9 is transmitted to the external controller along the reverse path of "ferroelectric memory chip 9 - pin body 1 connection end - pin middle section 7 - soldering end - PCB", completing one read / write interaction.

[0030] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A high-reliability ferroelectric memory read / write interface, characterized in that, include: The pin body (1) has a rubber pad (4) fixedly connected to the bottom of the connection end of the pin body (1). The bottom surface of the rubber pad (4) is provided with a plurality of semi-circular protrusions (5) for improving friction and buffering effect. A reinforcing plate (6) is disposed at one end of the rubber pad (4) to enhance the structural strength of the pin body (1).

2. The high-reliability ferroelectric memory read / write interface according to claim 1, characterized in that: The pin body (1) is provided with positioning holes (2) for assembly positioning.

3. The high-reliability ferroelectric memory read / write interface according to claim 1, characterized in that: One end of the pin body (1) is provided with a pin middle section (7), which is located between the connection end and the soldering end of the pin body (1).

4. The high-reliability ferroelectric memory read / write interface according to claim 3, characterized in that: The bottom of the connecting end of the pin body (1) is fixedly connected to the reinforcing plate (6), and one end of the reinforcing plate (6) is fixedly connected to the middle section (7) of the pin.

5. The high-reliability ferroelectric memory read / write interface according to claim 1, characterized in that: The pin body (1) has an annular boss (3) at the welding end, and the outer wall of the annular boss (3) has a surface plating layer (8).

6. The high-reliability ferroelectric memory read / write interface according to claim 1, characterized in that: A ferroelectric memory chip (9) is provided on one side of the pin body (1), and the pin body (1) is electrically connected to the ferroelectric memory chip (9) through its connection terminal.

7. The high-reliability ferroelectric memory read / write interface according to claim 6, characterized in that: The reinforcing plate (6) is configured to contact the outside of the ferroelectric memory chip (9) to provide lateral support when the pin body (1) is connected to the ferroelectric memory chip (9).

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