Conductive film and touch module
By optimizing the design of the silica layer and the hardening coating, the layer structure of the conductive film was simplified, the problem of blueing after the conductive film was laminated was solved, and the effects of low cost and simplified preparation process were achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU RIJIU OPTOELECTRONICS LTD
- Filing Date
- 2025-09-01
- Publication Date
- 2026-07-21
AI Technical Summary
Traditional conductive films are prone to turning blue after lamination, and their manufacturing process is complex and costly.
By optimizing the thickness and refractive index of the silicon dioxide layer and the first hardened coating, combined with the overall structural design of the conductive film, the layer structure was simplified and the preparation cost was reduced.
This method solves the problem of blueing after conductive film lamination, while achieving the effects of simple structure, simple preparation process and low cost.
Smart Images
Figure CN224536720U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of conductive film technology, specifically relating to a conductive film and a touch module. Background Technology
[0002] Conductive films, as an important thin-film material, possess excellent light transmittance in the visible light range while also exhibiting good conductivity, making them an ideal choice for various fields such as touchscreens. Traditional conductive films often exhibit a bluing effect after lamination. While existing conductive films can solve this problem, their complex internal layer structure leads to cumbersome manufacturing processes and high costs.
[0003] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content
[0004] The purpose of this invention is to provide a conductive film and a touch module that can solve the problem of blueing after the conductive film is bonded, and has the advantages of simple structure, easy production and low manufacturing cost.
[0005] To achieve the above objectives, a specific embodiment of this utility model provides the following technical solution: a conductive film, comprising:
[0006] The substrate layer includes a substrate body and a first base coating layer stacked together, wherein the refractive index of the first base coating layer is 1.62 to 1.65;
[0007] A first hardening coating is disposed on the side of the first base coating away from the substrate body. The refractive index of the first hardening coating is 1.60~1.68, and the thickness of the first hardening coating is 200~270nm.
[0008] A silicon dioxide layer is disposed on the side of the first hardened coating away from the substrate layer, and the thickness of the silicon dioxide layer is 1~10nm.
[0009] A conductive layer is disposed on the side of the silicon dioxide layer facing away from the substrate layer.
[0010] In one or more embodiments of this utility model, the thickness of the substrate body is 50~188μm; the substrate body is a PET substrate.
[0011] In one or more embodiments of this utility model, the thickness of the first base coating is 40~60nm.
[0012] In one or more embodiments of the present invention, the conductive layer includes an ITO coating disposed on a silicon dioxide layer, wherein the thickness of the ITO coating is 18~25nm.
[0013] In one or more embodiments of the present invention, the conductive layer further includes a copper plating layer and a connecting layer. The copper plating layer is disposed on the side of the ITO plating layer away from the silicon dioxide layer, and the connecting layer is disposed between the copper plating layer and the ITO plating layer to enhance the adhesion between the copper plating layer and the ITO plating layer.
[0014] In one or more embodiments of this utility model, the thickness of the copper plating layer is 100~200nm.
[0015] In one or more embodiments of this utility model, the thickness of the connecting layer is 0.5~1nm, and the connecting layer is a titanium oxide layer or an aluminum oxide layer.
[0016] In one or more embodiments of the present invention, the substrate layer further includes a second base coating layer disposed on the substrate body on the side opposite to the first base coating layer, the second base coating layer having a refractive index of 1.52-1.55, and a second hardening coating layer disposed on the second base coating layer on the side opposite to the substrate body, the second hardening coating layer having a refractive index of 1.53-1.57.
[0017] In one or more embodiments of this utility model, the thickness of the second base coating is 40~60nm, and the thickness of the second hardened coating is 1~2μm.
[0018] A specific embodiment of this utility model also provides a touch module, including a transparent substrate, a first conductive film adhered to the substrate, and a second conductive film adhered to the first conductive film. Both the first and second conductive films are conductive films as described above. The transmittance b of the touch module... ＊ The absolute value of the value is less than 1.
[0019] Compared with the prior art, the conductive film and touch module of this utility model solve the problem of blueing after the conductive film is bonded by selecting the thickness of the silicon dioxide layer, the thickness and refractive index of the first hardened coating, and the design of the entire film structure. It also has the advantages of simple structure, simple manufacturing process and low manufacturing cost. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This is a schematic diagram of the conductive film in one example of this utility model;
[0022] Figure 2 This is a schematic diagram of the conductive film in one example of this utility model;
[0023] Figure 3 This is a schematic diagram of the conductive film in another example of this utility model.
