Crosslinked high temperature insulation cable for aerospace

Abstract

The utility model relates to the field of insulated cable discloses a kind of crosslinking high temperature insulated cables for spaceflight, including conductor, silver layer is equipped on the conductor;The conductor is wrapped by low temperature resistant layer;High temperature resistant layer is crosslinked outside the low temperature resistant layer gradiently.The utility model proposes a kind of crosslinking high temperature insulated cables for spaceflight, adopts the special material of irradiation crosslinking after ETFE, PTFE etc., they have anti-radiation performance, under cosmic ray irradiation, can reduce the damage to cable internal structure and performance, maintain normal transmission function, guarantee spacecraft reliable operation in space, ensure cable radiation resistance, temperature resistance, high temperature impact and other properties.Can improve structural stability when reducing outer diameter, applicable to spacecraft power supply, on-board equipment signal transmission and other scenarios, electrical performance is stable under-196 ℃~+250 ℃, vacuum volatile substance is less than 0.1%, meet ASTME595 standard.

Description

Technical Field

[0001] This utility model relates to the field of insulated cable technology, and more specifically, to a cross-linked high-temperature insulated cable for aerospace applications. Background Technology

[0002] As an indispensable key component, cables play a vital role in aerospace technology for power transmission and signal transmission. From the interconnection of precision instruments inside spacecraft to the power and data transmission of various systems in rockets, and the energy and information exchange between complex modules of the space station, their performance directly affects the stable operation of aerospace equipment and the success or failure of missions. They are the fundamental guarantee for the efficient and safe transmission of power and information in aerospace technology.

[0003] In the outer space environment, extreme temperature fluctuations are significant, especially in the low Earth orbit (LEO) environment. Current aerospace cables have a series of problems: insufficient oxidation resistance of the conductor, low temperature resistance of the insulation layer, and weak radiation resistance. These problems directly lead to the degradation of the transmission performance of satellites and other spacecraft under extreme temperature differences and cosmic ray irradiation. Utility Model Content

[0004] This invention provides a cross-linked high-temperature insulated cable for aerospace applications, solving the technical problems in related technologies such as insufficient conductor oxidation resistance, weak insulation layer temperature difference resistance and radiation resistance, which lead to the degradation of transmission performance of spacecraft under extreme temperature differences and cosmic ray irradiation.

[0005] This utility model provides a cross-linked high-temperature insulated cable for aerospace applications, comprising a conductor, wherein a silver layer is provided on the conductor;

[0006] The conductor is encased in a low-temperature resistant layer;

[0007] The low-temperature resistant layer is externally cross-linked with a high-temperature resistant layer.

[0008] As a further optimization of this utility model, the conductor is composed of multiple strands twisted together.

[0009] As a further optimization of this utility model, a silver layer is provided on the outer periphery of each of the multiple sub-lines.

[0010] As a further optimization of this utility model, an elastic transition layer is provided between the low-temperature resistant layer and the high-temperature resistant layer.

[0011] As a further optimization of this utility model, the high-temperature resistant layer is radially recessed outward to form multiple recessed areas, and the low-temperature resistant layer and the elastic transition layer both form fitting areas that are adapted to the recessed areas.

[0012] As a further optimization of this utility model, a shape memory alloy sheet is provided at the root of the recessed area.

[0013] As a further optimization of this utility model, the low-temperature resistant layer is an ETFE low-temperature resistant layer, which has been irradiated with a 20-25kGy electron beam and has a crosslinking degree of 75%-80%.

[0014] As a further optimization of this utility model, the high-temperature resistant layer is a PTFE high-temperature resistant layer, which has been irradiated with 30-35kGy and has a crosslinking degree of 85%-90%.

[0015] As a further optimization of this utility model, the elastic transition layer is a fluororubber elastic transition layer.

[0016] As a further optimization of this utility model, the depth of the plurality of recessed areas is 0.2 mm, and the distance between adjacent recessed areas is 5 mm.

[0017] The beneficial effects of this utility model are as follows:

[0018] The conductor is plated with silver. Silver has excellent conductivity, second only to copper. Silver-plated conductors can significantly reduce contact resistance, reduce energy loss during signal transmission, and improve signal transmission efficiency. At the same time, silver has strong oxidation resistance, preventing the conductor from being oxidized, ensuring the stability of the conductor in complex outer space environments, and extending the service life of the cable.