[0024] Explanation of key figure labels:
[0025] 1. Substrate layer; 11. Substrate body; 12. First base coat; 13. Second base coat; 2. First hardening coating; 3. Silicon dioxide layer; 4. Conductive layer; 41. ITO plating; 42. Connecting layer; 43. Copper plating; 5. Second hardening coating. Detailed Implementation
[0026] To enable those skilled in the art to better understand the technical solutions in this disclosure, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this disclosure.
[0027] like Figure 1 As shown, in one example of this utility model, the conductive film includes a substrate layer 1, a first hardened coating layer 2, a silicon dioxide layer 3, and a conductive layer 4. The substrate layer 1 includes a substrate body 11 and a first base coating layer 12 stacked together. The refractive index of the first base coating layer 12 is 1.62~1.65. The first hardened coating layer 2 is disposed on the first base coating layer 12 on the side away from the substrate body 11. The refractive index of the first hardened coating layer 2 is 1.60~1.68, and the thickness of the first hardened coating layer 2 is 200~270nm. The silicon dioxide layer 3 is disposed on the first hardened coating layer 2 on the side away from the substrate layer 1. The thickness of the silicon dioxide layer 3 is 1~10nm. The conductive layer 4 is disposed on the silicon dioxide layer 3 on the side away from the substrate layer 1.
[0028] It is understood that the conductive film of this utility model solves the problem of blueing after the conductive film is bonded by selecting the thickness of the silicon dioxide layer 3, the thickness and refractive index of the first hardened coating 2, and the design of the entire film structure. It also has the advantages of simple structure, simple preparation process and low preparation cost.
[0029] The silicon dioxide layer 3 can be considered an optical matching layer, with a refractive index typically around 1.45. Besides matching the refractive indices of other layers in the conductive film, it also enhances mechanical properties and improves etching marks. The thicker the silicon dioxide layer 3, the greater the reflectivity in the short-wavelength band, resulting in a blue color reflected from the film surface. Therefore, the thickness of the silicon dioxide layer 3 needs to be limited to 1-10 nm, preferably 5 nm.
[0030] The first hardening coating 2 is formed by applying a hardening coating liquid, which can be commercially available Toyo Ink TYZ68-A01-CN and TYZ60-A01-CN coating liquids. The thickness of this layer affects the reflectivity corresponding to different light wave bands, thus affecting the chromaticity value after the conductive film is bonded to the touch screen. When the thickness is in the range of 200~270nm, combined with the design of the silicon dioxide layer 3, the color reflected by the conductive film surface will have a neutral chromaticity, thereby solving the problem of bluish discoloration after bonding.
[0031] Specifically, the thickness of the substrate 11 is 50~188μm; the substrate 11 is a PET (polyethylene terephthalate) substrate. In other examples, the substrate 11 can also be other substrates.
[0032] The substrate layer 1 also includes a second base coating 13 disposed on the substrate body 11 on the side opposite to the first base coating 12, the refractive index of the second base coating 13 being 1.55. The substrate layer 1 can be a commercially available substrate, such as a PET (polyethylene terephthalate) substrate from Toray Industries, Japan, model UH4V, in which the substrate body 11 has the first base coating 12 and the second base coating 13 on its opposite sides. Alternatively, the substrate layer 1 can be a commercially available substrate body 11, with the first base coating 12 and the second base coating 13 prepared on its opposite sides.
[0033] Specifically, the thickness of the first base coating 12 is 40~60nm, the thickness of the second base coating 13 is 40~60nm, and the refractive index of the second base coating 13 is 1.55.
[0034] like Figure 1As shown, a second hardening coating 5 is provided on the side of the second base coating 13 facing away from the substrate 11. The refractive index of the second hardening coating 5 is 1.53~1.57. The thickness of the second hardening coating 5 is 1~2μm. The second hardening coating 5 is also formed by coating with a coating liquid, for example, the coating liquid can be CHT-X1 from Arakawa Chemical.
[0035] like Figure 2 As shown in a specific example, the conductive layer 4 is an ITO plating layer 41 disposed on the silicon dioxide layer 3. The thickness of the ITO plating layer 41 is 18~25nm, and the refractive index of the ITO plating layer 41 is 1.9. The material of the ITO plating layer 41 is indium tin oxide, which is commercially available. The silicon dioxide layer 3 can increase the interlayer adhesion between the ITO plating layer 41 and the first hardened coating layer 2. Without the silicon dioxide layer 3, the ITO plating layer 41 may not be able to crystallize, and the adhesion will be poor and the etching marks will be heavier. Therefore, the silicon dioxide layer 3 is crucial in the film structure. Its thickness should not be too thick, but it cannot be absent either. A suitable thickness is needed to perfectly match all the advantages of this layer.
[0036] like Figure 3 As shown, in another specific example, the conductive layer 4 includes an ITO plating layer 41, a copper plating layer 43, and a connecting layer 42. The thickness of the ITO plating layer 41 is 18~25nm, and the refractive index of the ITO plating layer 41 is typically around 1.9. The ITO plating layer 41 is disposed on the silicon dioxide layer 3, and the copper plating layer 43 is disposed on the side of the ITO plating layer 41 facing away from the silicon dioxide layer 3. The connecting layer 42 is disposed between the copper plating layer 43 and the ITO plating layer 41 to improve the adhesion between the copper plating layer 43 and the ITO plating layer 41. The copper plating layer 43 is made of metallic copper.
[0037] Specifically, the thickness of the copper plating layer 43 is 100~200nm. The thickness of the bonding layer 42 is 0.5~1nm, and the bonding layer 42 is a titanium oxide layer or an aluminum oxide layer. The bonding layer 42 is mainly used to enhance the interlayer adhesion between the Cu layer and the ITO plating layer 41.
[0038] In this invention, the silicon dioxide layer 3 and the conductive layer 4 can be prepared by magnetron sputtering, and the first hardened coating 2 and the second hardened coating 5 can be prepared by coating.
[0039] A specific example of this utility model also provides a touch module, including a transparent substrate, a first conductive film adhered to the substrate, and a second conductive film adhered to the first conductive film. Both the first and second conductive films are conductive films as described above. The transmittance b of the touch module... ＊ The absolute value of the value is less than 1.
[0040] The transparent substrate can be glass, a touch screen, etc., and existing OCA adhesive can be used to bond these materials together.
[0041] The conductive film and touch module of this utility model will be described in detail below with reference to specific embodiments and comparative examples.
[0042] Example 1
[0043] Obtain as Figure 3 The conductive film shown has the following characteristics: the substrate layer is a PET substrate of Toray Industries, Japan, model UH4V; the first hardened coating has a refractive index of 1.68 (Toyo Ink TYZ68-A01-CN) and a thickness of 235nm; the second hardened coating has a refractive index of 1.54 (Arakawa Chemicals CHT-X1) and a thickness of 1200nm; the silicon dioxide layer has a thickness of 5nm; the ITO coating has a thickness of 21nm; the connecting layer (alumina) has a thickness of 0.5nm; and the copper coating has a thickness of 150nm.
[0044] Example 2
[0045] Obtain as Figure 3 The conductive film shown has the following characteristics: the substrate layer is a PET substrate of Toray Industries, Japan, model UH4V; the first hardened coating has a refractive index of 1.68 (Toyo Ink TYZ68-A01-CN) and a thickness of 260 nm; the second hardened coating has a refractive index of 1.54 (Arakawa Chemicals CHT-X1) and a thickness of 1200 nm; the silicon dioxide layer has a thickness of 5 nm; the ITO coating has a thickness of 21 nm; the connecting layer (alumina) has a thickness of 0.5 nm; and the copper coating has a thickness of 150 nm.
[0046] Example 3
[0047] Obtain as Figure 3 The conductive film shown has the following characteristics: the substrate layer is a PET substrate of Toray Industries, Japan, model UH4V; the first hardened coating has a refractive index of 1.68 (Toyo Ink TYZ68-A01-CN) and a thickness of 210 nm; the second hardened coating has a refractive index of 1.54 (Arakawa Chemicals CHT-X1) and a thickness of 1200 nm; the silicon dioxide layer has a thickness of 5 nm; the ITO coating has a thickness of 21 nm; the connecting layer (alumina) has a thickness of 0.5 nm; and the copper coating has a thickness of 150 nm.
[0048] Example 4
[0049] Obtain as Figure 3The conductive film shown has the following characteristics: the substrate layer is a PET substrate of Toray Industries, Japan, model UH4V; the first hardened coating has a refractive index of 1.68 (Toyo Ink TYZ68-A01-CN) and a thickness of 235nm; the second hardened coating has a refractive index of 1.54 (Arakawa Chemicals CHT-X1) and a thickness of 1200nm; the silicon dioxide layer has a thickness of 8nm; the ITO coating has a thickness of 21nm; the connecting layer (alumina) has a thickness of 0.5nm; and the copper coating has a thickness of 150nm.
[0050] Example 5
[0051] Obtain as Figure 3 The conductive film shown has the following characteristics: the substrate layer is a PET substrate of Toray Industries, Japan, model UH4V; the first hardened coating has a refractive index of 1.68 (Toyo Ink TYZ68-A01-CN) and a thickness of 210 nm; the second hardened coating has a refractive index of 1.54 (Arakawa Chemicals CHT-X1) and a thickness of 1200 nm; the silicon dioxide layer has a thickness of 8 nm; the ITO coating has a thickness of 21 nm; the connecting layer (alumina) has a thickness of 0.5 nm; and the copper coating has a thickness of 150 nm.