[0019] The elastic transition layer, made of fluororubber, is located between the low-temperature resistant layer and the high-temperature resistant layer. It effectively buffers the deformation differences between the two layers caused by thermal expansion and contraction, preventing cracking or peeling due to inconsistent deformation and enhancing the overall structural stability. The high-temperature resistant layer has a recessed area on its inner periphery, with a depth of 0.2mm and an adjacent spacing of 5mm. It precisely interlocks with the interlocking area of ​​the low-temperature resistant layer and the elastic transition layer. This design ensures uniform stress distribution between layers, prevents local stress concentration, and improves the fatigue resistance of the overall structure. The shape memory alloy sheet at the root of the recessed area deforms accordingly with temperature changes, keeping the recessed area and the interlocking area in a tight interlocking state at all times. This further enhances the stability of the interlayer structure and ensures that the cable can work together in complex temperature environments without interlayer displacement or detachment.

[0020] The special materials used, such as irradiated cross-linked ETFE and PTFE, possess inherent radiation resistance properties. Under cosmic ray irradiation, they reduce the damage to the cable's internal structure and performance, maintain the cable's normal transmission function, ensure reliable operation of spacecraft in the high-radiation space environment, and guarantee the cable's long-term radiation resistance, temperature resistance, radiation resistance, and high-temperature impact resistance under special environments. This improves the overall structural stability of the cable while reducing the product's outer diameter. This product is suitable for spacecraft power supply systems, onboard equipment signal transmission, and other scenarios. It maintains stable electrical performance under operating conditions of -196℃ to +250℃, with vacuum volatiles <0.1%, a lightweight structural design (35% weight reduction compared to conventional materials), and meets ASTM E595 standards. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of a cross-linked high-temperature insulated cable for aerospace applications proposed in this utility model.

[0022] Figure 2 This is a schematic diagram of the end structure of a cross-linked high-temperature insulated cable for aerospace applications proposed in this utility model.

[0023] In the picture:

[0024] 1. Conductor;

[0025] 2. Silver layer;

[0026] 3. Low-temperature resistant layer;

[0027] 4. High-temperature resistant layer; 401. Recessed area;

[0028] 5. Elastic transition layer;

[0029] 6. Shape memory alloy sheets. Detailed Implementation

[0030] The subject matter described herein will now be discussed with reference to exemplary embodiments. It should be understood that these embodiments are discussed only to enable those skilled in the art to better understand and implement the subject matter described herein, and changes may be made to the function and arrangement of the elements discussed without departing from the scope of this specification. Various processes or components may be omitted, substituted, or added as needed in the examples. Furthermore, features described in some examples may be combined in other examples.

[0031] Example 1

[0032] like Figures 1 to 2 As shown, an embodiment of the present invention provides a cross-linked high-temperature insulated cable for aerospace applications, comprising a conductor 1, a silver layer 2 on the conductor 1, the conductor 1 being composed of multiple stranded sub-wires, and a silver layer 2 being provided on the outer periphery of each of the multiple sub-wires.

[0033] Conductor 1 is composed of multiple stranded sub-wires. These sub-wires are tightly wound together through a stranding process to form an integral conductive structure. During the stranding process, the contact area between the sub-wires increases, allowing current to be transmitted simultaneously through multiple sub-wires. Furthermore, the stranded structure enhances the overall flexibility of conductor 1. Compared to a single conductor, conductor 1 with a stranded structure is less prone to breakage during spacecraft vibrations and deformations, exhibits higher mechanical strength, and can stably transmit current, reducing transmission interruptions caused by mechanical damage.

[0034] Each of the multiple sub-wires has a silver layer 2 around its periphery. The silver layer 2 of each sub-wire independently wraps its own sub-wire. When the sub-wires are twisted together to form conductor 1, the silver layers 2 of all the sub-wires together constitute a complete coverage of conductor 1. Although the silver layers 2 do not conduct electricity directly between each other, they are in close contact through the twisting of the sub-wires, forming a continuous anti-oxidation barrier. Each sub-wire is protected by the silver layer 2, which prevents the oxidation of a single sub-wire from affecting the overall conductivity and comprehensively improves the anti-oxidation performance and service life of conductor 1.