[0052] Example 6
[0053] Obtain as Figure 2 The conductive film shown has the following characteristics: the substrate layer is a PET substrate of Toray Industries, Japan, model UH4V; the first hardened coating has a refractive index of 1.68 (Toyo Ink TYZ68-A01-CN) and a thickness of 235nm; the second hardened coating has a refractive index of 1.54 (Arakawa Chemicals CHT-X1) and a thickness of 1200nm; the silicon dioxide layer has a thickness of 5nm; and the ITO coating has a thickness of 21nm.
[0054] Comparative Example 1
[0055] It is basically the same as Example 1, except that there is no silicon dioxide layer.
[0056] Comparative Example 2
[0057] It is basically the same as Example 1, except that the thickness of the silicon dioxide layer is 15nm.
[0058] Comparative Example 3
[0059] It is basically the same as Example 1, except that the thickness of the first hardened coating is 170 nm.
[0060] The conductive films in the examples and comparative examples will be subjected to the following performance tests:
[0061] Prepare two conductive films and laminate them using OCA. Then, use OCA to attach them to the glass to obtain a touch module. This process is also called GFF lamination. Then, measure the transmittance b. ＊ Values. The data shown in the table below was obtained.
[0062]
[0063] From the transmittance b of Example 1, Comparative Example 2, and Comparative Example 3 in the table above ＊ The data shows that the conductive films in Comparative Examples 2 and 3 have a blue hue and poor visual effect; the conductive film in Example 1 has a neutral hue and good visual effect.
[0064] Although the transmittance b of example 1 in the table above ＊ When the value is less than 1, the conductive film has a neutral color tone and good visual effect. However, because there is no silicon dioxide layer, the ITO coating is easy to fall off, cannot crystallize, and the etching marks are aggravated.
[0065] Among them, the data of Example 1 and Example 6 in the table above are similar because the copper plating layer needs to be etched off before the above test process. Therefore, there is no copper plating layer in the actual test. As a result, the conductive film of Example 1 and Example 6 has almost the same structure during the test, which leads to their data being almost equal.
[0066] It will be apparent to those skilled in the art that this disclosure is not limited to the details of the exemplary embodiments described above, and that this disclosure can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of this disclosure is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this disclosure. No reference numerals in the claims should be construed as limiting the scope of the claims.
[0067] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A conductive film, characterized in that, include: The substrate layer includes a substrate body and a first base coating layer stacked together, wherein the refractive index of the first base coating layer is 1.62 to 1.65; A first hardening coating is disposed on the side of the first base coating away from the substrate body. The refractive index of the first hardening coating is 1.60~1.68, and the thickness of the first hardening coating is 200~270nm. A silicon dioxide layer is disposed on the side of the first hardened coating away from the substrate layer, and the thickness of the silicon dioxide layer is 1~10nm. A conductive layer is disposed on the side of the silicon dioxide layer facing away from the substrate layer.
2. The conductive film according to claim 1, characterized in that, The thickness of the substrate body is 50~188μm; the substrate body is a PET substrate.
3. The conductive film according to claim 1, characterized in that, The thickness of the first base coating is 40~60nm.
4. The conductive film according to claim 1, characterized in that, The conductive layer includes an ITO coating disposed on a silicon dioxide layer, the thickness of which is 18~25nm.
5. The conductive film according to claim 4, characterized in that, The conductive layer further includes a copper plating layer and a bonding layer. The copper plating layer is disposed on the side of the ITO plating layer away from the silicon dioxide layer, and the bonding layer is disposed between the copper plating layer and the ITO plating layer to improve the adhesion between the copper plating layer and the ITO plating layer.
6. The conductive film according to claim 5, characterized in that, The thickness of the copper plating layer is 100~200nm.
7. The conductive film according to claim 5, characterized in that, The thickness of the connecting layer is 0.5~1nm, and the connecting layer is a titanium oxide layer or an aluminum oxide layer.
8. The conductive film according to claim 1, characterized in that, The substrate layer further includes a second base coating layer disposed on the substrate body on the side opposite to the first base coating layer, the second base coating layer having a refractive index of 1.52-1.55, and a second hardening coating layer disposed on the second base coating layer on the side opposite to the substrate body, the second hardening coating layer having a refractive index of 1.53-1.
57.
9. The conductive film according to claim 8, characterized in that, The thickness of the second base coating is 40~60nm, and the thickness of the second hardened coating is 1~2μm.
10. A touch module, characterized in that, The touch module includes a transparent substrate, a first conductive film adhered to the substrate, and a second conductive film adhered to the first conductive film. Both the first and second conductive films are conductive films as described in any one of claims 1 to 9. The transmittance b of the touch module... ＊ The absolute value of the value is less than 1.