[0035] Meanwhile, when alternating current flows through conductor 1, the skin effect occurs due to Lenz's law, meaning that the current density on the surface is greater than the current density inside the conductor. This is equivalent to reducing the cross-sectional area of ​​conductor 1 and greatly increasing its resistance. Therefore, if silver is plated on the surface of conductor 1, the surface resistance can be reduced, thereby improving the overall conductivity of the conductor and enhancing the safety and reliability of power transmission.

[0036] Conductor 1 is encased in low-temperature resistant layer 3;

[0037] The low-temperature resistant layer 3 has an external gradient cross-linked high-temperature resistant layer 4.

[0038] Conductor 1 serves as the core of current transmission, and its surface is covered by a silver layer 2 that is directly and tightly bonded to conductor 1. The silver layer 2 utilizes the excellent oxidation resistance of silver to effectively isolate the conductor 1 from oxidation and corrosion by the external environment, preventing the conductor 1 from experiencing a decline in conductivity due to oxidation. Conductor 1 is completely encased by the low-temperature resistant layer 3, which can maintain structural stability in low-temperature environments and prevent conductor 1 from being damaged due to low-temperature embrittlement. The exterior of the low-temperature resistant layer 3 forms a gradient cross-linked structure with the high-temperature resistant layer 4. This cross-linking method allows the molecular chains of the two to permeate and bond together, making the connection between the low-temperature resistant layer 3 and the high-temperature resistant layer 4 tighter and preventing delamination during extreme temperature alternation. The silver layer 2 enhances the oxidation resistance of conductor 1, and the low-temperature resistant layer 3 and the high-temperature resistant layer 4 are adapted to high and low temperature environments respectively. The gradient cross-linking expands the overall temperature resistance range and reduces the attenuation of transmission performance under extreme temperatures.

[0039] Furthermore, the high-temperature resistant layer 4 is radially recessed outward to form multiple recessed areas 401, and the low-temperature resistant layer 3 forms an interlocking area that matches the recessed areas 401.

[0040] The recessed area 401 on the inner periphery of the high-temperature resistant layer 4 precisely interlocks with the interlocking area of ​​the low-temperature resistant layer 3, forming a physical locking structure. When each layer deforms due to temperature changes, the mutual interlocking of the recessed area 401 and the interlocking area restricts the relative sliding between the layers, making the connection between the low-temperature resistant layer 3 and the high-temperature resistant layer 4 more solid. The mechanical interlocking enhances the interlayer bonding force, preventing relative displacement between layers under extreme temperature alternation or vibration environments, and improving the overall structure's resistance to deformation.

[0041] A shape memory alloy sheet 6 is provided at the root of the recessed area 401.

[0042] The shape memory alloy sheet 6 is installed at the root of the recessed area 401 and directly contacts the inner wall of the recessed area 401 and the mating area, so that the recessed area 401 and the mating area always maintain a tight engagement. By utilizing the deformation characteristics of the shape memory alloy, the tight engagement between the recessed area 401 and the mating area is actively maintained, offsetting the loosening caused by temperature changes, and further improving the stability of the interlayer structure.

[0043] Specifically, the low-temperature resistant layer 3 is an ETFE low-temperature resistant layer, which has been irradiated with a 20-25 kGy electron beam and has a cross-linking degree of 75%-80%.

[0044] The low-temperature resistant layer 3 is made of ETFE material. After being irradiated with a 20-25 kGy electron beam, it forms a cross-linked structure with a degree of 75%-80%, which tightly wraps the conductor 1 and the silver layer 2. ETFE itself has excellent low-temperature resistance. The cross-linked structure formed by electron beam irradiation improves its molecular chain stability, making the low-temperature resistant layer 3 less prone to embrittlement in low-temperature environments and able to maintain good insulation performance. The low-temperature resistant layer 3 does not fail at extreme low temperatures, effectively insulates and protects the conductor 1, and avoids the decrease in insulation performance caused by low temperature.

[0045] Specifically, the high-temperature resistant layer 4 is a PTFE high-temperature resistant layer, which has been irradiated with 30-35 kGy and has a cross-linking degree of 85%-90%.

[0046] After being irradiated with 30-35 kGy, a cross-linking degree of 85%-90% is formed, which forms a gradient cross-link with the low temperature resistant layer 3. PTFE itself is resistant to high temperature, and the high degree of cross-linking enhances its thermal stability and mechanical strength. The gradient cross-linking makes the bond between the high temperature resistant layer 4 and the low temperature resistant layer 3 tighter, avoiding delamination at high temperatures. The high temperature resistant layer 4 maintains its insulation performance in high temperature environments, resists thermal aging, and works with the low temperature resistant layer 3 to expand the cable's temperature resistance range and adapt to extreme temperature alternation.

[0047] Multiple recessed areas 401 have a depth of 0.2mm, and the spacing between adjacent recessed areas 401 is 5mm. This size and spacing design ensures uniform interlocking force, avoids local stress concentration, and ensures that each recessed area 401 can effectively share the deformation force. The uniformly distributed interlocking structure balances the interlayer force, prevents local disengagement during vibration or temperature changes, and improves the fatigue resistance of the overall structure.

[0048] Example 2

[0049] Based on Embodiment 1, an elastic transition layer 5 is provided between the low-temperature resistant layer 3 and the high-temperature resistant layer 4, and the elastic transition layer 5 forms an interlocking area that is adapted to the recessed area 401.

[0050] The elastic transition layer 5 is located between the low-temperature resistant layer 3 and the high-temperature resistant layer 4, and is directly and tightly bonded to the two layers to form an intermediate buffer structure. When the ambient temperature changes drastically, the low-temperature resistant layer 3 and the high-temperature resistant layer 4 will experience different degrees of thermal expansion and contraction due to the difference in materials. The elastic transition layer 5 absorbs this deformation difference through its own elastic deformation, reduces the tensile force between the two layers, buffers the thermal expansion and contraction stress of the low-temperature resistant layer 3 and the high-temperature resistant layer 4, avoids cracking or peeling of the two layers due to deformation differences, and enhances the overall structural stability.

[0051] The elastic transition layer 5 is a fluororubber elastic transition layer.

[0052] The recessed areas 401 have a depth of 0.2 mm and an adjacent spacing of 5 mm, and are evenly distributed on the inner periphery of the high-temperature resistant layer 4, precisely engaging with the interlocking areas of the low-temperature resistant layer 3 and the elastic transition layer 5. This size and spacing design ensures uniform force distribution during engagement, avoids localized stress concentration, and ensures that each recessed area 401 can effectively share the deformation force. The evenly distributed engagement structure balances the forces between layers, preventing localized separation during vibration or temperature changes and improving the overall structure's fatigue resistance.

[0053] The embodiments of the present utility model have been described above, but the present embodiments are not limited to the specific implementation methods described above. The specific implementation methods described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present embodiments, all of which are within the protection scope of the present embodiments.

Claims

1. A cross-linked high-temperature insulated cable for aerospace applications, comprising a conductor (1), characterized in that: A silver layer (2) is provided on the conductor (1); The conductor (1) is wrapped by a low-temperature resistant layer (3); The low-temperature resistant layer (3) has a high-temperature resistant layer (4) externally cross-linked with gradient. An elastic transition layer (5) is provided between the low-temperature resistant layer (3) and the high-temperature resistant layer (4); The high-temperature resistant layer (4) is radially recessed outward to form multiple recessed areas (401), and the low-temperature resistant layer (3) and the elastic transition layer (5) both form fitting areas that are compatible with the recessed areas (401).

2. The aerospace cross-linked high-temperature insulated cable according to claim 1, characterized in that: The conductor (1) is composed of multiple strands twisted together.

3. The aerospace cross-linked high-temperature insulated cable according to claim 2, characterized in that: The outer periphery of each of the sub-lines is provided with a silver layer (2).

4. The aerospace cross-linked high-temperature insulated cable according to claim 1, characterized in that: A shape memory alloy sheet (6) is provided at the root of the recessed area (401).

5. The aerospace cross-linked high-temperature insulated cable according to claim 1, characterized in that: The low-temperature resistant layer (3) is an ETFE low-temperature resistant layer, which is irradiated with 20-25kGy electron beam and has a cross-linking degree of 75%-80%.

6. The aerospace cross-linked high-temperature insulated cable according to claim 1, characterized in that: The high-temperature resistant layer (4) is a PTFE high-temperature resistant layer, which has been irradiated with 30-35kGy and has a crosslinking degree of 85%-90%.

7. The aerospace cross-linked high-temperature insulated cable according to claim 1, characterized in that: The elastic transition layer (5) is a fluororubber elastic transition layer.

8. The aerospace cross-linked high-temperature insulated cable according to claim 1, characterized in that: The depth of each of the multiple recessed areas (401) is 0.2 mm, and the distance between adjacent recessed areas (401) is 5 mm.

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